CN210093798U - Liquid cooling heat dissipation device for industrial switch - Google Patents
Liquid cooling heat dissipation device for industrial switch Download PDFInfo
- Publication number
- CN210093798U CN210093798U CN201920060840.5U CN201920060840U CN210093798U CN 210093798 U CN210093798 U CN 210093798U CN 201920060840 U CN201920060840 U CN 201920060840U CN 210093798 U CN210093798 U CN 210093798U
- Authority
- CN
- China
- Prior art keywords
- liquid
- liquid coolant
- switch
- heat dissipation
- cooling heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 144
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 74
- 238000001816 cooling Methods 0.000 title claims abstract description 46
- 239000002826 coolant Substances 0.000 claims abstract description 105
- 238000005452 bending Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 8
- 238000004891 communication Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of the industry switch heat dissipation technique and specifically relates to a liquid cooling heat abstractor of industry switch, especially an industry switch liquid cooling heat abstractor along with temperature variation autoselect coolant. This industry switch liquid cooling heat abstractor includes: a liquid cooling heat dissipation module; the liquid cooling heat dissipation module comprises a liquid coolant circulating pipeline and an automatic control valve; at least a portion of the liquid coolant circulation line is disposed within the interior of the industrial switch, the liquid coolant circulation line having a first liquid coolant line for transporting a low thermal conductivity liquid coolant and a second liquid coolant line for transporting a high thermal conductivity liquid coolant; the automatic control valve is used for respectively controlling the opening and closing states of the first liquid coolant pipeline and the second liquid coolant pipeline.
Description
Technical Field
The utility model belongs to the technical field of the industry switch heat dissipation technique and specifically relates to a liquid cooling heat abstractor of industry switch, especially an industry switch liquid cooling heat abstractor along with temperature variation autoselect coolant.
Background
At present, with the development of communication network technology, higher requirements are put forward on the performance and reliability of an industrial switch, and the industrial switch is required to not only rapidly forward an electric signal, but also maintain stable and good performance in a severe environment. As the number of ports of the industrial switch increases, the speed is faster and faster, and the functions are more and more powerful, power consumption is larger and larger, and the temperature in the switch is higher and higher. The communication quality can be seriously influenced by the overhigh temperature of the switch, so that internal devices of the machine are damaged, and the service life is shortened. Heat dissipation is of great importance to the switch, while the heat dissipation mode of the existing switch takes convection heat dissipation and conduction heat dissipation as main heat dissipation means, and mainly takes fan heat dissipation in a case as heat dissipation in convection heat dissipation, but for industrial equipment in a severe environment, the reliability of the fan is also a great hidden danger; the efficiency of the heat dissipation mode of the commonly used heat dissipation fins or the heat dissipation mode of directly sticking the shell in the heat conduction and dissipation is not very high, and the heat dissipation requirements can not be met under certain severe and severe environments.
It can be seen that: the heat dissipation in the current switch has the following disadvantages:
1. a convection heat dissipation mode mainly comprising a built-in fan in the exchanger is adopted, and the built-in fan is a great hidden trouble of equipment reliability;
2. the heat dissipation mode that the fin or directly paste the casing in the heat dissipation of switch conduction is not high in efficiency, can not satisfy the heat dissipation requirement under adverse circumstances.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information constitutes prior art already known to a person skilled in the art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an industry switch liquid cooling heat abstractor to solve the technical problem who exists among the prior art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an industry switch liquid cooling heat abstractor, it includes: a liquid cooling heat dissipation module; the liquid cooling heat dissipation module comprises a liquid coolant circulating pipeline and an automatic control valve; at least a portion of the liquid coolant circulation line is disposed within the interior of the industrial switch, the liquid coolant circulation line having a first liquid coolant line for transporting a low thermal conductivity liquid coolant and a second liquid coolant line for transporting a high thermal conductivity liquid coolant; the automatic control valve is used for respectively controlling the opening and closing states of the first liquid coolant pipeline and the second liquid coolant pipeline.
As a further technical solution, the liquid cooling heat dissipation module further includes: a heat conducting plate; the heat-conducting plate set up in the inside of industry switch for give the heat transfer that the heat dissipation chip of switch produced liquid coolant circulating line.
As a further technical scheme, the heat exchange part of the liquid coolant circulating pipeline is distributed in a continuously bent shape.
As a further technical solution, the method further comprises: a temperature sensor; the temperature sensor is arranged in the industrial exchanger and used for detecting a heat dissipation chip of the exchanger and feeding back the heat dissipation chip to the automatic control valve; the automatic control valve selects the open and closed states of the first and second liquid coolant conduits based on the feedback temperature of the temperature sensor.
As a further technical solution, the method further comprises: liquid cooling heat dissipation pumps; the liquid-cooled heat sink pump is disposed in the liquid coolant vessel for powering the first liquid coolant conduit and the second liquid coolant conduit.
As a further technical solution, the method further comprises: a liquid cooling heat dissipation pump alarm device; the liquid cooling heat dissipation pump alarm device is in signal connection with the liquid cooling heat dissipation pump and used for sending out an alarm signal when the liquid cooling heat dissipation pump breaks down.
As a further technical solution, the liquid coolant container is disposed outside the industrial exchanger, and a circulation loop is formed between the liquid coolant circulation pipe and the liquid coolant container.
As a further technical solution, the industrial switch includes: the switch comprises a switch bottom shell and a switch upper cover plate; the switch bottom shell is provided with a switch heat dissipation chip; the heat conducting plate is arranged on the heat radiating chip of the switch, and the heat exchange part of the liquid coolant circulating pipeline is continuously distributed on the heat conducting plate in a bending manner.
Adopt above-mentioned technical scheme, the utility model discloses following beneficial effect has:
the utility model provides an industry switch liquid cooling heat abstractor can be in the switch, utilize the radiating mode of liquid cooling and reach high-efficient heat dissipation, and can be according to chip temperature's change and the automatic selection coolant, thereby practice thrift the relevant cost of cost, the heat dissipation gauge height and the high-performance coolant problem of high performance device of final solution, with the outstanding performance of realization industry switch in more abominable environment, promote the reliability of industry switch, and reduce the heat dissipation cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a liquid-cooled heat dissipation device of an industrial switch according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of the liquid-cooled heat dissipation module shown in fig. 1.
Icon: 1-switch bottom case; 2-switch upper cover plate; 3-heat conducting plate; 4-heat dissipation chip of the exchanger; 5-liquid cooling heat dissipation pump alarm device; 6-temperature control sensor; 7-a liquid coolant circulation conduit; 8-automatic control valve; 9-liquid cooling heat dissipation pump; 10-low thermal conductivity liquid coolant; 11-high thermal conductivity liquid coolant; 12-a liquid coolant container; 13-liquid cooling heat dissipation module; 14-a first liquid coolant conduit; 15-second liquid coolant channel.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
Referring to fig. 1 and fig. 2, the present embodiment provides an industrial switch liquid-cooled heat dissipation apparatus, which includes: a liquid cooling heat dissipation module 13; the liquid cooling heat dissipation module 13 comprises a liquid coolant circulating pipeline 7 and an automatic control valve 8; the liquid coolant circulation pipe 7 is at least partially disposed inside the industrial exchanger, the liquid coolant circulation pipe 7 has a first liquid coolant pipe 14 and a second liquid coolant pipe 15, the first liquid coolant pipe 14 is used for conveying the low thermal conductivity liquid coolant 10, the second liquid coolant pipe 15 is used for conveying the high thermal conductivity liquid coolant 11; the automatic control valve 8 is used to control the open and closed states of the first liquid coolant piping 14 and the second liquid coolant piping 15, respectively. This embodiment can utilize the radiating mode of liquid cooling and reach high-efficient heat dissipation in the switch to can be according to the change of chip temperature and the automatic selection coolant, thereby practice thrift the relevant cost of cost, the heat dissipation height and the high problem of high performance coolant price of finally solving the high performance device, with the outstanding performance of realization industry switch in more abominable environment, promote the reliability of industry switch, and reduce the heat dissipation cost.
In this embodiment, as a further technical solution, the liquid cooling heat dissipation module 13 further includes: a heat-conducting plate 3; the heat conducting plate 3 is disposed inside the industrial exchanger, and is used for transferring heat generated by the heat radiating chip 4 of the exchanger to the liquid coolant circulating pipeline 7.
Preferably, heat can be transferred between the heat conductive plate 3 and the heat sink chip 4 of the switch.
The heat conducting plate 3 may be a rectangular plate, but may have other shapes.
The heat-conducting plate 3 may be attached or fastened. For example: the bottom of the heat conducting plate 3 is provided with a clamping tongue, the base of the industrial exchanger is provided with a clamping groove, and the clamping tongue of the heat conducting plate 3 is connected with the clamping groove in a buckling mode. Of course, magnetic attraction may be used, and no further example is given here.
As the material of the heat conducting plate 3, metal or other heat conducting materials can be used.
In this embodiment, as a further technical solution, the heat exchange portion of the liquid coolant circulation pipe 7 is continuously bent. Wherein heat on the heat-conducting plate 3 can be quickly transferred out of the device by means of the liquid coolant in the liquid coolant circulation conduit 7.
In order to increase the contact area with the heat-conducting plate 3, the liquid coolant circulation duct 7 can be a two-channel flat tube for the liquid coolant circulation duct 7. Alternatively, the liquid coolant circulation pipe 7 may be partially or entirely embedded in the heat conductive plate 3 in order to be in more contact with the heat conductive plate 3.
In this embodiment, as a further technical solution, the method further includes: a temperature sensor; the temperature sensor is arranged in the industrial exchanger and used for detecting the heat dissipation chip 4 of the exchanger and feeding back the heat dissipation chip to the automatic control valve 8; the automatic control valve 8 selects the open and closed states of the first liquid coolant conduit 14 and the second liquid coolant conduit 15 based on the feedback temperature of the temperature sensor. When the heat generated by the heat dissipation chip 4 of the exchanger is not more than a certain limit, the automatic control valve 8 is controlled to open the channel of the first liquid coolant pipeline 14 and close the second liquid coolant pipeline 15 by giving a command through the temperature control sensor 6, so that the liquid coolant 10 with low thermal conductivity is used in circulation; when the heat generated by the heat sink chip 4 of the switch is larger than a certain limit, the automatic control valve 8 is controlled to open the channel of the second liquid coolant pipeline 15 and close the first liquid coolant pipeline 14 by giving a command through the temperature control sensor 6, so that the high-thermal-conductivity liquid coolant 11 is used in the circulation. Thereby achieving a selection of liquid coolant of different thermal conductivity with temperature changes.
In this embodiment, as a further technical solution, the method further includes: a liquid cooling heat sink pump 9; the liquid cooled heat sink pump 9 is disposed in a liquid coolant vessel 12 for powering a first liquid coolant conduit 14 and a second liquid coolant conduit 15. The circulation flow of the low-thermal-conductivity liquid coolant 10 or the high-thermal-conductivity liquid coolant 11 in the liquid coolant circulation pipe 7 is promoted by the power generation of the liquid-cooled heat-radiating pump 9.
In this embodiment, as a further technical solution, the method further includes: a liquid cooling heat radiation pump alarm device 5; and the liquid cooling heat dissipation pump alarm device 5 is in signal connection with the liquid cooling heat dissipation pump 9 and is used for sending out an alarm signal when the liquid cooling heat dissipation pump 9 breaks down. The liquid cooling heat dissipation pump alarm device 5 can detect the working state of the liquid cooling heat dissipation pump 9, and when the liquid cooling heat dissipation pump 9 is abnormal, an alarm signal is sent out to remind a user of timely maintenance.
In this embodiment, as a further technical solution, the liquid coolant container 12 is disposed outside the industrial exchanger, and a circulation loop is formed between the liquid coolant circulation pipe 7 and the liquid coolant container 12, and the liquid coolant can realize the circulation loop.
Of course, as for the first liquid coolant piping 14, its inlet is connected to the region for placing the low thermal conductivity liquid coolant 10, and its outlet is also connected to the region for placing the low thermal conductivity liquid coolant 10. Similarly, as for the second liquid coolant pipe 15, an inlet thereof is connected to a region for placing the high thermal conductivity liquid coolant 11, and an outlet thereof is also connected to a region for placing the high thermal conductivity liquid coolant 11.
The structure of the industrial switch can be selected according to actual needs. For example: the industrial switch comprises: the switch comprises a switch bottom shell 1 and a switch upper cover plate 2; the switch bottom shell 1 is provided with a switch heat dissipation chip 4; the heat conducting plate 3 is arranged on the heat radiating chip 4 of the switch, and the heat exchange part of the liquid coolant circulating pipeline 7 is continuously distributed on the heat conducting plate 3 in a bending manner.
To sum up, the utility model provides an industry switch liquid cooling heat abstractor can utilize the radiating mode of liquid cooling and reach high-efficient heat dissipation in the switch to can be according to chip temperature's change and the automatic selection coolant, thereby practice thrift the cost correlation cost, the heat dissipation gauge height and the high performance coolant problem of high performance device of final solution, with the outstanding performance of realization industry switch in the environment more abominable, promote the reliability of industry switch, and reduce the heat dissipation cost.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (8)
1. The utility model provides an industry switch liquid cooling heat abstractor which characterized in that includes: a liquid cooling heat dissipation module;
the liquid cooling heat dissipation module comprises a liquid coolant circulating pipeline and an automatic control valve; at least a portion of the liquid coolant circulation line is disposed within the interior of the industrial switch, the liquid coolant circulation line having a first liquid coolant line for transporting a low thermal conductivity liquid coolant and a second liquid coolant line for transporting a high thermal conductivity liquid coolant; the automatic control valve is used for respectively controlling the opening and closing states of the first liquid coolant pipeline and the second liquid coolant pipeline.
2. The industrial switch liquid-cooled heat sink of claim 1, wherein the liquid-cooled heat sink module further comprises: a heat conducting plate;
the heat-conducting plate set up in the inside of industry switch for give the heat transfer that the heat dissipation chip of switch produced liquid coolant circulating line.
3. The industrial switch liquid-cooled heat sink of claim 2, wherein the heat exchange portion of the liquid coolant circulation conduit is continuously bent.
4. The industrial switch liquid-cooled heat sink of claim 1, further comprising: a temperature sensor;
the temperature sensor is arranged in the industrial exchanger and used for detecting a heat dissipation chip of the exchanger and feeding back the heat dissipation chip to the automatic control valve; the automatic control valve selects the open and closed states of the first and second liquid coolant conduits based on the feedback temperature of the temperature sensor.
5. The industrial switch liquid-cooled heat sink of claim 1, further comprising: liquid cooling heat dissipation pumps;
the liquid-cooled heat sink pump is disposed in the liquid coolant vessel for powering the first liquid coolant conduit and the second liquid coolant conduit.
6. The industrial switch liquid-cooled heat sink of claim 5, further comprising: a liquid cooling heat dissipation pump alarm device;
the liquid cooling heat dissipation pump alarm device is in signal connection with the liquid cooling heat dissipation pump and used for sending out an alarm signal when the liquid cooling heat dissipation pump breaks down.
7. The industrial switch liquid-cooled heat sink of claim 5, wherein the liquid coolant container is disposed outside the industrial switch, and a circulation loop is formed between the liquid coolant circulation line and the liquid coolant container.
8. The industrial switch liquid-cooled heat sink of claim 2, wherein the industrial switch comprises: the switch comprises a switch bottom shell and a switch upper cover plate;
the switch bottom shell is provided with a switch heat dissipation chip; the heat conducting plate is arranged on the heat radiating chip of the switch, and the heat exchange part of the liquid coolant circulating pipeline is continuously distributed on the heat conducting plate in a bending manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920060840.5U CN210093798U (en) | 2019-01-15 | 2019-01-15 | Liquid cooling heat dissipation device for industrial switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920060840.5U CN210093798U (en) | 2019-01-15 | 2019-01-15 | Liquid cooling heat dissipation device for industrial switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210093798U true CN210093798U (en) | 2020-02-18 |
Family
ID=69470157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920060840.5U Active CN210093798U (en) | 2019-01-15 | 2019-01-15 | Liquid cooling heat dissipation device for industrial switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210093798U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109451714A (en) * | 2019-01-15 | 2019-03-08 | 天津卓越信通科技有限公司 | Liquid cooling heat dissipation device for industrial switch |
| CN111263572A (en) * | 2020-03-18 | 2020-06-09 | 连云港丰合新能源科技有限公司 | Temperature control radiator |
-
2019
- 2019-01-15 CN CN201920060840.5U patent/CN210093798U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109451714A (en) * | 2019-01-15 | 2019-03-08 | 天津卓越信通科技有限公司 | Liquid cooling heat dissipation device for industrial switch |
| CN109451714B (en) * | 2019-01-15 | 2024-02-27 | 天津卓越信通科技有限公司 | Liquid cooling heat abstractor of industrial switch |
| CN111263572A (en) * | 2020-03-18 | 2020-06-09 | 连云港丰合新能源科技有限公司 | Temperature control radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210093798U (en) | Liquid cooling heat dissipation device for industrial switch | |
| CN209314194U (en) | A kind of cooling system of liquid dipping machine cabinet | |
| CN209823474U (en) | Wireless charging equipment | |
| CN110300510A (en) | A kind of oil platform communication radiator of perfect heat-dissipating | |
| CN210865815U (en) | Intelligent heat dissipation oil-immersed transformer | |
| CN211019734U (en) | Novel heat dissipation regulator cubicle | |
| CN106783034B (en) | A kind of radiating device of oil-immersed transformer | |
| CN209314196U (en) | A kind of cooling system of liquid dipping machine cabinet | |
| CN101896045B (en) | Natural heat dissipation outdoor cabinet | |
| CN109451714B (en) | Liquid cooling heat abstractor of industrial switch | |
| CN217283820U (en) | Power supply with air cooling and liquid cooling device | |
| CN214957804U (en) | Water-cooling temperature control system | |
| CN214148465U (en) | Closed cooling water circulation device | |
| CN210865779U (en) | Transformer cooling device | |
| CN210292421U (en) | Integrated water-cooled heat exchanger | |
| CN116096028A (en) | Double rack formula data center and refrigerating system | |
| CN209768079U (en) | Liquid cooling heat dissipation device for industrial switch | |
| CN218677135U (en) | Heat source management system | |
| CN219658090U (en) | Liquid cooling heat dissipation system of server | |
| CN215002516U (en) | Assembly machine capable of achieving rapid cooling | |
| CN214957070U (en) | Battery pack heat exchange device and battery system | |
| CN220775629U (en) | Power conversion apparatus | |
| CN213178893U (en) | Efficient miniature refrigerator | |
| CN220402194U (en) | Data processing center with high heat dissipation efficiency | |
| CN117098368B (en) | Heat abstractor suitable for dc-to-ac converter concentrates arrangement for photovoltaic |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |