CN210091132U

CN210091132U - Touch panel

Info

Publication number: CN210091132U
Application number: CN201920742144.2U
Authority: CN
Inventors: 蔡宜珍; 方玮嘉; 朱俊鸿; 萧仲钦
Original assignee: Cambrios Technologies Corp
Current assignee: Cambrios Advanced Materials Quanzhou Corp; Cambrios Technologies Corp
Priority date: 2019-05-22
Filing date: 2019-05-22
Publication date: 2020-02-18
Anticipated expiration: 2029-05-22
Also published as: TWM599944U

Abstract

A touch panel, comprising: a substrate, wherein the substrate has a display area and a peripheral area; a plurality of peripheral leads arranged on the peripheral area; a plurality of first covers covering the peripheral leads; the touch sensing electrode is arranged in the display area of the substrate and is electrically connected with the peripheral leads, wherein the first covers and the touch sensing electrode comprise metal nanowires; and a patterned layer disposed on the first covers and the touch sensing electrodes in a patterned manner, the patterned layer having a printing side. The material is arranged on the metal nanowire layer or the metal layer in a patterning mode, and the patterning of the metal nanowire layer or the metal layer can be directly carried out without extra exposure and development steps, so that the purpose of simplifying the process is achieved, and the manufacturing cost is further controlled.

Description

Touch panel

Technical Field

The utility model relates to a touch panel.

Background

In recent years, transparent conductors have been used in many display or touch related devices to allow light to pass through and provide appropriate electrical conductivity. Generally, the transparent conductor may be various metal oxides, such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Cadmium Tin Oxide (CTO), or Aluminum-doped Zinc Oxide (AZO). However, these metal oxide thin films do not satisfy the flexibility requirements of display devices. Therefore, many flexible transparent conductors, for example, transparent conductors made of materials such as nanowires have been developed.

However, the nanowire process technology still has many problems to be solved, for example, the process of the touch panel mostly adopts an exposure and development step, and then removes the unnecessary part of metal according to the pattern, and the interference problem of the double-sided exposure must be overcome in the double-sided electrode manufacturing process.

Furthermore, utilize the nanowire preparation touch-control electrode, the alignment error region need be reserved when carrying out the counterpoint to the lead wire in nanowire and peripheral region, the alignment error region causes the unable reduction of lead wire size in peripheral region, and then leads to the width in peripheral region great, especially adopts Roll-to-Roll (Roll) technology, and the deformation volume of substrate leads to the size in alignment error region enlargies more (like 150um) for the minimum 2.5mm that only reaches of width in peripheral region, so can't satisfy the narrow frame demand of display.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an among the partial implementation mode, through with the material with the mode of patterning set up on metal nanowire layer or metal level, need not extra exposure development step just can directly carry out the patterning of metal nanowire layer or metal level to reach the purpose of simplifying technology, and then control the cost of manufacture.

The utility model discloses an among the partial implementation mode, once only etch through metal nanowire layer and metal level to reach the effect that does not need to reserve the counterpoint error zone when counterpointing to form the less peripheral lead wire of width, and then satisfy the demand of narrow frame.

According to the utility model discloses a partial implementation way, a touch panel, its characterized in that contains: a substrate, wherein the substrate has a display area and a peripheral area; a plurality of peripheral leads arranged on the peripheral area; a plurality of first covers covering the peripheral leads; the touch sensing electrode is arranged in the display area of the substrate and is electrically connected with the peripheral leads, wherein the first covers and the touch sensing electrode comprise metal nanowires; a patterned layer is disposed on the first covers and the touch sensing electrodes in a patterned manner, and the patterned layer has a printing side.

In some embodiments of the present invention, the patterned layer and the first covers form a first composite structure, or the patterned layer and the touch sensing electrode form a second composite structure.

In some embodiments of the present invention, the first cover has a side surface, the side surface and a side surface of the peripheral leads are a common etching surface, and the common etching surface and the printing side surface are aligned with each other.

In some embodiments of the present invention, the display device further includes a plurality of marks disposed in the peripheral area and a plurality of second covers covering the marks, wherein the second covers include metal nanowires.

In some embodiments of the present invention, the patterned layer is disposed on the second covers, and the patterned layer and the second covers form a third composite structure.

In some embodiments of the present invention, the second cover has a side surface, and the side surface and a side surface of the marks are a common etching surface, and the common etching surface and the printing side surface are aligned with each other.

In some embodiments of the present invention, the method further comprises: a film layer.

In some embodiments of the present invention, the peripheral leads and the marks are made of metal material. The peripheral leads are made of the same layer of metal material as the label.

In some embodiments of the present invention, the peripheral area further includes a shielding wire disposed in the peripheral area and a third covering the shielding wire, wherein the third covering includes the metal nanowire.

In some embodiments of the present invention, the patterned layer is disposed on the third covering, and the patterned layer and the third covering form a fourth composite structure.

Drawings

Fig. 1A to 1C are schematic step views of a method for manufacturing a touch panel according to some embodiments of the present invention.

Fig. 2 is a schematic top view of a touch panel according to some embodiments of the present invention.

Fig. 2A is a schematic cross-sectional view taken along line a-a of fig. 2.

Fig. 2B is a schematic cross-sectional view taken along line B-B of fig. 2.

Fig. 3 is a schematic top view of a touch panel and a flexible printed circuit board according to some embodiments of the present invention.

Fig. 4 is a schematic view of a touch panel according to another embodiment of the present invention.

Fig. 5 is a schematic top view of a touch panel according to another embodiment of the present invention.

Fig. 5A is a schematic cross-sectional view taken along line a-a of fig. 5.

Fig. 6A to 6C are schematic step diagrams of a method for manufacturing a touch panel according to some embodiments of the present invention.

Fig. 7 is a schematic top view of a touch panel according to another embodiment of the present invention.

Fig. 7A is a schematic cross-sectional view taken along line a-a of fig. 7.

Fig. 7B is a schematic sectional view taken along line B-B of fig. 7.

Fig. 8 is a schematic view of a touch panel according to another embodiment of the present invention.

Fig. 9 is a schematic top view of a touch panel according to another embodiment of the present invention.

Fig. 9A is a schematic cross-sectional view taken along line a-a of fig. 9.

Fig. 10 is a schematic top view of a touch panel according to another embodiment of the present invention.

Wherein the reference numerals are:

100: touch panel

110: substrate

120: peripheral lead wire

122: side surface

124: upper surface of

140: marking

142: side surface

144: upper surface of

130: film layer

136: non-conductive region

160: shielded conductor

170: flexible circuit board

ML: metal layer

NWL: metal nanowire layer

PL: patterned layer

M1: a first intermediate layer

M1L: side surface

M2: second intermediate layer

M2L: side surface

VA: display area

PA: peripheral zone

BA: bonding region

TE 1: first touch electrode

TE 2: second touch electrode

TE: touch electrode

C1: first cover

C1L: side surface

C2: second cover

C2L: side surface

D1: a first direction

D2: second direction

Detailed Description

In the following description, numerous implementation details are set forth in order to provide a more thorough understanding of the present invention. It should be understood, however, that these implementation details should not be used to limit the invention. That is, in some embodiments of the invention, details of these implementations are not necessary. In addition, some conventional structures and components are shown in simplified schematic form in the drawings.

As used herein, "about" or "approximately" generally means that the numerical value has an error or range within twenty percent, preferably within ten percent, and more preferably within five percent. Unless expressly stated otherwise, all numerical values mentioned are approximate, i.e., have an error or range as indicated by the term "about", "approximately" or "approximately".

Please refer to fig. 2 to 2B, which are schematic top view and schematic cross-sectional view of a touch panel 100 according to some embodiments of the present invention. The touch panel 100 includes a substrate 110, a peripheral lead 120, a first cover C1, a patterned layer PL, and a touch sensing electrode TE. Referring to fig. 2, the substrate 110 has a display area VA and a peripheral area PA disposed at a side of the display area VA, for example, the peripheral area PA may be a frame-shaped area disposed at a periphery (i.e. covering a right side, a left side, an upper side and a lower side) of the display area VA, but in other embodiments, the peripheral area PA may be an L-shaped area disposed at the left side and the lower side of the display area VA. As shown in fig. 2, the present embodiment has eight groups of peripheral wires 120 and the first covers C1 corresponding to the peripheral wires 120 are disposed on the peripheral area PA of the substrate 110; the touch sensing electrode TE is substantially disposed in the display area VA of the substrate 110.

By transferring the pattern through the patterned layer PL, the first cover C1 can be disposed on the upper surface 124 of the peripheral lead 120, so that the upper and lower layers of material can mold the first cover C1 and the peripheral lead 120 at predetermined positions without aligning, thereby reducing or avoiding the need to provide an alignment error region in the process, thereby reducing the width of the peripheral region PA and achieving the narrow frame requirement of the display.

Referring to fig. 2, the touch panel 100 further includes a mark 140 and a second cover C2, and in the embodiment, two sets of marks 140 and a second cover C2 corresponding to the marks 140 are disposed in the peripheral area PA of the substrate 110. The number of the peripheral leads 120, the marks 140, the first cover C1, the second cover C2 and the touch sensing electrodes TE may be one or more, and the numbers drawn in the following embodiments and drawings are only for illustrative purposes and are not intended to limit the present invention.

Specifically, referring to fig. 1A to 1C, the touch panel 100 according to the embodiment of the present invention can be manufactured as follows: first, a substrate 110 having a peripheral area PA and a display area VA defined in advance is provided. Then, forming a metal layer ML in the peripheral area PA (as shown in fig. 1A); then, forming a metal Nanowire (NWL) layer in the peripheral region PA and the display region VA (as shown in fig. 1B); then, forming a patterned layer PL on the metal nanowire layer NWL (as shown in fig. 1C); then, patterning is performed according to the patterned layer PL to form a patterned metal layer ML and a patterned metal nanowire layer NWL. This will be described in more detail below.

Referring to fig. 1A, a metal layer ML is formed on the peripheral region PA of the substrate 110, and the metal layer ML may be patterned into the peripheral wires 120. In detail, in some embodiments of the present invention, the metal layer ML may be made of metal with better conductivity, preferably a single-layer metal structure, such as a silver layer, a copper layer, etc.; or a multi-layer conductive structure, such as molybdenum/aluminum/molybdenum, copper/nickel, titanium/aluminum/titanium, molybdenum/chromium, etc., which is preferably opaque, such as having a light Transmission of less than about 90% for visible light (e.g., wavelengths between 400nm and 700 nm).

In the present embodiment, the metal may be formed on the substrate 110 by sputtering (such as but not limited to physical sputtering, chemical sputtering, etc.). The metal layer ML may be selectively formed in the peripheral region PA directly instead of the display region VA, or may be formed entirely in the peripheral region PA and the display region VA, and then the metal layer ML in the display region VA is removed by etching.

In one embodiment, the copper layer is deposited on the peripheral area PA of the substrate 110 by electroless plating, i.e., under the condition of no external current, by using a suitable reducing agent, metal ions in the plating solution are reduced to metal under the catalysis of a metal catalyst and plated on the surface of the metal ions, which is called electroless plating (electroless plating) or autocatalytic plating (autocatalytic plating), so the metal layer ML of the embodiment can be called electroless plating, electroless plating or autocatalytic plating. Specifically, for example, a plating solution whose main component is copper sulfate may be used, and the composition thereof may be, but is not limited to: copper sulfate (copper sulfate) at a concentration of 5g/L, ethylenediaminetetraacetic acid (ethylenediamine tetraacetic acid) at a concentration of 12g/L, formaldehyde (formaldehyde) at a concentration of 5g/L, the pH of the electroless copper plating solution was adjusted to about 11 to 13 with sodium hydroxide (sodium hydroxide), the plating bath temperature was about 50 to 70 ℃, and the reaction time for immersion was 1 to 5 minutes. In one embodiment, a catalytic layer (not shown) may be formed on the peripheral area PA of the substrate 110, and since the catalytic layer is not in the display area VA, the copper layer is deposited only in the peripheral area PA and is not formed in the display area VA. During the electroless plating reaction, the copper material can nucleate on the catalytic layer with catalytic/activating capability, and then the copper film can grow continuously by the self-catalysis of copper.

Next, referring to fig. 1B, a metal nanowire layer NWL at least including metal nanowires, such as a silver nanowire (silver nanowire) layer, a gold nanowire (gold nanowire) layer, or a copper nanowire (copper nanowire) layer, is coated on the peripheral region PA and the display region VA; a first portion of the metal nanowire layer NWL is located in the display area VA, the first portion is mainly formed on the substrate 110, and a second portion in the peripheral area PA is mainly formed on the metal layer ML. The embodiment is embodied as follows: the dispersion or slurry (ink) having the metal nanowires is formed on the substrate 110 by a coating method, and is dried to coat the metal nanowires on the surfaces of the substrate 110 and the metal layer ML, thereby forming the metal nanowire layer NWL disposed on the substrate 110 and the metal layer ML. After the curing/drying step, the solvent and other substances are volatilized, and the metal nanowires are randomly distributed on the surface of the substrate 110 and the metal layer ML; preferably, the metal nanowires 140 are fixed on the surface of the substrate 110 and the metal layer ML without falling off to form the metal nanowire layer NWL, and the metal nanowires may contact each other to provide a continuous current path, thereby forming a conductive network (conductive network).

In embodiments of the present invention, the dispersion may be water, alcohol, ketone, ether, hydrocarbon or aromatic solvent (benzene, toluene, xylene, etc.); the dispersion may also contain additives, surfactants or binders such as carboxymethylcellulose (CMC), 2-Hydroxyethylcellulose (HEC), Hydroxypropylmethylcellulose (HPMC), sulfonates, sulfates, disulfonates, sulfosuccinates, phosphates or fluorosurfactants, and the like. The dispersion or slurry containing the metal nanowires can be formed on the surface of the substrate 110 and the metal layer ML by any method, such as but not limited to: screen printing, nozzle coating, roller coating and other processes; in one embodiment, the dispersion or slurry containing the metal nanowires can be applied to the surface of the continuously supplied substrate 110 and the metal layer ML by a roll-to-roll (RTR) process.

As used herein, "metal nanowires (metal nanowires)" is a collective term referring to a collection of metal wires comprising a plurality of elemental metals, metal alloys or metal compounds (including metal oxides), wherein the number of metal nanowires contained therein does not affect the scope of the claimed invention; and at least one cross-sectional dimension (i.e., cross-sectional diameter) of the single metal nanowire is less than about 500nm, preferably less than about 100nm, and more preferably less than about 50 nm; the metal nanostructures referred to in the present invention as "wires" mainly have a high aspect ratio, for example, between about 10 and 100,000, and more particularly, the aspect ratio (length: diameter of cross section) of the metal nanowires may be greater than about 10, preferably greater than about 50, and more preferably greater than about 100; the metal nanowires can be any metal including, but not limited to, silver, gold, copper, nickel, and gold-plated silver. Other terms such as silk (silk), fiber (fiber), tube (tube) and the like having the same dimensions and high aspect ratio are also included in the scope of the present invention.

Next, referring to fig. 1C, a patterned layer PL is formed on the metal nanowire layer NWL. In one embodiment, the patterned layer PL is formed by using a flexible printing (flexography) technique to directly form a material with a patterned structure on the metal nanowire layer NWL; in other words, the patterned layer PL has a specific pattern while being formed on the working surface (in this embodiment, the metal nanowire layer NWL), so that a patterning step for the coated material is not required. According to one or more embodiments of the present invention, the patterned layer PL may be formed by a flexographic printing method, such as but not limited to a printing apparatus comprising at least a supply roll and a printing roll having a flexographic printing structure thereon. In operation, the feed roller rotates to transfer the material to be printed from the feed tray to the feed roller; then, the material to be printed is transferred to a flexographic printing structure along with the rotation of the feeding roller; the flexographic printing structure may include a contact surface having a specific pattern to transfer the material to be printed onto the metal nanowire layer NWL according to the specific pattern. In one embodiment, the material to be printed is printed on the metal nanowire layer NWL and then a curing step is performed according to the material characteristics. In one embodiment, the patterned layer PL is formed by transferring the material to be printed onto the metal nanowire layer NWL according to a specific pattern by letterpress printing, gravure printing, screen printing or the like. The patterned layer PL fabricated according to the above method may have a printing side different from a side formed by a conventional process such as exposure, development or etching.

The patterned layer PL may be formed in the peripheral area PA according to the above-mentioned method, or may be formed in the peripheral area PA and the display area VA. The patterned layer PL (also referred to as a second patterned layer) in the peripheral area PA is mainly used as an etching mask in the peripheral area PA for patterning the metal nanowire layer NWL and the metal layer ML in the peripheral area PA in the following steps, and the patterned layer PL (also referred to as a first patterned layer) in the display area VA is mainly used as an etching mask in the display area VA for patterning the metal nanowire layer NWL in the display area VA in the following steps.

Embodiments of the present invention are not limited to the material of the patterned layer PL (i.e. the aforementioned material to be printed), for example, the polymer material includes the following: various photoresist materials, bottom coating materials, outer coating materials, protective layer materials, insulating layer materials and the like, and the high polymer materials can be phenolic resin, epoxy resin, acrylic resin, PU resin, ABS resin, amino resin, silicone resin and the like. The material of the patterned layer PL may be photo-curable or thermal-curable, in terms of material characteristics. In one embodiment, the material of the patterned layer PL has a viscosity of about 200 cps to about 1500cps and a solid content of about 30-100%.

Then, patterning is performed, and after the patterning step, the touch panel 100 shown in fig. 2 can be manufactured. In one embodiment, the metal layer ML and the metal nanowire layer NWL are patterned in the same process by using an etching solution capable of simultaneously etching the metal nanowire layer NWL and the metal layer ML in the peripheral region PA in cooperation with an etching mask formed by the patterned layer PL (also referred to as a second patterned layer). As shown in fig. 2 and 2B, the patterned metal layer ML formed on the peripheral region PA is the peripheral circuit 120, and the patterned metal nanowire layer NWL constitutes an etching layer, which is located on the peripheral circuit 120 and can be referred to as a first cover C1; in other words, after the patterning step, the peripheral area PA forms the first coverages C1 composed of the second portions of the metal nanowire layers NWL and the peripheral lines 120 composed of the metal layer ML. In another embodiment, an etching layer formed by the second portion of the metal nanowire layer NWL, and the peripheral circuit 120 and the mark 140 formed by the metal layer ML (see fig. 2, 2A and 2B) may be fabricated on the peripheral region PA, wherein the etching layer may include a first cover C1 and a second cover C2, the first cover C1 is disposed on the corresponding peripheral circuit 120, and the second cover C2 is disposed on the corresponding mark 140. In one embodiment, the metal nanowire layer NWL and the metal layer ML can be etched simultaneously, meaning that the ratio of the etching rates of the metal nanowire layer NWL and the metal layer ML is between about 0.1-10 or 0.01-100.

According to one embodiment, in the case where the metal nanowire layer NWL is a nano-silver layer and the metal layer ML is a copper layer, the etching solution can be used to etch copper and silver, for example, the etching solution has H3PO4 (ratio of about 55% to 70%) and HNO3 (ratio of about 5% to 15%) as main components to remove the copper material and the silver material in the same process. In another embodiment, additives, such as etch selectivity modifiers, may be added in addition to the main components of the etching solution to adjust the rates of etching copper and etching silver; for example, about 5% to 10% of Benzotriazole (BTA) can be added to the main components H3PO4 (at a ratio of about 55% to 70%) and HNO3 (at a ratio of about 5% to 15%) to solve the problem of over-etching of copper. In another specific embodiment, the main component of the etching solution is ferric chloride/nitric acid or phosphoric acid/hydrogen peroxide.

The patterning step may further include: the patterning of the metal nanowire layer NWL in the display area VA is performed at the same time. In other words, as shown in fig. 1C, the etching solution can be used to pattern the first portion of the metal nanowire layer NWL of the display area VA to form the touch sensing electrode TE in the display area VA, and the touch sensing electrode TE can be electrically connected to the peripheral lead 120, in cooperation with the etching mask formed by the patterned layer PL (i.e., the first patterned layer). Specifically, the touch sensing electrode TE may also be a metal nanowire layer at least including metal nanowires, that is, the patterned metal nanowire layer NWL forms the touch sensing electrode TE in the display area VA and forms the first cover C1 in the peripheral area PA, so that the touch sensing electrode TE can be electrically connected to the peripheral lead 120 for signal transmission by the contact between the first cover C1 and the peripheral lead 120. The metal nanowire layer NWL also forms a second cover C2 on the upper surface 144 of the mark 140 in the peripheral region PA, and the mark 140 can be broadly interpreted as a pattern with a non-electrical function, but not limited thereto. In some embodiments of the present invention, the peripheral lead 120 and the mark 140 may be made of the same metal layer ML (i.e., they are made of the same metal material, such as the aforementioned electroless copper plating layer or sputtering copper plating layer); the touch sensing electrode TE, the first cover C1 and the second cover C2 may be fabricated from the same metal nanowire layer NWL.

In an alternative embodiment, the metal nanowire layers NWL in the display area VA and the peripheral area PA can be patterned by different etching steps (i.e. different etching solutions are used), for example, in the case that the metal nanowire layers NWL are nano-silver layers and the metal layer ML is a copper layer, the etching solution used in the display area VA can be an etching solution having an etching capability only for silver. In other words, the etching rate of the etching solution for silver is greater than about 100 times, about 1000 times, or about 10000 times the etching rate for copper.

According to one embodiment, the material of the patterned layer PL is chosen to be a material that is capable of remaining in the structure, i.e. the patterned layer PL is not removed after the above-mentioned etching step. For example, the patterned layer PL may be a photo-curable material with high transmittance, low dielectric constant and low haze, so as to maintain the transmittance of the touch sensing electrode TE in the display area VA between about 88% and 94%, the haze between about 0 and 2 and the area resistance between about 10 and 150 ohms/square (ohm/square), and the photoelectric property of the patterned layer PL enables the combination of the patterned layer PL and the metal nanowire layer NWL to meet the optical and touch sensing requirements of the display area VA. In this embodiment, a curing step (e.g., UV curing) may be further included, after the curing step, the composite structure formed by the touch sensing electrode TE and the patterned layer PL in the display area VA may preferably have conductivity and light transmittance, for example, the light transmittance (Transmission) of visible light (e.g., wavelength between about 400nm and 700nm) of the composite structure may be greater than about 80%, and the surface resistivity (surface resistance) may be between about 10 to 1000 ohm/square (ohm/square); preferably, the composite structure has a light Transmission (Transmission) of greater than about 85% in visible light (e.g., wavelengths between about 400nm and 700nm) and a surface resistivity (surface resistance) between about 50 and 500 ohms/square (ohm/square).

In addition, the patterned layer PL may form a composite structure with the metal nanowire layer NWL (such as the first cover C1, the second cover C2 or the touch sensing electrode TE) to have certain specific chemical, mechanical and optical properties, such as adhesion of the touch sensing electrode TE, the first cover C1, the second cover C2 and the substrate 110, or better physical mechanical strength, so the patterned layer PL may also be referred to as a matrix (matrix). In yet another aspect, the patterned layer PL is made of certain specific polymers to provide additional scratch and abrasion resistant surface protection to the touch sensing electrode TE, the first cover C1, and the second cover C2, in which case the patterned layer PL may also be referred to as an overcoat (overcoat), and the use of materials such as polyacrylate, epoxy, polyurethane, polysilane, silicone, poly (silicon-acrylic acid) and the like can provide the touch sensing electrode TE, the first cover C1, and the second cover C2 with higher surface strength to improve scratch resistance. However, the above is only to illustrate the possibility of other additional functions/names of the patterned layer PL and is not intended to limit the present invention. It should be noted that the drawings herein depict the patterned layer PL and the touch sensing electrode TE, the first cover C1, and the second cover C2 as different layer structures, but in one embodiment, the polymer used for making the patterned layer PL may penetrate between the metal nanowires before or in a pre-cured state to form a filler, and the metal nanowires may be embedded in the patterned layer PL after the polymer is cured. That is, the present invention does not limit the structure between the patterned layer PL and the metal nanowire layer NWL (e.g., the first cover C1, the second cover C2, or the touch sensing electrode TE).

Fig. 2 is a schematic top view of a touch panel 100 according to an embodiment of the present invention, and fig. 2A and 2B are cross-sectional views of a-a line and a-B line of fig. 2, respectively. Referring to fig. 2A, as shown in fig. 2A, the peripheral wires 120 and the marks 140 are disposed in the peripheral region PA, the first cover C1 and the second cover C2 are respectively formed to cover the upper surfaces 124 and 144 of the peripheral wires 120 and the marks 140, and the patterned layer PL is remained on the first cover C1 and the second cover C2 after the etching process. In some embodiments of the present invention, the metal nanowire may be a silver nanowire. For convenience of illustration, the cross-section of the peripheral leads 120 and the marks 140 is a quadrilateral (e.g., a rectangle as drawn in fig. 2A), but the configuration or number of the side surfaces 122 and the upper surface 124 of the peripheral leads 120 and the side surfaces 142 and the upper surface 144 of the marks 140 may vary according to practical applications, and is not limited by the text and the drawings herein.

In the present embodiment, the mark 140 is a bonding area BA disposed in the peripheral area PA, which is a mark for aligning an external circuit board, such as a flexible circuit board 170, with the touch panel 100 in a step of connecting the flexible circuit board 170 to the touch panel 100 (i.e., a bonding step) (please refer to fig. 2). However, the present invention is not limited to the placement position or function of the mark 140, for example, the mark 140 may be any inspection mark, pattern or label required in the process, and is within the protection scope of the present invention. The indicia 140 may have any possible shape, such as a circle, a quadrilateral, a cross, an L-shape, a T-shape, and so forth. On the other hand, the portion of the peripheral lead 120 extending to the bonding area BA may also be referred to as a connection portion (bonding section), and the upper surface of the connection portion at the bonding area BA is also covered by the first cover C1, as in the previous embodiment.

As shown in fig. 2A and 2B, in the peripheral region PA, a non-conductive region 136 is disposed between adjacent peripheral wires 120 to electrically isolate the adjacent peripheral wires 120 and thus avoid short circuit. That is, the side surfaces 122 of the adjacent peripheral wires 120 have the non-conductive region 136 therebetween, and in the present embodiment, the non-conductive region 136 is a gap (gap) to isolate the adjacent peripheral wires 120. The side surface 122 of the peripheral lead 120 and the side surface C1L of the first cover C1 are aligned with each other, that is, the side surface 122 of the peripheral lead 120 and the side surface C1L of the first cover C1 are formed in the same etching step according to the printed side surface of the patterned layer PL using the printed side surface of the patterned layer PL as a reference, so that the printed side surface and the same etched surface are aligned with each other; similarly, side 142 of indicium 140 is in common with and aligned with side C2L of second overlay C2, and the printed side of patterned layer PL is also in common with the etched side. In one embodiment, the side C1L of the first cap C1 and the side C2L of the second cap C2 are not covered by the metal nanowires due to the etching process. Furthermore, the patterned layer PL, the peripheral wires 120 and the first cover C1 have the same or similar patterns and sizes, such as long and straight patterns, and the same or similar widths; the patterned layer PL, indicia 140 and second cover C2 may likewise have the same or similar patterns and dimensions, such as circles, quadrilaterals, etc., all of the same or similar radius, or other same or similar patterns of crosses, L-shapes, T-shapes, etc.

As shown in fig. 2B, in the display area VA, a non-conductive area 136 is disposed between the adjacent touch sensing electrodes TE to electrically block the adjacent touch sensing electrodes TE and thus avoid short circuit. That is, the sidewall of the adjacent touch sensing electrode TE has a non-conductive region 136 therebetween, and in the present embodiment, the non-conductive region 136 is a gap (gap) to isolate the adjacent touch sensing electrode TE; in one embodiment, the above-mentioned etching method can be used to form the gap between the adjacent touch sensing electrodes TE, so that the printed side of the patterned layer PL and the etched side of the touch sensing electrode TE are coplanar and aligned with each other. In the present embodiment, the touch sensing electrode TE and the first cover C1 can be fabricated by using the same metal nanowire layer NWL (e.g., a layer of silver nanowires) so that at the boundary between the display area VA and the peripheral area PA, the metal nanowire layer NWL forms a climbing structure to facilitate the formation of the metal nanowire layer NWL and cover the upper surface 124 of the peripheral lead 120, thereby forming the first cover C1.

The utility model discloses an among the partial implementation, touch panel 100's first cover C1 sets up in the upper surface 124 of peripheral lead wire 120, and first cover C1 and peripheral lead wire 120 shape in same etching process, so can reach and reduce or avoid setting up the demand in counterpoint error zone in the technology, thereby reduce the width in peripheral region PA, and then reach the narrow frame demand of display. Specifically, the width of the peripheral lead 120 of the touch panel 100 of some embodiments of the present invention is about 5um to 30um, the distance between adjacent peripheral leads 120 is about 5um to 30um, or the width of the peripheral lead 120 of the touch panel 100 is about 3um to 20um, the distance between adjacent peripheral leads 120 is about 3um to 20um, and the width of the peripheral area PA can also reach the size of about less than 2mm, which reduces the size of the frame by about 20% or more compared with the conventional touch panel product.

In some embodiments of the present invention, the touch panel 100 further has a second cover C2 and a mark 140, the second cover C2 is disposed on the upper surface 144 of the mark 140, and the second cover C2 and the mark 140 are formed in the same etching process.

Fig. 3 shows an assembly structure after the flexible circuit board 170 and the touch panel 100 are aligned, wherein electrode pads (not shown) of the flexible circuit board 170 may be electrically connected to the peripheral leads 120 of the bonding area BA on the substrate 110 through a conductive adhesive (not shown), such as an anisotropic conductive adhesive. In some embodiments, the first cover C1 in the bonding area BA may be opened with an opening (not shown) to expose the peripheral wires 120, and a conductive adhesive (e.g., an anisotropic conductive adhesive) may be filled in the opening of the first cover C1 to directly contact the peripheral wires 120 to form a conductive path. In the present embodiment, the touch sensing electrodes TE are arranged in a non-staggered manner. For example, the touch sensing electrode TE is a strip-shaped electrode extending along the first direction D1 and having a width varying along the second direction D2, which are not staggered with each other, but in other embodiments, the touch sensing electrode TE may have a suitable shape, which should not limit the scope of the present invention. In this embodiment, the touch sensing electrodes TE are configured in a single layer, wherein the touch position can be obtained by detecting the capacitance change of each touch sensing electrode TE. Furthermore, the patterned layer PL and the touch sensing electrode TE have the same or similar patterns and sizes, such as the above-mentioned patterns of the strip-shaped electrode extending along the first direction D1 and having the width variation in the second direction D2, and the sizes are the same or similar.

The present invention can also apply the above method to the double-sided touch panel 100 manufactured on the double sides of the substrate 110, for example, the method can be manufactured as follows: first, a substrate 110 having a peripheral area PA and a display area VA defined in advance is provided. Then, forming a metal layer ML on the first and second surfaces (such as the upper surface and the lower surface) of the substrate 110, where the metal layer ML is located in the peripheral region PA; then, respectively forming metal nanowire (metal nanowire) layers NWL in the peripheral area PA and the display area VA of the first surface and the second surface; then forming a patterning layer PL on the metal nanowire layers NWL on the first surface and the second surface respectively; then, a patterning step is performed on the first and second surfaces according to the patterned layer PL, so as to form the touch sensing electrode TE and the peripheral lead 120 on the first and second surfaces, and the first cover C1 covers the peripheral lead 120. The patterned layer PL may be formed by a flexographic printing process on the metal nanowire layer NWL on the first and second surfaces, respectively, as shown in fig. 4. Since the embodiment does not need to go through the yellow light process (such as exposure and development), the problem of mutual influence/interference of the two-sided processes is avoided, which is beneficial to simplifying the process and improving the yield. The foregoing is referred to for a specific implementation of this embodiment, and details are not repeated herein.

Fig. 5 is a touch panel 100 according to an embodiment of the present invention, which includes a substrate 110, touch sensing electrodes TE formed on the upper and lower surfaces of the substrate 110 (i.e., a first touch sensing electrode TE1 and a second touch sensing electrode TE2 formed on a metal nanowire layer NWL), and a peripheral circuit 120 formed on the upper and lower surfaces of the substrate 110; for simplicity of the drawing, fig. 5 does not show the first and second coverlets C1, C2 and the patterned layer PL. The first touch sensing electrode TE1 of the display area VA and the peripheral circuit 120 of the peripheral area PA are electrically connected to each other to transmit signals when viewed from the upper surface of the substrate 110; similarly, the second touch sensing electrode TE2 of the display area VA and the peripheral circuit 120 of the peripheral area PA are electrically connected to each other to transmit signals when viewed from the lower surface of the substrate 110. In addition, as in the previous embodiment, a patterned layer PL (as shown in fig. 5A) is formed on each of the first touch sensing electrode TE1 and the second touch sensing electrode TE 2; the peripheral circuit 120 is made of a metal layer ML on which a first coverlay C1 and a patterned layer PL are formed (also shown in fig. 5A). The embodiment may further include the mark 140 and the second cover C2 corresponding to the mark 140 disposed on the peripheral region PA of the substrate 110, which is described in detail above.

Referring to fig. 5 in conjunction with the cross-sectional view shown in fig. 5A, in an embodiment, the first touch sensing electrode TE1 is substantially located in the display area VA, which may include a plurality of long and straight sensing electrodes extending along the same direction (e.g., the first direction D1), and the etching removal area may be defined as a non-conductive area 136 to electrically block adjacent sensing electrodes. Each sensing electrode is provided with a patterned layer PL, and the first touch sensing electrode TE1 and the patterned layer PL are provided with corresponding patterns; in one embodiment, the first touch sensing electrode TE1 and the patterned layer PL have substantially the same pattern, such as the long straight bar shape described above, and the first touch sensing electrode TE1 and the patterned layer PL have mutually aligned sides or sides. Similarly, the second touch sensing electrode TE2 is substantially located in the display area VA, and may include a plurality of sensing electrodes extending in the same direction (e.g., the second direction D2), and the removed area may be defined as a non-conductive area 136 to electrically block adjacent sensing electrodes. Each of the sensing electrodes has a patterned layer PL thereon. The second touch sensing electrode TE2 and the patterned layer PL have corresponding patterns, and in one embodiment, the second touch sensing electrode TE2 and the patterned layer PL have substantially the same pattern, such as the long straight bar, and the second touch sensing electrode TE2 and the patterned layer PL have side surfaces aligned with each other). The first touch sensing electrode TE1 and the second touch sensing electrode TE2 are staggered in structure, and can constitute a touch sensing electrode TE for sensing a touch or controlling a gesture.

Referring to fig. 6A to 6C, a touch panel according to another embodiment of the present invention can be manufactured as follows: first, a substrate 110 having a peripheral area PA and a display area VA defined in advance is provided. Then, forming a metal nanowire (metal nanowire) layer NWL in the peripheral area PA and the display area VA; then, forming a metal layer ML in the peripheral area PA (see fig. 6A); then, a patterned layer PL is formed on the metal nanowire layer NWL (see fig. 6B); then, patterning is performed according to the patterned layer PL to form a patterned metal layer ML and a patterned metal nanowire layer NWL (see fig. 6C). The difference between the present embodiment and the previous embodiments is at least in the forming sequence of the metal layer ML and the metal nanowire layer NWL, that is, the present embodiment first manufactures the metal nanowire layer NWL, and then manufactures the metal layer ML. For example, the patterned layer PL may be formed by a flexographic printing process to dispose the patterned layer PL on the metal layer ML and the metal nanowire layer NWL; the pattern of the patterned layer PL is transferred to the metal layer ML and the metal nanowire layer NWL by etching.

The present embodiment can also directly form the material on the workpiece, such as the metal layer ML of the present embodiment, in a patterned manner by using a flexographic printing technique. In this embodiment, a photoresist material is selected to form the patterned layer PL; specifically, a photoresist with a viscosity of about 300-; and a thermosetting type material can be selected, and the thermosetting conditions can be that the curing temperature is less than 130 ℃ and the curing time is less than 60 seconds. In one embodiment, a photoresist with acid-resistant etching characteristics may be selected for the direct back-end etching process.

After the patterning step, the method further includes a step of removing the patterned layer PL. In particular embodiments, the stripping may be by an organic solvent or an alkaline stripper, such as: KOH, K₂CO₃And Propylene Glycol Methyl Ether Acetate (PGMEA). In other words, after the etching step, the patterned layer PL is removed without remaining in the structure of the product.

The foregoing references to other detailed manufacturing methods of this embodiment, and the details are not repeated herein.

Referring to fig. 7, which shows a touch panel 100 (with the patterned layer PL removed) completed by the present invention, fig. 7A and 7B are respectively a cross section a-A, B-B in fig. 7, where the cross section a-a shows a pattern located in the peripheral area PA, and the cross section B-B shows a pattern located in the peripheral area PA and the display area VA. As shown in fig. 7A and 7B, after the metal nanowire layer NWL and the metal layer ML in the peripheral area PA are subjected to an etching step (such as the aforementioned one-time etching), a gap (i.e., a non-conductive area 136) may be formed, i.e., an etching layer formed by patterning the metal nanowire layer NWL and the peripheral circuit 120 formed by the metal layer ML are formed in the peripheral area PA; since the etching layer is located between the peripheral circuits 120 and the substrate 110, it can be referred to as the first interlayer M1, in other words, the first interlayer M1 is patterned under the peripheral circuits 120, and the non-conductive region 136 is located between adjacent peripheral circuits 120; moreover, the side surface 122 of the peripheral wire 120 and the side surface M1L of the first middle layer M1 are a common etching surface and aligned with each other, that is, the side surface 122 of the peripheral wire 120 and the side surface M1L of the first middle layer M1 are formed according to the side wall of the patterned layer PL in the same etching step by using the side wall of the patterned layer PL as a reference in the patterning step. Because the structure layer of the peripheral area PA is patterned in the same step, the traditional alignment step can be omitted, and the requirement of setting an alignment error area in the process is reduced or avoided, so that the width of the peripheral area PA is reduced, and the narrow frame requirement of the touch panel/the touch display is met.

In another embodiment, the peripheral area PA may have an etching layer formed by a metal nanowire layer NWL, and the peripheral circuit 120 and the mark 140 formed by the metal layer ML, and the etching layer may include a first middle layer M1 and a second middle layer M2, the first middle layer M1 is disposed between the peripheral circuit 120 and the substrate 110, the second middle layer M2 is disposed between the mark 140 and the substrate 110, and the side 142 of the mark 140 and the side M2L of the second middle layer M2 are a common etching surface and aligned with each other.

As shown in fig. 7B, in the display area VA, the metal nanowire layer NWL also uses the patterned layer PL as an etching mask to form the touch sensing electrode TE in the patterning step. In the present embodiment, the metal nanowire layer NWL is patterned to form voids to form non-conductive regions 136 between adjacent touch sensing electrodes TE. Furthermore, the touch sensing electrode TE can be electrically connected to the peripheral circuit 120 through the metal nanowire layer NWL extending to the peripheral region PA.

In another embodiment, the touch panel 100 may include a film layer 130 or a protection layer. For example, fig. 8 is a schematic view of the film 130 formed on the embodiment shown in fig. 7B. In one embodiment, the film 130 covers the touch panel 100 comprehensively, for example, the film 130 may be disposed in the display area VA and the peripheral area PA to cover the touch sensing electrodes TE, the peripheral circuit 120 and/or the marks 140. As shown, in the peripheral area PA, the film 130 covers the first peripheral wires 120, and the film 130 fills the non-conductive area 136 between the adjacent peripheral wires 120, that is, the non-conductive area 136 between the adjacent peripheral wires 120 has a filling layer made of the same material as the film 130. In addition, for a single set of corresponding peripheral wires 120 and first intermediate layer M1, the film layer 130 surrounds the single set of corresponding upper and lower peripheral wires 120 and first intermediate layer M1. Similarly, for a single set of corresponding markers 140 and second intermediate layer M2, the film 130 surrounds the single set of corresponding markers 140 and second intermediate layer M2.

In the display area VA, the film layer 130 covers the touch sensing electrodes TE, and the film layer 130 fills the non-conductive area 136 between the adjacent touch sensing electrodes TE, that is, the non-conductive area 136 between the adjacent touch sensing electrodes TE has a filling layer made of the same material as the film layer 130 to isolate the adjacent touch sensing electrodes TE.

In some embodiments of the present invention, the material of the film 130 may be a non-conductive resin or other organic material, for example, the film 130 may be Polyethylene (PE), Polypropylene (PP), Polyvinyl butyral (PVB), Polycarbonate (PC), Acrylonitrile Butadiene Styrene (ABS), poly (3, 4-ethylenedioxythiophene) (PEDOT), poly (styrenesulfonic acid) (PSS), ceramic material, or the like. In one embodiment of the present invention, the film layer 130 may be a polymer, but is not limited to, polyacrylic resins, such as polymethacrylate (e.g., poly (methyl methacrylate)), polyacrylate, and polyacrylonitrile; polyvinyl alcohol; polyesters (e.g., polyethylene terephthalate (PET), polyester naphthalate, and polycarbonate); polymers having high aromaticity, such as phenol-formaldehyde resins or cresol-formaldehyde, polystyrene, polyvinyltoluene, polyvinylxylene, polyimide, polyamide, polyamideimide, polyetherimide, polysulfide, polysulfone, polyphenylenes and polyphenylethers; polyurethanes (polyurethanes; PU); an epoxy resin; polyolefins (e.g., polypropylene, polymethylpentene, and cyclic olefins); cellulose; silicones and other silicon-containing polymers (e.g., polysilsesquioxanes and polysilanes); polyvinyl chloride (PVC); a polyacetate; polynorbornene;synthetic rubbers (e.g., ethylene-Propylene Rubber (EPR), styrene-Butadiene Rubber (SBR), ethylene-Propylene-Diene Monomer (EPDM), and fluoropolymers (e.g., polyvinylidene fluoride, polytetrafluoroethylene (TFE), or polyhexafluoropropylene), copolymers of fluoro-olefins and hydrocarbon olefins, etc. in other embodiments, silica, mullite, alumina, SiC, carbon fibers, MgO-Al, may be used₂O₃-SiO₂、Al₂O₃-SiO₂Or MgO-Al₂O₃-SiO₂-Li₂And O and the like. In some embodiments of the present invention, the film 130 is formed of an insulating material. In some embodiments of the present invention, the film 130 may be formed by spin coating, spray coating, printing, or the like. In some embodiments, the thickness of the film 130 is about 20 nm to 10 μm, or 50nm to 200 nm, or 30 to 100nm, for example, the thickness of the film 130 may be about 90 nm or 100 nm.

In addition, similar to the above, the film 130 may form a composite structure with the metal nanowires (e.g., the touch sensing electrode TE) to have certain specific chemical, mechanical and optical properties, such as adhesion between the metal nanowires and the substrate 110, or better physical mechanical strength, so the film 130 may also be referred to as a matrix (matrix). It should be noted that, the drawings herein illustrate the film layer 130 and the touch sensing electrode TE as different layer structures, but the polymer used for manufacturing the film layer 130 may penetrate into the metal nanowires before curing or in a pre-cured state to form the filler, and when the polymer is cured, the metal nanowires may be embedded into the film layer 130, that is, the present invention is not particularly limited to the structure between the film layer 130 and the metal nanowire layer NWL (e.g., the touch sensing electrode TE). It is to be noted that the film 130 or the protection layer can be applied to the embodiments of the present disclosure, and is not limited to the embodiment shown in fig. 7B.

Fig. 9 shows a double-sided touch panel manufactured in the embodiment of the present invention, which can be manufactured as follows: first, a substrate 110 having a peripheral area PA and a display area VA defined in advance is provided. Then, forming metal nanowire layers NWL on the peripheral regions PA and the display regions VA of the first and second surfaces (e.g., the upper surface and the lower surface) of the substrate 110 respectively; then, forming a metal layer ML, wherein the metal layer ML is positioned in the peripheral area PA; then forming a patterning layer PL on the metal nanowire layer NWL and the metal layer ML on the first surface and the second surface respectively; then, the first and second surfaces are patterned according to the patterned layer PL, so as to form a first touch electrode TE1, a second touch electrode TE2 and a peripheral lead 120 on the first and second surfaces, and the peripheral lead 120 covers the first interlayer M1. Embodiments of the present invention may further comprise removing the patterned layer PL. For simplicity of the drawing, the first intermediate layer M1 is not labeled in fig. 9.

In the present embodiment, for example, the patterned layer PL may be formed by a flexographic printing process on the metal nanowire layer NWL and the metal layer ML on the first and second surfaces, respectively. Since the embodiment does not need to go through the yellow light process (such as exposure and development), the problem of mutual influence/interference of the two-sided processes is avoided, which is beneficial to simplifying the process and improving the yield.

Referring to fig. 9 and 9A, the first touch electrode TE1 is formed on one surface (such as the top surface) of the substrate 110, and the second touch electrode TE2 is formed on the other surface (such as the bottom surface) of the substrate 110, so that the first touch electrode TE1 and the second touch electrode TE2 are electrically insulated from each other; the peripheral lead 120 electrically connected to the first touch electrode TE1 covers the first middle layer M1; similarly, the peripheral lead 120 connected to the second touch electrode TE2 covers the corresponding first middle layer M1. The first touch electrode TE1 is a plurality of strip electrodes arranged along the first direction D1, and the second touch electrode TE2 is a plurality of strip electrodes arranged along the second direction D2. As shown in the figure, the extending directions of the elongated touch sensing electrodes TE1 and the elongated touch sensing electrodes TE2 are different and are staggered with each other. The first touch sensing electrode TE1 and the second touch sensing electrode TE2 can be used for transmitting a control signal and receiving a touch sensing signal, respectively. From this, the touch position can be obtained by detecting a signal change (e.g., a capacitance change) between the first touch sensing electrode TE1 and the second touch sensing electrode TE 2. With this arrangement, a user can perform touch sensing at each point on the substrate 110. The touch panel 100 of the present embodiment may further include a film layer 130, which covers the touch panel 100 in a full-surface manner, that is, the film layer 130 is disposed on both the upper and lower surfaces of the substrate 110 and covers the first touch electrode TE1, the second touch electrode TE2 and the peripheral lead 120, and the film layer 130 also covers and fills the upper and lower non-conductive regions 136 of the substrate 110.

Like the previous embodiments, any side (e.g., the upper surface or the lower surface) of the substrate 110 may further include the mark 140 and the second middle layer M2.

Fig. 10 is a schematic top view of a touch panel 100 according to some embodiments of the present invention. This embodiment is similar to the previous embodiment, with the main differences: in the present embodiment, the touch panel 100 further includes a shielding wire 160 disposed in the peripheral area PA, which mainly surrounds the touch sensing electrode TE and the peripheral lead 120, and the shielding wire 160 extends to the bonding area BA and is electrically connected to the ground terminal on the flexible circuit board 170, so that the shielding wire 160 can shield or eliminate signal interference or Electrostatic Discharge (ESD) protection, especially a small current change caused by a human hand touching the connecting wire around the touch device.

According to the aforementioned method for fabricating the patterned layer PL without removing the patterned layer PL, the shielding conductive line 160 and the peripheral lead 120 may be fabricated by forming the same metal layer ML (i.e. the same metal material, such as the aforementioned electroless copper plating layer) on which the metal nanowire layer NWL (or the third covering) and the patterned layer PL are stacked, and then etching the metal layer PL according to the pattern of the patterned layer PL, or the shielding conductive line 160 may be a composite structure layer including the patterned layer PL, the metal nanowire layer NWL and the metal layer ML, as described with reference to the embodiment shown in fig. 2A and 2B. In addition, according to the method for removing the patterned layer PL, the shielding wire 160 and the peripheral lead 12 can be formed by forming the metal layer ML on the same layer (i.e. they are made of the same metal material, such as the aforementioned electroless copper plating layer), etching the metal layer according to the pattern of the patterned layer PL, and removing the patterned layer PL, so that the shielding wire 160 can also be understood as a composite structure layer including the metal nanowire layer NWL (or the third intermediate layer) and the metal layer ML, as described in the embodiment shown in fig. 7A and 7B.

In some embodiments, the touch panel 100 described herein can be manufactured by a Roll-to-Roll (Roll to Roll) process, which uses existing equipment and can be fully automated, and can significantly reduce the cost of manufacturing the touch panel. The roll-to-roll coating process is specifically a process in which a flexible substrate 110 is selected, the substrate 110 in a roll form is mounted between two rollers, and the rollers are driven by a motor so that the substrate 110 can be continuously moved along a movement path between the two rollers. For example, deposition of the metal layer ML using a plating bath, deposition of a slurry containing metal nanowires on the surface of the substrate 110 using a storage tank, a spraying device, a brushing device, and the like, and a curing step are applied to form a metal nanowire layer NWL; forming a patterned layer PL (e.g., by flexographic printing) on the metal layer ML and/or the metal nanowire layer NWL; and patterning by using an etching tank or spraying an etching solution. Subsequently, the completed touch panel 100 is rolled out by a roller at the rearmost end of the production line to form a touch sensor roll tape.

The touch sensor tape of the present embodiment may further include a film layer 130 that covers the uncut touch panel 100 on the touch sensor roll in a full-scale manner, that is, the film layer 130 may cover the uncut touch panels 100 on the touch sensor roll and be cut and separated into the individual touch panels 100.

In some embodiments of the present invention, the substrate 110 is preferably a transparent substrate, and more particularly, may be a rigid transparent substrate or a flexible transparent substrate, and the material thereof may be selected from transparent materials such as glass, acryl (PMMA), polyvinyl Chloride (PVC), polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polycarbonate (PC), Polystyrene (PS), Cyclic Olefin Polymers (COP), Cyclic Olefin Copolymer (COC), and the like.

The roll-to-roll line may adjust the sequence of multiple coating steps as desired along the path of motion of the substrate or may incorporate any number of additional stations as desired. For example, pressure rollers or plasma equipment may be installed in the production line to achieve proper post-processing.

In some embodiments, the metal nanowires formed may be further post-treated to increase their conductivity, and the post-treatment may be a process step including, for example, heating, plasma, corona discharge, UV ozone, pressure, or a combination thereof. For example, after the step of curing to form the metal nanowire layer NWL, a roller may be used to apply pressure thereon, in one embodiment, a roller or rollers may be used to apply a pressure of 50 to 3400psi, preferably 100 to 1000psi, 200 to 800psi, or 300 to 500psi to the metal nanowire layer NWL; the step of applying pressure is preferably performed before the step of coating the film layer 130. In some embodiments, the post-treatment with heat and pressure may be performed simultaneously; in particular, the metal nanowires formed may be subjected to pressure applied by one or more rollers as described above, while being heated, for example, at a pressure of 10 to 500psi, preferably 40 to 100 psi; simultaneously, the roller is heated to a temperature between about 70 ℃ and 200 ℃, preferably between about 100 ℃ and 175 ℃, which can improve the conductivity of the metal nanowires. In some embodiments, the metal nanowires are preferably exposed to a reducing agent for post-treatment, for example, metal nanowires comprising silver nanowires are preferably exposed to a silver reducing agent for post-treatment, the silver reducing agent comprising a borohydride, such as sodium borohydride; boron nitrogen compounds such as Dimethylaminoborane (DMAB); or gaseous reducing agents, such as hydrogen (H)₂). And the exposure time is from about 10 seconds to about 30 minutes, preferably from about 1 minute to about 10 minutes.

Other details of this embodiment are substantially as described above, and will not be further described herein.

The structures of the different embodiments of the present invention can be cited, and are not limited to the above-described embodiments.

In some embodiments of the present invention, the mask for etching is selectively disposed at a predetermined position on the metal nanowire layer NWL or/and the metal layer ML by directly disposing the patterned layer PL, so that the material of the patterned layer PL is not required to be integrated, and an additional patterning step is not required to be performed on the material of the patterned layer PL, thereby achieving the effect of saving the manufacturing cost.

The utility model discloses an among the partial implementation, through patterning layer PL as the etching shade, make two-layer structure (for example the upper strata be metal nanowire layer NWL and lower floor for metal level ML, or the upper strata be metal level ML and lower floor for metal nanowire layer NWL) can be through the peripheral lead wire and/or the mark in order to make the peripheral zone of disposable etching, so can avoid the error space that the in-process of counterpointing was reserved, so can effectively reduce the width in peripheral zone.

Claims

1. A touch panel, comprising:

a substrate, wherein the substrate has a display area and a peripheral area;

a plurality of peripheral leads arranged on the peripheral area;

a plurality of first covers covering the peripheral leads; and

the touch sensing electrode is arranged in the display area of the substrate and is electrically connected with the peripheral leads, wherein the first covers and the touch sensing electrode comprise metal nanowires; and

and the patterning layer is arranged on the first covers and the touch sensing electrodes in a patterned mode and is provided with a printing side face.

2. The touch panel of claim 1, wherein the patterned layer and the first covers form a first composite structure, or the patterned layer and the touch sensing electrodes form a second composite structure.

3. The touch panel of claim 1, wherein the first covers have a side surface, and the side surface and a side surface of the peripheral leads are a common etched surface, and the common etched surface and the printed side surface are aligned with each other.

4. The touch panel of claim 1, further comprising a plurality of marks disposed in the peripheral region and a plurality of second covers covering the marks, wherein the second covers comprise metal nanowires.

5. The touch panel of claim 4, wherein the patterned layer is disposed on the second covers, and the patterned layer and the second covers form a third composite structure.

6. The touch panel of claim 4, wherein the second covers have a side surface, and the side surface and a side surface of the marks are a common etched surface, and the common etched surface and the printed side surface are aligned with each other.

7. The touch panel of claim 1, further comprising: a film layer.

8. The touch panel of claim 4, wherein the peripheral leads and the marks are made of metal material.

9. The touch panel of claim 1, further comprising a shielding conductive line disposed in the peripheral region and a third covering the shielding conductive line, wherein the third covering comprises metal nanowires.

10. The touch panel of claim 9, wherein the patterned layer is disposed on the third cover, and the patterned layer and the third cover form a fourth composite structure.