CN210072141U - TO-CAN subassembly and optical module - Google Patents
TO-CAN subassembly and optical module Download PDFInfo
- Publication number
- CN210072141U CN210072141U CN201920686791.6U CN201920686791U CN210072141U CN 210072141 U CN210072141 U CN 210072141U CN 201920686791 U CN201920686791 U CN 201920686791U CN 210072141 U CN210072141 U CN 210072141U
- Authority
- CN
- China
- Prior art keywords
- temperature
- heating resistor
- pin
- optical module
- subassembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
Abstract
The utility model discloses a TO-CAN subassembly and optical module, this TO-CAN subassembly include the tube socket, and the pipe cap is located the pin on the tube socket for the temperature-sensing ware of monitoring temperature TO and be used for promoting the heating resistor of temperature, heating resistor includes the base plate and sets up the heating resistor on the base plate, heating resistor and temperature-sensing ware are connected with the pin electricity. According TO the utility model discloses a TO-CAN subassembly, through the temperature of temperature-sensing ware monitoring TO-CAN subassembly, the temperature that improves the TO-CAN subassembly through heating resistor makes the optical module normally work in low temperature environment, when ambient temperature is less than-20 ℃, the optical module also CAN not be because of the low working property that influences the optical module of crossing excessively of temperature, make its operating temperature that CAN be applied TO industrial level, through setting up heating resistor on the tube socket, heating resistor directly passes through the pin power supply, and is with low costs, simple manufacture, and the working property is stable, and heating effect is good.
Description
Technical Field
The utility model relates TO a photoelectric communication field especially relates TO a TO-CAN subassembly and optical module.
Background
Currently, the operating temperatures of the emitter dies for optical devices on the market are mainly classified into three categories: commercial grades, extended grades and technical grades, wherein commercial grades are typically 0 ℃ to 75 ℃, extended grades are typically-20 ℃ to 85 ℃ and technical grades are typically-40 ℃ to 85 ℃. And the optical devices are generally only divided into commercial grade and industrial grade temperatures after being applied to optical modules. Therefore, the extended-class emitter die can only be applied to commercial-class optical devices and modules, which results in less than full performance.
When the ambient temperature is reduced, the temperature of the device is reduced, the Tracking Error (TE) performance of the optical device is deteriorated due TO the temperature reduction, and the central wavelength of the optical device is reduced along with the temperature reduction, so that when the ambient temperature is lower than-20 ℃, the expansion level TO cannot meet the operating performance requirement.
The extended-level transmitting tube core can meet the working requirement of high temperature of 85 ℃, has the working requirement of only the low temperature range of minus 40 ℃ to minus 20 ℃ different from that of the industrial-level transmitting tube core, has lower manufacturing requirement and cost and the like compared with the industrial-level transmitting tube core, and can save the cost for large-scale production. The extended-level transmitting tube core is applied to an optical device with industrial-level temperature, and the working requirement of an optical module can be met in a temperature range of-40 ℃ to-20 ℃.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is TO provide a TO-CAN subassembly TO satisfy optical device and optical module at-40 ℃ TO the operating requirement of 20 ℃ of low temperature range.
The utility model discloses a following technical scheme realizes: the TO-CAN assembly comprises a tube seat, a tube cap, a pin, a temperature sensor and a heating resistor, wherein the pin is positioned on the tube seat, the temperature sensor is used for monitoring temperature, the heating resistor is used for increasing the temperature, the heating resistor and the temperature sensor are arranged on the tube seat and positioned between the tube seat and the tube cap, the heating resistor comprises a substrate and a heating resistor arranged on the substrate, and the heating resistor and the temperature sensor are electrically connected with the pin.
As a further improvement of the above technical solution, the pins include a first pin, a second pin and a third pin, and the heating resistor and the temperature sensor are connected to any two of the first pin, the second pin and the third pin.
As a further improvement of the technical scheme, the heating resistor is a resistor disc, a resistor belt or a resistance wire.
As a further improvement of the above technical solution, the substrate is a ceramic substrate.
As a further improvement of the above technical solution, the temperature sensor is a thermistor.
As a further improvement of the technical scheme, the preset working temperature of the heating resistor is-20 ℃ to 25 ℃.
As a further improvement of the above technical solution, the preset operating temperature of the heating resistor is 10 ℃.
On the other hand, the utility model also provides an optical module, optical device includes flexible circuit board and the optics submodule that is connected with flexible circuit board, optics submodule includes foretell TO-CAN subassembly.
The beneficial effects of the utility model include at least: the utility model discloses an among the TO-CAN subassembly, through the temperature of temperature-sensing ware monitoring TO-CAN subassembly, the temperature that improves the TO-CAN subassembly through heating resistor makes optical device CAN be applicable TO industrial grade operating temperature, and through setting up heating resistor on the tube socket, heating resistor directly passes through the pin power supply, and is with low costs, simple manufacture, working property are stable, the heating is effectual.
Drawings
Fig. 1 is a schematic perspective view of an optical module according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of an optical module according to an embodiment of the present invention;
fig. 3 is an exploded schematic view of an optical module according to an embodiment of the present invention;
FIG. 4 is a schematic perspective view of a TO-CAN assembly according TO one embodiment of the present invention;
FIG. 5 is a schematic perspective view of a tube socket of a TO-CAN assembly according TO one embodiment of the present invention;
fig. 6 is a partial perspective view of a TO-CAN assembly according TO one embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in fig. 1 to 3, in the present embodiment, the optical module 100 includes a flexible circuit board 300, an electronic sub-module, and an optical sub-module 200 disposed on the flexible circuit board 300, and the optical module 100 is connected to a PCB of the optical module through the flexible circuit board 300. Specifically, the optical subassembly 200 is packaged by the TO-CAN assembly 10 (die), the sleeve 20, the fixing glue 30, etc., which are well known TO those skilled in the art and will not be described herein again.
As shown in fig. 3 TO 4, the TO-CAN assembly 10 includes a socket 1, a cap 2, a pin 3 on the socket 1, a temperature sensor 4 for monitoring temperature, and a heating resistor 5 for increasing temperature, the heating resistor 5 and the temperature sensor 4 are disposed on the socket 1 and between the socket 1 and the cap 2, the heating resistor 5 includes a substrate 51 and a heating resistor 52 disposed on the substrate 51, and the heating resistor 52 and the temperature sensor 4 are electrically connected TO the pin 3. Specifically, the TO-CAN assembly 10 further comprises a laser chip 40, the laser chip 40 is arranged on a substrate 51, and the TO-CAN assembly 10 is a coaxial packaging TO-CAN assembly 10.
The heating resistor 5 and the temperature sensor 4 are packaged between the tube seat 1 and the tube cap 2, the heating resistor 5 packaged in the TO-CAN component 10 is slightly influenced by the outside, the heating rate is high, the heat loss is small, and therefore the power consumption of the optical module 100 CAN be reduced.
As shown in fig. 5 to 6, the pins 3 include a first pin 31, a second pin 32, and a third pin 33, and the heating resistor 52 and the temperature sensor 4 are connected to any two pins 3 among the first pin 31, the second pin 32, and the third pin 33.
In the present embodiment, the heating resistor 52 is electrically connected to the first pin 31 and the second pin 32, and the temperature sensor 4 is electrically connected to the third pin 33. It is understood that the first pin 31, the second pin 32 and the third pin 33 of the TO-CAN component 10 CAN be defined according TO the design of the user, and therefore the connection manner of the heating resistor 52 and the temperature sensor 4 TO the pins is not limited TO the connection manner of the embodiment.
The heating resistor 52 is a resistor disc, a resistor belt or a resistance wire. In an embodiment, the heating resistor 52 is a resistor sheet, and the material of the resistor sheet may be a metal, such as copper, aluminum, etc., or an alloy material composed of several metals, or resistors made of other materials may also be used. As long as the resistance that can realize the function of heat supply all is applicable to the utility model discloses. The heating resistor 52 in this embodiment is rectangular in shape, and the shape thereof is not particularly limited and may be changed as needed. The heating resistor 52 can be fixed on the substrate 51 by using glue, and the heating resistor 52 is directly powered by the first pins 31 and the second pins 32, so that the circuit is simple, the installation is convenient, and the manufacture is simple.
The substrate 51 is a ceramic substrate 51. The ceramic substrate 51 has good electrical insulation performance and high thermal conductivity, the electrical insulation performance can prevent the heating resistor 52 from affecting the operation of other devices, and the high thermal conductivity can better transfer the heat generated by the heating resistor 52 to the socket 1 and the optical sub-assembly 200. The base plate 51 may be fixed to the socket 1 by glue. It will be appreciated that the base plate 51 may also be mounted by locking, snap-fitting or the like to the socket 1.
The temperature sensor 4 is a thermistor. The thermistor is small in size, CAN be easily processed into a complex shape, and is suitable for the small space of the TO-CAN component 10. In this embodiment, the temperature sensor 4 is fixed on the socket 1 and located on one side of the substrate 51, so that the influence of the heating resistor 5 on the thermistor CAN be reduced, and the temperature of the TO-CAN assembly 10 monitored by the thermistor CAN be more accurate. The thermistor may be glued to the socket 1 by means of glue.
The TO-CAN assembly 10 further includes a control unit for acquiring the temperature monitored by the temperature sensor 4 and controlling the operation or stop of the heating resistor 5 according TO the monitored temperature.
The utility model aims at heating the optical secondary module 200 to the temperature of-20 ℃ through the heating resistor 5 within the temperature range of-40 ℃ to-20 ℃ so as to increase the temperature of the optical secondary module to more than-20 ℃ and enable the chip to meet the performance requirement, thereby enabling the optical module 100 to be applicable to the industrial-grade working environment of-40 ℃ to 85 ℃.
In order TO solve the above problem, the working process of the TO-CAN assembly 10 of the present invention is as follows: the environment temperature is monitored by using the temperature sensor 4, the data is transmitted to the control unit, whether the environment temperature data obtained by the control unit meets the working temperature of the heating resistor 5 or not is judged, the heating resistor 5 is controlled, the heating resistor 5 heats the optical module 100 to raise the temperature of the optical module 100 in a heat conduction mode, and the working temperature range of the optical module 100 is increased to-40 ℃ to 85 ℃ so as to meet the requirement of industrial grade.
In the present embodiment, the monitored temperature is the internal temperature of the optical subassembly 200. In other embodiments, the monitored temperature may further include one or more of an external environment temperature, a chip temperature, a device temperature, an optical module 100 temperature, and other relevant temperatures, and a specific monitoring manner may be monitored by disposing thermistors at different positions of the optical module 100.
In this embodiment, the control unit is located on the PCB of the optical module, and controls the heating power of the heating resistor 5 by analyzing the temperature data collected by the thermistor and controlling the output current value.
The preset operating temperature of the heating resistor 52 is-20 ℃ to 25 ℃. Particularly, the utility model discloses utilize temperature-sensing ware 4 monitoring temperature to with data transmission to the control unit, the temperature data that the control unit obtained if be less than predetermined operating temperature, then heating resistor 52 begins work, then stop work when the temperature reaches or is higher than this predetermined operating temperature.
In the present embodiment, the preset operating temperature of the heating resistor 52 is 10 ℃. The heating resistor 52 starts to operate when the monitored temperature is lower than 10 c, and the heating resistor 52 stops operating when the monitored temperature is higher than 10 c, by the temperature monitored by the temperature sensor 4.
The optical module further comprises a storage unit, the storage unit stores the working state and the heating power of the heating resistor 5 under different temperature conditions, and the control unit can search the corresponding heating power through the temperature monitored by the thermistor in real time and the obtained temperature data and output corresponding current. The storage unit is arranged on a PCB of the optical module.
The utility model discloses a TO-CAN subassembly 10 passes through the temperature of temperature-sensing ware 4 monitoring TO-CAN subassembly 10, the temperature that improves TO-CAN subassembly 10 through heating resistor 5 makes optical module 100 normally work in low temperature environment, when ambient temperature is less than-20 ℃, the optical module also CAN not cross the working property that influences the optical module because of the temperature is low excessively, make it CAN be applied TO industrial-grade optical module and optical module, through setting up heating resistor 5 on tube socket 1, heating resistor 5 directly supplies power through pin 3, and is with low costs, the preparation is simple, the working property is stable, it is effectual TO heat.
In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (8)
1. The TO-CAN component is characterized by comprising a tube seat, a tube cap, a pin, a temperature sensor and a heating resistor, wherein the pin is positioned on the tube seat, the temperature sensor is used for monitoring temperature, the heating resistor is used for increasing the temperature, the heating resistor and the temperature sensor are arranged on the tube seat and positioned between the tube seat and the tube cap, the heating resistor comprises a substrate and a heating resistor arranged on the substrate, and the heating resistor and the temperature sensor are electrically connected with the pin.
2. The TO-CAN assembly of claim 1, wherein the pins comprise a first pin, a second pin, and a third pin, and the heating resistor and temperature sensor are electrically connected TO any two of the first pin, the second pin, and the third pin.
3. The TO-CAN component of claim 1, wherein the heating resistor is a resistive sheet, strip or wire.
4. The TO-CAN component of claim 1, wherein the substrate is a ceramic substrate.
5. The TO-CAN assembly of claim 1, wherein the temperature sensor is a thermistor.
6. The TO-CAN component of claim 1, wherein the preset operating temperature of the heating resistor is-20 ℃ TO 25 ℃.
7. The TO-CAN assembly of claim 1, wherein the pre-set operating temperature of the heating resistor is 10 ℃.
8. An optical module comprising a flexible circuit board and an optical sub-module connected TO the flexible circuit board, the optical sub-module comprising a TO-CAN assembly according TO any one of claims 1 TO 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920686791.6U CN210072141U (en) | 2019-05-10 | 2019-05-10 | TO-CAN subassembly and optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920686791.6U CN210072141U (en) | 2019-05-10 | 2019-05-10 | TO-CAN subassembly and optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210072141U true CN210072141U (en) | 2020-02-14 |
Family
ID=69452170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920686791.6U Active CN210072141U (en) | 2019-05-10 | 2019-05-10 | TO-CAN subassembly and optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210072141U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113960727A (en) * | 2021-09-13 | 2022-01-21 | 江苏奥雷光电有限公司 | Optical device with temperature rising function |
-
2019
- 2019-05-10 CN CN201920686791.6U patent/CN210072141U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113960727A (en) * | 2021-09-13 | 2022-01-21 | 江苏奥雷光电有限公司 | Optical device with temperature rising function |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20180034115A1 (en) | Temperature measuring assembly, electrical device assembly, battery pack connecting assembly and battery pack | |
| JP2003315161A (en) | Measuring device | |
| KR102505615B1 (en) | Battery pack | |
| US11375604B2 (en) | Camera module capable of dissipating heat and electronic device using the same | |
| CN210072141U (en) | TO-CAN subassembly and optical module | |
| CN211740441U (en) | Battery temperature acquisition device and battery module with same | |
| CN109188622A (en) | A kind of optical module | |
| CN106290249A (en) | A kind of integrated small laser gas detection components | |
| CN101777589A (en) | APD (avalanche photo diode) temperature control device | |
| CN210090744U (en) | TO-CAN subassembly and optical module | |
| CN112770432A (en) | Over-temperature protection circuit and method of OLED lamp and OLED lamp | |
| CN202930743U (en) | Small constant-temperature laser module | |
| KR102514901B1 (en) | A lighting device comprising a circuit board | |
| CN207764415U (en) | A kind of high speed optoelectronic coaxial transmitting component based on CWDM | |
| CN212254416U (en) | Glass liner temperature sensing probe mounting structure capable of rapidly and accurately sensing temperature | |
| CN210572950U (en) | Narrow-band filter with adapter ring | |
| CN204758157U (en) | Detect high temperature sensor of precision | |
| CN111912538B (en) | Crimping type semiconductor device, crimping submodule and elastic temperature measurement packaging assembly | |
| CN202195896U (en) | Electronic temperature controlled switch temperature sensor assembly | |
| CN205483281U (en) | Cooking pot , cooking device and temperature sensor | |
| CN218069840U (en) | Power electronic device and over-temperature protection circuit | |
| CN211378029U (en) | Rate module of can adjusting luminance for 5G | |
| CN208715560U (en) | A kind of miniature PTC adhesive tape heating device of electronic component braid equipment | |
| CN219612426U (en) | Heat radiation structure of laser processing detection device | |
| CN111272300A (en) | High radiator protector temperature sensor that stability is strong of security |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 701, 801, building C3, Nanshan wisdom garden, 1001 Xueyuan Avenue, Changyuan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Xunte Communication Technology Co.,Ltd. Address before: Room 805, East Tower, Nanshan Software Park, 10128 Shennan Avenue, Nantou street, Bao'an District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN SONT TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210702 Address after: 701, 801, building C3, Nanshan wisdom garden, 1001 Xueyuan Avenue, Changyuan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Xunte Communication Technology Co.,Ltd. Patentee after: JIANGXI SONT COMMUNICATION TECHNOLOGY Co.,Ltd. Address before: 701, 801, building C3, Nanshan wisdom garden, 1001 Xueyuan Avenue, Changyuan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: Shenzhen Xunte Communication Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |