CN210070289U - Semiconductor cooling and heating mechanism - Google Patents

Abstract

The utility model relates to a semiconductor cooling and heating mechanism, it includes semiconductor refrigeration piece, first heat conductor, radiator unit and protective housing, first heat conductor with radiator unit attaches respectively in the refrigeration of semiconductor refrigeration piece with heat the two sides, the protective housing includes the detachable first box of planting and the box of planting of second that combines together, first box of planting with the box of planting of second has respectively and inserts first heat conductor with first board and the second board in clearance between the radiator unit, first board with the junction of second board is formed with and is used for holding the caulking groove of semiconductor refrigeration piece. The first heat conductor and the heat dissipation assembly can be isolated by the first plate and the second plate, and the influence on the working efficiency of the semiconductor refrigeration piece due to large heat transfer between the first heat conductor and the heat dissipation assembly on the two sides of the semiconductor refrigeration piece is avoided. The protective shell is formed by combining the first insertion box and the second insertion box which can be separated, so that the protective shell is easier to assemble.

Description

Semiconductor cooling and heating mechanism

Technical Field

The utility model relates to a semiconductor cooling and heating mechanism, in particular to a semiconductor cooling and heating mechanism for a pet house or a pet water dispenser.

Background

With the improvement of living standard of people, more and more people are raising pets. Products manufactured around pets are also increasingly marketed, such as pet beds or pet houses.

In the prior art, a semiconductor refrigeration sheet is used for pet articles to improve the environment of pets. The semiconductor refrigerating plate is a cooling device composed of semiconductors, when a thermocouple formed by connecting an N-type semiconductor material and a P-type semiconductor material has current passing through, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold and hot end. And the cold and hot ends can be reversed by switching the direction of the current.

The Chinese patent document with the publication number of CN2785349Y discloses an automatic constant temperature pet bed, and the Chinese patent document with the publication number of CN2458867Y discloses a semiconductor cold and hot pet bed. The proposal of the two patent documents is to heat or cool the mattress through a semiconductor refrigeration sheet. The semiconductor refrigerating piece and the heat radiating component are arranged on the other side of the semiconductor refrigerating piece, and the heat conducting piece is isolated from the heat radiating component on one side of the semiconductor refrigerating piece by the aid of the middle partition plate or the bedstead partition plate.

SUMMERY OF THE UTILITY MODEL

The utility model aims to overcome the prior art defect and provide a semiconductor changes in temperature mechanism.

In order to achieve the above purpose, the utility model adopts the technical scheme that:

the utility model provides a semiconductor cooling and heating mechanism, it includes semiconductor refrigeration piece, first heat conductor, radiator unit and protective housing, first heat conductor with radiator unit attaches respectively the refrigeration of semiconductor refrigeration piece with heat the two sides, the protective housing includes the detachable first box of planting and the second box of planting that combines together, first box of planting with the second box of planting has respectively and inserts first heat conductor with first board and the second board in clearance between the radiator unit, first board with the junction of second board is formed with and is used for holding the caulking groove of semiconductor refrigeration piece.

Optimally, an air inlet and an air outlet are formed in the protective shell.

Optimally, the shape of the caulking groove is matched with that of the semiconductor refrigeration piece.

Preferably, the heat dissipation assembly comprises a second heat conductor attached to the semiconductor refrigeration sheet and a wind power mechanism arranged on the second heat conductor.

Furthermore, the edge of the wind power mechanism is also provided with a stabilizing plate, the stabilizing plate is provided with a stabilizing groove, and the inner side of the first inserting box or the second inserting box is also provided with a convex rib matched with the stabilizing groove in a clamping manner.

Further, the second heat conductor is a heat dissipation fin.

Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages:

the utility model discloses a semiconductor cooling and heating mechanism, owing to set up the protective housing, the first board and the second board of protective housing can be kept apart first heat conductor and radiator unit, avoid taking place big heat transfer and influence the work efficiency of semiconductor refrigeration piece between the first heat conductor and the radiator unit on semiconductor refrigeration piece two sides. The protective shell is formed by combining the first insertion box and the second insertion box which can be separated, so that the protective shell is easier to assemble.

Drawings

Some specific embodiments of the present invention will be described in detail hereinafter, by way of illustration and not by way of limitation, with reference to the accompanying drawings. The same reference numbers in the drawings identify the same or similar elements or components. Those skilled in the art will appreciate that the drawings are not necessarily drawn to scale. In the drawings:

FIG. 1 is a schematic view of embodiment 1 in case of installation of a protective case;

FIG. 2 is an exploded view of the protective case;

FIG. 3 is a schematic view of the protective case in its installed position;

FIG. 4 is a cross-sectional view A-A of FIG. 3;

FIG. 5 is a schematic view showing the protective case of embodiment 2;

FIG. 6 is a schematic view of the embodiment 3 protective case installation;

wherein the reference numerals are as follows:

101. a metal plate; 102. a first heat conductor; 103. a semiconductor refrigeration sheet; 104. a heat dissipating component; 108. a heat dissipating fin; 109. a wind power mechanism; 1091. a stabilizing plate; 1092. a stabilizing groove; 110. a fan II; 111. a temperature control water tank;

116. a protective shell; 1161. a first insertion cassette; 11611. a first plate; 1162. a second insertion cassette; 11621. a second plate; 11622. a rib is protruded; 1163. caulking grooves; 1164. an air inlet; 1165. and (7) air outlet.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Example 1

As shown in fig. 1, the cooling and heating module for daily use of pets includes a metal plate 101, a first heat conductor 102, a semiconductor cooling plate 103, and a heat dissipation assembly 104, which are sequentially disposed from top to bottom. The first heat conductor 102 and the heat dissipation assembly 104 are respectively attached to the refrigerating and heating surfaces of the semiconductor refrigerating sheet 103.

After the semiconductor refrigeration piece 103 is connected with a power supply and powered on, the upper surface of the semiconductor refrigeration piece 103 is heated and cooled, and the lower surface is cooled and refrigerated. The heat of the upper surface of the semiconductor cooling plate 103 is transferred to the first heat conductor 102 in direct contact with the semiconductor cooling plate, and the first heat conductor 102 is made of aluminum and can store and conduct heat, which can also be called as an energy storage element. The first heat conductor 102 conducts heat of the upper surface of the semiconductor chilling plate 103 to the metal plate 101. The metal plate 101 is heated, so that the mattress laid on the upper surface of the metal plate 101 can be heated, and a sitting space with proper temperature is provided for the pet. This may be suitable for cold seasons. On the contrary, two wires for connecting the semiconductor refrigeration piece 103 with the power supply can be exchanged, so that the upper surface of the semiconductor refrigeration piece 103 is refrigerated, the temperature of the metal plate 101 is reduced, and the refrigeration device is suitable for hot seasons.

The heat dissipation assembly 104 includes a second heat conductor attached to the semiconductor chilling plate 103 and a wind mechanism 109 disposed on the second heat conductor. The second heat conductor may be a metal member having a heat conductive capability. In this embodiment, the second heat conductor is provided as the heat dissipation fins 108, and the heat dissipation performance is excellent.

The lower surface of the semiconductor refrigeration sheet 103 is tightly attached with a heat dissipation fin 108, the heat dissipation fin 108 is made of aluminum alloy, and the lower surface of the heat dissipation fin 108 is provided with a wind power mechanism 109 through screws. The wind mechanism 109 may be a small fan, and can generate wind force to take away hot air and cold air generated on the lower surface of the semiconductor cooling sheet 103, so as to ensure better heating and cooling performance of the semiconductor cooling sheet 103.

A protective shell 116 surrounds the heat sink assembly 104. The protective case 116 includes a first insertion box 1161 and a second insertion box 1162 separably joined together, the first insertion box 1161 and the second insertion box 1162 respectively have a first plate 11611 and a second plate 11621 inserted into a gap between the energy storage member 102 and the heat dissipation assembly 104, and the first insertion box 1161 and the second insertion box 1162 are moved toward each other on both sides of the heat dissipation assembly 104 such that the first plate 11611 and the second plate 11621 are inserted into the gap between the energy storage member 102 and the heat dissipation assembly 104. The junction of the first plate 11611 and the second plate 11621 is formed with a recess 1163 for receiving the semiconductor chilling plate 103. The semiconductor refrigerating sheet 103 is clamped in the embedding groove 1163. And the shape of the caulking groove 1163 matches the shape of the semiconductor chilling plate 103.

The first plate 11611 and the second plate 11621 isolate the energy storage devices 102 from the heat dissipation assembly 104 to reduce heat generated by the energy storage devices 102 from being carried away by the heat dissipation assembly 104. The energy consumption is reduced.

The protective shell 116 has an air inlet 1164 and an air outlet 1165. The air inlet 1164 is a sieve hole formed on the surface of the protection casing 116, and the air outlet 1165 is a round hole formed on the surface of the protection casing 116, and the round hole is formed by combining one side surfaces of the first insertion box 1161 and the second insertion box 1162. The outlet 1165 is adjacent to the outlet end of the wind mechanism 109.

As shown in fig. 2 and 4, the edge of the wind mechanism 109 is further provided with a fixing plate 1091, the fixing plate 1091 is provided with a fixing groove 1092, and the inner side of the second insertion box 1162 is further provided with a rib 11622 snap-fitted with the fixing groove 1092. When the first and second insertion boxes 1161 and 1162 are combined together, the ribs 11622 are engaged with the fixing grooves 1092, so that the first and second insertion boxes 1161 and 1162 are more stable and are not dislocated due to the vibration of the wind mechanism 109. And the first inserting box 1161 and the second inserting box 1162 are fastened by bolts, so that the assembly and disassembly are easy.

In this embodiment, the protective shell 116 may surround the heat dissipation assembly 104 to protect the heat dissipation assembly 104 from being damaged, and may isolate the heat dissipation assembly 104 from the energy storage element 102 to block heat transfer between the heat dissipation assembly 104 and the energy storage element 102, thereby reducing energy consumption.

Example 2

As shown in fig. 5, the air conditioner for daily use of pets comprises a fan ii 110, a first heat conductor 102, a semiconductor refrigeration sheet 103 and a heat dissipation assembly 104 which are arranged in sequence from top to bottom.

The first heat conductor 102 is also a heat dissipation fin having excellent heat dissipation performance. The fan II 110 and the first heat conductor 102 get hot or cold from the semiconductor refrigeration sheet 103 and blow hot air or cold air into the pet nest. The heat dissipation assembly 104 carries away cold air or hot air generated on the other surface of the semiconductor chilling plate 103 to ensure the performance of the semiconductor chilling plate 103.

Example 3

As shown in fig. 6, the water dispenser for daily use of pets comprises a temperature control water tank 111, a first heat conductor 102, a semiconductor refrigeration sheet 103, and a heat dissipation assembly 104, which are sequentially arranged from top to bottom.

The temperature-controlled water tank 111 is provided with water for pets to drink, and the temperature-controlled water tank 111 contacts with the first heat conductor 102 to transfer heat, thereby heating (in winter) or cooling (in hot summer) the drinking water.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (6)

1. A semiconductor cooling and heating mechanism is characterized in that: the semiconductor refrigeration device comprises a semiconductor refrigeration sheet (103), a first heat conductor (102), a heat dissipation assembly (104) and a protective shell (116), wherein the first heat conductor (102) and the heat dissipation assembly (104) are respectively attached to the refrigeration and heating surfaces of the semiconductor refrigeration sheet (103), the protective shell (116) comprises a first insertion box (1161) and a second insertion box (1162) which are separably combined together, the first insertion box (1161) and the second insertion box (1162) are respectively provided with a first plate (11611) and a second plate (11621) which are inserted into a gap between the first heat conductor (102) and the heat dissipation assembly (104), and an insertion groove (1163) used for accommodating the semiconductor refrigeration sheet (103) is formed at the joint of the first plate (11611) and the second plate (11621).

2. The semiconductor cooling and heating mechanism according to claim 1, wherein: an air inlet (1164) and an air outlet (1165) are arranged on the protective shell (116).

3. The semiconductor cooling and heating mechanism according to claim 1, wherein: the shape of the caulking groove (1163) is matched with that of the semiconductor refrigeration piece (103).

4. The semiconductor cooling and heating mechanism according to claim 1, wherein: the heat dissipation assembly (104) comprises a second heat conductor attached to the semiconductor refrigeration sheet (103) and a wind power mechanism (109) arranged on the second heat conductor.

5. The semiconductor cooling and heating mechanism according to claim 4, wherein: the edge of the wind power mechanism (109) is further provided with a stabilizing plate (1091), a stabilizing groove (1092) is formed in the stabilizing plate (1091), and a convex rib (11622) matched with the stabilizing groove (1092) in a clamping mode is further arranged on the inner side of the first inserting box (1161) or the second inserting box (1162).

6. The semiconductor cooling and heating mechanism according to claim 4, wherein: the second heat conductor is a heat dissipation fin (108).

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