CN210053430U

CN210053430U - Fingerprint identification subassembly and electronic equipment

Info

Publication number: CN210053430U
Application number: CN201921020634.8U
Authority: CN
Inventors: 吕亮; 刘文涛
Original assignee: Silead Inc
Current assignee: Silead Inc
Priority date: 2019-07-01
Filing date: 2019-07-01
Publication date: 2020-02-11
Anticipated expiration: 2029-07-01

Abstract

The application discloses fingerprint identification subassembly and electronic equipment, wherein, a fingerprint identification subassembly includes: a metal support plate; the light sensing mechanism is used for processing light signals and fixedly arranged on the metal supporting plate; the circuit board is arranged on the metal supporting plate; the circuit board is electrically connected with one side of the light sensing mechanism; the surrounding frame is arranged around the light sensing mechanism; adhesive is filled between the enclosure frame and the light sensing mechanism; the adhesive fixes the light sensing mechanism on the metal support plate. The fingerprint identification subassembly and screen fingerprint identification electronic equipment that this application provided can be favorable to reducing the thickness of fingerprint identification subassembly.

Description

Fingerprint identification subassembly and electronic equipment

Technical Field

The application relates to the field of fingerprint identification, in particular to a fingerprint identification assembly and an electronic device.

Background

The technology of optical fingerprint recognition under screen is rapidly developed and applied because it does not occupy the surface space of electronic devices (e.g., smart phones).

However, at present, the module structure that optical fingerprint identification technique adopted under the screen is more complicated, and its whole thickness is great, and the thickness that is subject to the cell-phone does not place the space of battery under the fingerprint identification structure, leads to being difficult to promote battery capacity in limited space, compares in the fingerprint cell-phone under the non-screen, and battery capacity is less, influences cell-phone duration.

In addition, when reworking is needed in the production process or repairing is conducted on a subsequent complete machine, the fingerprint structure needs to be installed and disassembled, the vulnerability of the fingerprint structure and the screen is limited, and the fingerprint structure or the screen is extremely easy to damage in the reworking or repairing process, so that the yield is affected, and the cost is lost.

SUMMERY OF THE UTILITY MODEL

In view of the deficiencies of the prior art, it is an object of the present application to provide a fingerprint identification assembly and an off-screen fingerprint identification electronic device that can facilitate reducing the thickness of the fingerprint identification assembly.

Another object of the present application is to provide a fingerprint identification component and an electronic device for fingerprint identification under a screen, so as to be beneficial to avoiding the fingerprint identification component or the screen from being damaged when the fingerprint identification component is disassembled in installation.

In order to achieve at least one of the above purposes, the following technical scheme is adopted in the application:

a fingerprint identification assembly comprising:

a metal support plate;

the light sensing mechanism is used for processing light signals and fixedly arranged on the metal supporting plate;

the circuit board is arranged on the metal supporting plate; the circuit board is electrically connected with one side of the light sensing mechanism;

the surrounding frame is arranged around the light sensing mechanism; adhesive is filled between the enclosure frame and the light sensing mechanism; the adhesive fixes the light sensing mechanism on the metal support plate.

As a preferred embodiment, the metal support plate includes: a main body part and a lap structure positioned on the peripheral side of the main body part; the lap edge structure is used for fixing the fingerprint identification component at a target position; the light sensation mechanism, the surrounding frame and the circuit board are fixedly arranged on the main body part.

As a preferred embodiment, an embedded step is arranged between the lapping edge structure and the main body part; the embedding step is used for embedding the target installation groove.

In a preferred embodiment, the bead structure and the insertion step are formed by bending.

As a preferred embodiment, the thickness of the bead structure is smaller than that of the body portion to form the insertion step.

As a preferred embodiment, the metal support plate is a steel plate; the thickness of the metal supporting plate is less than 0.3 mm.

As a preferred embodiment, the light sensation mechanism includes:

the light sensing chip is used for processing the optical signal to form an electric signal; the light sensing chip is provided with a first surface and a second surface which are opposite; the first surface is provided with a light sensing part for sensing optical signals;

a light adjusting member disposed on the first surface of the light sensing chip; the light adjusting member is used for inputting light rays into the light sensing part in the form of parallel light.

As a preferred embodiment, the light adjusting member includes a collimator adhered to the first surface; the collimator is adhered to the first surface through an adhesive layer; the light transmittance of the bonding layer is more than 95%; the thickness of the bonding layer is 10-50 microns; and a light filtering film is plated on the surface of the light regulating part facing the light sensing chip.

As a preferred embodiment, the circuit board is a flexible circuit board; the flexible circuit board is attached to the metal support plate; the flexible circuit board is electrically connected with the light sensing chip through a metal connecting wire; the metal connecting wire is positioned in the adhesive.

As a preferred embodiment, at least a part of the enclosure frame is fixedly arranged on the circuit board; the distance between the enclosing frame and the light sensing chip is larger than the distance between the circuit board and the light sensing chip.

An electronic device, comprising: the fingerprint identification device comprises a shell, a display screen and a fingerprint identification component, wherein the shell is internally provided with a middle frame; wherein the fingerprint identification component comprises:

the metal supporting plate is fixedly arranged on the middle frame;

the light sensing mechanism is used for processing light signals and fixedly arranged on the metal supporting plate; a spacing gap is formed between the light sensing mechanism and the display screen;

As a preferred embodiment, the middle frame is provided with a containing part for containing the fingerprint identification component;

the metal support plate includes: a main body part and a lap structure positioned on the peripheral side of the main body part; the main body part is embedded in the accommodating part; the lap structure is fixedly bonded on the middle frame.

As a preferred embodiment, an embedded step is arranged between the lapping edge structure and the main body part; the embedding step is embedded into the accommodating part and attached to the inner wall of the accommodating part.

As a preferred embodiment, the accommodating portion includes an accommodating recess opened toward the display screen; the opening end of the accommodating groove is provided with a bearing step; the lap edge structure is fixedly bonded on the bearing step; the thickness of the middle frame at the bearing step is larger than that at the bottom wall of the accommodating groove.

As a preferred embodiment, the accommodating portion includes an accommodating through hole penetrating the middle frame; the end part of the accommodating through hole, which is far away from the display screen, is provided with a bearing step; the lap edge structure is fixedly bonded on the bearing step; the thickness of the lap structure is smaller than that of the main body part to form the embedded step.

Has the advantages that:

the fingerprint identification subassembly that this application provided provides the support for light sense mechanism and circuit board through setting up the metal support board to better structural reliability has, and this fingerprint identification subassembly sets up the circuit board in one side of light sense mechanism, and does not occupy the thickness of fingerprint identification subassembly, so can be convenient for reduce fingerprint identification's thickness, thereby processing forms ultra-thin fingerprint identification subassembly.

The metal support plate that the fingerprint identification subassembly provided in this application adopted is the metal material, and it can not lose the structural reliability of fingerprint identification subassembly under thinner condition to keep whole subassembly structure to have stable structure on the basis of being favorable to reducing the thickness of fingerprint identification subassembly, make the fingerprint identification subassembly of this embodiment can keep the life of preferred in the use scene of difference.

When this fingerprint identification subassembly is applied to electronic equipment such as smart mobile phone, utilize the ultra-thin characteristics of this fingerprint identification subassembly, can place the battery in the below of this fingerprint identification subassembly with the thickness of preferred to electronic equipment can have bigger battery capacity, guarantees good battery continuation of the journey.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and the accompanying drawings, which specify the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the present invention are not so limited in scope.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

In order to illustrate the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

FIG. 1 is a schematic diagram of a fingerprint identification assembly according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of a fingerprint identification module according to another embodiment of the present application.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. As used herein, the term "vertical"),

"horizontal," "left," "right," and the like are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Please refer to fig. 1-2. An embodiment of the application provides a fingerprint identification assembly, and this fingerprint identification assembly can be applied to fingerprint identification electronic equipment under the screen, and this electronic equipment can include touch screen cell-phone, or fingerprint punched-card machine, also can be applied to fingerprint input equipment certainly. Preferably, the fingerprint identification component is applied to a mobile phone, and particularly can be placed below (on the inner side) a touch screen of the mobile phone, so that a full-screen mobile phone is formed.

Specifically, the fingerprint identification assembly includes: a metal support plate 6; the light sensing mechanism is used for processing light signals and is arranged on the circuit board 3 on the metal supporting plate 6; and the surrounding frame 4 is arranged around the light sensing mechanism.

Wherein, the light sensation mechanism is fixedly arranged on the metal support plate 6; the circuit board 3 is electrically connected with one side of the light sensing mechanism; an adhesive 5 is filled between the enclosure frame 4 and the light sensing mechanism; the adhesive 5 fixes the light sensing mechanism on the metal support plate 6.

The fingerprint identification component provided by the embodiment provides support for the light sensation mechanism and the circuit board 3 by arranging the metal support plate 6, so that the thickness of the fingerprint identification component can be reduced on the basis of not losing the structural reliability. And this fingerprint identification subassembly sets up circuit board 3 in one side of light sense mechanism to do not occupy the thickness of fingerprint identification subassembly, so can be convenient for reduce fingerprint identification's thickness, thereby processing forms ultra-thin fingerprint identification subassembly.

The metal support plate 6 that the fingerprint identification subassembly that this embodiment provided adopted is the metal material, and it can not lose the structural reliability of fingerprint identification subassembly under thinner condition to keep whole subassembly structure to have stable structure on the basis that is favorable to reducing the thickness of fingerprint identification subassembly, make the fingerprint identification subassembly of this embodiment can keep the life of preferred in the use scene of difference.

The fingerprint identification subassembly that this embodiment provided forms a stable whole of structure through adhesive 5 with the bonding of fingerprint identification subassembly to have better structural reliability, can adapt to different use scenarios, for example still can keep the integrality of structure and be difficult to damaged when electronic equipment drops.

The fingerprint identification subassembly that this embodiment provided can install in center 100 when electronic equipment such as smart mobile phone, because the fingerprint identification subassembly has thinner thickness, thereby the fingerprint identification subassembly can and the screen between keep certain spacing distance, the two contactless, thereby when dismantling the installation with the fingerprint identification subassembly, the two is difficult for taking place the touching phenomenon, consequently, the fingerprint identification subassembly that this embodiment provided can be favorable to avoiding fingerprint identification subassembly or screen to be destroyed when dismantling the fingerprint identification subassembly in the installation.

In the embodiment of the present application, the optical sensing mechanism may process the optical signal. The light sensing mechanism can screen out parallel light in input light and process the parallel light to form an electric signal capable of carrying out fingerprint identification. Specifically, the light sensation mechanism includes: a photo chip 1 and a light adjuster 2. The light sensing chip 1 is used for processing the optical signal to form an electrical signal. The light-sensing chip 1 has a first surface (the first surface is an upper surface in the state shown in fig. 1) and a second surface (the first surface is a lower surface in the state shown in fig. 1) which are opposite to each other. The first surface has a light sensing portion for sensing a light signal. The light adjusting member 2 is disposed on the first surface of the photo sensor chip 1. The light adjusting member 2 is used to input light into the light sensing section in the form of parallel light.

In the present embodiment, the light-adjusting member 2 may cover the entire light-sensing portion. The area of the first surface is larger than the projection area of the light adjusting member 2 on the first surface, and the light adjusting member 2 can be smaller than the area of the upper surface of the optical sensing chip 1, so that the cost can be reduced. At this time, the projection of the light modulation member 2 is located within the first surface, that is, the light modulation member 2 may partially cover the first surface. Of course, the projection of the light adjusting member 2 may be equal to the first surface in some embodiments.

The light adjuster 2 screens light, screens parallel light from the input light, and transmits the parallel light to the light sensing portion on the light sensing chip 1. The light adjusting part 2 can be a glass collimator or a silicon pinhole collimating structure, and can also realize light collimation by manufacturing a photoresist structure with a customized pattern on the surface of the light sensing chip 1. In this embodiment, the light adjuster 2 may be a glass collimator, such as a fiber collimator.

In order to effectively reduce the thickness of the fingerprint recognition assembly, the light adjusting member 2 includes a collimator adhered to the first surface. The collimator is bonded to the first surface by an adhesive layer. The adhesive layer is made of transparent adhesive material. For example, the adhesive layer is a transparent glue after curing. In order to avoid light intensity loss and ensure the success rate of fingerprint identification, the light transmittance of the bonding layer is more than 95%. The thickness of the bonding layer is 10-50 microns. The refractive index of the adhesive layer may be 1.5 or less, and specifically, the refractive index of the adhesive layer may be 1.48.

In order to have a better light collimation effect and output parallel light with better parallelism to improve the fingerprint identification accuracy, the thickness of the collimator is 150 micrometers to 500 micrometers along the direction from the first surface to the second surface. In the embodiment of the application, the thickness of the fingerprint identification component is 0.28 mm to 1.5 mm. Preferably, the thickness of the fingerprint identification component is below 0.8. Wherein, the direction from the first surface to the second surface is parallel to the thickness direction. In the embodiment shown in fig. 1, the fingerprint identification assembly may have a thickness of 0.33 millimeters.

The surface of the light adjusting member 2 facing the light sensing chip 1 is coated with a light filter (not shown). The filter film is an IP filter film. The filter film is plated on the light adjusting member 2 and has an ultra-thin thickness. Specifically, the filter film may be deposited on the surface of the light adjuster 2 by PVD. In order to protect the filter film, the filter film is plated on the lower surface of the collimator and is covered by the adhesive layer, so that the filter film is prevented from being damaged due to exposure.

In this embodiment, the circuit board 3 and the light sensing chip 1 are electrically connected through the metal connecting wire 7, and the light sensing chip 1 forms an electrical signal carrying fingerprint information and transmits the electrical signal to the circuit board 3 through the metal connecting wire 7. The circuit board 3 can transmit the electric signal to the controller for fingerprint identification. Of course, the circuit board 3 may have electronic components for performing signal processing on the electric signals. The circuit board 3 may be a PCB board. The cured adhesive 5 can wrap the metal connecting wire 7, so that the metal connecting wire 7 is effectively protected.

In the embodiment of the present application, the metal support plate 6 provides support for the entire fingerprint identification assembly and ensures structural reliability. The light sensing chip 1, the surrounding frame 4, or the circuit board 3 can be adhered and fixed on the metal supporting plate 6. Wherein, enclose and form the filling space between frame 4, circuit board 3 and the light sense mechanism, metal support plate 6 is located the below in this filling space, forms the bottom in this filling space, so, this fingerprint identification subassembly forms the filling space of opening up, through pouring into adhesive 5 into this filling space, waits to bond each subassembly of fingerprint identification subassembly together fixedly after adhesive 5 solidifies, forms stable structure.

Specifically, the metal supporting plate 6 is integrally disposed on the side of the light sensing mechanism, the surrounding frame 4 and the circuit board 3 opposite to the display screen 200. The metal support plate 6 can fixedly support the photosensitive mechanism, the circuit board 3 and the enclosure frame 4, and plugs the lower part of the filling space, so that the filling space forms an upward glue injection opening.

This metal support plate 6 not only can be with light sense mechanism, circuit board 3, it is fixed to enclose 4 position supports of frame, guarantee the structural reliability of whole fingerprint identification subassembly, can also form the filling space, conveniently fill into adhesive 5 to the filling space, at adhesive 5 solidification shaping, light sense mechanism with enclose frame 4, circuit board 3, metal support plate 6 forms the overall structure of a structural stability preferred, this metal support plate 6 can utilize metal support plate 6 to bond this fingerprint identification equipment in the target location when being applied to electronic equipment, for example, this target location is on cell-phone casing inside center 100.

In the present embodiment, the metal support plate 6 is a steel plate. The thickness of the metal support plate 6 is below 0.3 mm. In particular, the thickness of the metal support plate 6 is between 0.1 mm and 0.3 mm. In other embodiments, the metal supporting plate 6 may also be an aluminum alloy plate, or a copper plate, or other metal material plate, and the application is not limited to this.

The main body part is flat, and the light sensing mechanism, the surrounding frame 4 and the circuit board 3 are arranged on the same side of the main body. When installing in electronic equipment, light sense mechanism, enclose frame 4, circuit board 3 are located between metal support plate 6 and the display screen 200, and when the user carried out fingerprint identification and touched the appointed area of display screen 200 with the finger, light sense mechanism was used for handling the light that carries the fingerprint to display screen 200 transmission and converts the signal of telecommunication into carrying fingerprint data.

To facilitate mounting the fingerprint recognition assembly at a target location, the metal support plate 6 comprises: a main body portion and a bead structure 61 located on the periphery of the main body portion. The attachment structure 61 is used to secure the fingerprint identification assembly in a target position. The light sensing mechanism, the enclosure frame 4 and the circuit board 3 are fixedly arranged on the main body part.

In the present embodiment, the metal support plate 6 is preferably of an integrally molded structure. The attachment means 61 is located at the edge of the entire metal support plate 6. The thickness of the main body part is kept unchanged, and the main body part can be a metal plate with uniform thickness so as to facilitate the attaching of the light sensing chip 1, the circuit board 3 or the surrounding frame 4. In other embodiments, the lap structure 61 may be fixed to the main body portion by a fixing method such as welding, and the present application is not limited to this.

An embedded step 62 is provided between the lap formation 61 and the main body portion. The seating step 62 is used to seat in the target mounting groove. Through being equipped with this embedding step 62, can conveniently be installed fingerprint identification subassembly accurate positioning to accurately install in the target mounting groove, guarantee follow-up fingerprint identification precision.

In the embodiment shown in fig. 1, the edge structure 61 and the insertion step 62 are formed by bending. The bead structure 61 surrounds the body portion. In this embodiment, the metal support plate 6 forms a groove structure, the main body part is the bottom of the groove structure, and supports and mounts the light sensing mechanism, the circuit board 3 and the enclosure frame 4.

Such as the embodiment shown in fig. 2. The thickness of the bead structure 61 is smaller than that of the body portion to form the insertion step 62. The insertion step 62 is a transition point of the thickness of the metal support plate 6. In this embodiment, the entire metal support plate 6 is of a flat plate structure. The thickness of the landing edge structure 61 may differ by less than 100 microns from the thickness of the body portion. In particular, the thickness of the bead structure 61 may be 50 microns less than the thickness of the body portion.

In order to reduce the thickness of the fingerprint identification assembly, the circuit board 3 is located on the peripheral side of the light sensing mechanism, and may be disposed around the light sensing mechanism, or may be located only in a certain partial area of the peripheral side, which is not limited in this application. To ensure that the circuit board 3 remains attached to the metal support plate 6, a strong support is provided for the circuit board 3. In the present embodiment, the circuit board 3 is preferably a flexible circuit board 3 (FPC).

Considering that the hard circuit board 3 (PCB) has warpage and flatness problems, it is difficult to attach to the metal support plate 6 well, a stable structure with better sealing performance cannot be formed, and the filling of the adhesive 5 at a later stage may be affected. In this regard, the circuit board 3 employs a flexible circuit board 3. The flexible circuit board 3 has strong wiring adaptability, and can be connected with two connecting ends needing to transmit electric signals in a non-planar or non-linear direction. The flexible circuit board 3 can be better attached to the metal support plate 6, and the metal support plate 6 can also be reinforced by the flexible circuit board 3, so that the structural reliability is improved.

Considering that there is tolerance when the fixed position of light sense chip 1 and circuit board 3 and need leave the space when fixing to the both ends welded of metal connecting wire 7 and weld (there are two solder joints at the both ends of metal connecting wire 7, just conveniently make the second solder joint to first solder joint welding completion need advance a distance in welding process), based on this consideration, certain distance is separated to the looks between circuit board 3 and the light sense chip 1, promptly, light sense chip 1 and the inner wall that holds through-hole 31 do not contact. The distance between the circuit board 3 and the light sensing chip 1 is more than 50 micrometers. In the present embodiment, the circuit board 3 and the photo sensor chip 1 are spaced apart by 200 μm.

In the present embodiment, the enclosure 4 is directly or indirectly supported by a metal support plate 6. The enclosure frame 4 may be adhesively fixed to the metal support plate 6 and the upper surface of the circuit board 3. The ring shape of the enclosure frame 4 may be a regular circle, an ellipse, or an irregular ring, and the present application is not limited in any way. In order to enable the injected adhesive 5 to completely wrap the metal connecting wire 7 and effectively protect the metal connecting wire 7, the distance between the surrounding frame 4 and the light sensing chip 1 is larger than the distance between the circuit board 3 and the light sensing chip 1. The enclosure frame 4 is an annular structure and is fixedly mounted on the upper surfaces of the metal support plate 6 and the circuit board 3. The enclosure frame 4 may be a plastic ring or a metal ring, and the application is not limited.

The surrounding frame 4 surrounds the light sensing mechanism, and at least part of the surrounding frame 4 is fixedly arranged on the circuit board 3. Specifically, part of the enclosure frame 4 may be fixed to the upper surface of the metal plate, and part may be fixed to the upper surface of the circuit board 3. In the embodiment where the circuit board 3 also surrounds the optical sensing mechanism, the enclosure 4 may be disposed entirely on the circuit board 3, and indirectly supported by the metal supporting plate 6. The distance between the surrounding frame 4 and the light sensing chip 1 is larger than the distance between the circuit board 3 and the light sensing chip 1.

It should be noted that "up" and "down" described in this embodiment may refer to the orientation of the reader facing fig. 1, and may also refer to the position of the fingerprint identification component in the intelligent electronic device relative to the display screen 200, for example: the "up" is near the display 200 and the "down" is far from the display 200.

In the present embodiment, the adhesive 5 may be glue. Through injecting glue into the filling space, surround the light sense mechanism after waiting the glue solidification, form effective protection to the light sense mechanism to, glue after the solidification can be fixed in the light sense mechanism on circuit board 3 for this fingerprint identification subassembly has the structural reliability of preferred, has the life of preferred. The filled adhesive 5 is cured to protect the metal connecting wires 7 electrically connecting the circuit board 3 and the photosensitive member.

For avoid adhesive 5 to spill over, avoid disturbing the light input of light regulating part 2, for the plane at second surface place, enclose frame 4 highly be in below light regulating part 2's the height. The filling height of the adhesive 5 is lower than the height of the enclosure frame 4. In this embodiment, the surface of the circuit board 3 facing away from the enclosure frame 4 is flush with the second surface, and both are placed on the metal support plate 6. The circuit board 3 and the light sensing chip 1 are located on the upper surface of the metal supporting plate 6, the upper surface of the metal supporting plate 6 forms a supporting plane for supporting the circuit board 3 and the light sensing chip 1, and the height of the enclosure frame 4 and the height of the optical fiber adjusting assembly can be the height relative to the supporting plane.

The height direction in this embodiment is also the thickness direction of the fingerprint identification component and its components (the light sensing chip 1, the collimator, the circuit board 3, and the enclosure frame 4). The height of the surrounding frame 4 is the distance (also can be understood as the thickness) between the surface (upper surface) of the surrounding frame 4, which is back to the circuit board 3, and the plane where the second surface is located (or the lower surface of the circuit board 3); accordingly, the height of the light adjuster 2 is the distance (also understood as the thickness) between the surface (upper surface) of the light adjuster 2 facing away from the photo-sensing chip 1 and the second surface.

Based on the same conception, the utility model also provides an electronic equipment, this electronic equipment can include but not limited to fingerprint identification electronic equipment under the screen. As described in the examples below. Because the principle of solving the problems and the technical effect which can be obtained by the electronic equipment are similar to those of the fingerprint identification component, the implementation of the electronic equipment can refer to the implementation of the fingerprint identification component, and repeated parts are not repeated.

An embodiment of the present application further provides an electronic device, and specifically, the electronic device includes: the inside shell that is equipped with center 100, set up in display screen 200 on the shell is fixed in the fingerprint identification subassembly on the center 100.

Wherein the fingerprint identification component comprises: a metal support plate 6 fixedly disposed on the middle frame 100; the light sensing mechanism is used for processing light signals and is fixedly arranged on the metal supporting plate 6; a spacing gap is formed between the light sensing mechanism and the display screen 200; a circuit board 3 disposed on the metal supporting plate 6; the circuit board 3 is electrically connected with one side of the light sensing mechanism; an enclosure frame 4 arranged around the light sensing mechanism; an adhesive 5 is filled between the enclosure frame 4 and the light sensing mechanism; the adhesive 5 fixes the light sensing mechanism on the metal support plate 6.

Wherein the width of the spacing gap is between 100 and 300 microns. In this embodiment, the width of the spacing gap is preferably 200 microns. The display screen 200 is preferably an OLED screen, but may of course also be an LCD screen. The present application is not particularly limited. The inner side of the display 200 may be covered with a protection layer 201 (e.g., foam), and the area corresponding to the light sensing mechanism may not be covered with the protection layer 201, so that the light of the fingerprint image can be transmitted to the light sensing mechanism through the display 200.

For the easy to assemble fingerprint identification subassembly to avoid occupying the inside too much space of shell, center 100 is provided with and holds the portion that holds of fingerprint identification subassembly. Accordingly, the metal support plate 6 includes: a main body portion and a bead structure 61 located on the periphery of the main body portion. The body portion is embedded in the accommodating portion. The receiving portion may be a groove or a through hole, and the application is not limited to the only limitation. That is, the receiving portion may or may not penetrate the middle frame 100 (groove form). Of course, in order to reduce the influence on the structural strength of the middle frame 100, the receiving portions are preferably receiving grooves. The lap structure 61 is adhesively fixed to the middle frame 100.

An embedded step 62 is provided between the lap formation 61 and the main body portion. The insertion step 62 is inserted into the receiving portion to be attached to the inner wall of the receiving portion. The embedding step 62 is a transition structure between the bead structure 61 and the main body portion. The insertion step 62 may be formed by bending or may be formed by using a thickness transition portion.

In one embodiment, the receiving portion includes a receiving groove opened toward the display screen 200. The open end of the receiving groove is provided with a receiving step 101. The lap structure 61 is fixed on the receiving step 101 in an adhering manner. The thickness of the middle frame 100 at the receiving step 101 is greater than the thickness at the bottom wall of the receiving groove. The receiving groove is a stepped groove, and a stepped structure is formed from the receiving step 101 to the bottom of the groove.

As shown in fig. 1, the joint edge structure 61 protrudes from the upper surface of the middle frame 100 in order to provide effective support without reducing structural reliability. Therefore, the bearing step 101 can still keep larger thickness, and the structure is guaranteed to have better reliability. It should be noted that the lower end of the through hole in fig. 1 may be sealed to form a receiving groove structure, and the through hole structure and the groove structure of the receiving portion are not mutually exclusive.

In the embodiment shown in fig. 2. The receiving portion includes a receiving through hole through which the middle frame 100 passes. The receiving step 101 is disposed at an end (a lower end in the state shown in fig. 2) of the receiving through hole far away from the display screen 200. The lap structure 61 is fixed on the receiving step 101 in an adhering manner. The thickness of the bead structure 61 is smaller than that of the body portion to form the insertion step 62.

In the electronic device provided by the embodiment, the middle frame 100 is provided with an accommodating part for accommodating the fingerprint identification component; the accommodating part can consume part of the thickness of the fingerprint identification component, and the groove bottom (bottom surface) or the bearing step 101 arranged at the end part of the accommodating part can bear the fingerprint identification component. This electronic equipment can further reduce the shared thickness of fingerprint identification subassembly through the thickness that utilizes partial center 100, is favorable to placing the large capacity battery, promotes electronic equipment's duration.

In summary, the fingerprint identification device can be fixed on the middle frame 100, and because the fingerprint identification device has a smaller thickness, the fingerprint identification device can be placed between the battery and the display screen 200 and does not contact with the battery and the display screen 200, thereby avoiding the problem that the fingerprint identification device touches the battery or the screen and is damaged by each other under some use conditions (such as repair, dropping, and the like).

It should be noted that the electronic device provided in the present embodiment may have any suitable conventional configuration, such as a control portion, a display screen 200 portion for fingerprint touch, and other portions (e.g., a housing portion and a key portion). For clearly and briefly explaining the technical solution provided by the present embodiment, the above parts will not be described again, and the drawings in the specification are also simplified accordingly. It should be understood, however, that the present embodiments are not limited in scope thereby.

Any numerical value recited herein includes all values from the lower value to the upper value that are incremented by one unit, provided that there is a separation of at least two units between any lower value and any higher value. For example, if it is stated that the number of a component or a value of a process variable (e.g., temperature, pressure, time, etc.) is from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended that equivalents such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also expressly enumerated in this specification. For values less than 1, one unit is suitably considered to be 0.0001, 0.001, 0.01, 0.1. These are only examples of what is intended to be explicitly recited, and all possible combinations of numerical values between the lowest value and the highest value that are explicitly recited in the specification in a similar manner are to be considered.

Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. The use of "about" or "approximately" with a range applies to both endpoints of the range. Thus, "about 20 to about 30" is intended to cover "about 20 to about 30", including at least the endpoints specified.

All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional.

A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of the subject matter that is disclosed herein is not intended to forego such subject matter, nor should the inventors be construed as having contemplated such subject matter as being part of the disclosed inventive subject matter.

Claims

1. A fingerprint identification assembly, comprising:

a metal support plate;

2. The fingerprint identification assembly of claim 1, wherein the metal support plate comprises: a main body part and a lap structure positioned on the peripheral side of the main body part; the lap edge structure is used for fixing the fingerprint identification component at a target position; the light sensation mechanism, the surrounding frame and the circuit board are fixedly arranged on the main body part.

3. The fingerprint identification assembly of claim 2, wherein an inset step is provided between said ledge structure and said body portion; the embedding step is used for embedding the target installation groove.

4. The fingerprint identification assembly of claim 3, wherein said ledge structure and said inset step are formed by a bend.

5. The fingerprint identification assembly of claim 3, wherein the ledge structure has a thickness less than a thickness of the body portion to form the inset step.

6. The fingerprint identification assembly of claim 1, wherein the metal support plate is a steel plate; the thickness of the metal supporting plate is less than 0.3 mm.

7. The fingerprint identification assembly of any one of claims 1-6, wherein the light-sensitive mechanism comprises:

8. The fingerprint identification assembly of claim 7, wherein the light modifier comprises a collimator adhered to the first surface; the collimator is adhered to the first surface through an adhesive layer; the light transmittance of the bonding layer is more than 95%; the thickness of the bonding layer is 10-50 microns; and a light filtering film is plated on the surface of the light regulating part facing the light sensing chip.

9. The fingerprint identification assembly of claim 7, wherein the circuit board is a flexible circuit board; the flexible circuit board is attached to the metal support plate; the flexible circuit board is electrically connected with the light sensing chip through a metal connecting wire; the metal connecting wire is positioned in the adhesive.

10. The fingerprint identification assembly of claim 7, wherein at least a portion of the enclosure is fixedly disposed on the circuit board; the distance between the enclosing frame and the light sensing chip is larger than the distance between the circuit board and the light sensing chip.

11. An electronic device, comprising: the fingerprint identification device comprises a shell, a display screen and a fingerprint identification component, wherein the shell is internally provided with a middle frame; wherein the fingerprint identification component comprises:

the metal supporting plate is fixedly arranged on the middle frame;

12. The electronic device of claim 11, wherein the middle frame is provided with a receiving portion that receives the fingerprint recognition component;

13. The electronic device of claim 12, wherein an inset step is provided between the ledge structure and the body portion; the embedding step is embedded into the accommodating part and attached to the inner wall of the accommodating part.

14. The electronic device according to claim 13, wherein the accommodating portion includes an accommodating recess opening toward the display screen; the opening end of the accommodating groove is provided with a bearing step; the lap edge structure is fixedly bonded on the bearing step; the thickness of the middle frame at the bearing step is larger than that at the bottom wall of the accommodating groove.

15. The electronic device according to claim 13, wherein the accommodating portion includes an accommodating through-hole that penetrates the middle frame; the end part of the accommodating through hole, which is far away from the display screen, is provided with a bearing step; the lap edge structure is fixedly bonded on the bearing step; the thickness of the lap structure is smaller than that of the main body part to form the embedded step.