CN210015199U

CN210015199U - High-frequency test seat for QFN chip

Info

Publication number: CN210015199U
Application number: CN201920355227.6U
Authority: CN
Inventors: 钱晓晨; 骆兴顺
Original assignee: Suzhou Helin Micro-Nano Technology Co Ltd
Current assignee: Suzhou Helin Micro Technology Co., Ltd
Priority date: 2019-03-20
Filing date: 2019-03-20
Publication date: 2020-02-04
Anticipated expiration: 2029-03-20

Abstract

The utility model provides a high frequency test seat for QFN chip, including at least two-layer mutual superimposed test main part board, and set up in the guide clamp plate of test main part board top, the guide clamp plate middle part is offered and is used for holding the through hole chamber that holds of QFN chip, and test main part board middle part is the detection portion, just the detection portion set up in hold under the through hole chamber, detection portion has seted up the detection hole groove, be provided with in the detection hole inslot be used for with the probe that the QFN chip is connected, the probe is the slice setting, and the dislocation of detection hole groove on the test main part board of upper and lower floor is seted up, the detection hole inslot on different layers is arranged in respectively at the both ends of probe, the contact of QFN chip bottom pass through the probe with test main part board. The beneficial effects of the utility model are embodied in: the QNF chip has the transmission capability of high-frequency signals, and the QNF chip is connected with the circuit board in high frequency under the condition of ensuring the bearing of relatively large current.

Description

High-frequency test seat for QFN chip

Technical Field

The invention belongs to the technical field of electronic components, and particularly relates to a high-frequency test seat.

Background

With the rapid development of chip technology, the existing high-frequency test socket is a spring probe type test socket, the signal transmission channel is longer, the inductive reactance and the capacitive reactance of the probe are higher, and the transmission quality of high-frequency signals is not high. With the increase of signal transmission frequency in the present chip, the conventional socket structure based on spring probe test has encountered serious challenges, and a new structure of test probe and corresponding test socket need to be developed to meet the development requirements.

Disclosure of Invention

In order to solve the defects of the prior art, the invention provides a high-frequency test socket.

The purpose of the invention is realized by the following technical scheme:

the high-frequency test seat for the QFN chip comprises at least two layers of test main body plates which are mutually overlapped, and a guide pressure plate arranged above the test main body plates, wherein a containing through hole cavity used for containing the QFN chip is formed in the middle of the guide pressure plate, a detection part is arranged in the middle of the test main body plates, the detection part is arranged under the containing through hole cavity, a detection hole groove is formed in the detection part, a probe used for being connected with the QFN chip is arranged in the detection hole groove, the probe is arranged in a sheet shape, the detection hole grooves in the upper layer of the test main body plates and the lower layer of the test main body plates are arranged in a staggered mode, the two ends of the probe are respectively arranged in the detection hole grooves in different layers, and a contact at the bottom of the.

Preferably, four groups of detection hole grooves are arranged, each group of detection hole groove is formed by a plurality of detection hole grooves which are arranged in parallel, a probe is arranged in each detection hole groove, and the adjacent detection hole groove groups are perpendicular to each other.

Preferably, the test main body plate is provided with four end portions, each end portion is provided with a plug hole, the bottom of the guide pressing plate is provided with a guide column, and the guide pressing plate is connected with the test main body plate in a plug-in mode through the guide columns.

Preferably, the test body panels are provided with four layers, and adjacent test body panels are connected by bonding.

Preferably, an elastic pressing piece is arranged in the detection hole groove, the elastic pressing piece is transversely arranged on the probe and is abutted against the probe, and the elastic pressing piece is shared by the detection hole grooves in the same group.

Preferably, the elastic pressing piece is cylindrical, the probe comprises a positioning end and a contact end, the top end of the contact end is in contact with a contact of the QFN chip, and the positioning end is provided with an arc.

Preferably, the lower end face of the elastic pressing piece is embedded in the arc of the positioning end, and the upper end face of the elastic pressing piece is pressed tightly through the guide pressing plate.

Preferably, the elastic pressing piece is a rubber pressing rod.

The invention has the beneficial effects that: the QNF chip has the transmission capability of high-frequency signals, and the QNF chip is connected with the circuit board in high frequency under the condition of ensuring the bearing of relatively large current.

Drawings

FIG. 1: an exploded view of the test socket of the present invention.

FIG. 2: the invention discloses a seat front structure schematic diagram of a test seat.

FIG. 3: the cross-sectional structure of fig. 2 is schematically shown in fig. 2C.

FIG. 4: part a of fig. 3 is a partially enlarged schematic structural view.

Detailed Description

The invention will be described in detail with reference to the following embodiments, and discloses a high frequency test socket for QFN chips, which is shown in fig. 1-4 and includes at least two stacked test main body plates 3 and a guide pressing plate 2 disposed above the test main body plates 3, wherein the test main body plates 3 are disposed in four pieces, and adjacent test main body plates 3 are bonded and connected to form a whole. The test main body plate 3 is provided with four end portions, and each end portion is provided with a plug hole 31.

The guide pressing plate 2 is made of polyamide-imide materials, a guide column 21 is arranged at the bottom of the guide pressing plate, and the guide pressing plate 2 and the test main body plate 3 are connected in an inserted mode through the guide column 21. The cross section of the test main body plate 3 is in an X shape, the middle part of the test main body plate 3 is a detection part, the middle part of the guide pressure plate 2 is provided with an accommodating through hole cavity for accommodating the QFN chip 1, and the accommodating through hole cavity is arranged right above the detection part. The detection part is provided with a detection hole groove 32, a metal probe 4 connected with the QFN chip 1 is arranged in the detection hole groove 32, the probe 4 is arranged in a sheet shape, and one end of the probe is pressed tightly through an elastic pressing piece 5. The elastic pressing piece 5 is cylindrical and is transversely arranged at one end of the elastic pressing piece.

Specifically, four groups of detection hole grooves 32 are arranged, each group of detection hole groove is composed of a plurality of detection hole grooves 32 which are arranged in parallel, a probe is arranged in each detection hole groove, and the adjacent detection hole groove groups are perpendicular to each other. The shape and the structure of the detection hole group are equal to the cross section of the QFN chip, namely, the contacts of the QFN chip are distributed around the bottom of the chip, and in order to detect all the contacts, probes are required to be distributed around the QFN chip.

The detection hole grooves 32 on the adjacent upper and lower test main body plates 3 are arranged in a staggered manner, two ends of the probe 4 are respectively arranged in the detection hole grooves of different layers, and the contact 11 at the bottom of the QFN chip 1 is in contact connection with the test main body plates 3 through the probe 4. The offset opening of the invention is to better accommodate the probe 4, and make the upper part of the probe 4 contact the contact point, and the other end keeps a stable state. The probe 4 comprises a positioning end 41 and a contact end 42 and is substantially W-shaped, although the shape of the probe is not exclusive and other similar shapes can be used. The contact end 42 is the upper part of the probe, and the positioning end 41 is the lower part of the probe. The top end of the contact end is in contact with the contact 11 of the QFN chip 1, the positioning end 41 is provided with an arc shape, the lower end face 51 of the elastic pressing piece 5 is embedded and pressed in the arc shape of the positioning end 41, and the upper end face 52 of the elastic pressing piece is pressed tightly through the guide pressing plate 2. The same group of detection hole slots 32 share one elastic pressing piece 5, namely, one elastic pressing piece 5 presses the lower end of the probe in each detection empty slot 32. The elastic pressing piece 5 is a rubber pressing rod or a silica gel pressing rod. The principle of the testing method of the test socket is similar to that of the prior art, and at the same time, the testing method does not belong to the protection focus of the invention, so the details are not repeated herein. The high-frequency test base has very small integral thickness, so that the distance between the QFN chip and the PCB is shortened by 2-5 times compared with a conventional socket, the high-frequency test base has excellent resistance, the inductive reactance and the capacitive reactance in a high-frequency test are relatively small, and the signal passing attenuation in a high-frequency signal test is very little. Meanwhile, because the contact point slides in the test, the contact point on the chip is easy to puncture, and the stable contact is further kept.

There are, of course, many other specific embodiments of the invention and these are not to be considered as limiting. All technical solutions formed by using equivalent substitutions or equivalent transformations fall within the scope of the claimed invention.

Claims

The high-frequency test seat for the QFN chip is characterized in that: the test device comprises at least two layers of mutually superposed test main body plates and a guide pressure plate arranged above the test main body plates, wherein a through hole cavity used for containing a QFN chip is arranged in the middle of the guide pressure plate, the middle of the test main body plate is a detection part, the detection part is arranged under the through hole cavity, a detection hole groove is formed in the detection part, a probe used for being connected with the QFN chip is arranged in the detection hole groove, the probe is arranged in a sheet shape, the detection hole grooves in the upper layer and the lower layer of the test main body plates are arranged in a staggered mode, the two ends of the probe are respectively arranged in the detection hole grooves in different layers, and a contact at the bottom of the QFN chip is in contact connection with the test main body plates.
2. The high-frequency test socket for QFN chips as claimed in claim 1, wherein: the detection hole grooves are provided with four groups, each group of detection hole grooves is formed by a plurality of detection hole grooves which are arranged in parallel, a probe is arranged in each detection hole groove, and the adjacent detection hole groove groups are perpendicular to each other.
3. The high-frequency test socket for QFN chips as claimed in claim 1, wherein: the test main body plate is provided with four end parts, each end part is provided with a plug hole, the bottom of the guide pressing plate is provided with a guide column, and the guide pressing plate is connected with the test main body plate in a plug-in mode through the guide columns.
4. The high-frequency test socket for QFN chips as claimed in claim 1, wherein: the test main body plate is provided with four layers, and the adjacent test main body plates are connected in a bonding mode.
5. The high-frequency test socket for QFN chips as claimed in claim 4, wherein: an elastic pressing piece is arranged in the detection hole groove, the elastic pressing piece is transversely arranged on the probe and is abutted against the probe, and the detection hole grooves in the same group share one elastic pressing piece.
6. The high frequency test socket for QFN chips of claim 5, wherein: the elastic pressing piece is cylindrical, the probe comprises a positioning end and a contact end, the top end of the contact end is in contact with a contact of the QFN chip, and the positioning end is provided with an arc.
7. The high-frequency test socket for QFN chips of claim 6, wherein: the lower end face of the elastic pressing piece is embedded in the arc of the positioning end, and the upper end face of the elastic pressing piece is pressed tightly through the guide pressing plate.
8. The high frequency test socket for QFN chips of claim 5, wherein: the elastic pressing piece is a rubber pressing rod.