CN210008041U - rectifier module ceramic chip soldering paste printing device - Google Patents
rectifier module ceramic chip soldering paste printing device Download PDFInfo
- Publication number
- CN210008041U CN210008041U CN201920725030.7U CN201920725030U CN210008041U CN 210008041 U CN210008041 U CN 210008041U CN 201920725030 U CN201920725030 U CN 201920725030U CN 210008041 U CN210008041 U CN 210008041U
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- fixture
- clamp
- base
- sliding block
- ceramic chip
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- Expired - Fee Related
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- 239000000919 ceramic Substances 0.000 title claims abstract description 69
- 238000005476 soldering Methods 0.000 title claims abstract description 36
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 51
- 239000010959 steel Substances 0.000 claims abstract description 51
- 230000033001 locomotion Effects 0.000 claims abstract description 8
- 229910000679 solder Inorganic materials 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000007790 scraping Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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- Screen Printers (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses an rectifier module ceramic chip soldering paste printing device, including the base, be equipped with on the base and adjust support, ceramic chip locating piece, steel mesh, adjust the support and include upper and lower frame, upper and lower slider, the lower frame sets up on the base, set up down the slider in the lower frame, lower slider can carry out reciprocal linear motion for base, lower frame, set up the upper ledge on the lower slider, the upper ledge sets up along base width direction, set up the top shoe in the upper ledge, the top shoe sets up with lower slider is perpendicular, the top shoe can carry out reciprocal linear motion for the upper ledge, set up the locating piece on the top shoe, the ceramic chip locating piece is placed on the top shoe and is fixed a position through the locating piece, be equipped with a plurality of small opening on the steel mesh, the small opening shape treats printing soldering paste regional cooperateing with the ceramic chip on the ceramic chip locating piece, the steel mesh passes through anchor clamps hinge joint on the base, the steel mesh is located directly over the ceramic chip locating piece.
Description
Technical Field
The utility model relates to a rectifier module processing sets up technical field, specifically is kinds of rectifier module ceramic chip soldering paste printing device.
Background
In the assembly process of the rectifier module, three methods are mainly used for ceramic chip soldering, wherein is that the ceramic chip is tin-lined, secondly, screen drawing soldering paste is used for the surface of the ceramic chip for drying, and thirdly, the other surface of the ceramic chip is dried, thirdly, soldering paste is dispensed on the ceramic chip during assembly, the three methods have the advantages and the disadvantages, namely, the method has thick tin layer and low efficiency, soldering flux needs to be cleaned and coated, but the soldering effect is good, the second method has little tin quantity and low efficiency, the screen has short service life, the ceramic chip is easy to oxidize, and poor soldering is caused, and the third method has the advantages that the soldering paste quantity is not easy to control, more tin is easy to be connected.
The Chinese patent with the publication number of CN 109348640A and the publication number of 2019, 02, 15 discloses screen plates for printing soldering paste on an aluminum substrate, the screen plates are made of metal plates with the thickness of less than 0.5mm, a plurality of round holes are formed in the metal plates and distributed in an array mode, the metal plates except the round holes are all continuous plate bodies and are used for printing the soldering paste on the aluminum substrate, the area occupied by the round holes is 45% -55% of the whole area of the metal plates, the metal plates are steel plates, the thickness of the metal plates is 0.1mm, the diameter of the round holes is 0.8-1.0 mm, the edges of the metal plates are smaller than the edges of the aluminum substrate, the distance between the edges of the metal plates and the edges of the aluminum substrate is at least 0.5mm in vertical projection, the distance between the round holes is at least 0.8mm, the screen plates adopting the structure are difficult to align with the round.
Therefore, new rectifier module tile paste printing devices are needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide kinds of rectifier module ceramic chip soldering paste printing device, easy and simple to handle, it is efficient, ceramic chip soldering paste printing is accurate, the line production of being convenient for, the utility model discloses size, density and the steel sheet thickness in steel mesh small opening can be adjusted according to the soldering paste volume as required, the welding effect is guaranteed, long service life, and non-human factor can not damage.
The utility model aims at realizing the kinds of rectifier module ceramic chip soldering paste printing devices by the following technical proposal, which comprises a base and is characterized in that an adjusting bracket, a ceramic chip positioning block and a steel mesh are arranged on the base;
the adjusting bracket comprises a lower frame, a lower sliding block, an upper frame and an upper sliding block, wherein the lower frame is arranged on the base and is arranged along the length direction of the base; the lower frame is internally provided with a lower sliding block which can perform reciprocating linear motion relative to the base and the lower frame; an upper frame is arranged on the lower sliding block, the upper frame is arranged along the width direction of the base, an upper sliding block is arranged in the upper frame, and the upper sliding block is perpendicular to the lower sliding block; the upper sliding block can perform reciprocating linear motion relative to the upper frame;
the upper sliding block is provided with a positioning block, and the ceramic chip positioning block is placed on the upper sliding block and is positioned through the positioning block;
the steel mesh is provided with a plurality of leakage holes, and the shapes of the leakage holes are matched with areas to be printed with soldering paste by the ceramic chips on the ceramic chip positioning blocks;
the steel mesh is hinged to the base through the clamp, and the steel mesh is located right above the ceramic chip positioning block.
Preferably, the clamp comprises an th clamp, a second clamp and a third clamp, a th clamp mounting hole is formed in the base, a th clamp is arranged in a th clamp mounting hole, the th clamp is perpendicular to the base, the th clamp is provided with the second clamp, the second clamp is perpendicular to the th clamp, the base and the th clamp form an I-shaped structure, the third clamp is hinged to the second clamp, and a steel mesh is arranged on the third clamp.
Preferably, the th clamp comprises a cylindrical part, a round notch is arranged on the side of the cylindrical part , and a threaded connecting shaft is arranged at the top of the cylindrical part;
the bottom of the second clamp is provided with a threaded hole, and a threaded connecting shaft of the th clamp is arranged in the threaded hole.
Preferably, blind holes are processed on two sides of the second clamp;
the third clamp is of a U-shaped structure and comprises a horizontal part and vertical parts at two ends of the horizontal part, long grooves are machined in the outer side of the horizontal part along the length direction, and steel meshes are placed in the long grooves and fixed through bolts;
the opposite ends of the two vertical parts of the third clamp are processed with pin shaft holes, the pin shaft holes correspond to the corresponding blind holes of the second clamp and are provided with pin shafts, the third clamp is connected with the second clamp, and the third clamp can rotate relative to the second clamp.
Preferably, the lower frame is of a square structure, th inverted L-shaped rails are machined on the inner sides of two long sides of the lower frame, th L-shaped bosses are machined on two sides of the lower slider, th L-shaped bosses are matched with the corresponding th inverted L-shaped rails, and the length of the lower slider is smaller than that of the th inverted L-shaped rails.
Preferably, the upper frame is in a square structure, second inverted-L-shaped rails are processed on the inner sides of two long sides of the upper frame, second L-shaped bosses are processed on two sides of the upper sliding block, and the second L-shaped bosses are matched with the corresponding second inverted-L-shaped rails; the length of the upper sliding block is smaller than that of the second inverted L-shaped track.
Preferably, the end of the lower slide block is provided with a th adjusting bolt hole, and a th adjusting bolt hole is arranged in a th adjusting bolt hole.
Preferably, a second adjusting bolt hole is machined at the end of the upper slide block , and a th adjusting bolt is arranged in the second adjusting bolt hole.
Preferably, a balancing weight is arranged on the clamp.
Preferably, the balancing weight is arranged on the pin shaft, or the balancing weight is arranged on the third clamp.
Compared with the prior art, the utility model discloses following beneficial effect has:
, the positions of the upper and lower sliding blocks of the adjusting bracket are adjusted to realize the movement of the ceramic chip positioning block on the upper sliding block in the X-axis direction and the Y-axis direction, so that the ceramic chip positioning block is suitable for ceramic chips of different models, and in addition, the ceramic chips on the steel mesh and the ceramic chip positioning block are accurately matched by adjusting the adjusting bracket, so that the printing accuracy of the soldering paste is greatly improved.
Secondly, according to the shape of the ceramic chip, the leakage hole corresponding to the laser welding position is designed on the steel mesh, so that the soldering paste on the steel mesh can enter the area to be printed with the soldering paste by the ceramic chip in a targeted manner. The area of the solder paste is not required to be printed, and the solder paste cannot enter the area due to the obstruction of the steel mesh.
And thirdly, the upper frame is matched with the upper sliding block and the lower frame is matched with the lower sliding block through the L-shaped tracks and the bosses, so that the structure is simple, the design is ingenious, and the use performance is good.
Fourthly, the upper sliding block and the lower sliding block are in threaded connection with an adjusting bolt, and the adjusting bolt is used for adjusting the X-axis direction and the Y-axis direction of the upper sliding block and the lower sliding block, so that the use is convenient.
Fifthly, set up the balancing weight on anchor clamps for after the printing solder paste was accomplished, lift the steel mesh, under the effect of balancing weight, the steel mesh can be in the opening angle that keeps and decide, the taking out of the ceramic chip locating piece of being convenient for.
Sixth, the utility model discloses size, density and steel sheet thickness in steel mesh small opening can be adjusted according to the soldering paste volume that needs, welding effect is guaranteed. The service life is long, and the non-human factors are unlikely to damage.
Drawings
FIG. 1 is a side view of the overall structure of an rectifier module ceramic chip soldering paste printing device according to the present invention;
FIG. 2 is a top view of the overall structure of an rectifier module ceramic tile solder paste printing device according to the present invention;
FIG. 3a is a top view of the base of the rectifier module tile paste printing apparatus of the present invention;
FIG. 3b is a side view of the base of the rectifier module tile paste printing apparatus of the present invention;
FIG. 4a is a front view of the lower frame of an rectifier module tile paste printing apparatus of the present invention;
FIG. 4b is a side view of the lower frame of the rectifier module tile paste printing apparatus of the present invention;
FIG. 4c is a top view of the lower frame of the rectifier module tile paste printing apparatus of the present invention;
FIG. 5a is a front view of the lower slider of the rectifier module tile paste printing apparatus of the present invention;
FIG. 5b is a side view of the lower slider of the rectifier module tile paste printing apparatus of the present invention;
FIG. 5c is a top view of the lower slider of the rectifier module tile paste printing apparatus of the present invention;
FIG. 6a is a front view of the upper frame of an rectifier module tile paste printing apparatus according to the present invention;
fig. 6b is a side view of the upper frame of the rectifier module ceramic tile solder paste printing apparatus of the present invention;
fig. 6c is a top view of the upper frame of the rectifier module ceramic tile solder paste printing apparatus of the present invention;
FIG. 7a is a front view of the upper slider of the rectifier module tile paste printing apparatus of the present invention;
fig. 7b is a side view of the upper slider of the rectifier module ceramic tile solder paste printing apparatus of the present invention;
fig. 7c is a top view of the upper slider of the rectifier module ceramic tile solder paste printing apparatus of the present invention;
FIG. 8a is a front view of a fixture of the rectifier module tile paste printing apparatus of the present invention;
FIG. 8b is a top view of the fixture of the rectifier module tile paste printing apparatus of the present invention;
FIG. 9a is a front view of a second fixture of the rectifier module tile paste printing apparatus of the present invention;
FIG. 9b is a side view of a second fixture of the rectifier module tile paste printing apparatus of the present invention;
FIG. 9c is a top view of a second fixture of the rectifier module tile paste printing apparatus of the present invention;
FIG. 10a is a front view of a third fixture of the rectifier module tile paste printing apparatus of the present invention;
FIG. 10b is a side view of a third fixture of the rectifier module tile paste printing apparatus of the present invention;
FIG. 10c is a top view of a third fixture of the rectifier module tile paste printing apparatus of the present invention;
fig. 11a is a top view of the steel mesh (for MDC160 tiles) of the rectifier module tile paste printing apparatus of the present invention;
FIG. 11b is a top view of the steel mesh (for MDS160-1 tile) of the rectifier module tile paste printing apparatus of the present invention;
FIG. 11c is a top view of the steel mesh (for MDS160-2 tile) of the rectifier module tile paste printing apparatus of the present invention;
fig. 12 is a top view of a ceramic chip positioning block of kinds of rectifier module ceramic chip paste printing devices according to the present invention.
Detailed Description
The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings.
As shown in fig. 1-12, rectifier module ceramic tile soldering paste printing devices comprise a base 1, wherein an adjusting bracket 2, a ceramic tile positioning block 7 and a steel mesh 4 are arranged on the base 1.
The adjusting bracket 2 comprises a lower frame 21, a lower sliding block 22, an upper frame 23 and an upper sliding block 24, wherein the lower frame 21 is arranged on the base 1, and the lower frame 21 is arranged along the length direction of the base 1; a lower sliding block 22 is arranged in the lower frame 21, and the lower sliding block 22 can perform reciprocating linear motion relative to the base 1 and the lower frame 21; an upper frame 23 is arranged on the lower sliding block 22, the upper frame 23 is arranged along the width direction of the base 1, an upper sliding block 24 is arranged in the upper frame 23, and the upper sliding block 24 is arranged perpendicular to the lower sliding block 22; the upper slider 24 is reciprocally linearly movable with respect to the upper frame 23.
The upper slider 24 is provided with a positioning block 241, and the positioning block 241 is two L-shaped blocks. The tile positioning block 7 is placed on the upper slider 24 and positioned by the positioning block 241.
The steel mesh 4 is provided with a plurality of leakage holes 41, and the shapes of the leakage holes 41 are matched with the areas to be printed with soldering paste of the ceramic chips on the ceramic chip positioning blocks 7.
The steel mesh 4 is hinged on the base 1 through the clamp 3, and the steel mesh 4 is positioned right above the ceramic chip positioning block 7.
The clamp 3 comprises an -th clamp 31, a second clamp 32 and a third clamp 33, a -th clamp mounting hole 11 is formed in the base 1, a -th clamp 31 is arranged in the -th clamp mounting hole 11, the -th clamp 31 is perpendicular to the base 1, the -th clamp 31 is provided with the second clamp 32, the second clamp 32 is perpendicular to the -th clamp 31, the base 1 and the -th clamp 31 form an I-shaped structure, the second clamp 32 is hinged to the third clamp 33, and the third clamp 33 is provided with a steel net 4.
The -th clamp 31 comprises a cylindrical part 311, a round notch is arranged on the side of the cylindrical part 311 , a threaded connecting shaft 312 is arranged on the top of the cylindrical part 311, and the second clamp 32 is of a square structure.
The bottom of the second clamp 32 is provided with a threaded hole 321, a threaded connecting shaft 312 of the -th clamp is arranged in the threaded hole 321, and blind holes 322 are processed on two sides of the second clamp 32.
The third clamp 33 has a U-shaped structure, and includes a horizontal portion 331 and vertical portions 332 at both ends of the horizontal portion, a long groove 333 is formed on the outer side of the horizontal portion 331 along the longitudinal direction, and a steel mesh 4 is placed in the long groove 333 and fixed by bolts.
The opposite ends of the two vertical parts 332 of the third clamp 33 are processed with pin shaft holes 334, the pin shaft holes 334 correspond to the corresponding blind holes 322 of the second clamp and are provided with pin shafts, so that the third clamp 33 is connected with the second clamp 32, and the third clamp 33 can rotate relative to the second clamp 32.
The lower frame 21 is in a square structure, th inverted L-shaped rails 211 are processed on the inner sides of two long sides of the lower frame 21, th L-shaped bosses 221 are processed on two sides of the lower slider 22, the th L-shaped bosses 221 are matched with the corresponding th inverted L-shaped rails 211, and the length of the lower slider 22 is smaller than that of the th inverted L-shaped rails 211.
The upper frame 21 is in a square structure, the inner sides of two long sides of the upper frame 23 are provided with second inverted L-shaped rails 231, the two sides of the upper sliding block 24 are provided with second L-shaped bosses 243, and the second L-shaped bosses 243 are matched with the corresponding second inverted L-shaped rails 231; the length of the upper slider 24 is smaller than the length of the second inverted-L shaped rail 231.
The lower slider 22 is provided with a adjustment bolt hole 222 at the end, and a adjustment bolt is arranged in the adjustment bolt hole 222.
The end of the upper slide block 24 is provided with a second adjusting bolt hole 242, and a th adjusting bolt is arranged in the second adjusting bolt hole 242.
The utility model discloses a position of the upper and lower slider of support is adjusted in the adjustment, realizes the removal of X axle direction, the Y axle direction of the ceramic chip locating piece on the top shoe to be suitable for the ceramic chip of different models, in addition, through adjusting the support, make the ceramic chip accurately cooperate on steel mesh and the ceramic chip locating piece, make the printing accuracy of soldering paste improve greatly.
The utility model discloses need welding pattern (metal level) according to the ceramic chip on the steel mesh, cut out the small opening that corresponds through laser, the purpose of design small opening is so that the soldering paste on the steel mesh can make to have pointed ground to get into the ceramic chip and treat that printing soldering paste is regional. The area of the solder paste is not required to be printed, and the solder paste cannot enter the area due to the obstruction of the steel mesh.
The utility model discloses the cooperation that upper ledge and last slider, lower frame and lower slider pass through L shape track and boss, and the structure is succinct, design benefit, and performance is good.
The utility model discloses a threaded connection adjusting bolt on slider about, realize the regulation to slider X axle direction, Y axle direction about, convenient to use through adjusting bolt.
The utility model discloses set up the balancing weight on anchor clamps for after the printing soldering paste was accomplished, lift the steel mesh, under the effect of balancing weight, the steel mesh can be in keeping fixed opening angle, the taking out of the ceramic chip locating piece of being convenient for.
The tool and the effect of the steel mesh printing are specifically as follows: steel mesh: and cutting a leak hole on the stainless steel sheet by laser according to requirements. A rack: comprises a base, an adjusting bracket and a clamp, and is used for placing a steel mesh and a ceramic positioning block. Ceramic chip positioning block: placing the ceramic tiles to be printed. Scraping: and scraping the soldering paste on the steel mesh into the leakage hole.
The technological process of the ceramic chip soldering paste printing device of the rectification module comprises the following steps:
(1) the ceramic chip 71 is placed on the ceramic chip positioning block 7 and then on the upper sliding block 24 of the rack;
(2) the steel mesh 4 is put down, the figure is checked to be aligned, namely, the ceramic tiles 71 on the ceramic tile positioning block 7 correspond to and are aligned with the leakage holes 41 on the steel mesh 4, the stirred soldering paste is poured into the front end of the steel mesh, and the scraper is held by hand, and slight pressure is applied to scrape the soldering paste to the lower end.
(3) The steel mesh is lifted slightly, the steel mesh is tapped slightly, and the tiles fall off from the template.
(4) And (5) taking down the ceramic chip positioning block 7 and repeating the steps.
Claims (10)
- The ceramic chip soldering paste printing device for the rectifier modules comprises a base (1) and is characterized in that an adjusting bracket (2), a ceramic chip positioning block (7) and a steel mesh (4) are arranged on the base (1);the adjusting bracket (2) comprises a lower frame (21), a lower sliding block (22), an upper frame (23) and an upper sliding block (24), wherein the lower frame (21) is arranged on the base (1), and the lower frame (21) is arranged along the length direction of the base (1); a lower sliding block (22) is arranged in the lower frame (21), and the lower sliding block (22) can perform reciprocating linear motion relative to the base (1) and the lower frame (21); an upper frame (23) is arranged on the lower sliding block (22), the upper frame (23) is arranged along the width direction of the base (1), an upper sliding block (24) is arranged in the upper frame (23), and the upper sliding block (24) is perpendicular to the lower sliding block (22); the upper sliding block (24) can do reciprocating linear motion relative to the upper frame (23); the upper sliding block (24) is provided with a positioning block (241), and the ceramic chip positioning block (7) is placed on the upper sliding block (24) and is positioned through the positioning block (241);a plurality of leakage holes (41) are formed in the steel mesh (4), and the shapes of the leakage holes (41) are matched with areas to be printed with soldering paste of the ceramic chips on the ceramic chip positioning blocks (7);the steel mesh (4) is hinged to the base (1) through the clamp (3), and the steel mesh (4) is located right above the ceramic chip positioning block (7).
- 2. The ceramic tile solder paste printing device of claim 1, wherein the fixture (3) comprises a th fixture (31), a second fixture (32) and a third fixture (33), the base (1) is provided with a th fixture mounting hole (11), the th fixture (31) is arranged in the th fixture mounting hole (11), the th fixture (31) is arranged perpendicular to the base (1), the th fixture (31) is provided with the second fixture (32), the second fixture (32) is arranged perpendicular to the th fixture (31), the base (1) and the th fixture (31) form an I-shaped structure, the second fixture (32) is hinged to the third fixture (33), and the third fixture (33) is provided with a steel mesh (4).
- 3. The commutation module tile solder paste printing apparatus of claim 2, wherein the th clamp (31) comprises a cylindrical portion (311), a segment is provided on a side of the cylindrical portion (311) , a threaded connection shaft (312) is provided on a top of the cylindrical portion (311), the second clamp (32) has a square structure;the bottom of the second clamp (32) is provided with a threaded hole (321), and a threaded connecting shaft (312) of the th clamp is arranged in the threaded hole (321).
- 4. The commutation module tile solder paste printing apparatus of claim 3, wherein blind holes (322) are formed in both sides of the second fixture (32);the third clamp (33) is of a U-shaped structure and comprises a horizontal part (331) and vertical parts (332) at two ends of the horizontal part, long grooves (333) are machined in the outer side of the horizontal part (331) along the length direction, and steel nets (4) are placed in the long grooves (333) and fixed through bolts; and opposite ends of two vertical parts (332) of the third clamp (33) are processed with pin shaft holes (334), the pin shaft holes (334) correspond to the corresponding blind holes (322) of the second clamp, pin shafts are arranged in the holes, the third clamp (33) is connected with the second clamp (32), and the third clamp (33) can rotate relative to the second clamp (32).
- 5. The rectifying module ceramic tile solder paste printing device according to claim 1, wherein the lower frame (21) is in a square structure, th inverted L-shaped rails (211) are formed on the inner sides of two long sides of the lower frame (21), th L-shaped bosses (221) are formed on two sides of the lower slider (22), the th L-shaped bosses (221) are matched with the corresponding th inverted L-shaped rails (211), and the length of the lower slider (22) is smaller than that of the th inverted L-shaped rails (211).
- 6. The ceramic tile solder paste printing device of claim 1, wherein the upper frame (23) is in a square structure, the inner sides of two long sides of the upper frame (23) are provided with second inverted L-shaped rails (231), the two sides of the upper slide block (24) are provided with second L-shaped bosses (243), and the second L-shaped bosses (243) are matched with the corresponding second inverted L-shaped rails (231); the length of the upper sliding block (24) is less than that of the second inverted L-shaped track (231).
- 7. The commutation module tile paste printing device of claim 1, wherein the lower slider (22) has a th adjustment bolt hole (222) formed at an end thereof, and a th adjustment bolt is disposed in the th adjustment bolt hole (222).
- 8. The commutation module tile paste printing apparatus of claim 1, wherein the upper slider (24) has a second adjustment bolt hole (242) formed at an end thereof, and wherein the second adjustment bolt hole (242) has a th adjustment bolt disposed therein.
- 9. The commutation module tile solder paste printing apparatus of claim 4, wherein the fixture (3) has a weight (6) thereon.
- 10. The commutation module tile solder paste printing apparatus of claim 9, wherein the weight (6) is disposed on a pin, or wherein the weight (6) is disposed on a third fixture (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920725030.7U CN210008041U (en) | 2019-05-20 | 2019-05-20 | rectifier module ceramic chip soldering paste printing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920725030.7U CN210008041U (en) | 2019-05-20 | 2019-05-20 | rectifier module ceramic chip soldering paste printing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210008041U true CN210008041U (en) | 2020-01-31 |
Family
ID=69307338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920725030.7U Expired - Fee Related CN210008041U (en) | 2019-05-20 | 2019-05-20 | rectifier module ceramic chip soldering paste printing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210008041U (en) |
-
2019
- 2019-05-20 CN CN201920725030.7U patent/CN210008041U/en not_active Expired - Fee Related
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200131 |
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| CF01 | Termination of patent right due to non-payment of annual fee |