CN210006734U - Packaged antenna module - Google Patents
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- CN210006734U CN210006734U CN201921157991.9U CN201921157991U CN210006734U CN 210006734 U CN210006734 U CN 210006734U CN 201921157991 U CN201921157991 U CN 201921157991U CN 210006734 U CN210006734 U CN 210006734U
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Abstract
The utility model provides an kind of encapsulation antenna module, encapsulation antenna module include rewiring layer, antenna structure, semiconductor chip, third encapsulated layer and encapsulation antenna connector, wherein, antenna structure includes the connector window and piles up at least and set up antenna structure and the second antenna structure on rewiring layer's second face, and encapsulation antenna connector is arranged in the connector window and is connected with rewiring layer electricity, the utility model discloses a encapsulation antenna connector that is arranged in the connector window carries out the electrical property and draws forth, reducible signal loss, and need not to prepare and rewiring layer electricity the metal lug of being connected, need not to adopt the flip-chip technology to carry out the electricity and connect, therefore can improve the flexibility of encapsulation antenna module position overall arrangement, advance the whole competitive advantage of the improvement WLP AiP of step.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package, a kinds of encapsulation antenna module are related to.
Background
With the popularization of high-tech electronic products, especially in order to meet the mobile requirement, most of the high-tech electronic products have increased wireless communication functions.
A Package Antenna (AiP for short) is a technology which integrates an Antenna and a chip in a Package based on Package materials and processes to realize a system-level wireless function, and has the advantages of simplified system design, miniaturized product and low cost. AiP technology provides a good Antenna and Package solution for a system-level wireless chip due to the fact that the technology conforms to the trend of improving the integration level of a silicon-based semiconductor process, and with the rapid development of communication information, AiP technology becomes technologies which are necessary for 5G (5 generation) communication and automobile radar chips, so AiP technology receives attention.
In the conventional AiP module, the antenna is usually directly fabricated on the circuit board, and the connector is used as the interconnection between the antenna and the outside, the side of the circuit board is used as the antenna radiation surface, and the side is connected to the encapsulated chip and the motherboard.
The wafer level packaging antenna (WLP AiP) works on a whole wafer, an antenna is made on a plastic packaging layer, compared with a traditional AiP module, the WLP AiP has higher precision, is lighter, thinner and shorter in size, and is widely applied to .
Therefore, novel packaged antenna modules are designed, so that WLP aips can be directly interconnected with the outside without a motherboard, thereby reducing the signal loss of the packaged antenna, improving the flexibility of the position layout of the packaged antenna, and further improving the overall competitive advantage of wlpaips by .
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, the present invention provides kinds of packaged antenna modules, which are used for solving the problems of signal loss and position layout limitation of the packaged antenna caused by interconnection between the packaged antenna and the external world through the motherboard in the prior art.
To achieve the above and other related objects, the present invention provides kinds of packaged antenna modules, including:
a rewiring layer including th and second surfaces oppositely arranged;
an antenna structure, wherein the antenna structure comprises a connector window and a th antenna structure and a second antenna structure stacked and arranged on a second face of the redistribution layer, wherein the th antenna structure comprises a 0 th antenna feed line, a 1 th antenna metal layer and a 2 th encapsulation layer, a th end of the 3 th antenna feed line is electrically connected with the redistribution layer, a th encapsulation layer covers the th antenna feed line and exposes a second end of the th antenna feed line, a th antenna metal layer is located on the th encapsulation layer and is electrically connected with a second end of the th antenna feed line, the second antenna structure comprises a second encapsulation layer and a second antenna metal layer, the second encapsulation layer covers the th antenna metal layer, and the second antenna metal layer is located on the second encapsulation layer;
a semiconductor chip located on an th face of the rewiring layer and electrically connected to the rewiring layer;
a third encapsulation layer covering the th face of the semiconductor chip and the rewiring layer;
a package antenna connector located in the connector window and electrically connected to the redistribution layer.
Optionally, the package antenna connector is matched with a circuit board connector on a circuit board, and the circuit board connector is electrically connected through the package antenna connector, wherein the circuit board comprises or a combination of a flexible circuit board and a rigid circuit board.
Optionally, the antenna structure further includes a metal pillar and a metal connector, the end of the metal pillar is electrically connected to the redistribution layer, the th encapsulation layer covers the second surface of the redistribution layer and the metal pillar and exposes the second end of the metal pillar, the metal connector is located on the th encapsulation layer and is electrically connected to the second end of the metal pillar, the metal connector is exposed at the bottom of the connector window, and the package antenna connector is electrically connected to the metal connector so as to be electrically connected to the redistribution layer through the metal connector and the metal pillar.
Optionally, the bottom of the connector window exposes the metal wires of the rewiring layer, and the package antenna connector is electrically connected to the metal wires.
Optionally, a dielectric layer is further included between the th antenna structure and the second antenna structure.
Optionally, the second antenna structure further comprises a second antenna feed line between the second and th antenna metal layers, the second antenna metal layer and the th antenna metal layer being connected by the second antenna feed line.
Optionally, the th antenna feed line comprises or a combination of a copper feed line, a gold feed line, a silver feed line, and an aluminum feed line.
Optionally, the semiconductor chip comprises or a combination of active and passive components, the active component comprises or a combination of bulk and power management chips, and the passive component comprises or a combination of resistors, capacitors and inductors.
Optionally, the packaged antenna module includes types or combinations of a GPS antenna, an FM earpiece aperture antenna, a WIFI antenna, a BT antenna, a diversity antenna, and a main antenna.
As described above, the utility model discloses an encapsulation antenna module, through the connector window, the encapsulation antenna connector that will be arranged in the connector window is connected with rewiring layer electricity, carries out the electrical property through the encapsulation antenna connector and draws forth for encapsulation antenna module can directly realize interconnecting with the external world, thereby reducible signal loss, just the utility model discloses need not to prepare the metal convex block of being connected with rewiring layer electricity, need not to adopt the flip-chip technology to carry out the electricity and connect, therefore can improve the flexibility of encapsulation antenna module position overall arrangement, the whole competitive advantage of improvement WLP AiP of step.
Drawings
Fig. 1 shows a flow chart of a manufacturing process of the packaged antenna module according to the present invention.
Fig. 2 to 8 are schematic structural diagrams illustrating steps of preparing a packaged antenna module according to embodiment , wherein fig. 8 is a schematic structural diagram of a packaged antenna module according to embodiment .
Fig. 9 is a schematic structural diagram illustrating the packaged antenna module and the circuit board in the embodiment .
Fig. 10 and fig. 11 are schematic structural diagrams of a packaged antenna module according to a second embodiment of the present invention, wherein fig. 11 is a schematic structural diagram of a packaged antenna module according to the second embodiment of the present invention.
Fig. 12 is a schematic structural diagram illustrating the packaged antenna module and the circuit board according to the second embodiment of the disclosure.
Description of the element reference numerals
101 supporting substrate
102 separating layers
103. 203 rewiring layer
113. 213 Wiring Medium
123. 223 metal wiring
104. 204 th antenna structure
1141. 214 th antenna feed line
1142 Metal post
124. 224 th encapsulation layer
1341. 234 th antenna metal layer
1342 Metal connecting piece
105. 205 dielectric layer
106. 206 second antenna structure
116. 216 second encapsulation layer
126. 226 second antenna metal layer
107. 207 semiconductor chip
108. 208 third encapsulation layer
109. 209 connector window
110. 210 connector
111. 211 encapsulated antenna connector
112. 212 circuit board connector
120. 220 circuit board
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
It should be noted that the drawings provided in the embodiments are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the form, amount and ratio of each component can be changed freely in in actual implementation, and the layout of the components may be more complicated.
Example
As shown in FIG. 8, the present embodiment provides packaging antenna module, which includes a redistribution layer 103, an antenna structure, a semiconductor chip 107, a third packaging layer 108 and a packaging antenna connector 111, wherein the redistribution layer 103 includes a second side and a second side disposed opposite to each other, the antenna structure includes a connector window 109 and at least a first 0 antenna structure 104 and a second antenna structure 106 stacked on the second side of the redistribution layer 103, the antenna structure 104 includes a 2 antenna feed line 1141, a 3 antenna metal layer 1341 and a packaging layer 124, the end of the antenna feed line 1141 is electrically connected to the redistribution layer 103, the packaging layer 124 covers the antenna feed line 1141 and exposes the second end of the antenna feed line 1141, the antenna metal layer 1341 is located on the packaging layer 124 and is electrically connected to the second end of the antenna feed line 1141, the second antenna structure 106 includes a second antenna layer 1341 and a second antenna layer 116, the second antenna structure 13411 is electrically connected to the semiconductor chip 107, the redistribution layer 103 is electrically connected to the second antenna structure 111, and the second antenna structure 102 is electrically connected to the antenna feed line 1141, and the antenna structure 116.
The packaged antenna module of this embodiment, through the connector window, the packaged antenna connector that will be located in the connector window is connected with rewiring layer electricity, carry out the electrical property through packaged antenna connector and draw forth for packaged antenna module can directly realize interconnecting with the external world, thereby reducible signal loss, and this embodiment need not to prepare the metal lug that is connected with rewiring layer electricity, need not to adopt the flip-chip technology to carry out the electricity and connect, therefore can improve the flexibility of packaged antenna module position overall arrangement, the whole competitive advantage of improvement WLPAiP of step.
Referring to fig. 1, the present embodiment provides methods for manufacturing the packaged antenna module, but the method for manufacturing the packaged antenna module is not limited thereto.
Specifically, as shown in fig. 2 to 8, schematic structural diagrams of steps of preparing the packaged antenna module in this embodiment are shown.
First, a package antenna structure is provided, wherein fig. 2 to 6 show schematic structural diagrams of steps of manufacturing the package antenna structure in this embodiment, but the manufacturing method of the package antenna structure is not limited thereto.
As shown in fig. 2, a supporting substrate 101 is provided, and a separation layer 102 is formed on the supporting substrate 101.
In particular, the supporting substrate 101 may include kinds of substrates selected from a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate, the separation layer 102 may include a polymer layer with reduced viscosity under heating or light irradiation, and the polymer layer may include an LTHC light-to-heat conversion layer, in this embodiment, the supporting substrate 101 is preferably a glass substrate because the glass substrate has a low cost, the separation layer 102 is easily formed on the surface thereof, and the difficulty of a subsequent stripping process is reduced, and the separation layer 102 is preferably applied to the surface of the supporting substrate 101 by a spin coating process, and is cured by an ultraviolet curing or thermal curing process to form the LTHC light-to-heat conversion layer, so that the LTHC light-to-heat conversion layer may be heated based on laser in the subsequent stripping process to separate the supporting substrate 101 from the LTHC light-to-heat conversion layer.
As shown in fig. 3, the redistribution layer 103 is formed on the separation layer 102, and the redistribution layer 103 includes an -th surface in contact with the separation layer 102 and an opposite second surface.
Specifically, the redistribution layer 103 includes a wiring medium 113 and metal wires 123, the material of the wiring medium 113 may include or a combination of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass, the material of the metal wires 123 may include or a combination of copper, aluminum, nickel, gold, silver, and titanium, the method for fabricating the wiring medium 113 may include or a combination of pvd and cvd, and the method for fabricating the metal wires 123 may include or a combination of pvd, cvd, electroplating, or electroless plating, and the specific materials, number of layers, and distribution shapes of the wiring medium 113 and the metal wires 123 may be selected according to specific needs, and are not limited herein.
As shown in fig. 4, the -th antenna structure 104 is formed on the second side of the redistribution layer 103.
As an example, the antenna structure 104 may further include a metal pillar 1142 and a metal connector 1342, the end of the metal pillar 1142 is electrically connected to the redistribution layer 103, the encapsulation layer 124 covers the second side of the redistribution layer 103 and the metal pillar 1142 and exposes the second end of the metal pillar 1142, and the metal connector 1342 is located on the encapsulation layer 124 and is electrically connected to the second end of the metal pillar 1142.
Specifically, in this embodiment, the metal connector 1342 is exposed at the bottom of the connector window 109, and the package antenna connector 111 is electrically connected to the metal connector 1342, so as to be electrically connected to the redistribution layer 103 through the metal connector 1342 and the metal pillar 1142.
Wherein the step of forming the th antenna structure 104 may comprise:
forming the th antenna feed line 1141 and the metal post 1142 on the second surface of the redistribution layer 103, wherein the th end of the th antenna feed line 1141 and the th end of the metal post 1142 are electrically connected to the redistribution layer 103;
forming an th encapsulation layer 124 on the second side of the redistribution layer 103, the th encapsulation layer 124 covering the second side of the redistribution layer 103, the th antenna feed line 1141 and the metal post 1142 and exposing a second end of the th antenna feed line 1141 and a second end of the metal post 1142;
forming the antenna metal layer 1341 and a metal connector 1342 on the packaging layer 124, wherein the antenna metal layer 1341 is electrically connected to the second end of the antenna feed line 1141, and the metal connector 1342 is electrically connected to the second end of the metal post 1142.
As an example, the th antenna feed line 1141 may be formed by or a combination of soldering, plating and electroless plating, the th antenna feed line 1141 may be formed by or a combination of copper, gold, silver and aluminum, the metal post 1142 may be formed by or a combination of soldering, plating and electroless plating, and the metal post 1142 may be formed by or a combination of copper, gold, silver and aluminum.
Specifically, the th antenna feed line 1141 and the metal post 1142 are preferably made of the same material, the th antenna metal layer 1341 and the metal connector 1342 are preferably made of the same material, so that the th antenna feed line 1141 and the metal post 1142 can be formed in the same process, and the th antenna metal layer 1341 and the metal connector 1342 can be formed in the same process, thereby improving the production efficiency and reducing the production cost.
The material of the th encapsulating layer 124 can include of polyimide, silicone and epoxy, the method for forming the th encapsulating layer 124 can include of compression molding, transfer molding, liquid seal molding, vacuum lamination and spin coating, after the th encapsulating layer 124 is formed, a chemical mechanical polishing method can be adopted to act on the upper surface of the th encapsulating layer 124 so as to provide the flat th encapsulating layer 124, and the step improves the product quality.
As an example, the methods of forming the th antenna metal layer 1341 and the metal connecting member 1342 may include or a combination of physical vapor deposition, chemical vapor deposition, electroplating process, or electroless plating process.
Specifically, a metal layer may be formed on the surface of the th encapsulating layer 124 by using physical vapor deposition or chemical vapor deposition, and then the th antenna metal layer 1341 and the metal connector 1342 having a desired pattern are formed by using an etching process, or of course, the th antenna metal layer 1341 and the metal connector 1342 may be formed by using an electroplating process or a chemical plating process, for example, a metal seed layer may be formed on the surface of the th encapsulating layer 124, then a patterned photoresist is formed, the th antenna metal layer 1341 and the metal connector 1342 are formed by using an electroplating process, and finally the photoresist and the excess metal seed layer are removed.
As an example, a dielectric layer 105 may be further included between the th antenna structure 104 and the subsequently formed second antenna structure 106.
As shown in fig. 4, the dielectric layer 105 covers the th encapsulating layer 124, the th antenna metal layer 1341 and the metal connector 1342, and the bonding force between the th encapsulating layer 124 and the second encapsulating layer 116 can be further improved by the dielectric layer 105, so as to improve the stability of the encapsulated antenna structure, wherein the dielectric layer 105 can be formed by using the same material and preparation method as the th encapsulating layer 124 and the second encapsulating layer 116, so as to reduce the process complexity and improve the bonding performance between the th encapsulating layer 124 and the second encapsulating layer 116.
As shown in fig. 5, the second antenna structure 106 is formed.
Specifically, the second antenna structure 106 includes the second package layer 116 and a second antenna metal layer 126, the second package layer 116 covers the dielectric layer 105, and the second antenna metal layer 126 is located on the second package layer 116. the preparation method and material selection of the second antenna structure 106 may be the same as those of the antenna structure 104, which is not described herein again, and preferably, the second package layer 116, the dielectric layer 105, and the package layer 124 are made of the same material, so as to improve the structural stability.
For example, the second antenna metal layer 126 has windows in the vertical region of the metal connector 1342 to avoid the second antenna metal layer 126 from shielding the metal connector 1342, so as to further reduce the process difficulty and cost when the metal connector 1342 is exposed by removing the second package layer 116.
As an example, the second antenna structure 106 may further include a second antenna feed line (not shown) between the second antenna metal layer 126 and the th antenna metal layer 1341 for connecting the second antenna metal layer 126 and the th antenna metal layer 1341, so as to further reduce the signal loss of the packaged antenna structure.
As an example, the second side of the redistribution layer 103 may include N antenna structures stacked on top of each other, where N ≧ 2, to further increase the integration and integration performance of the packaged antenna structure.
Specifically, in this embodiment, N is 2, that is, the th antenna structure 104 and the second antenna structure 106 are stacked, in another embodiment, N may also be 3, 4, 5, and the like, so as to further improve the integration level and the integration performance of the packaged antenna structure, and a specific value of N is not limited herein.
Referring to fig. 6, the separation layer 102 and the supporting substrate 101 are removed to expose the th surface of the redistribution layer 103, and the semiconductor chip 107 and the third packaging layer 108 are formed on the th surface of the redistribution layer 103.
Specifically, the third encapsulation layer 108 may protect the redistribution layer 103 and the semiconductor chip 107, and the third encapsulation layer 108 may also serve as a support layer to improve structural stability, and the material and the preparation method of the third encapsulation layer 108 may be the same as those of the encapsulation layer 124, which is not described herein again.
By way of example, the semiconductor die 107 may include or a combination of active and passive components, the active components may include or a combination of bulk and power management dies, and the passive components may include or a combination of resistors, capacitors, and inductors.
Next, as shown in fig. 7, the connector window 109 is formed in the antenna structure.
Specifically, in the present embodiment, the metal connectors 1342 are exposed by removing a portion of the second package layer 116 and the dielectric layer 105. the method for removing the second package layer 116 and the dielectric layer 105 may include or a combination of dry etching and wet etching.
Then, as shown in fig. 8, the package antenna connector 111 is formed in the connector window 109, and the package antenna connector 111 is electrically connected to the redistribution layer 103 to prepare the package antenna module.
As an example, the method of forming the packaged antenna connector 111 in the connector window 109 may include or a combination of reflow soldering and laser soldering.
Specifically, the type and type of the packaged antenna connector 111 are not limited herein, in this embodiment, a reflow soldering manner is adopted to electrically connect the packaged antenna connector 111 and the metal connector 1342, and the packaged antenna connector 111 is electrically connected to the redistribution layer 103 through the metal connector 1342 and the metal post 1142. Wherein, after the packaged antenna connector 111 is formed, a cleaning step can be performed to improve the cleanliness.
By way of example, the package antenna connector 111 is matched with a circuit board connector 112 located on a circuit board 120, and the electrical connection between the package antenna structure and the circuit board 120 is realized through the electrical connection between the package antenna connector 111 and the circuit board connector 112, and the circuit board 120 includes or a combination of a flexible circuit board and a rigid circuit board.
Specifically, as shown in fig. 9, the circuit board 120 and the circuit board connector 112 are provided, wherein the circuit board 120 may include of a flexible circuit board and a rigid circuit board or a combination thereof, the circuit board connector 112 is electrically connected to the circuit board 120, and the circuit board connector 112 is matched with the package antenna connector 111 to form the connector 110 capable of being electrically connected well, so as to achieve interconnection through the connector 110, wherein the package layer 124 may serve as a core layer to provide a supporting function.
As an example, the packaged antenna module may include or a combination of a GPS antenna, an FM earpiece aperture antenna, a WIFI antenna, a BT antenna, a diversity antenna, and a main antenna.
Specifically, the packaged antenna module is electrically led out through the packaged antenna connector 111, so that the packaged antenna module can be directly interconnected with the outside, signal loss can be reduced, a metal bump electrically connected with the rewiring layer 103 does not need to be prepared, an inverted mounting process does not need to be adopted for electrical connection, the packaged antenna module directly serves as an electrical leading-out end through the packaged antenna connector 111, and therefore the flexibility of the position layout of the packaged antenna module can be improved, the packaged antenna module can be flexibly applied to equipment such as mobile phones, computers and smart homes, for example, mobile phones can include types or combinations of GPS antennas, FM earphone hole antennas, WIFI antennas, BT antennas, diversity antennas and main antennas, and the circuit board 120 can adopt a mobile phone shell.
Example two
As shown in fig. 11, this embodiment provides a schematic structural diagram of packaged antenna modules, and the main difference from embodiment is that the position of the connector window in the packaged antenna module is different, so as to expand the selection range of the packaged antenna connector.
The packaged antenna module comprises a rewiring layer 203, an antenna structure, a semiconductor chip 207, a third packaging layer 208 and a packaged antenna connector 211, wherein the rewiring layer 203 comprises a face and a second face which are arranged oppositely, the antenna structure comprises a connector window 209 and at least a antenna structure 204 and a second antenna structure 206 which are arranged on the second face of the rewiring layer 203 in a stacked mode, the antenna structure 204 comprises a antenna feed line 214, a antenna metal layer 234 and a packaging layer 224, the 5 end of the 4 antenna feed line 214 is electrically connected with the rewiring layer 203, the packaging layer 224 covers the antenna feed line 214 and exposes the second end of the antenna feed line 214, the antenna metal layer 234 is located on the 8236 packaging layer 224 and is electrically connected with the antenna feed line 214, the second antenna structure 206 comprises a second packaging layer 216 and a second antenna metal layer 226, the second packaging layer 216 is located on the second packaging layer packaging layer 224 and is electrically connected with the semiconductor chip connector 207, the rewiring layer 203, the second antenna structure 206 is located on the antenna wiring layer , and the semiconductor chip connector layer 36207.
As an example, the bottom of the connector window 209 exposes the metal wires 223 of the redistribution layer 203, and the package antenna connector 211 is electrically connected to the metal wires 223.
Specifically, the redistribution layer 203 includes a wiring medium 213 and the metal wiring 223. In this embodiment, the metal wires 223 of the redistribution layer 203 are directly exposed at the bottom of the connector window 209, and the package antenna connector 211 is electrically connected to the metal wires 223 so as to be electrically led out through the package antenna connector 211, thereby expanding the selection range of the package antenna connector 211.
Referring to fig. 10 and fig. 11, schematic structural diagrams of the packaged antenna module according to this embodiment are shown, wherein a dielectric layer 205 may further be included between the th antenna structure 204 and the second antenna structure 206, and the specific structure and the manufacturing method of the packaged antenna module may refer to embodiment , which is not described herein again.
Referring to fig. 12, a circuit board 220 and a circuit board connector 212 are provided, wherein the circuit board 220 may include or a combination of a flexible circuit board and a rigid circuit board, the circuit board connector 212 is electrically connected to the circuit board 220, and the circuit board connector 212 is matched with the package antenna connector 211 to form an electrically connectable connector 210, thereby realizing interconnection through the connector 210, and the third package layer 208 may serve as a core layer for providing a support function.
To sum up, the utility model discloses an encapsulation antenna module, through the connector window, the encapsulation antenna connector that will be arranged in the connector window is connected with rewiring layer electricity, carries out the electrical property through the encapsulation antenna connector and draws forth for encapsulation antenna module can directly realize interconnecting with the external world, thereby reducible signal loss, just the utility model discloses need not to prepare and rewiring layer electricity be connected's metal convex block, need not to adopt the flip-chip technology to carry out the electricity and connect, and directly draw forth the end as the electrical property through the encapsulation antenna connector, therefore can improve the flexibility of encapsulation antenna module position overall arrangement, advance step improvement WLP AiP's whole competitive advantage.
It will be appreciated by those skilled in the art that changes in this embodiment may be made without departing from the principles and spirit of the invention, the scope of which is defined by the claims appended hereto, and their equivalents in .
Claims (9)
1, kinds of encapsulation antenna module, its characterized in that, encapsulation antenna module includes:
a rewiring layer including th and second surfaces oppositely arranged;
an antenna structure, wherein the antenna structure comprises a connector window and a th antenna structure and a second antenna structure stacked and arranged on a second face of the redistribution layer, wherein the th antenna structure comprises a 0 th antenna feed line, a 1 th antenna metal layer and a 2 th encapsulation layer, a th end of the 3 th antenna feed line is electrically connected with the redistribution layer, a th encapsulation layer covers the th antenna feed line and exposes a second end of the th antenna feed line, a th antenna metal layer is located on the th encapsulation layer and is electrically connected with a second end of the th antenna feed line, the second antenna structure comprises a second encapsulation layer and a second antenna metal layer, the second encapsulation layer covers the th antenna metal layer, and the second antenna metal layer is located on the second encapsulation layer;
a semiconductor chip located on an th face of the rewiring layer and electrically connected to the rewiring layer;
a third encapsulation layer covering the th face of the semiconductor chip and the rewiring layer;
a package antenna connector located in the connector window and electrically connected to the redistribution layer.
2. The packaged antenna module of claim 1, wherein the packaged antenna connector is mated with a circuit board connector on a circuit board, the circuit board connector electrically connected to the circuit board connector, the circuit board comprising of a flexible circuit board and a rigid circuit board.
3. The packaged antenna module of claim 1, wherein the antenna structure further comprises a metal pillar having a end electrically connected to the redistribution layer, a encapsulation layer covering the second side of the redistribution layer and the metal pillar and exposing a second end of the metal pillar, and a metal connector on the encapsulation layer and electrically connected to the second end of the metal pillar, wherein the bottom of the connector window exposes the metal connector, and the packaged antenna connector is electrically connected to the metal connector to electrically connect to the redistribution layer through the metal connector and the metal pillar.
4. The packaged antenna module of claim 1, wherein: and the bottom of the connector window exposes the metal wiring of the rewiring layer, and the packaging antenna connector is electrically connected with the metal wiring.
5. The packaged antenna module of claim 1, further comprising a dielectric layer between the th antenna structure and the second antenna structure.
6. The packaged antenna module of claim 1, wherein the second antenna structure further comprises a second antenna feed line between the second antenna metal layer and the th antenna metal layer, the second antenna metal layer being connected to the th antenna metal layer by the second antenna feed line.
7. The packaged antenna module of claim 1, wherein the th antenna feed line comprises or a combination of a copper feed line, a gold feed line, a silver feed line, and an aluminum feed line.
8. The packaged antenna module of claim 1, wherein the semiconductor chip comprises active components and/or passive components, the active components comprise active components and/or passive components comprise resistors, capacitors and inductors, and the combination of the active components and the passive components comprise resistors, capacitors and inductors.
9. The packaged antenna module of any of claims 1-8, wherein the packaged antenna module comprises or a combination of a GPS antenna, an FM earpiece hole antenna, a WIFI antenna, a BT antenna, a diversity antenna, and a main antenna.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921157991.9U CN210006734U (en) | 2019-07-22 | 2019-07-22 | Packaged antenna module |
| US16/936,015 US11626657B2 (en) | 2019-07-22 | 2020-07-22 | Antenna packaging module and making method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921157991.9U CN210006734U (en) | 2019-07-22 | 2019-07-22 | Packaged antenna module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210006734U true CN210006734U (en) | 2020-01-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921157991.9U Active CN210006734U (en) | 2019-07-22 | 2019-07-22 | Packaged antenna module |
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| CN (1) | CN210006734U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112054281A (en) * | 2020-08-31 | 2020-12-08 | 瑞声新能源发展(常州)有限公司科教城分公司 | Antenna structure and mobile terminal |
| CN113539979A (en) * | 2020-04-16 | 2021-10-22 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
-
2019
- 2019-07-22 CN CN201921157991.9U patent/CN210006734U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113539979A (en) * | 2020-04-16 | 2021-10-22 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN112054281A (en) * | 2020-08-31 | 2020-12-08 | 瑞声新能源发展(常州)有限公司科教城分公司 | Antenna structure and mobile terminal |
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