CN209998916U - rectifier module bottom plate polishing device - Google Patents
rectifier module bottom plate polishing device Download PDFInfo
- Publication number
- CN209998916U CN209998916U CN201920734160.7U CN201920734160U CN209998916U CN 209998916 U CN209998916 U CN 209998916U CN 201920734160 U CN201920734160 U CN 201920734160U CN 209998916 U CN209998916 U CN 209998916U
- Authority
- CN
- China
- Prior art keywords
- axis slide
- wheel
- slide rail
- bottom plate
- rectifier module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007494 plate polishing Methods 0.000 title claims description 8
- 238000005498 polishing Methods 0.000 claims description 32
- 230000000694 effects Effects 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model belongs to the technical field of rectifier module processing equipment, rectifier module bottom plate burnishing device is disclosed, which comprises a frame, be equipped with moving table and burnishing device in the frame, moving table includes X axle slide rail, X axle slider, Y axle slide rail, Y axle slider, X axle slider drive arrangement, the frame sets up X axle slide rail, set up X axle slider on the X axle slide rail, set up Y axle slide rail on the X axle slider, set up Y axle slider on the Y axle slide rail, X axle slider drive arrangement includes motor, set up the disc on motor output shaft, the disc passes through the crank and is connected with X axle slider hinge, burnishing device includes the grinding wheel, the grinding wheel both sides set up action wheel, take-up pulley, action wheel, take-up pulley are located the grinding wheel top respectively, the abrasive band is established to action wheel, take-up pulley, the cover on the grinding wheel, the utility model discloses utilize single-end flat machine and 400 mesh abrasive band to drive the abrasive band high speed operation after assembling, polish the bottom plate surface to reach the effect of.
Description
Technical Field
The utility model relates to a rectifier module processing equipment technical field specifically is rectifier module bottom plate burnishing device.
Background
The rectifier module bottom plate adopts a copper plate, and the defects of scratches, pits and the like can be generated in the raw material copper plate and the production process. The appearance quality of the prepared product is poor. Currently, no effective measures exist.
The patent of Chinese utility model with the grant publication number of CN 203546165U and the grant publication date of 2014 4.16 discloses electrolytic manganese cathode plate leveling and polishing machines, which comprises a frame part, a leveling part and a polishing part, wherein the frame part is a frame formed by welding plates and comprises pairs of L-shaped main plates, the main plates are movably connected with main sliding plates through slideways, an upper beam and a lower beam are respectively fixed and positioned between the two main plates and between the two main sliding plates, the upper beam is provided with an upper bearing seat I and an upper bearing seat II with groove-shaped bolt holes, the lower beam is provided with a lower bearing seat I and a lower bearing seat II with groove-shaped bolt holes, the leveling part comprises 2 pairs of steel wheels which are arranged in a delta shape, the working height of the steel wheels is 3/5-4/5 of the height of the cathode plate surface, the upper part of the steel wheels is in a conical shape, two ends of each steel wheel are movably connected with the upper bearing seat I and the lower bearing seat I through bearings, the upper bearing seat I is connected with the lower beam, the lower bearing seat I is connected with the lower beam, the polishing part comprises at least pairs of steel wheels which are arranged behind the polishing part of the polishing part, the polishing part is connected with the lower bearing seat II, the lower bearing seat II is connected with the upper bearing seat II, the polishing part of the polishing wheel, the polishing part is connected with the polishing wheel, the polishing part of the polishing wheel, the polishing part is connected with the polishing wheel, the lower bearing seat II.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide rectifier module bottom plate burnishing device utilizes single-end flat throwing machine and 400 mesh abrasive band assembly back to drive the high-speed operation of abrasive band through high speed motor, polishes bottom plate surface to reach the effect to the bottom plate polishing.
The utility model aims at realizing the polishing device of rectifier module bottom plates by the following technical proposal, which comprises a frame, wherein a movable workbench and a polishing device are arranged on the frame;
the mobile workbench comprises an X-axis slide rail, an X-axis slide block, a Y-axis slide rail, a Y-axis slide block and an X-axis slide block driving device, wherein the rack is provided with the X-axis slide rail, the X-axis slide rail is provided with the X-axis slide block, the X-axis slide block is provided with the Y-axis slide rail, and the Y-axis slide rail is provided with the Y-axis slide block;
the polishing device comprises a driving wheel, a driving wheel driving motor, a tension wheel and a grinding wheel; a driving wheel and a tensioning wheel are arranged on two sides of the grinding wheel and are respectively positioned above the grinding wheel; the driving wheel, the tension wheel and the grinding wheel are sleeved with abrasive belts.
Preferably, a tensioning wheel height adjusting device is arranged on the machine frame and comprises an th screw rod, a th moving block and a 0 th mounting frame, the th mounting frame is of an inverted-U-shaped structure, the th moving block is slidably arranged in the th mounting frame, a th threaded hole is formed in a top plate of the th mounting frame, and the th screw rod penetrates through the th threaded hole and is in threaded connection with the th moving block.
Preferably, the grinding height adjusting device is arranged on the rack and comprises a second lead screw, a second moving block and a second mounting frame, the second mounting frame is of an inverted U-shaped structure, the second moving block is arranged in the second mounting frame in a sliding mode, a second threaded hole is formed in a top plate of the second mounting frame, and the second lead screw penetrates through the second threaded hole and is in threaded connection with the second moving block.
Preferably, the grinding wheel is a rubber wheel.
Preferably, the grain number of the abrasive belt is 400 meshes.
Preferably, a supporting plate is arranged on the Y-axis sliding block, and an L-shaped limiting block is arranged on the supporting plate.
Compared with the prior art, the utility model discloses following beneficial effect has:
, the drive wheel is driven by a motor, the drive wheel, the driven wheel, the grinding wheel are matched with the abrasive belt, so that the abrasive belt rotates, the rotating abrasive belt is contacted with the rectifier bottom plate, and the bottom plate of the finisher is polished.
And secondly, the rectifier module bottom plate is taken out and put in through the matching of the Y-axis slide rail and the Y-axis slide block. When the Y-axis sliding block is pulled out manually, the polished product is taken out, a new product to be polished is put in, the Y-axis sliding block is pushed into the position flush with the grinding wheel manually, the X-axis sliding block driving device adopts a crank structure, so that the X-axis sliding block, the Y-axis sliding block and the rectifying bottom plate can reciprocate along the X-axis direction, the product on the sliding block is pushed into the lower part of the grinding wheel, the grinding wheel polishes the product and is then pushed out of the grinding wheel, at the moment, the Y-axis sliding block is pulled outwards manually, the polished product is taken out, the new bottom plate to be polished is put in, and the steps are repeated. Compared with the original base plate which is not processed, the surface defects of the base plate are basically removed, the surface color is uniform, and the appearance quality is obviously improved.
Thirdly, polishing the finisher module floors with different thicknesses through a grinding wheel height adjusting device; in addition, the grinding wheel is adjusted to a proper height through adjusting the height, so that the base plate can be ground. Furthermore, by lifting the grinding wheel, it is also possible to time the removal and installation of the sanding belt.
Fourthly, the sand belt type grinding is adopted, the replacement is convenient and fast, and the operation of workers is easy.
Fifthly, the polishing efficiency is high, abrasive belts with different grain numbers can be replaced according to requirements, and the polishing device can also be used for removing the electroplated bottom plate coating.
Drawings
Fig. 1 is a structural diagram of an rectifier module bottom plate polishing device of the invention.
Detailed Description
The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings.
As shown in fig. 1, rectifier module bottom plate polishing devices comprise a frame 1, wherein a movable worktable and a polishing device are arranged on the frame 1.
The movable workbench comprises an X-axis slide rail 21, an X-axis slide block 22, a Y-axis slide rail 31, a Y-axis slide block 32 and an X-axis slide block driving device, the rack 1 is provided with the X-axis slide rail 21, the X-axis slide block 22 is arranged on the X-axis slide rail 21, the Y-axis slide rail 31 is arranged on the X-axis slide block 22, the Y-axis slide block 32 is arranged on the Y-axis slide rail 31, the Y-axis slide block 32 is used for placing the rectifier module bottom plate 5, the X-axis slide block driving device comprises an motor 9, an output shaft of the motor 9 is vertically arranged, a disc 8 is arranged on an output shaft of the motor 9, the disc 8 is eccentrically connected with a crank 7.
The polishing device comprises a driving wheel 10, a driving wheel driving motor, a tension wheel 11 and a grinding wheel 12; a driving wheel 10 and a tension wheel 11 are arranged on two sides of the grinding wheel 12, and the driving wheel 10 and the tension wheel 11 are respectively positioned above the grinding wheel 12; the driving wheel 10, the tension wheel 11 and the grinding wheel 12 are sleeved with abrasive belts 15.
The tensioning wheel height adjusting device 14 is arranged on the machine frame and comprises an th lead screw 141, a th moving block 142 and a 0 th mounting frame 143, the th mounting frame 143 is of an inverted U-shaped structure, the th moving block 142 is arranged in the th mounting frame 143 in a sliding mode, a th threaded hole is formed in a top plate of the th mounting frame 143, and the th lead screw 141 penetrates through an th threaded hole and is in threaded connection with the th moving block 142.
The frame is provided with a grinding height adjusting device 13 which comprises a second lead screw 131, a second moving block 132 and a second mounting frame 133, the second mounting frame 133 is of an inverted U-shaped structure, the second moving block 132 is arranged in the second mounting frame 133 in a sliding manner, a second threaded hole is formed in a top plate of the second mounting frame 133, and the second lead screw 131 penetrates through the second threaded hole and is in threaded connection with the second moving block 132.
The grinding wheel 12 is a rubber wheel.
The abrasive belt 15 has a grain number of 400 meshes.
The Y-axis slide block 32 is provided with a supporting plate 4, and the supporting plate is provided with an L-shaped limiting block 6.
polishing steps of the rectifier module bottom plate polishing device:
(1) starting a dust collection fan, and wearing the protective mask;
(2) turning on a power supply of the flat polisher, and preparing a sand belt with the granularity of 400 #;
(3) the abrasive belt is collapsed on the driving wheel, the rubber grinding wheel and the tension wheel, and the tension wheel is adjusted to enable the abrasive belt to be in a tight state;
(4) placing a carrier on the MDC160 bottom plate, descending the abrasive belt to a proper position, and continuously debugging until all the bottom plate areas can be polished;
(5) dragging out the base plate carrier, observing the polished surface of the base plate, and taking out the base plate carrier without defects such as scratches, black wires, pits and the like; replacing a new bottom plate and continuing polishing;
(6) the abrasive belt is required to be in uniform contact with the bottom plate in the polishing process, and the phenomena of vibration ripple and non-uniformity are avoided.
The utility model discloses a motor drive action wheel, from the cooperation on driving wheel, grinding wheel and abrasive band for the abrasive band is rotatory, and rotatory abrasive band and the contact of rectifier bottom plate, and then realize polishing to the finisher bottom plate. The height of the tensioning wheel can be adjusted by adjusting a tensioning wheel height adjusting device, namely a screw rod nut mechanism. When the abrasive belt is replaced, the tensioning wheel is moved downwards by rotating the screw rod, so that the abrasive belt is conveniently removed; the new belt is put on the belt and the tensioning wheel is moved upwards by rotating the screw to tension the belt.
The utility model discloses a cooperation of Y axle slide rail and Y axle slider realizes taking out and putting into of rectifier module bottom plate. When the Y-axis sliding block is pulled out manually, the polished product is taken out, a new product to be polished is put in, the Y-axis sliding block is pushed into the position flush with the grinding wheel manually, the X-axis sliding block driving device adopts a crank structure, so that the X-axis sliding block, the Y-axis sliding block and the rectifying bottom plate can reciprocate along the X-axis direction, the product on the sliding block is pushed into the lower part of the grinding wheel, the grinding wheel polishes the product and is then pushed out of the grinding wheel, at the moment, the Y-axis sliding block is pulled outwards manually, the polished product is taken out, the new bottom plate to be polished is put in, and the steps are repeated. Compared with the original base plate which is not processed, the surface defects of the base plate are basically removed, the surface color is uniform, and the appearance quality is obviously improved.
The utility model can meet the polishing requirements of the finisher module floors with different thicknesses through the grinding wheel height adjusting device; in addition, the grinding wheel is adjusted to a proper height through adjusting the height, so that the base plate can be ground. Furthermore, by lifting the grinding wheel, it is also possible to time the removal and installation of the sanding belt.
The utility model discloses an abrasive belt formula is polished, changes convenient and fast, easily workman's operation.
The utility model discloses it is efficient to polish, can change different grain number abrasive band according to the demand, also can be used to get rid of and electroplate back bottom plate cladding material.
Claims (6)
- The polishing device for the bottom plate of the rectifier module comprises a rack (1) and is characterized in that a movable workbench and a polishing device are arranged on the rack (1);the movable workbench comprises an X-axis slide rail (21), an X-axis slide block (22), a Y-axis slide rail (31), a Y-axis slide block (32) and an X-axis slide block driving device, wherein the rack (1) is provided with the X-axis slide rail (21), the X-axis slide rail (21) is provided with the X-axis slide block (22), the X-axis slide block (22) is provided with the Y-axis slide rail (31), the Y-axis slide block (32) is arranged on the Y-axis slide rail (31), the Y-axis slide block (32) is used for placing a rectifier module bottom plate (5), the X-axis slide block driving device comprises an motor (9), an output shaft of the motor (9) is vertically arranged, a disc (8) is arranged on an output shaft of a motor (9), the disc (8) is eccentrically connected with a crank (7), and the;the polishing device comprises a driving wheel (10), a driving wheel driving motor, a tension wheel (11) and a grinding wheel (12); a driving wheel (10) and a tension wheel (11) are arranged on two sides of the grinding wheel (12), and the driving wheel (10) and the tension wheel (11) are respectively positioned above the grinding wheel (12); the driving wheel (10), the tension wheel (11) and the grinding wheel (12) are sleeved with abrasive belts (15).
- 2. The polishing device for the bottom plate of the rectifier module according to claim 1, wherein a tensioning wheel height adjusting device (14) is arranged on the frame and comprises an th lead screw (141), a th movable block (142) and a 0 th mounting frame (143), the th mounting frame (143) is of an inverted U-shaped structure, the th movable block (142) is slidably arranged in the th mounting frame (143), a th threaded hole is formed in a top plate of the th mounting frame (143), and the th lead screw (141) penetrates through the th threaded hole and is in threaded connection with the th movable block (142).
- 3. The rectifier module bottom plate polishing device according to claim 1 or 2, wherein a grinding height adjusting device (13) is arranged on the frame and comprises a second lead screw (131), a second moving block (132) and a second mounting frame (133), the second mounting frame (133) is of an inverted U-shaped structure, the second moving block (132) is slidably arranged in the second mounting frame (133), a second threaded hole is formed in a top plate of the second mounting frame (133), and the second lead screw (131) penetrates through the second threaded hole and is in threaded connection with the second moving block (132).
- 4. A rectifier module floor polishing device according to claim 1, characterized in that said grinding wheel (12) is a rubber wheel.
- 5. A rectifier module floor polishing device according to claim 1, characterized in that the abrasive belt (15) has a grain size of 400 mesh.
- 6. The rectifier module bottom plate polishing device according to claim 1, wherein a carrier plate (4) is provided on the Y-axis slider (32), and an L-shaped stopper (6) is provided on the carrier plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920734160.7U CN209998916U (en) | 2019-05-21 | 2019-05-21 | rectifier module bottom plate polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920734160.7U CN209998916U (en) | 2019-05-21 | 2019-05-21 | rectifier module bottom plate polishing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209998916U true CN209998916U (en) | 2020-01-31 |
Family
ID=69307583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920734160.7U Expired - Fee Related CN209998916U (en) | 2019-05-21 | 2019-05-21 | rectifier module bottom plate polishing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209998916U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211258A (en) * | 2021-05-11 | 2021-08-06 | 江苏嘉瑞木业有限公司 | Polishing device for composite floor production |
-
2019
- 2019-05-21 CN CN201920734160.7U patent/CN209998916U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113211258A (en) * | 2021-05-11 | 2021-08-06 | 江苏嘉瑞木业有限公司 | Polishing device for composite floor production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200131 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |