CN209992074U - Temperature curve monitoring device for reflow soldering - Google Patents
Temperature curve monitoring device for reflow soldering Download PDFInfo
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- CN209992074U CN209992074U CN201920487138.7U CN201920487138U CN209992074U CN 209992074 U CN209992074 U CN 209992074U CN 201920487138 U CN201920487138 U CN 201920487138U CN 209992074 U CN209992074 U CN 209992074U
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Abstract
The utility model relates to a reflow soldering technical field just discloses a temperature curve monitoring devices that reflow soldering used, including organism and mount, the equal fixed mounting in the left and right sides of organism has the connecting plate, the front of organism is provided with the display screen, the front of organism is provided with quantity and is two and is located the warning light on display screen right side, the inside fixed mounting of mount has information transmission device, information transmission device passes through the connecting wire electricity with the back of organism and is connected. This temperature curve monitoring devices that reflow soldering used for temperature measurement is accomplished by multiple detection device jointly, reduces the error that single device measurement produced, and increase measurement area simultaneously avoids the great measurement of production of local temperature difference inaccurate, prevents that equipment from being great in the regulation time temperature and actual temperature deviation, loss when reducing circuit board reflow soldering.
Description
Technical Field
The utility model relates to a reflow soldering technical field specifically is a temperature curve monitoring devices that reflow soldering used.
Background
Reflow soldering technology is not strange in the field of electronic manufacturing, elements on various board cards used in computers are soldered on a circuit board through the technology, a heating circuit is arranged in the equipment, air or nitrogen is heated to a high enough temperature and then blown to the circuit board with the elements attached, solder on two sides of the elements is melted and then bonded with a mainboard, the technology has the advantages that the temperature is easy to control, oxidation can be avoided in the soldering process, the manufacturing cost is easy to control, due to the continuous miniaturization requirement of a PCB (printed circuit board) of an electronic product, the chip elements appear, the traditional soldering method cannot adapt to the requirement, at first, the reflow soldering technology is adopted only in the assembly of a mixed integrated circuit board, most of the assembled and soldered elements are chip capacitors, chip inductors, surface-mounted transistors, diodes and the like, and the whole technology development of SMT is gradually improved, the appearance of various chip components and mounted devices, reflow soldering process technology and equipment as part of the mounting technology have been developed, and the application of the reflow soldering process technology and equipment is becoming wide and almost applied to all electronic product fields.
When reflow soldering equipment works, the temperature detection device used by the internal temperature curve monitoring device is single, and only the internal local temperature curve during reflow soldering can be measured, so that the corresponding temperature setting error is higher, electronic components on a circuit board can be damaged when the temperature is higher, and the welding pins are unstable due to too low temperature, so that the temperature curve monitoring device for reflow soldering is provided to solve the problem.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a temperature curve monitoring devices that reflow soldering used possesses advantages such as temperature monitoring scope is big, solved at reflow soldering equipment during operation, the temperature-detecting device that inside temperature curve monitoring devices used is single, inside local temperature curve when only can surveying reflow soldering, it is higher to result in corresponding temperature setting error, can cause the harm to electronic components on the circuit board when the temperature is higher, the low problem that will make the welding foot connect unstably of temperature.
(II) technical scheme
For the purpose that realizes that above-mentioned temperature monitoring range is big, the utility model provides a following technical scheme: a temperature curve monitoring device for reflow soldering comprises a machine body and a fixing frame, wherein connecting plates are fixedly mounted on the left side and the right side of the machine body, a display screen is arranged on the front side of the machine body, two warning lamps are arranged on the front side of the machine body and positioned on the right side of the display screen, an information transmission device is fixedly mounted in the fixing frame and electrically connected with the back side of the machine body through a connecting wire, two thermocouples are fixedly mounted in the fixing frame and respectively positioned on the two sides of the information transmission device and electrically connected with the information transmission device, a heat conducting rod penetrating through the fixing frame is fixedly mounted at the bottom of the thermocouple, the heat conducting rod is fixedly connected with the fixing frame through a heat insulation pipe, one opposite side of the heat conducting rod is fixedly connected through a conducting piece, and a heat insulation plate is fixedly mounted at, the bottom fixed mounting of mount has quantity to be two and is located the division board of two heat conduction pole mutually opposite sides one side respectively, the equal fixed mounting in inner wall left and right sides of mount has the first fixed plate that is located the division board below, the equal fixed mounting in left and right sides of mount has quantity to be two second fixed plates, the bottom fixed mounting of mount has quantity to be two and is located the inside link of two division boards respectively, the inside fixed mounting of link has the infrared radiation thermometer who runs through the relative one side of division board.
Preferably, the outside of first fixed plate and second fixed plate all is provided with equidistant evenly distributed's fixed orifices, two the warning light is red warning light and green work light respectively.
Preferably, the two thermocouples are oppositely arranged, and the two infrared thermometers are electrically connected with the information transmission device.
Preferably, the information transmission device includes a housing, a conversion circuit and an information transmission circuit, and the conversion circuit and the information transmission circuit are both fixedly mounted inside the housing.
Preferably, the infrared thermometers are all obliquely arranged, and grooves located outside the infrared thermometers are arranged on the opposite sides of the isolation plates.
Preferably, the left side and the right side of the top of the fixing frame are both provided with inclined planes, and the bottom of the fixing frame is fixedly provided with two supporting plates.
(III) advantageous effects
Compared with the prior art, the utility model provides a temperature curve monitoring devices that reflow soldering used possesses following beneficial effect:
the temperature curve monitoring device for reflow soldering is characterized in that a machine body is arranged on a control console of reflow soldering equipment through a connecting plate, a fixing frame is arranged on a workbench of the reflow soldering equipment through a first fixing plate and a second fixing plate, a circuit board to be soldered stays below the fixing frame when the temperature curve monitoring device is used, high-temperature air blown out by a heating device preheats and heats the circuit board from the side surface, the high-temperature air flows through gaps of conducting pieces, the conducting pieces conduct the temperature of large-area air above the circuit board to a thermocouple through a conducting rod, the thermocouple converts a thermal signal into an electric signal and transmits the electric signal to the machine body through a transmission shaft, the electric signal is displayed through a display screen, an infrared thermometer obliquely arranged at the same time measures the temperature of the surface of the circuit board, the measured temperature is transmitted into the machine body through an information transmission device to be displayed, and the temperature measurement, the error that single device measurement produced is reduced, and increase measuring area simultaneously avoids the great measurement of producing of local temperature difference inaccurate, prevents that equipment temperature and actual temperature deviation are great when the regulation, loss when reducing circuit board reflow soldering.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a side view of the infrared thermometer of the present invention.
In the figure: the device comprises a machine body 1, a fixing frame 2, a display screen 3, a warning lamp 4, an information transmission device 5, a connecting wire 6, a thermocouple 7, a heat conducting rod 8, a heat insulation pipe 9, a heat conduction sheet 10, a heat insulation plate 11, a partition plate 12, a first fixing plate 13, a second fixing plate 14, a connecting frame 15, an infrared thermometer 16 and a connecting plate 17.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, a temperature curve monitoring device for reflow soldering comprises a machine body 1 and a fixing frame 2, wherein the left and right sides of the top of the fixing frame 2 are provided with inclined planes, the bottom of the fixing frame 2 is fixedly provided with two supporting plates, the left and right sides of the machine body 1 are fixedly provided with connecting plates 17, the front of the machine body 1 is provided with a display screen 3, the front of the machine body 1 is provided with two warning lamps 4 which are positioned at the right side of the display screen 3, the inside of the fixing frame 2 is fixedly provided with an information transmission device 5, the information transmission device 5 comprises a shell, a conversion circuit and an information transmission circuit, the conversion circuit and the information transmission circuit are both fixedly arranged inside the shell, the information transmission device 5 is electrically connected with the back of the machine body 1 through a connecting wire 6, the inside of the fixing frame 2 is fixedly provided with two thermocouples 7 which are respectively positioned at the, the bottom of the thermocouple 7 is fixedly provided with a heat conducting rod 8 penetrating through the fixed frame 2, the heat conducting rod 8 is fixedly connected with the fixed frame 2 through a heat insulation pipe 9, the opposite side of the heat conducting rod 8 is fixedly connected through a conducting sheet 10, the bottom of the inner wall of the fixed frame 2 is fixedly provided with a heat insulation plate 11, the bottom of the fixed frame 2 is fixedly provided with two isolation plates 12 which are respectively positioned at the opposite sides of the two heat conducting rods 8, the left side and the right side of the inner wall of the fixed frame 2 are fixedly provided with a first fixing plate 13 positioned below the isolation plate 12, the left side and the right side of the fixed frame 2 are fixedly provided with two second fixing plates 14, the outer parts of the first fixing plate 13 and the second fixing plate 14 are respectively provided with fixing holes which are uniformly distributed at equal intervals, the two warning lamps 4 are respectively a red warning lamp and a green work lamp, the bottom of the fixed, an infrared thermometer 16 which penetrates through the opposite side of the isolation plate 12 is fixedly arranged inside the connecting frame 15, the model of the infrared thermometer 16 can be CTlaser2MH1, the two thermocouples 7 are oppositely arranged, the two infrared thermometers 16 are electrically connected with the information transmission device 5, the infrared thermometers 16 are obliquely arranged, grooves which are positioned outside the infrared thermometers 16 are arranged on the opposite side of the isolation plate 12, the machine body is arranged on a control table of the reflow soldering device through a connecting plate 17, the fixing frame 2 is arranged on a workbench of the reflow soldering device through a first fixing plate 13 and a second fixing plate 14, when the machine body is used, a circuit board to be welded stays below the fixing frame 2, high-temperature air blown out by the heating device preheats and heats the circuit board from the side surface, at the moment, the high-temperature air flows through gaps of the conducting sheets 10, the conducting sheets 10 conduct the temperature of large-area air above the circuit board to the thermocouples 7 through the heat conducting rods 8, thermocouple 7 changes the heat signal into the signal of telecommunication and passes through the transmission axle is transmitted to organism 1 at 5, and rethread display screen 3 shows, and the infrared thermometer 16 that the slope set up simultaneously carries out the temperature measurement to the surface of circuit board, will record the temperature and spread into organism 1 through information transmission device 5 and show, makes the temperature measurement accomplish jointly by multiple detection device, reduces the error that single device measured the production, increase measurement area simultaneously, avoid the great measurement inaccuracy that produces of local temperature difference, prevent that equipment temperature and actual temperature deviation are great when transferring, loss when reducing circuit board reflow soldering.
To sum up, the temperature curve monitoring device for reflow soldering installs the body on the console of the reflow soldering device through the connecting board 17, installs the fixing frame 2 on the workbench of the reflow soldering device through the first fixing board 13 and the second fixing board 14, when in use, the circuit board to be soldered stays below the fixing frame 2, the high temperature air blown by the heating device preheats and heats the circuit board from the side, at this time, the high temperature air flows through the gap of the conducting sheet 10, the conducting sheet 10 conducts the temperature of the large area air above the circuit board to the thermocouple 7 through the heat conducting rod 8, the thermocouple 7 converts the thermal signal into the electric signal and transmits the electric signal to the body 1 through the transmission shaft 5, and then displays the electric signal through the display screen 3, and the infrared thermometer 16 which is obliquely arranged measures the temperature of the surface of the circuit board, and transmits the measured temperature to the body 1 through the information transmission device 5 for displaying, make temperature measurement accomplish jointly by multiple detection device, reduce the error that single device measurement produced, increase measuring area simultaneously, the measurement of avoiding the great production of local temperature difference is inaccurate, it is great to prevent that equipment temperature and actual temperature deviation are great when the regulation, loss when reducing circuit board reflow soldering, when reflow soldering equipment work has been solved, the temperature-detecting device that inside temperature curve monitoring devices used is single, inside local temperature curve when only can surveying reflow soldering, lead to corresponding temperature setting error higher, can cause the harm to electronic components on the circuit board when the temperature is higher, the low problem that makes the welding foot connect unstably of temperature will crossing.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a temperature curve monitoring devices that reflow soldering used, includes organism (1) and mount (2), its characterized in that: the novel multifunctional electric heating machine is characterized in that connecting plates (17) are fixedly mounted on the left side and the right side of the machine body (1), a display screen (3) is arranged on the front side of the machine body (1), two warning lamps (4) which are located on the right side of the display screen (3) are arranged on the front side of the machine body (1), an information transmission device (5) is fixedly mounted inside the fixing frame (2), the information transmission device (5) is electrically connected with the back side of the machine body (1) through a connecting wire (6), two thermocouples (7) which are located on the two sides of the information transmission device (5) respectively and are electrically connected with the information transmission device (5) are fixedly mounted inside the fixing frame (2), heat conducting rods (8) penetrating through the fixing frame (2) are fixedly mounted at the bottoms of the thermocouples (7), and the heat conducting rods (8) are fixedly connected with the fixing frame (, the utility model discloses a heat conduction device, including heat conduction pole (8), inner wall bottom fixed mounting of mount (2) has heat insulating board (11), the bottom fixed mounting of mount (2) has quantity to be two and is located two heat conduction pole (8) division board (12) of one side mutually away mutually respectively, the equal fixed mounting in inner wall left and right sides of mount (2) has first fixed plate (13) that are located division board (12) below, the equal fixed mounting in left and right sides of mount (2) has second fixed plate (14) that quantity is two, the bottom fixed mounting of mount (2) has quantity to be two and is located two inside link (15) of division board (12) respectively, the inside fixed mounting of link (15) has infrared radiation thermometer (16) that run through division board (12) relative one side.
2. A temperature profile monitoring device for reflow soldering according to claim 1, wherein: the outside of first fixed plate (13) and second fixed plate (14) all is provided with equidistant evenly distributed's fixed orifices, two warning light (4) are red warning light and green work light respectively.
3. A temperature profile monitoring device for reflow soldering according to claim 1, wherein: the two thermocouples (7) are oppositely arranged, and the two infrared thermometers (16) are electrically connected with the information transmission device (5).
4. A temperature profile monitoring device for reflow soldering according to claim 1, wherein: the information transmission device (5) comprises a shell, a conversion circuit and an information transmission circuit, wherein the conversion circuit and the information transmission circuit are fixedly arranged in the shell.
5. A temperature profile monitoring device for reflow soldering according to claim 1, wherein: the infrared thermometers (16) are all obliquely arranged, and grooves located outside the infrared thermometers (16) are arranged on the opposite sides of the partition plates (12).
6. A temperature profile monitoring device for reflow soldering according to claim 1, wherein: the left side and the right side of the top of the fixing frame (2) are both provided with inclined planes, and two supporting plates are fixedly mounted at the bottom of the fixing frame (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920487138.7U CN209992074U (en) | 2019-04-11 | 2019-04-11 | Temperature curve monitoring device for reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920487138.7U CN209992074U (en) | 2019-04-11 | 2019-04-11 | Temperature curve monitoring device for reflow soldering |
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| Publication Number | Publication Date |
|---|---|
| CN209992074U true CN209992074U (en) | 2020-01-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920487138.7U Active CN209992074U (en) | 2019-04-11 | 2019-04-11 | Temperature curve monitoring device for reflow soldering |
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| Country | Link |
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| CN (1) | CN209992074U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112872522A (en) * | 2021-01-11 | 2021-06-01 | 武汉倍普科技有限公司 | Reflow furnace temperature curve intelligent detection system |
| CN116441696A (en) * | 2023-06-19 | 2023-07-18 | 中国航发成都发动机有限公司 | Vacuum electron beam welding method and clamping device for stator assembly of aero-engine |
-
2019
- 2019-04-11 CN CN201920487138.7U patent/CN209992074U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112872522A (en) * | 2021-01-11 | 2021-06-01 | 武汉倍普科技有限公司 | Reflow furnace temperature curve intelligent detection system |
| CN116441696A (en) * | 2023-06-19 | 2023-07-18 | 中国航发成都发动机有限公司 | Vacuum electron beam welding method and clamping device for stator assembly of aero-engine |
| CN116441696B (en) * | 2023-06-19 | 2023-09-15 | 中国航发成都发动机有限公司 | Vacuum electron beam welding method and clamping device for stator assembly of aero-engine |
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