CN209949751U

CN209949751U - SMD radiator structure

Info

Publication number: CN209949751U
Application number: CN201920504276.1U
Authority: CN
Inventors: 李展行; 陈煦; 李梦蝉; 张荣国; 苗天凤; 沈晓娟; 王福礼; 王盟; 薛守博; 陈平; 王雷
Original assignee: JIANGSU TOPPOWER AUTOMOTIVE ELECTRONICS CO Ltd
Current assignee: JIANGSU TOPPOWER AUTOMOTIVE ELECTRONICS CO Ltd
Priority date: 2019-04-15
Filing date: 2019-04-15
Publication date: 2020-01-14
Anticipated expiration: 2029-04-15

Abstract

The utility model discloses a patch element radiator structure in the technical field of vehicle-mounted entertainment hosts, wherein the top of a right-side bending plate is provided with a right-side threaded hole in a running-through manner from top to bottom, and the top of the front end face of a metal plate middle frame is provided with three groups of stamping bosses from left to right in sequence; the heat dissipation mode has the advantages that the traditional heat radiator mostly adheres to the heating element on the side surface to conduct heat, the heat radiator can realize natural heat transfer from bottom to top, and the heat conduction directionality is met; the process is simple, the radiator is made of aluminum alloy, and the radiator is molded; the design appearance is small, and the heat interaction of the patch elements is prevented; the heat dissipation efficiency is high, the aluminum material with high heat conductivity coefficient is selected, and meanwhile, the rectangular compression shapes are designed on the four sides of the radiator, so that the appearance size is small, and the heat dissipation area is large; the installation cooperation is controllable, and the radiator is fixed in the center, and PCB board and center precision fit have reduced manufacturing error's accumulation.

Description

SMD radiator structure

Technical Field

The utility model relates to an on-vehicle amusement host computer technical field specifically is a patch element radiator structure.

Background

In the vehicle audio industry, the main reasons for product failure are often caused by poor heat dissipation of electronic components and overheating of components. Meanwhile, as new technology of the patch element is gradually introduced into the electronic industry and used in large scale, the traditional radiator can not meet the radiating requirement of the element;

in addition, with the limitation of cost, the external dimension of the host and the layout of the PCB elements, the novel, small and high-heat-transfer-efficiency radiator is designed to effectively solve the problems;

to this end, we propose a patch element heat sink structure.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a patch element radiator structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a surface-mounted component radiator structure is characterized in that a radiator is fixed on a sheet metal middle frame, a boss is arranged at the bottom of the radiator, a front end face bending plate is arranged at the top of the front end face of the radiator, a right side bending plate is arranged at the rear end face of the right side top of the radiator, a left side bending plate is arranged at the left side top of the radiator, a front end face rivet column and a left side rivet column are respectively arranged at the top right side of the front end face bending plate and the top rear end face of the left side bending plate, a front end face threaded hole and a left side threaded hole are respectively arranged at the top left side of the front end face bending plate and the top front end face of the left side bending plate in a penetrating manner, a right side threaded hole is arranged at the top of the right side bending plate in a penetrating manner from top to bottom, a PCB is transversely arranged at the bottom of the front end face of the, and three groups of stamping bosses are sequentially arranged corresponding to the left side bending plate, the front end face bending plate and the right side bending plate from left to right, the left side bending plate, the front end face bending plate and the corresponding stamping bosses are respectively connected with the front end face rivet column through the left side rivet column, the stamping bosses are all provided with connecting holes matched with the front end face screw hole and the left side screw hole, the left side bending plate is provided with stamping bosses matched with the connecting holes through the left side screw hole and the connecting holes by screw movable connecting positions, the front end face bending plate is provided with stamping bosses matched with the connecting holes by screw movable connecting positions through the matched front end face screw hole and the connecting holes, the right side bending plate is provided with stamping bosses corresponding to the screw movable connecting positions through the matched right side screw hole and the connecting holes, the left side and the right side of the bottom of the, and limiting and fixing the PCB.

Preferably, the appearance of radiator sets up to the rectangle, the preceding terminal surface die mould muscle of radiator has set gradually from a left side to the right side, the right side of radiator has set gradually right side die mould muscle to the back by preceding, the left side of radiator has set gradually left side die mould muscle to the back by preceding, the rear end face of radiator has set gradually rear end face die mould muscle from a left side to the right side.

Preferably, the top of PCB board is provided with the paster component, the top of paster component is provided with heat conduction silica gel piece, the top laminating of heat conduction silica gel piece is provided with the radiator.

Preferably, the radiator is an aluminum plate material radiator.

Preferably, the tops of the front end face bending plate, the right side bending plate and the left side bending plate are arranged on the same horizontal plane.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the patch element radiator structure is simple in structure and convenient to use, and a radiating mode has advantages, most of the traditional radiators are attached to a heating element on the side face for heat conduction, and the radiator can realize natural heat transfer from bottom to top and accords with the heat conduction directivity;

2. the process is simple, the radiator is made of aluminum alloy, and the radiator is molded;

3. the design appearance is small, and the heat interaction of the patch elements is prevented;

4. the heat dissipation efficiency is high, the aluminum material with high heat conductivity coefficient is selected, and meanwhile, the rectangular compression shapes are designed on the four sides of the radiator, so that the appearance size is small, and the heat dissipation area is large; the installation and matching are controllable, the radiator is fixed on the middle frame, the PCB is precisely matched with the middle frame, and the clearance between the radiator and the surface mounted element is ensured by controlling the overall matching size, so that the effective heat transmission is guaranteed;

5. the PIN foot of the element is prevented from being broken, and the clearance between the element and the radiator is controlled and filled with the compressible heat-conducting silica gel sheet, so that the effects of shock absorption and buffering are achieved, and the risk of the PIN foot being broken under pressure is reduced;

6. the design of the radiator avoids the accumulation of assembly errors and the risk of poor contact between the heat-conducting silica gel sheet and the surface-mounted element; meanwhile, due to the characteristics of simple processing technology, small size and large area of the radiator, the components are used for replacing online split charging, the production technology is simplified, and the production cost is greatly reduced; in addition, in design aspect, the heat radiator scheme also provides an important theoretical basis for heat radiation design of different patch elements.

Drawings

FIG. 1 is a diagram: the utility model discloses a schematic diagram of a three-dimensional structure of a radiator;

FIG. 2 is a diagram of: the utility model discloses a schematic view of a heat radiator overlooking three-dimensional structure;

FIG. 3 is a diagram of: the utility model discloses radiator and paster component complex heat transfer structure schematic diagram.

In the figure: 100. a metal plate middle frame; 200. a heat sink; 300. a PCB board; 400. a heat-conducting silica gel sheet; 500. a patch element; 600. a screw; 700. stamping a boss; 800. detecting a plate; 1. profiling ribs on the front end face; 2. profiling ribs on the right side; 3. profiling ribs on the left side; 4. profiling ribs on the rear end face; 5. a boss; 6. a left rivet post; 7. a front end face threaded hole; 8. a left threaded hole; 9. a right threaded hole; 10. a front end face rivet post; 11. a front end face bending plate; 12. a right side bending plate; 13. a left bending plate; 10. a front end face rivet post; 11. a front end face bending plate; 12. a right side bending plate; 13. and (5) bending the plate at the left side.

The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a surface-mounted component radiator structure is disclosed, wherein a radiator 200 is fixed on a sheet metal middle frame 100, a boss 5 is arranged at the bottom of the radiator 200, a front end face bending plate 11 is arranged at the top of the front end face of the radiator 200, a right side bending plate 12 is arranged at the rear end face of the right side top of the radiator 200, a left side bending plate 13 is arranged at the left side top of the radiator 200, a front end face rivet column 10 and a left side rivet column 6 are respectively arranged at the top right side of the front end face bending plate 11 and the top rear end face of the left side bending plate 13, a front end face threaded hole 7 and a left side threaded hole 8 are respectively arranged at the top left side of the front end face bending plate 11 and the top front end face of the left side bending plate 13 in a penetrating manner, a right side threaded hole 9 is arranged at the top of the right side bending plate 12 in a penetrating manner from top to bottom, a PCB 300 is transversely arranged at the bottom of the front, three groups of stamping bosses 700 are sequentially arranged corresponding to a left side bending plate 13, a front end face bending plate 11 and a right side bending plate 12 from left to right, the left side bending plate 13, the front end face bending plate 11 and the corresponding stamping bosses 700 are respectively connected with a front end face rivet column 10 through a left side rivet column 6, the stamping bosses 700 are respectively provided with a front end face threaded hole 7, a left side threaded hole 8 and a connecting hole which are matched with a right side threaded hole 9, the left side bending plate 13 is movably connected with the stamping boss 700 corresponding to the position of the connecting hole by a screw 600 through the matched left side threaded hole 8, the front end face bending plate 11 is movably connected with the stamping boss 700 corresponding to the position of the connecting hole by the screw 600 through the matched front end face threaded hole 7, the right side bending plate 12 is movably connected with the stamping boss 700 corresponding to the position of the connecting hole by the screw 600 through the matched right side threaded hole 9, the, the PCB board (300) is fixed in a limiting way.

Wherein: the radiator 200 is rectangular in shape, a front end surface profiling rib 1 is sequentially arranged on the front end surface of the radiator 200 from left to right, a right side profiling rib 2 is sequentially arranged on the right side of the radiator 200 from front to back, a left side profiling rib 3 is sequentially arranged on the left side of the radiator 200 from front to back, and a rear end surface profiling rib 4 is sequentially arranged on the rear end surface of the radiator 200 from left to right, so that the heat dissipation area is increased, and the radiator blades are used;

the top of the PCB 300 is provided with a patch element 500, the top of the patch element 500 is provided with a heat-conducting silica gel sheet 400, the top of the heat-conducting silica gel sheet 400 is provided with a radiator 200 in a fitting manner, so that the heat of the element is transmitted to the radiator through the heat-conducting silica gel sheet 400 from bottom to top, and the heat of the element is automatically radiated;

the radiator 200 is an aluminum plate radiator, and the radiator 200 is formed by stamping an aluminum plate, so that the processing is simple;

the tops of the front end face bending plate 11, the right side bending plate 12 and the left side bending plate 13 are arranged on the same horizontal plane, so that the installation is convenient.

The working principle is as follows: as shown in fig. 1, the heat sink 200 is formed by stamping an aluminum plate, and is bent by four-sided profiling to form a closed structure, the heat sink 200 is a four-sided vertical surface, and is provided with a front-end-face profiled rib 1, a right-side profiled rib 2, a left-side profiled rib 3, and a rear-end-face profiled rib 4, so as to increase the heat dissipation area and play a role of a heat sink blade, and a boss 5 is designed at the bottom for positioning and adhering a heat-conducting silicone sheet 400 and playing a role of heat transfer by being tightly attached to the surface of a;

three vertical surfaces of a radiator 200 body are designed into a characteristic front end face bending plate 11, a right side bending plate 12 and a left side bending plate 13, the three bending characteristic matching surfaces are all on the same plane and are matched with three stamping bosses 700 on a metal plate middle frame 100, the radiator 200 and the metal plate middle frame 100 are fixed through a left side rivet column 6, a front end face rivet column 10 and three screws 600 on the radiator 200, and the two are component incoming materials, so that the cost is reduced, and meanwhile, the error accumulation is reduced;

the gap size and form and position tolerance between the plane of the detection plate and the plane of the boss 5 are strictly controlled by detecting the middle frame component (the sheet metal middle frame 100 and the radiator 200) of the component incoming material, compared with the production line split charging radiator 200, the error accumulation is greatly reduced by controlling the size of the incoming material component, and the manufacturing and assembling precision is improved;

during assembly, the heat-conducting silica gel sheet 400 is adhered to the boss 5 of the radiator, and the heat-conducting silica gel sheet 400 is tightly filled between the patch element 500 and the radiator 200 (see an enlarged view in fig. 3), so that air thermal resistance in a heat transfer process is eliminated, and the heat transfer reliability of the element is realized;

the heat of the patch element 500 is transferred vertically upward, and is transferred from the heat-conductive silicone sheet 400 to the heat sink 200 from bottom to top, and the heat dissipation is realized through the heat sink main body.

The utility model discloses the standard part that uses all can purchase from the market, and dysmorphism piece all can be customized according to the description with the record of drawing of description, and the concrete connection mode of each part all adopts conventional means such as ripe bolt, rivet, welding among the prior art, and machinery, part and equipment all adopt prior art, and conventional model, including circuit connection adopts conventional connection mode among the prior art, does not detailed here again.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a patch element radiator structure, radiator (200) are fixed in on panel beating center (100), its characterized in that: the bottom of the radiator (200) is provided with a boss (5), the top of the front end face of the radiator (200) is provided with a front end face bending plate (11), the rear end face of the right top of the radiator (200) is provided with a right side bending plate (12), the top of the left side of the radiator (200) is provided with a left side bending plate (13), the front end face rivet columns (10) and the left side rivet columns (6) are respectively arranged on the right side of the top of the front end face bending plate (11) and the rear end face of the top of the left side bending plate (13), the front end face threaded hole (7) and the left side threaded hole (8) are respectively arranged on the left side of the top of the front end face bending plate (11) and the front end face of the top of the left side bending plate (13) in a penetrating manner, the right side threaded hole (9) is arranged on the top of the right side bending plate (12), the top of the PCB (300) is provided with a radiator (200), the top of the front end face of the sheet metal middle frame (100) is sequentially provided with three groups of stamping bosses (700) from left to right, the three groups of stamping bosses (700) are sequentially arranged corresponding to a left side bending plate (13), a front end face bending plate (11) and a right side bending plate (12) from left to right, the left side bending plate (13), the front end face bending plate (11) and the corresponding stamping bosses (700) are respectively connected with a front end face rivet column (10) through a left side rivet column (6), the stamping bosses (700) are respectively provided with connecting holes matched with a front end face threaded hole (7), a left side threaded hole (8) and a right side threaded hole (9), the left side bending plate (13) is movably connected with the corresponding stamping bosses (700) through the matched with the connecting holes by screws (600), preceding terminal surface board (11) of bending is by corresponding punching press boss (700) of screw (600) swing joint position through assorted preceding terminal surface screw hole (7) and connecting hole, the right side board (12) of bending is by corresponding punching press boss (700) of screw (600) swing joint position through assorted right side screw hole (9) and connecting hole, the bottom left and right sides of panel beating center (100) all is provided with pick-up plate (800), spacing fixed PCB board (300).

2. A patch element heat sink structure according to claim 1, wherein: the appearance of radiator (200) sets up to the rectangle, the preceding terminal surface of radiator (200) has set gradually preceding terminal surface die mould muscle (1) from a left side to the right side, the right side of radiator (200) has set gradually right side die mould muscle (2) to the back by preceding, the left side of radiator (200) has set gradually left side die mould muscle (3) to the back by preceding, the rear end face of radiator (200) has set gradually rear end surface die mould muscle (4) from a left side to the right side.

3. A patch element heat sink structure according to claim 1, wherein: the PCB is characterized in that a patch element (500) is arranged at the top of the PCB (300), a heat conduction silica gel sheet (400) is arranged at the top of the patch element (500), and a radiator (200) is attached to the top of the heat conduction silica gel sheet (400).

4. A patch element heat sink structure according to claim 1, wherein: the radiator (200) is an aluminum plate material radiator.

5. A patch element heat sink structure according to claim 1, wherein: the tops of the front end face bending plate (11), the right side bending plate (12) and the left side bending plate (13) are arranged on the same horizontal plane.