CN209929347U

CN209929347U - Organic light-emitting device

Info

Publication number: CN209929347U
Application number: CN201921214747.1U
Authority: CN
Inventors: 田杰
Original assignee: Incoflex Semiconductor Technology Ltd
Current assignee: Incoflex Semiconductor Technology Ltd
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2020-01-10
Anticipated expiration: 2029-07-30

Abstract

The organic light-emitting device sequentially comprises a substrate, a thin film transistor, an anode, a functional layer, an insulating layer and a packaging thin film layer from bottom to top, wherein the thin film transistor is arranged on the substrate, the anode is arranged on the thin film transistor, the functional layer is arranged on the anode, the insulating layer is arranged on the functional layer, and the packaging thin film layer is arranged on the insulating layer.

Description

Organic light-emitting device

Technical Field

The utility model relates to an organic light emitting device technical field especially relates to an organic light emitting device of encapsulation thin layer with function of blocking water.

Background

Electronic and optoelectronic devices include Electroluminescent (EL) display devices, particularly Organic Light Emitting Display (OLED) devices, electrophoretic displays (e.g., electronic paper), photovoltaic modules, and semiconductor devices (commonly referred to as organic field effect transistors, thin film transistors, and integrated circuits), electronic circuits that drive the electronic operation of these devices are commonly fabricated and/or mounted on substrates. The encapsulation layer may be disposed on the outside of the above-described components, partially or completely encapsulating the circuit and the substrate.

Substrates and encapsulation layers suitable for use in these electronic or optoelectronic devices may be transparent, translucent, or opaque, but more commonly substrates and encapsulation layers are transparent and may need to meet stringent specifications for optical clarity. For general electronic devices, an optical transparency of 55% in the 400 nm-800 nm range is acceptable, but for applications in display technology, an optical transparency of at least 85% or higher is desirable. Smoothness and smoothness of its surface is also necessary to ensure the integrity of subsequently applied coatings, such as electrode conductive coatings. Furthermore, the substrate and the encapsulation layer should also have good barrier properties, i.e. a high resistance to penetration by gases and solvents. Mechanical properties such as flexibility, impact resistance, light weight, hardness and scratch resistance are also weight considerations.

For the organic light emitting device, the current packaging method is rigid packaging, the packaging material is glass, and the glass increases the thickness of the whole display screen, and the screen is inflexible, so that the requirement of flexibility of the screen or other electronic equipment cannot be met.

SUMMERY OF THE UTILITY MODEL

According to prior art's defect, the utility model discloses a main aim at adopts flexible encapsulation thin layer to come to encapsulate electronic equipment and optoelectronic device, because the encapsulation thin layer is flexible and thickness than prior art's glass encapsulation layer thin, consequently can reach the demand that electronic equipment and optoelectronic device can be flexible and reduce electronic equipment and optoelectronic device's whole thickness.

According to the above objects, the present invention discloses an organic light emitting device, which comprises, in order from bottom to top, a substrate, a thin film transistor, an anode, a functional layer, an insulating layer and an encapsulation thin film layer, wherein the thin film transistor is disposed on the substrate, the anode is disposed on the thin film transistor, the functional layer is disposed on the anode, the insulating layer is disposed on the functional layer, and the encapsulation thin film layer is disposed on the insulating layer.

In a preferred embodiment of the present invention, the substrate is glass.

In a preferred embodiment of the present invention, the anode is Indium Tin Oxide (ITO).

In a preferred embodiment of the present invention, the functional layer at least comprises a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an emissive layer (EML), a cathode and a cover layer from bottom to top.

In a preferred embodiment of the present invention, the insulating layer is silicon nitride (SiN).

In a preferred embodiment of the present invention, the packaging film layer is a flexible packaging film layer.

In a preferred embodiment of the present invention, the encapsulating film layer is a fluoropolymer film layer.

Drawings

Fig. 1 is a schematic cross-sectional view of an organic light emitting device according to the disclosed technology.

Detailed Description

In order to make the objects, technical features and advantages of the present invention more comprehensible to those skilled in the relevant art and to enable implementation of the present invention, accompanying drawings are provided herein to illustrate technical features and embodiments of the present invention, and preferred embodiments are further described. The drawings referred to below are for illustrative purposes only and are not necessarily drawn to scale. The description of the embodiments related to the present invention will not be repeated, except for those skilled in the art.

Referring to fig. 1, fig. 1 is a schematic cross-sectional view illustrating an organic light emitting device according to the present disclosure. In fig. 1, the organic light emitting device 1 at least comprises, in order from bottom to top, a substrate 10, a thin film transistor 12, an anode 14, a functional layer 16, an insulating layer 18, and an encapsulation thin film layer 20, wherein the thin film transistor 12 is disposed on the substrate 10, the anode 14 is disposed on the thin film transistor 12, the functional layer 16 is disposed on the anode 14, the insulating layer 18 is disposed on the functional layer 16, and the encapsulation thin film layer 20 is disposed on the insulating layer 18.

In an embodiment of the present invention, the substrate 10 is glass, the anode 14 is Indium Tin Oxide (ITO), and the functional layer 16 at least includes a Hole Injection Layer (HIL) 162, a Hole Transport Layer (HTL) 164, an emission layer (EML) 166, an Electron Transport Layer (ETL) 168, a cathode 170, and a cover layer 172 from bottom to top in sequence. It should be noted that the functions, materials and structures of the functional layer 16 are the same as those of the prior art, and the technical features of the present invention are not included in the functional layer 16, so that the description is omitted.

Please continue with fig. 1. The utility model discloses in, insulating layer 18 among the organic light emitting device 1 is silicon nitride (SiN) its purpose is used for separation overburden 172 and encapsulation thin layer 20 (be the water blocking layer) direct contact, forms the insulating layer that the one deck is fine and close and encapsulation thin layer 20 among the organic light emitting device 1 is the water blocking layer, and has the flexibility the utility model discloses a can block water and have simultaneously can the flexibility, then adopt fluoropolymer to come as the encapsulation thin layer.

In the present invention, since the fluoropolymer is used as a main material of the encapsulating thin film layer, and the fluoropolymer has high solubility in a fluorine solvent and low solubility in a general solvent, the fluoropolymer is used as the encapsulating thin film layer 20 of the organic light-emitting device 1 by utilizing the characteristic of high solubility in a fluorine solvent. Therefore, the fluoropolymer film is formed by dissolving the fluoropolymer in a fluorine solvent at a certain concentration, and then applying the coating process, the three-dimensional inkjet printing process or both to a device, such as the organic light emitting device 1. Then, the residual fluorine solvent in the fluoropolymer film is removed by baking, so that a dense encapsulating film layer 20 made of fluoropolymer is formed on the surface of the organic light-emitting device 1. In a more preferred embodiment of the present invention, the fluorine solvent used may be perfluoroalkyl, perfluoro-2-butyltetrahydrofuran, perfluorotrialkylamine, hexafluoroisopropanol, perfluorocyclic ether, perfluoroether, octafluoropentanol or perfluoroacetone, but is not limited thereto.

Taking the present invention as an example, after the organic light emitting device 1 forms the substrate 10, the thin film transistor 12, the anode 14, the functional layer 16 and the insulating layer 18 according to the semiconductor technology, the fluorine solvent in which the fluoropolymer is dissolved is formed on the insulating layer 18 by the coating process and/or the three-dimensional inkjet printing process, and then the fluorine solvent in the fluoropolymer formed on the insulating layer 18 is removed by the baking process, and the fluoropolymer thin film layer 20 is formed on the insulating layer 18, so as to complete the fabrication of the organic light emitting device 1.

In addition, it should be noted that the fluoropolymer used in the present invention is an amorphous fluoropolymer, which is a linear alkane polymer, the hydrogen of the molecule of which is completely or partially substituted by fluorine atoms, so that the fluoropolymer can be polymerized by perfluoro-a-olefin, partially fluorinated a-olefin or perfluoro-a-olefin and partially fluorinated a-olefin, and the monomer of the fluoropolymer is polymerized by one of a monomer, B monomer or C monomer. In another embodiment, the general formula of the fluoropolymer compound can be represented by formula (I), formula (II) or formula (III), wherein formula (I) is

Formula (II) is

And formula (III) isAnd A in the above-mentioned formula (I), formula (II) and formula (III)₁、B₁And C₁Are respectively substituted units, and the structural formula can be shown as a formula (IV):

and Y in the formula (IV)₁-Y₄Is a substituent group, and may be a F atom-substituted group, a CF 3-substituted group, a perfluoroalkyl-substituted group, a perfluoroaromatic hydrocarbon-substituted group, an OCF₃Substituent group and OCF₂CF₃SubstitutionA group.

The structure of the fluoropolymer film layer 20 thus obtained can be as follows:

and

therefore, it is summarized that the utility model discloses after dissolving fluoropolymer in the fluorine solvent with coating process and/or three-dimensional inkjet printing process with fluoropolymer formation on organic light emitting device 1's insulating layer 18, can form one deck fluoropolymer thin layer 20 on insulating layer 18 after getting rid of the fluorine solvent, and this fluoropolymer thin layer 20 is outside each layer structure in organic light emitting device 1 can be protected to the water-blocking layer of compactness, can also obstruct organic light emitting device 1 and external contact, and make organic light emitting device 1 have good product stability, and fluoropolymer thin layer 20 still has the flexibility. And thus can satisfy the demand for flexibility of the organic light emitting device 1.

Claims

1. An organic light-emitting device, comprising:

a substrate;

a thin film transistor disposed on the substrate;

an anode disposed on the thin film transistor;

a functional layer disposed on the anode;

an insulating layer disposed on the functional layer; and

and the packaging thin film layer is arranged on the insulating layer.

2. The organic light emitting device of claim 1, wherein the substrate is glass.

3. The organic light emitting device of claim 1, wherein the anode is indium tin oxide.

4. The organic light-emitting device according to claim 1, wherein the functional layer comprises at least a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, a cathode, and a capping layer in this order from bottom to top.

5. The organic light emitting device according to claim 1, wherein the insulating layer is a silicon nitride or aluminum oxide inorganic insulating layer.

6. The organic light emitting device of claim 1, wherein the encapsulation thin film layer is a water-blocking layer.

7. The organic light emitting device of claim 1, wherein the encapsulation film layer is a flexible encapsulation film layer.

8. The organic light emitting device of any of claims 1, 6, or 7, wherein the encapsulation film layer is a fluoropolymer film layer.