CN209928325U

CN209928325U - Extended liquid cooling active soaking passive heat dissipation type case

Info

Publication number: CN209928325U
Application number: CN201821962749.4U
Authority: CN
Inventors: 徐鹏
Original assignee: Individual
Current assignee: Individual
Priority date: 2018-11-27
Filing date: 2018-11-27
Publication date: 2020-01-10
Anticipated expiration: 2028-11-27

Abstract

The utility model discloses an expanding liquid cooling active soaking passive heat dissipation type case, which comprises a panel, a mainboard bracket and a panel cavity connected by screws, wherein the panel comprises an upper panel and a lower panel which are oppositely arranged, a glass panel which is oppositely arranged by a liquid cooling active soaking passive heat dissipation plate, and a front panel and a rear panel, the upper panel and the lower panel have the same structure and can be exchanged universally, the liquid cooling active soaking passive heat dissipation plate is divided into an outer liquid cooling active soaking passive heat dissipation plate and an inner liquid cooling active soaking passive heat dissipation plate, the outer liquid cooling active soaking passive heat dissipation plate and the inner liquid cooling active soaking passive heat dissipation plate respectively comprise an upper sheet which is arranged on an outer layer and a lower sheet which is arranged on an inner layer, the upper sheet is divided into a surface and a surface B surface, the lower sheet is divided into a surface which is attached to the B surface of the upper sheet and a surface which is attached to the inner side D surface, and the A surface, the B surface, the C surface and the D surface, the surface B is separated by a groove to form a water channel, and a sealing groove is arranged on the outer ring of the water channel.

Description

Extended liquid cooling active soaking passive heat dissipation type case

Technical Field

The utility model relates to a quick-witted case with passive heat dissipation function specifically indicates an extended type liquid cooling initiative soaking passive heat dissipation formula machine case.

Background

The existing heat dissipation methods are divided into two types, namely active heat dissipation and passive heat dissipation. Active heat dissipation means that more heat is taken away in unit time by installing a fan and increasing the air flow rate. Active heat dissipation has the advantages of high power and efficiency, but noise is always the biggest problem due to the presence of the moving part, the fan. Passive heat dissipation refers to passive heat release by the direct contact of air and heat sink without moving parts such as fans. The passive heat dissipation has the advantages of silence, no power consumption and obvious defects, and the passive heat dissipation has small heat dissipation power and low efficiency because of passive contact with air. If the heat dissipation power of passive heat dissipation is desired to be improved, the heat dissipation power can be improved only by increasing the volume of the heat sink and obtaining a larger contact area with air, but the heat sink itself is installed inside the chassis, and the heated air is still actively exhausted out of the chassis by increasing the fan, otherwise, the air of the chassis is higher and higher, and finally the heat dissipation effect of the heat sink is lost. Passive heat dissipation is often used in less powerful applications.

The first type is a liquid cooling mode which provides power through a pump, and cooling liquid is used as a medium carrying heat, has high specific heat capacity and can absorb heat at a hot end and release heat at a cold end; the second is to use the vacuum heat pipe and the vacuum soaking plate to conduct heat, but the principle of the vacuum heat pipe and the vacuum soaking plate is to conduct heat by the way of vaporization heat absorption and liquefaction heat release of the cold end and the hot end, so the cold end and the hot end need enough temperature difference to play a role to the maximum extent, the efficiency in practical use is not as good as that of liquid cooling heat conduction, and the heat conduction efficiency can be further influenced after the vacuum heat pipe and the vacuum soaking plate are bent; the third is to directly utilize the heat conduction characteristic of metal itself to conduct heat, which is also the most common heat conduction mode of low-power heat sink.

The existing case mainly has the function of serving as an installation carrier of each hardware, the hardware is installed in the case, and the case provides protection for the hardware. The heat sink is also mounted inside the chassis.

Along with the improvement of the living standard of people at present, the development of microelectronic circuits is rapidly advanced, a greater challenge is provided for heat dissipation, the problem of noise pollution exists in active heat dissipation, passive heat dissipation is more and more emphasized by people, and a solution of high-power passive heat dissipation is urgently needed in the market.

SUMMERY OF THE UTILITY MODEL

To the above problem, the utility model provides an expansion type liquid cooling initiative soaking passive heat dissipation formula machine case.

The technical scheme is as follows:

an extended liquid cooling active soaking passive heat dissipation type case comprises a panel, a panel bracket and a cavity body which is connected through screws and is enclosed into a containing mainboard, a CPU, a memory bank, a hard disk and a power supply, wherein the panel comprises an upper panel and a lower panel which are oppositely arranged, a glass panel and a front panel and a rear panel which are oppositely arranged, the upper panel and the lower panel are mutually identical in structure and can be universally exchanged, the liquid cooling active soaking passive heat dissipation panel is divided into an outer liquid cooling active soaking passive heat dissipation panel and an inner liquid cooling active soaking passive heat dissipation panel which are connected through fast screwing screws, the outer liquid cooling active soaking passive heat dissipation panel and the inner liquid cooling active soaking passive heat dissipation panel respectively comprise an upper sheet arranged on the outer layer and a lower sheet arranged on the inner layer, and the upper sheet and the lower sheet are fixed into a whole through screws arranged around, the utility model discloses a solar energy collecting device, including last piece, water course outer lane, mainboard bracket, water course outer lane, last piece divide into A face and B face, the piece divide into the C face and the inboard D face of laminating mutually with last piece B face down, all be equipped with inside sunken recess on A face, B face, C face and the D face, the B face cuts off through the recess and forms the water course, the water course outer lane is equipped with the seal groove, piece bottom one end is equipped with a set of screw thread through-hole down, the mainboard bracket passes through the copper post connection to be fixed on the copper post hole site on the D face of the passive heating panel of soaking in the initiative liquid cooling, install multi-functional hole site above the mainboard bracket, mountable ATX mainboard, Mirco-ATX mainboard and.

As a further description, the size of the outer liquid-cooled active soaking passive heat dissipation plate is slightly larger than that of the inner liquid-cooled active soaking passive heat dissipation plate, and the inner liquid-cooled active soaking passive heat dissipation plate is provided with copper pillar mounting threaded holes.

For further explanation, the threaded through holes are respectively a pagoda threaded interface and a quick-screwing screw interface.

As a further illustration, a rubber sealing ring is disposed in the sealing groove.

For further explanation, the water channel structure corresponds to the pagoda screw interface of the lower piece.

As a further explanation, the grooves on the surface a and the surface D are vertical grooves vertically arranged, and the vertical grooves are perpendicular to the water channel.

As a further description, a wiring space is left between the motherboard bracket and the active soaking heat dissipation plate, a fan mounting position is reserved on the motherboard bracket, a temperature control fan can be mounted, a trigger temperature is set in the motherboard BIOS, and after the trigger temperature is reached, the fan is turned on, so that automatic control timely active heat dissipation is realized.

As a further explanation, the upper panel and the lower panel are both provided with heat dissipation vents.

As a further description, the glass panel is connected and fixed to the upper panel and the lower panel by a right-angle mounting piece.

For further explanation, the groove on the C surface is arranged near the edge of the C surface, and has only one circle.

As a further description, the structure of the outer liquid-cooled active soaking passive cooling plate is the same as that of the inner liquid-cooled active soaking passive cooling plate, and is slightly larger than that of the inner liquid-cooled active soaking passive cooling plate.

Compared with the prior art, the utility model the advantage lie in:

1. providing a silent heat dissipation solution for a high-power platform;

2. passive heat dissipation is not limited to a low-power-consumption platform any more, and performance and silence are achieved;

3. the machine has no influence of noise, can be placed in any place, has no influence of noise for creative workers, can be better used as a productivity tool, and improves the working efficiency of users; meanwhile, the passive radiating case does not accumulate a large amount of dust like the active fan radiating, so that the stability of the machine can be improved, and the cost of frequent dust cleaning and maintenance of personnel is saved;

4. the desk can be placed on a desk at a lower temperature in winter, and heat emitted by the case can be utilized to warm a user.

Drawings

FIG. 1 is a schematic view of an overall structure of an extended liquid-cooled active soaking and passive heat dissipation type case;

FIG. 2 is an exploded view of an expanded liquid-cooled active soaking passive heat dissipation type case structure;

FIG. 3 is a schematic structural view of an upper sheet A surface of an extended liquid-cooled active soaking passive heat dissipation type case;

FIG. 4 is a schematic structural diagram of an upper sheet B surface of an extended liquid-cooled active soaking passive heat dissipation type case;

FIG. 5 is a schematic view of a lower sheet C-side structure of an extended liquid-cooled active soaking passive heat dissipation type case;

FIG. 6 is a schematic view of a lower plate D-surface structure of an extended liquid-cooled active soaking passive heat dissipation type case;

FIG. 7 is a schematic diagram of a motherboard bracket structure of an extended liquid-cooled active soaking passive heat dissipation chassis;

FIG. 8 is a schematic diagram of a front panel structure of an extended liquid-cooled active soaking passive heat dissipation type chassis;

fig. 9 is a schematic diagram of a rear panel structure of an extended liquid-cooled active soaking passive heat dissipation type chassis;

FIG. 10 is a schematic diagram of the upper panel and the lower panel of the extended liquid-cooled active soaking passive heat dissipation case;

fig. 11 is a schematic view of an installation plane of an extended liquid-cooled active soaking passive heat dissipation type case.

In the figure: 1. a face, 2 face, B face, 3 face, C face, 4 face, D face, 5, mainboard bracket, 6, front panel, 7, back panel, 8, upper panel and lower panel, 9, glass panel, 10, screw through hole.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

As shown in connection with figures 1-11 of the drawings,

an expanded liquid cooling active soaking passive heat dissipation type case comprises a panel, a panel bracket 5 and a cavity body which is connected by screws and is used for enclosing and containing a mainboard, a CPU, a memory bank, a hard disk and a power supply, wherein the panel comprises an upper panel and a lower panel 8 which are oppositely arranged, a glass panel 9 which is oppositely arranged with the liquid cooling active soaking passive heat dissipation plate, a front panel 6 and a rear panel 7, the upper panel and the lower panel 8 are mutually identical in structure and can be universally exchanged, the liquid cooling active soaking passive heat dissipation plate is divided into an outer liquid cooling active soaking passive heat dissipation plate and an inner liquid cooling active soaking passive heat dissipation plate which are connected by quickly screwing screws, the outer liquid cooling active soaking passive heat dissipation plate and the inner active soaking passive heat dissipation plate respectively comprise an upper sheet arranged on an outer layer and a lower sheet arranged on an inner layer, and the upper sheet and the lower sheet are fixed into a whole by screws arranged on the periphery, the upper segment is divided into A face 1 and B face 2, the lower segment is divided into C face 3 and inboard D face 4 of laminating mutually with upper segment B face 2, all be equipped with inside sunken recess on A face 1, B face 2, C face 3 and the D face 4, B face 2 cuts off through the recess and forms the water course, the water course outer lane is equipped with the seal groove, lower segment bottom one end is equipped with a set of screw thread through-hole 10, mainboard bracket 5 is fixed on the copper post hole site on the D face of liquid cooling initiative soaking passive cooling panel through the copper post connection, install multi-functional hole site above mainboard bracket 5, mountable ATX mainboard, Mirco-ATX mainboard and MINI-ITX mainboard of multiple standard.

For further illustration, the threaded through-hole 10 is a pagoda threaded interface and a quick-screwing screw interface, respectively.

As a further description, the grooves on the a surface 1 and the D surface 4 are vertical grooves vertically arranged, and the vertical grooves are perpendicular to the water channels.

The area of the water channel accounts for more than 80% of the total area of the surface B and the surface C, the water channel is large in width, small in depth and flat.

This expanding liquid cooling initiative soaking passive heat dissipation formula quick-witted case overall arrangement principle:

the extended liquid cooling active soaking passive heat dissipation type case is larger in size, two core components, namely a liquid cooling active soaking passive heat dissipation plate are different in size and are arranged on one side of the case in a staggered and parallel mode, the maximum heat dissipation area is guaranteed, meanwhile, a space is reserved for the other side of the case to be provided with a glass side plate, the design of single-side penetration is beneficial to observing the operation condition of hardware inside the case, a multifunctional hole site is arranged on a main plate bracket, various hardware can be installed, and a standard ATX main plate, a Mirco-ATX main plate and a MINI-ITX main plate are supported.

A wiring space is reserved between the mainboard bracket and the liquid cooling active soaking passive heat dissipation plate, a fan installation position is reserved on the mainboard bracket, a temperature control fan can be installed, a trigger temperature is set in the BIOS of the mainboard, and after the trigger temperature is reached, the fan is turned on, so that timely active heat dissipation of automatic control is realized. The extended liquid cooling passive heat dissipation type case is provided with side transparent glass, two liquid cooling active and passive heat dissipation plates are intensively arranged on one side of the case, in order to ensure that two groups of water inlets and water outlets of pagoda/quick screwing threaded interfaces on the two liquid cooling active and passive heat dissipation plates are not shielded, in the design, the two liquid cooling active and passive heat dissipation plates are different in size, the outermost side of the case is full-size, the inner side of the case is secondary-size, the secondary-size is slightly shorter than the full-size, a certain distance is reserved between the two liquid cooling active and passive heat dissipation plates, the two liquid cooling active and passive heat dissipation plates are not tightly attached, and the extended liquid cooling passive heat dissipation type case is used for convection heat dissipation of air. A gap is also reserved between the liquid cooling active soaking passive cooling plate and the mainboard bracket which are arranged on the inner side of the case, and the gap is used for wiring and cooling internal hardware. The upper panel and the lower panel of the case have the same structure and are provided with radiating holes.

Liquid cooling initiative soaking passive cooling plate structure: go up the piece and constitute with lower piece, fixed as an organic whole through round screw on every side, go up the piece and be aluminium alloy plate CNC directly by the inside processing in surface with lower piece, go up the piece by the A face of installing outside the quick-witted case and constitute with the B face of C face laminating, A face processing has perpendicular groove, and the parallel water course of perpendicular groove direction and B face is perpendicular, and perpendicular to the ground. The most marginal screw hole that is of B face, screw hole inboard processing have the round sealing washer groove, and inside is provided with rubber seal, and the inboard in sealing washer groove still processes flat parallel circulation water course, and the width of water course is big, and the degree of depth is little, and the pagoda screwed interface of water course structure and lower piece corresponds, and the water course direction is perpendicular with the perpendicular groove direction of A face, structurally can play the effect of strengthening anyhow like this. The lower plate is composed of a C surface and a D surface, the C surface is attached to the B surface of the upper plate, the D surface is installed in the case, the edge of the C surface is provided with a through hole, corresponding to the B surface, of an installation countersunk screw, two tower fast-screwing threaded interfaces which pass in and out are arranged inside the sealing groove, the C surface is attached to the B surface of the upper plate during installation, the D surface faces the case, a peripheral circle of the through hole is provided with a fixing screw, a vertical groove is formed in the inward processing of the surface of the inner side, the vertical groove direction is consistent with the vertical groove direction of the A surface of the upper plate, the D surface is also provided with a tower fast-screwing threaded interface which corresponds to the C surface, the C surface and the D surface are two surfaces of the lower plate, the tower fast-screwing threaded interfaces which pass in and out are. The surfaces B and C of the liquid cooling active soaking passive heat dissipation plate are contact surfaces with cooling liquid and belong to heat absorption surfaces. The A surface and the D surface are contact surfaces with air and belong to heat dissipation surfaces. The screw holes of the C surface and the B surface are opposite. The surfaces of the A surface and the D surface are both provided with vertical heat-dissipating grooves. The surface A is a whole vertical groove, the direction of the vertical groove is vertical to the water channel of the surface B, the surface A faces the outside of the case and is installed, and heat is directly released to the outside of the case. The D surface is not provided with vertical grooves except for the positions of screw hole positions on the periphery and the positions of quick-screwing threaded connectors for entering and exiting the pagoda, a large-area vertical groove is also processed in the middle, the direction of the vertical groove is consistent with that of the vertical groove on the A surface, the D surface is installed towards the inner part of the case, heat is released on the inner surface of the case, and is discharged out of the case through ventilation holes on the upper panel and the lower panel of the case through cold and hot air convection.

The working principle of the liquid cooling active soaking passive cooling plate is as follows: the liquid cooling active soaking passive cooling plate needs to be installed in a liquid cooling system to play a role. The liquid cooling active soaking passive cooling plate plays a role of 'cold drain' in the traditional liquid cooling system and is used for cooling the cooling liquid. The cooling liquid enters the liquid cooling active soaking passive cooling plate from the threaded joint of the pagoda, the flat water channels of the internal circulation cover the interior of the cooling plate, and the cooling liquid flows through the surfaces of all the flat water channels in the cooling plate and can flow out. The flat water course of tiling lets coolant liquid and the inside area of contact that possesses the maximize of heating panel, and heat conduction that can be faster for the coolant liquid cooling, can not let the water course too narrow again, has guaranteed the flow of coolant liquid, reduces the resistance of coolant liquid circulation. The heat exchange between the cooling liquid and the liquid cooling active soaking passive heat dissipation plate is active and efficient, and is 'active soaking'. After heat conduction gives the passive radiator plate of liquid cold initiative soaking itself, two cooling surfaces of the passive radiator plate of liquid cooling possess great surface area, and surface machining's perpendicular groove has increased the area of contact with the air, erects the groove simultaneously and also plays the effect of water conservancy diversion, and the air flows along the surface of erecting the groove upwards, and air is heated back density reduction, and hot-air rises, and cold air supplyes the position, constantly circulates. Does not need a fan, has extremely high heat dissipation efficiency and is 'passive heat dissipation'. The cooling liquid cooled by the liquid cooling active soaking passive cooling plate continues to circularly cool in the liquid cooling pipeline.

The liquid cooling active soaking passive cooling plate needs to be made of a material with good heat conductivity and certain strength, and ideal materials include aluminum alloy, copper alloy and the like.

The present invention and the embodiments thereof have been described above, but the description is not limited thereto, and the embodiment shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should understand that they should not be limited to the embodiments described above, and that they can design the similar structure and embodiments without departing from the spirit of the invention.

Claims

1. An expanded liquid cooling active soaking passive heat dissipation type case is characterized by comprising a panel, a panel bracket and a cavity which is enclosed by the panel connected through screws and is used for containing a mainboard, a CPU, a memory bank, a hard disk and a power supply, wherein the panel comprises an upper panel and a lower panel which are oppositely arranged, a glass panel and a front panel and a rear panel which are oppositely arranged, and the liquid cooling active soaking passive heating panel and the glass panel are oppositely arranged, the upper panel and the lower panel are mutually identical in structure and can be universally interchanged, the liquid cooling active soaking passive heating panel is divided into an outer liquid cooling active soaking passive heating panel and an inner liquid cooling active soaking passive heating panel which are connected through fast screwing screws, the outer liquid cooling active soaking passive heating panel and the inner liquid cooling active soaking passive heating panel respectively comprise an upper sheet arranged on an outer layer and a lower sheet arranged on an inner layer, and the upper sheet and the lower sheet are fixed into a whole through fixing screws arranged around, the utility model discloses a solar energy water heater, including last piece, water course outer lane, mainboard bracket, water course, last piece divide into A face and B face, the piece divide into the C face and the inboard D face of laminating mutually with last piece B face down, all be equipped with inside sunken recess on A face, B face, C face and the D face, the B face cuts off through the recess and forms the circulation water course, the water course outer lane is equipped with the seal groove, piece bottom one end is equipped with a set of screw thread through-hole down, the mainboard bracket passes through the copper post connection to be fixed on the copper post hole site on the D face of liquid cooling initiative soaking passive cooling board, install multi-functional hole site above the mainboard bracket, mountable multi-standard's ATX mainboard, Mirco-ATX mainboard and MINI.

2. The extended liquid-cooling active soaking passive heat dissipation case according to claim 1, wherein the size of the outer liquid-cooling active soaking passive heat dissipation plate is slightly larger than that of the inner liquid-cooling active soaking passive heat dissipation plate, and the inner liquid-cooling active soaking passive heat dissipation plate is provided with copper pillar mounting threaded holes.

3. The extended liquid-cooled active heat soaking passive heat dissipation case according to claim 1, wherein the threaded through holes are a pagoda threaded interface and a quick-screwing screw interface respectively.

4. The chassis with the expanded liquid cooling active soaking and passive heat dissipation function as claimed in claim 1, wherein a rubber sealing ring is arranged in the sealing groove.

5. The chassis with the extended liquid-cooling active heat soaking and passive heat dissipation functions as claimed in claim 1, wherein the water channel structure corresponds to the threaded pagoda interface of the lower plate.

6. The expanding type liquid-cooling active heat soaking passive heat dissipation case according to claim 1, wherein the grooves on the surface A and the surface D are vertical grooves which are vertically arranged and are perpendicular to the water channel.

7. The chassis with the function of expanding liquid cooling, active heat soaking and passive heat dissipation according to claim 1, wherein the upper panel and the lower panel are both provided with heat dissipation vents.

8. The chassis with the extended liquid-cooling active heat soaking and passive heat dissipation functions as claimed in claim 1, wherein the glass panel is fixedly connected with the upper panel and the lower panel through right-angle mounting pieces.

9. The chassis with the function of expanding liquid cooling, active heat soaking and passive heat dissipation according to claim 1, wherein the grooves on the C surface are arranged close to the edge of the C surface, and are only one circle.