CN209927332U - Broadband variable-angle one-emitting-one-receiving ultrasonic probe for measuring residual stress - Google Patents

Broadband variable-angle one-emitting-one-receiving ultrasonic probe for measuring residual stress Download PDF

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CN209927332U
CN209927332U CN201920166157.XU CN201920166157U CN209927332U CN 209927332 U CN209927332 U CN 209927332U CN 201920166157 U CN201920166157 U CN 201920166157U CN 209927332 U CN209927332 U CN 209927332U
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electrode layer
probe
piezoelectric wafer
lower electrode
residual stress
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刘东旭
周学农
贾鑫
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Pingtuo (shanghai) New Material Technology Co Ltd
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Pingtuo (shanghai) New Material Technology Co Ltd
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Abstract

The utility model discloses a broadband variable-angle one-emitting-one-receiving ultrasonic probe for measuring residual stress, a receiving probe shell is arranged on a receiving probe fixing rod through a receiving probe shell fixing screw, a transmitting probe is arranged on the transmitting probe fixing rod through a transmitting probe shell fixing screw, the upper surface of a piezoelectric wafer is plated with an upper electrode layer through magnetron sputtering, the lower surface of the piezoelectric wafer is plated with a lower electrode layer through magnetron sputtering, a concave matching layer is adhered to the lower electrode layer lower surface of the piezoelectric wafer through epoxy, a backing material is uniformly stirred through tungsten powder and epoxy and then solidified on the upper surface of the upper electrode layer of the piezoelectric wafer, the backing material is solidified and formed in a 45-DEG oven, a lower electrode layer lead is welded on the lower electrode layer of the piezoelectric wafer, an upper electrode layer lead is welded on the upper electrode layer of the piezoelectric wafer, a lower electrode layer lead and an upper electrode, the coaxial cable is fixed on the shell of the probe, and the wire protecting sleeve is sleeved on the coaxial cable.

Description

Broadband variable-angle one-emitting-one-receiving ultrasonic probe for measuring residual stress
Technical Field
The utility model relates to a residual stress measures and receives ultrasonic probe with variable angle of broadband for measurement belongs to ultrasonic wave stress measurement technical field.
Background
Residual stress, also known as internal stress, refers to the stress that remains inside the workpiece when the external load is removed. The residual stress is generated by the uneven volume change of the internal structure of the metal. Its external factors are hot working and cold working. The workpiece having internal stress is in an unstable state, and the structure inside thereof tends to be strongly restored to a stable state free from internal stress. The shape of the workpiece gradually changes (e.g., warp) and loses its original accuracy. If a workpiece with internal stress is fitted into the machine, the accuracy of the entire machine is impaired by its deformation in use. Since the residual stresses themselves are balanced with each other, when an object having a residual stress is loaded, the operating stress of some portion in the object is different from the sum of the stress caused by an external force and the residual stress of some portion, which causes the stress to be unevenly distributed in the object. When the working stress reaches the yield strength of the material, the object can generate plastic deformation; when the fracture strength of the material is reached, the object will fracture, thereby shortening the service life of the part.
The measurement of residual stress is crucial, and can be identified by ultrasonic waves due to the residual stress generated after the internal tissues are deformed. And (4) measuring the change of the sound velocity of the tissue so as to judge whether residual stress exists. The method adopts ultrasonic critical refraction longitudinal waves to detect residual stress, and the longitudinal waves need to be incident into a detected material at a first critical angle, so that the critical refraction longitudinal waves can be ensured to be excited by being incident at a certain angle. Before the acoustic wedge is machined, the longitudinal wave sound velocity in organic glass and a tested material needs to be calibrated, and a first critical angle is calculated through Snell's law, so that the accuracy of the angle is very important. However, due to changes in ambient temperature, the material sound velocities of the wedge material and the test material also change, resulting in a change in the wedge angle that needs to be excited to the first critical angle. The materials with different sound velocities need to be selected from wedges with different angles, which leads to the complexity of wedge processing and the difficulty of precision control. The utility model provides a probe of receiving is sent out to variable angle of broadband can all can excite out first critical angle longitudinal wave in different work pieces and different environment through changing the angle, adopts the wide band signal for some work pieces are great to ultrasonic attenuation, and the receipt that the condition that the frequency reduces also can be fine, thereby carry out the accuracy measurement to residual stress, have improved the adaptability that residual stress detected.
Disclosure of Invention
In order to solve the problems, the technical problem to be solved by the utility model is to provide a broadband variable-angle one-shot ultrasonic probe for measuring residual stress, which solves the problem of the detection adaptability of the probe in steel pieces made of different materials by increasing the frequency bandwidth of the probe; by adding a variable angle structure, the incident angle can be changed under the condition of sound velocity under different environments, so that a first critical longitudinal wave is generated, and the quality of residual stress detection is improved.
The utility model discloses a broadband variable angle send-receive ultrasonic probe for residual stress measurement, the voussoir be processed and form by the plastic pellet, process two cambered surfaces on the voussoir, the receiving probe dead lever passes through fastening screw to be fixed on a cambered surface on the voussoir, the transmitting probe dead lever passes through fastening screw to be fixed on another cambered surface on the voussoir, the receiving probe shell passes through receiving probe shell fixing screw to be installed on the receiving probe dead lever, the transmitting probe install at the transmitting probe dead lever through transmitting probe shell fixing screw outward, the voussoir on process the angle groove, two probes are installed on two cambered surfaces of voussoir, two probes can change the angle through receiving probe dead lever and transmitting probe dead lever, the upper surface of piezoelectric wafer plated the upper electrode layer through magnetron sputtering, the lower surface of piezoelectric wafer plated the lower electrode layer through magnetron sputtering, the probe comprises a lower electrode layer, a concave matching layer, a backing material, an upper electrode layer, a coaxial cable, a lower electrode layer lead, a back material and a protective wire sleeve, wherein the concave matching layer is adhered to the lower surface of the lower electrode layer on a piezoelectric wafer through epoxy, the concave matching layer can increase the sensitivity and the bandwidth of the probe, the backing material is uniformly stirred through tungsten powder and epoxy and then is solidified on the upper surface of the upper electrode layer of the piezoelectric wafer, the backing material is solidified and formed in a 45-DEG C oven, the back material can increase the bandwidth of the probe, the lower electrode layer lead is welded on the lower electrode layer of the piezoelectric wafer, the upper electrode layer lead is welded on the upper electrode layer of the piezoelectric wafer.
Further, the piezoelectric wafer is 5MHz and has a thickness of 420 microns.
Furthermore, the thicknesses of the upper electrode layer and the lower electrode layer are both 50 micrometers.
Furthermore, the acoustic impedance of the concave matching layer is 5 megarayls, the thickness of the central point of the concave matching layer is 120 microns, the thickness is 1/4 of the wavelength, the radian of the concave matching layer is matched with the wedge block, and the radian of the concave matching layer is 50 mm.
Further, the acoustic attenuation of the backing material was 3.4 dB/cm.
Furthermore, the concave matching layer is prepared by adopting polymers and fillers according to different filling ratios.
Furthermore, the piezoelectric wafer is made of piezoelectric ceramics or piezoelectric composite materials.
Furthermore, the backing material is a composite material with high acoustic impedance and high acoustic attenuation, for example, tungsten powder with high filling ratio is filled in epoxy resin to prepare the backing, and the material with higher density is pressed by an isostatic pressing method in order to improve the acoustic impedance of the backing material and further improve the bandwidth of the probe.
Furthermore, the wedge block is made of a plastic material, and can be made of polystyrene, organic glass or polyimide.
The utility model has the advantages that: the utility model increases the frequency bandwidth of the probe, thereby solving the problem of detecting adaptability of the probe in steel pieces made of different materials; by adding a variable angle structure, the incident angle can be changed under the condition of sound velocity under different environments, so that a first critical longitudinal wave is generated, and the quality of residual stress detection is improved.
Drawings
For ease of illustration, the invention is described in detail by the following detailed description and accompanying drawings.
FIG. 1 is a front view structural diagram of the present invention;
fig. 2 is a front sectional view of the present invention.
In the figure: 1-1 wedge block; 1-2 receiving a probe fixing rod; 1-3 fixing screws; 1-5 receiving a probe shell fixing screw; 1-6 receiving a probe housing; 1-7 coaxial cables; 1-8 transmitting probe shell; 1-9 transmitting probe shell fixing screws; 1-10 transmitting probe fixing rods; 2-1 a concave matching layer; 2-2 lower electrode layer; 2-3 piezoelectric wafers; 2-4 upper electrode layer; 2-5 backing material; 2-6 lower electrode layer leads; 2-7 wire sheath; 2-8 upper electrode layer leads; 2-9 probe shell.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described below with reference to specific embodiments shown in the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1 and 2, a broadband variable-angle transmit-receive ultrasonic probe for measuring residual stress, wherein a wedge block 1-1 is processed by a plastic block, two arc surfaces are processed on the wedge block 1-1, a receiving probe fixing rod 1-2 is fixed on one arc surface of the wedge block 1-1 through a fastening screw 1-3, a transmitting probe fixing rod 1-10 is fixed on the other arc surface of the wedge block 1-1 through a fastening screw 1-3, a receiving probe shell 1-6 is installed on the receiving probe fixing rod 1-2 through a receiving probe shell fixing screw 1-5, a transmitting probe shell 1-8 is installed on the transmitting probe fixing rod 1-10 through a transmitting probe shell fixing screw 1-9, an angle scribing line is processed on the wedge block 1-1, two probes are arranged on two arc surfaces of a wedge block 1-1, the two probes can change angles through a receiving probe fixing rod 1-2 and a transmitting probe fixing rod 1-10, the upper surface of a piezoelectric wafer 2-3 is plated with an upper electrode layer 2-4 through magnetron sputtering, the lower surface of the piezoelectric wafer 2-3 is plated with a lower electrode layer 2-2 through magnetron sputtering, a concave matching layer 2-1 is adhered to the lower surface of the lower electrode layer 2-2 on the piezoelectric wafer 2-3 through epoxy, the concave matching layer 2-1 can increase the sensitivity and the bandwidth of the probes, a backing material 2-5 is uniformly stirred through tungsten powder and epoxy and then is solidified on the upper surface of the upper electrode layer 2-4 of the piezoelectric wafer 2-3, and the backing material 2-5 is solidified and formed in a baking oven at 45 ℃, the back lining material 2-5 can increase the bandwidth of the probe, the lower electrode layer lead 2-6 is welded on the lower electrode layer 2-2 of the piezoelectric wafer, the upper electrode layer lead 2-8 is welded on the upper electrode layer 2-4 of the piezoelectric wafer, the lower electrode layer lead 2-6 and the upper electrode layer lead 2-8 are connected with the coaxial cable 2-7, the coaxial cable 2-7 is fixed on the probe shell 2-9, and the wire protection sleeve 2-7 is sleeved on the coaxial cable 2-7.
Specifically, the piezoelectric wafer 2-3 is 5MHz and has a thickness of 420 micrometers, the upper electrode layer 2-4 and the lower electrode layer 2-2 are both 50 micrometers thick, the acoustic impedance of the concave matching layer 2-1 is 5 Mrayls, the thickness of the center point of the concave matching layer 2-1 is 120 micrometers, the thickness is 1/4 of the wavelength, the radian of the concave matching layer 2-1 is matched with a wedge, the radian of the concave matching layer 2-1 is 50mm, the acoustic attenuation of the backing material 2-5 is 3.4dB/cm, the concave matching layer 2-1 is prepared by adopting polymers and fillers according to different filling ratios, the piezoelectric wafer 2-3 is a piezoelectric ceramic or piezoelectric composite material, the backing material 2-5 is a high-acoustic impedance and high-acoustic attenuation composite material containing air holes, if tungsten powder with high filling ratio is filled in epoxy resin to prepare a backing, in order to improve the acoustic impedance of the backing material and further improve the bandwidth of the probe, the material with higher density is pressed by an isostatic pressing method, and the wedge block 1-1 is a plastic material, which can be polystyrene, organic glass or polyimide.
The basic principles and main features of the present invention, the advantages of the present invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (5)

1. A broadband transmitting-receiving ultrasonic probe with a variable angle for measuring residual stress is characterized in that a wedge block is formed by processing a plastic block, two arc surfaces are processed on the wedge block, a receiving probe fixing rod is fixed on one arc surface on the wedge block through a fastening screw, a transmitting probe fixing rod is fixed on the other arc surface on the wedge block through a fastening screw, a receiving probe shell is installed on the receiving probe fixing rod through a receiving probe shell fixing screw, the outside of a transmitting probe is installed on the transmitting probe fixing rod through a transmitting probe shell fixing screw, the upper surface of a piezoelectric wafer is plated with an upper electrode layer through magnetron sputtering, the lower surface of the piezoelectric wafer is plated with a lower electrode layer through magnetron sputtering, a concave matching layer is adhered to the lower surface of the lower electrode layer on the piezoelectric wafer through epoxy, and a backing material is solidified on the upper surface of, the lower electrode layer lead is welded on the lower electrode layer of the piezoelectric wafer, the upper electrode layer lead is welded on the upper electrode layer of the piezoelectric wafer, the lower electrode layer lead and the upper electrode layer lead are connected with a coaxial cable, the coaxial cable is fixed on the probe shell, and the wire protection sleeve is sleeved on the coaxial cable.
2. The broadband variable-angle transmit-receive ultrasonic probe for measuring residual stress according to claim 1, wherein: the thickness of the piezoelectric wafer is 420 microns.
3. The broadband variable-angle transmit-receive ultrasonic probe for measuring residual stress according to claim 1, wherein: the thicknesses of the upper electrode layer and the lower electrode layer are both 50 micrometers.
4. The broadband variable-angle transmit-receive ultrasonic probe for measuring residual stress according to claim 1, wherein: the acoustic impedance of the concave matching layer is 5 megarayls, and the thickness of the central point of the concave matching layer is 120 microns.
5. The broadband variable-angle transmit-receive ultrasonic probe for measuring residual stress according to claim 1, wherein: the acoustic attenuation of the backing material was 3.4 dB/cm.
CN201920166157.XU 2019-01-30 2019-01-30 Broadband variable-angle one-emitting-one-receiving ultrasonic probe for measuring residual stress Active CN209927332U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112345130A (en) * 2020-11-02 2021-02-09 哈尔滨工程大学 Stress distribution measuring device and method based on ultrasonic side waves
CN112946077A (en) * 2021-02-02 2021-06-11 北京理工大学 Carbon fiber composite material surface critical refraction longitudinal wave excitation detection system and method
US11604172B2 (en) 2020-06-05 2023-03-14 Beijing Institute Of Technology Ultrasonic monitoring probe for internal service stress of a marine structural component

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11604172B2 (en) 2020-06-05 2023-03-14 Beijing Institute Of Technology Ultrasonic monitoring probe for internal service stress of a marine structural component
CN112345130A (en) * 2020-11-02 2021-02-09 哈尔滨工程大学 Stress distribution measuring device and method based on ultrasonic side waves
CN112946077A (en) * 2021-02-02 2021-06-11 北京理工大学 Carbon fiber composite material surface critical refraction longitudinal wave excitation detection system and method

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