CN209861261U - Chip heat dissipation device - Google Patents
Chip heat dissipation device Download PDFInfo
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- CN209861261U CN209861261U CN201920376418.0U CN201920376418U CN209861261U CN 209861261 U CN209861261 U CN 209861261U CN 201920376418 U CN201920376418 U CN 201920376418U CN 209861261 U CN209861261 U CN 209861261U
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Abstract
The utility model provides a chip heat abstractor, including the cover body, heat-conducting part and heat-conducting plate, the upper surface laminating of heat-conducting plate is in on the internal surface of the cover body, the partial surface of heat-conducting part with the heat-conducting plate is laminated mutually, keeping away from of heat-conducting part the partial surface of heat-conducting plate is used for laminating with the radiating surface of the electronic components on the PCB board. The heat conducting part in the shielding case is attached to the heat conducting plate, and the heat conducting plate is attached to the cover body, so that heat can be quickly and uniformly transferred to all positions of the cover body, the purposes of uniform heat dissipation and quick heat dissipation are achieved, and the problems that the heat dissipation is uneven and the heat dissipation is slow due to the fact that the contact area of the heat conducting part and the cover body is limited and the heat conducting coefficient of the shielding case is low are solved.
Description
Technical Field
The utility model relates to an electronic components heat dissipation technical field especially relates to a chip heat abstractor.
Background
The development of electronic products tends to be towards the direction of lightness, thinness, high speed, multi-functional compatibility, high reliability and stability, various electronic components such as a CPU, an LED, a resistor, a capacitor, an inductor and the like are distributed in the electronic products, the electronic components are covered with shielding cases for preventing electromagnetic interference, and due to the trend of lightness, thinness, high speed and multi-functional development, a good heat dissipation effect of various electronic components with a large number must be obtained in a limited space limited by the shielding cases, so that the reliable and stable work of the electronic products is ensured.
In order to solve the problem of heat dissipation of electronic components, in the prior art, a heat conducting component is filled between the electronic components and a shielding case so as to conduct heat generated by the electronic components to the shielding case through the heat conducting component and further radiate the heat to the outside through the shielding case.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a chip heat abstractor is provided, it can make the heat dissipation in the shield cover even, and the heat dissipation is very fast.
In order to solve the technical problem, the utility model discloses a realize like this, a chip heat abstractor, including the cover body, heat-conducting part and heat-conducting plate, the upper surface laminating of heat-conducting plate is in on the internal surface of the cover body, heat-conducting part's partial surface with the heat-conducting plate laminating mutually, keeping away from of heat-conducting part partial surface of heat-conducting plate is used for laminating with the radiating surface of the electronic components on the PCB board.
Furthermore, the heat conducting parts are columnar, the number of the heat conducting parts is at least one, the number of the heat conducting plates is multiple, each heat conducting part is clamped between two adjacent heat conducting plates, and the upper end faces of the heat conducting parts are attached to the inner surface of the cover body.
Furthermore, the heat conducting component is columnar, a groove is formed in the upper end face of the heat conducting component, the heat conducting plate comprises a substrate and a convex column, the upper surface of the substrate is attached to the inner surface of the cover body, the convex column is arranged on the lower surface of the substrate, and the convex column is embedded into the groove.
Furthermore, the heat conducting components are columnar, the heat conducting plate comprises a bottom plate and convex walls, the upper surface of the bottom plate is attached to the inner surface of the cover body, the convex walls are arranged on the lower surface of the bottom plate, and each heat conducting component is clamped between two adjacent convex walls.
Furthermore, the heat conducting plate further comprises a suspension plate and an adherence plate, at least one suspension plate is arranged between the hollow areas of the adjacent convex walls and the convex wall and between the adjacent convex wall and the inner side surface of the cover body, and the upper surface of the suspension plate is attached to the bottom plate and extends towards the PCB; the bottom plate extends along the inner side wall of the cover body and then along the PCB to form the L-shaped wall pasting plate.
Furthermore, the periphery of the heat conducting plate is provided with a bending part which is bent downwards, and the outer side surface of the bending part is attached to the inner surface of the shielding cover.
Furthermore, the heat conducting plate is a copper part, an aluminum part, a graphite part, a nano copper carbon part or a nano aluminum carbon part.
Furthermore, the heat conducting component is a heat conducting silica gel pad, a heat conducting silicone grease piece, a graphite piece or a ceramic piece.
Compared with the prior art, the utility model, beneficial effect lies in: the utility model discloses the shield cover has included the cover body, heat-conducting part and heat-conducting plate, and heat-conducting part and heat-conducting plate are laminated mutually, and the heat-conducting plate is laminated mutually with the cover body again, like this, the heat just can be more quick, evenly pass to each position of the cover body to reach even heat dissipation, quick radiating purpose, avoided because heat-conducting part and the limited and shield cover body area of contact and shield cover coefficient of heat conduction low heat dissipation that brings uneven, the slow problem of heat dissipation.
Drawings
Fig. 1 is a schematic structural diagram of embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of embodiment 3 of the present invention;
fig. 4 is a schematic structural diagram of embodiment 4 of the present invention;
fig. 5 is a schematic structural diagram of embodiment 5 of the present invention;
fig. 6 is a schematic structural diagram of embodiment 6 of the present invention.
In the drawings, each reference numeral denotes:
1. a cover body; 2. a heat conductive member; 3. a heat conducting plate; 4. a bending section; 31. a substrate; 32. a convex column; 33. a base plate; 34. a convex wall; 35. a suspension plate; 36. pasting a wall plate; 100. a PCB board; 200. an electronic component.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
Example 1:
as shown in fig. 1, the present embodiment provides a chip heat dissipation apparatus, which includes a cover body 1, a heat conduction member 2 and a heat conduction plate 3, wherein an upper surface of the heat conduction plate 3 is attached to an inner surface of the cover body 1, a partial surface of the heat conduction member 2 is attached to the heat conduction plate 3, and a partial surface of the heat conduction member 2 away from the heat conduction plate 3 is used for attaching to a heat dissipation surface of an electronic component 200 on a PCB 100. Such a chip heat sink can provide uniform and fast heat dissipation for the electronic components 200 mounted on the PCB 100.
The heat conducting member 2 is preferably made of a material having good heat conducting properties, such as heat conducting silicone, heat conducting silicone grease, graphite, or ceramic, but other materials having good heat conducting properties may be used.
Heat-conducting plate 3 in this embodiment is one, laminate mutually with the internal surface of the cover body 1, the position of laminating can be the internal surface of the upper portion of the internal surface of the cover body 1 or including the whole internal surface including the lateral part internal surface, this embodiment laminates mutually with the upper portion of the internal surface of the cover body 1, heat-conducting part 2 is the column in this embodiment, because electronic components 200 laminates mutually with heat-conducting part 2, heat-conducting part 2 laminates mutually with heat-conducting plate 3, heat-conducting plate 3 laminates mutually with the cover body 1 again, and like this, the heat just can be more fast, each position of the cover body 1 is passed to uniformly, thereby reach even heat dissipation, quick radiating purpose, avoided because heat-conducting part 2 is limited with the contact area of the cover body 1 and the low heat dissipation unevenness that brings of shield cover. In this embodiment, the cover 1 is generally made of a metal material with good thermal conductivity and electromagnetic shielding function.
Example 2:
as shown in fig. 2, the present embodiment is different from embodiment 1 in that: the heat conducting component 2 is columnar, the number of the heat conducting components 2 is at least one (one, two, three, four or even more), the number of the heat conducting plates 3 is multiple, each heat conducting component 2 is clamped between two adjacent heat conducting plates 3, and the upper end face of each heat conducting component 2 is attached to the inner surface of the cover body 1. In this embodiment, the heat conducting member 2 is in contact with the cover body 1 and the heat conducting plate 3 at the same time, so as to achieve the purpose of uniform and fast heat dissipation.
Example 3:
as shown in fig. 3, the present embodiment is different from embodiment 1 in that: the heat conducting member 2 is in a column shape, a groove (not shown in the figure due to being embedded with a convex column 32 described below) is formed in the upper end face of the heat conducting member 2, the heat conducting plate 3 comprises a substrate 31 and the convex column 32, the upper surface of the substrate 31 is attached to the inner surface of the cover body 1, the convex column 32 is arranged on the lower surface of the substrate 31, and the convex column 32 is embedded into the groove. This embodiment is owing to set up projection 32 and recess, make heat-conducting plate 3 further strengthen with the area of contact of heat-conducting part 2, it is even to have reached the heat dissipation better, the faster purpose of heat dissipation, and, because mutual gomphosis of projection 32 and recess, make heat-conducting plate 3 and heat-conducting part 2 can remain stable contact throughout, can not be because of the vibrations of electronic product, electronic components 200's vibrations break away from the contact, so that influence conduction heat dissipation, also can not lead to breaking away from the contact because of the deformation of the cover body 1 because of the unexpected circumstances, this has guaranteed evenly to dispel the heat equally, fast heat dissipation.
Example 4:
as shown in fig. 4, the present embodiment is different from embodiment 1 in that: the heat conducting members 2 are columnar, the heat conducting plate 3 includes a bottom plate 33 and convex walls 34, the upper surface of the bottom plate 33 is attached to the inner surface of the cover body 1, the convex walls 34 are arranged on the lower surface of the bottom plate 33, and each heat conducting member 2 is sandwiched between two adjacent convex walls 34.
This embodiment is owing to set up protruding wall 34, make heat-conducting plate 3 and heat-conducting component 2's area of contact further increase, it is even better to have reached the heat dissipation, the faster purpose of heat dissipation, moreover, because protruding wall 34 and the mutual gomphosis of columnar heat-conducting component 2, make heat-conducting plate 3 and heat-conducting component 2 can remain stable contact throughout, can not be because of the vibrations of electronic product, the vibrations of electronic components 200 break away from the contact, so that influence conduction heat dissipation, also can not lead to breaking away from the contact because of the deformation of the cover body 1 because of the unexpected circumstances, this has guaranteed even heat dissipation equally, fast heat dissipation.
Example 5:
as shown in fig. 5, the present embodiment is different from embodiment 4 in that: the heat conducting plate 3 further comprises a suspension plate 35 and an adherence plate 36, at least one suspension plate 35 is arranged between the hollow areas of the adjacent convex walls 34 and between the adjacent convex walls 34 and the inner side surface of the cover body 1 (the number of the suspension plates 35 can be one, two or three, etc., according to actual requirements, and is not described in detail herein), and the upper surface of the suspension plate 35 is adhered to the bottom plate 33 and extends towards the PCB board 100; the bottom plate 33 extends along the inner side wall of the cover 1 and along the PCB board 100 to form an L-shaped wall board 36.
In the embodiment, the suspension plate 35 is arranged, so that heat can be further dissipated into the air; because the wall-attached plate 36 is arranged, the contact area between the heat conduction plate 3 and the heat conduction part 2 is further enlarged, and the purposes of uniform heat dissipation and quick heat dissipation are better achieved.
Example 6:
as shown in fig. 6, the present embodiment is different from embodiment 1 in that: all have the kink 4 of buckling downwards and the outside surface of kink 4 and the laminating of shield cover internal surface mutually around heat-conducting plate 3, just so make heat-conducting plate 3 and the binding face of the cover body 1 cover the upper portion and the lateral part of the internal surface of the cover body 1.
In the above embodiments 1 to 6, the heat conductive plate 3 is preferably made of copper, aluminum, graphite, nano copper carbon or nano aluminum carbon, or the like, which has good heat conductive properties; of course, the heat conducting plate 3 can also be made of other materials with good heat conducting performance; or, the heat conducting plate 3 is directly a regular or irregular metal radiator, and at the same time, the metal radiator can be subjected to surface treatment (surface treatment methods such as nano-carbon spraying, anodic treatment, electrophoresis, painting, and the like, but not limited to the above surface treatment methods) according to actual requirements.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. The chip heat dissipation device is characterized by comprising a cover body (1), a heat conduction part (2) and a heat conduction plate (3), wherein the upper surface of the heat conduction plate (3) is attached to the inner surface of the cover body (1), part of the surface of the heat conduction part (2) is attached to the heat conduction plate (3), and part of the surface of the heat conduction part (2) far away from the heat conduction plate (3) is used for being attached to the heat dissipation surface of an electronic component (200) on a PCB (100).
2. The chip heat sink according to claim 1, wherein the heat conducting member (2) has a cylindrical shape, the number of the heat conducting members (2) is at least one, the number of the heat conducting plates (3) is plural, each heat conducting member (2) is sandwiched between two adjacent heat conducting plates (3), and an upper end surface of the heat conducting member (2) is attached to an inner surface of the cover (1).
3. The heat sink according to claim 1, wherein the heat conducting member (2) is cylindrical, a groove is formed on an upper end surface of the heat conducting member (2), the heat conducting plate (3) comprises a substrate (31) and a protruding pillar (32), an upper surface of the substrate (31) is attached to an inner surface of the housing (1), the protruding pillar (32) is disposed on a lower surface of the substrate (31), and the protruding pillar (32) is embedded in the groove.
4. The heat sink according to claim 1, wherein the heat conducting members (2) are in a cylindrical shape, the heat conducting plate (3) includes a bottom plate (33) and convex walls (34), an upper surface of the bottom plate (33) is attached to an inner surface of the housing (1), the convex walls (34) are disposed on a lower surface of the bottom plate (33), and each heat conducting member (2) is sandwiched between two adjacent convex walls (34).
5. The chip heat sink according to claim 4, wherein the heat conducting plate (3) further comprises a suspension plate (35) and an attachment plate (36), at least one suspension plate (35) is disposed between the hollow areas of the adjacent protruding walls (34) and between the adjacent protruding walls (34) and the inner side of the cover body (1), and the upper surface of the suspension plate (35) is attached to the bottom plate (33) and extends toward the PCB (100); the bottom plate (33) extends along the inner side wall of the cover body (1) and the upper surface of the PCB (100) to form an L-shaped pasting plate.
6. The heat sink according to claim 1, wherein the heat conducting plate (3) has a bent portion (4) bent downward around the periphery thereof, and the outer surface of the bent portion (4) is attached to the inner surface of the shielding case.
7. The chip heat sink according to any of claims 1 to 6, wherein the thermally conductive plate (3) is a copper piece, an aluminum piece, a graphite piece, a nano-copper carbon piece, a nano-aluminum carbon piece or a ceramic piece.
8. The chip heat sink according to any one of claims 1 to 6, wherein the heat conducting member (2) is a heat conducting silicone pad, a heat conducting silicone grease member, a graphite member, or a ceramic member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920376418.0U CN209861261U (en) | 2019-03-22 | 2019-03-22 | Chip heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920376418.0U CN209861261U (en) | 2019-03-22 | 2019-03-22 | Chip heat dissipation device |
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| Publication Number | Publication Date |
|---|---|
| CN209861261U true CN209861261U (en) | 2019-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920376418.0U Active CN209861261U (en) | 2019-03-22 | 2019-03-22 | Chip heat dissipation device |
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| CN (1) | CN209861261U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021253472A1 (en) * | 2020-06-19 | 2021-12-23 | 昆山达卡特电子有限公司 | Waterproof electronic core pcb |
-
2019
- 2019-03-22 CN CN201920376418.0U patent/CN209861261U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021253472A1 (en) * | 2020-06-19 | 2021-12-23 | 昆山达卡特电子有限公司 | Waterproof electronic core pcb |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A chip heat dissipation device Effective date of registration: 20220623 Granted publication date: 20191227 Pledgee: Shenzhen small and medium sized small loan Co.,Ltd. Pledgor: PROVENCE TECHNOLOGY (SHENZHEN) Co.,Ltd. Registration number: Y2022440020106 |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 7a, Seaview Plaza, 18 Taizi Road, Shekou, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Aixin Environmental Protection Materials (Shenzhen) Co.,Ltd. Address before: 7a, Seaview Plaza, 18 Taizi Road, Shekou, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: PROVENCE TECHNOLOGY (SHENZHEN) Co.,Ltd. |