CN209844494U - Insulating bus duct - Google Patents

Insulating bus duct Download PDF

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Publication number
CN209844494U
CN209844494U CN201921116598.5U CN201921116598U CN209844494U CN 209844494 U CN209844494 U CN 209844494U CN 201921116598 U CN201921116598 U CN 201921116598U CN 209844494 U CN209844494 U CN 209844494U
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CN
China
Prior art keywords
bus duct
duct body
fixing
conductive copper
copper bar
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Application number
CN201921116598.5U
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Chinese (zh)
Inventor
朱陈根
朱建新
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Jiangsu Zhongyuan General Electrical And Mechanical Co Ltd
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Jiangsu Zhongyuan General Electrical And Mechanical Co Ltd
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Priority to CN201921116598.5U priority Critical patent/CN209844494U/en
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Publication of CN209844494U publication Critical patent/CN209844494U/en
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Abstract

The utility model relates to a technical field of electric power engineering's circuit equipment specifically is an insulating type bus duct, including conductive copper bar and busbar body, the inside bottom of busbar body is equipped with the recess, and conductive copper bar passes through recess and busbar body fixed connection. The utility model has the advantages that the plurality of heat dissipation holes are arranged on the surfaces of the bus duct body and the upper cover plate, and the inside of each heat dissipation hole is embedded with the tiny heat conduction wires, so that the heat generated inside the bus duct can be effectively dissipated; and by adopting the magnesium-aluminum alloy in the bus duct body, the epoxy polyester powder is sprayed on the surface of the bus duct body, and the semiconductor shielding layer is arranged to insulate the inside of the bus duct, so that the inside of the bus duct body is prevented from rusting, and the repair cost is reduced to a certain extent.

Description

Insulating bus duct
Technical Field
The utility model relates to an electric power engineering technical field specifically is an insulating type bus duct.
Background
The bus duct is a closed metal device formed from copper and aluminium bus posts, and is used for distributing large power for every element of dispersion system. Wire and cable have been increasingly replaced in indoor low voltage power transmission mains engineering projects. The bus duct is produced as a novel distribution wire, and compared with the traditional cable, the bus duct fully embodies the superiority thereof in large current transmission; most of the existing bus ducts do not have an insulation function or have poor insulation effect, so that the bus ducts are easy to short circuit, the operation of users is influenced, and the input cost is increased.
SUMMERY OF THE UTILITY MODEL
Technical problem
To sum up, the utility model provides an insulating type bus duct to solve the bus duct and do not have insulating function or insulating poor problem of effect.
(II) technical scheme
The utility model provides an insulated bus duct, which comprises a conductive copper bar and a bus duct body, wherein the bottom end inside the bus duct body is provided with a groove, the conductive copper bar is fixedly connected with the bus duct body through the groove,
the conductive copper bar comprises an upper fixing bundle, a side fixing bundle and a partition plate, the bottom end of the conductive copper bar is fixedly connected with the upper fixing bundle, the side surface of the conductive copper bar is fixedly connected with the side fixing bundle, the lower end of the upper fixing bundle is uniformly and fixedly provided with the partition plate, and the side fixing bundle is fixedly connected with the upper fixing bundle;
the utility model provides a bus duct body, including bus duct body, bottom plate, louvre, socket, jack, fixed plate, gim peg, semiconductor shielding layer, the side of bus duct body is inlayed and is had the louvre, the bottom fixed mounting of bus duct body has the bottom plate, the top fixed mounting of bus duct body has the upper cover plate, the upper cover plate is equipped with a plurality of louvre, the fixed surface installation socket of upper cover plate, the surface of socket is equipped with the jack, the positive fixed mounting of bus duct body has the fixed plate, fixed mounting has the gim peg on the fixed plate, the bottom fixed surface of bus duct body installs semiconductor shielding layer.
Preferably, the partition plates are uniformly distributed among the conductive copper bars, and rubber is embedded in the surface of each partition plate.
Preferably, the busbar groove body is made of magnesium-aluminum alloy, and epoxy polyester powder is sprayed on the surface of the busbar groove body.
Preferably, the upper fixing binder and the side fixing binder are made of polytetrafluoroethylene materials.
Preferably, the semiconducting shield is comprised of a conductive polymer composite.
Preferably, the surface of the fixing plate is made of conductive aluminum alloy metal.
Preferably, the heat dissipation holes are provided with a plurality of heat dissipation holes, and fine heat conduction wires are embedded in each heat dissipation hole.
(III), beneficial effect:
1) the utility model discloses a be equipped with a plurality of louvre on the surface of generating line cell body and upper cover plate, and the inside of louvre is inlayed and is had tiny heat conduction silk, can effectively dispel the heat to the inside heat that produces of bus duct.
2) Secondly, through adopting matter magnalium at the busbar body, its surface sprays has epoxy polyester powder and is equipped with the semiconductor shield layer and insulates to the bus duct is inside, avoids the inside rust of busbar body simultaneously, has reduced repair cost to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall connection of the present invention.
Fig. 2 is a schematic connection diagram of the bus duct body of the present invention.
Fig. 3 is a schematic view of the connection of the middle conductive copper bar of the present invention.
In the figure: 1-upper cover plate, 2-lower cover plate, 3-conductive copper bar, 4-heat dissipation hole, 5-socket, 6-jack, 7-fixing plate, 8-fixing bolt, 9-semiconductor shielding layer, 10-upper fixing tie, 11-side fixing tie, 12-partition plate, 13-bus bar groove body and 14-groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example (b):
referring to fig. 1 to 3, an insulated bus duct includes a conductive copper bar 3 and a bus duct body 13, a groove 14 is disposed at the bottom end of the inside of the bus duct body 13, and the conductive copper bar 3 is fixedly connected to the bus duct body 13 through the groove 14: the conductive copper bar 3 comprises an upper fixing bundle 10, a side fixing bundle 11 and a partition plate 12, wherein the bottom end of the conductive copper bar 3 is fixedly connected with the upper fixing bundle 10, the side surface of the conductive copper bar 3 is fixedly connected with the side fixing bundle 11, the partition plate 12 is uniformly and fixedly installed at the lower end of the upper fixing bundle 10, and the side fixing bundle 11 is fixedly connected with the upper fixing bundle 10;
bus duct body 13 includes upper cover plate 1, lower cover plate 2, louvre 4, socket 5, jack 6, fixed plate 7, gim peg 8, semiconductor shielding layer 9, bus duct body 13's side is inlayed and is had louvre 4, bus duct body 13's bottom fixed mounting has lower cover plate 2, bus duct body 13's top fixed mounting has upper cover plate 1, upper cover plate 1 is equipped with a plurality of louvre 4, upper cover plate 1's fixed surface installation socket 5, socket 5's surface is equipped with jack 6, bus duct body 13's positive fixed mounting has fixed plate 7, fixed mounting has gim peg 8 on the fixed plate 7, bus duct body 13's bottom fixed surface installs semiconductor shielding layer 9. Wherein, baffle 12 evenly distributed has rubber between the copper bar 3, and the surface mosaic of every baffle 12, can insulate it again when keeping apart copper bar 3.
The bus duct body 13 is made of magnesium-aluminum alloy, and epoxy polyester powder is sprayed on the surface of the bus duct body, so that the bus duct body 13 can be effectively prevented from being corroded.
Wherein, the upper fixing binder 10 and the side fixing binder 11 are made of polytetrafluoroethylene materials, which can prevent the surfaces of the upper fixing binder 10 and the side fixing binder 11 from being corroded due to long-term fixation.
The semiconductor shielding layer 9 is made of a conductive polymer composite material, and can effectively conduct electricity to the conductive copper bar 3.
The surface of the fixing plate 7 is made of conductive aluminum alloy, and the conductive copper bar 3 in the bus duct body 13 can be conducted to a certain degree.
Wherein, louvre 4 is equipped with a plurality of, and it has tiny heat conduction silk to inlay in every louvre 4, can carry out more effectual heat dissipation to the heat of the inside production of busbar groove body 13.
The working principle is as follows: when the bus bar is operated, heat generated by the conductive copper bar 3 in the bus bar groove body 13 is dissipated through the heat dissipation holes 4 on the periphery, and the heat in the bus bar groove body is more effectively dissipated by transmitting the heat to the heat conduction wires in the heat dissipation holes 4; when inside circular telegram, keep apart between conductive copper bar 3 through the baffle 12 that inlays and have rubber, insulate it, the semiconductor shielding layer 9 is conducted electrical insulation to conductive copper bar 3's bottom simultaneously, reaches good insulating effect through the multilayer insulation.

Claims (7)

1. The utility model provides an insulating type busway, includes conductive copper bar (3) and busbar body (13), the inside bottom of busbar body (13) is equipped with recess (14), conductive copper bar (3) are through recess (14) and busbar body (13) fixed connection, its characterized in that:
the conductive copper bar (3) comprises an upper fixing bundle (10), side fixing bundles (11) and a partition plate (12), the bottom end of the conductive copper bar (3) is fixedly connected with the upper fixing bundle (10), the side surface of the conductive copper bar (3) is fixedly connected with the side fixing bundles (11), the partition plate (12) is uniformly and fixedly installed at the lower end of the upper fixing bundle (10), and the side fixing bundles (11) are fixedly connected with the upper fixing bundle (10);
the bus duct body (13) comprises an upper cover plate (1), a lower cover plate (2), heat dissipation holes (4), a socket (5), jacks (6), a fixing plate (7), fixing bolts (8) and a semiconductor shielding layer (9), the side surface of the bus duct body (13) is embedded with heat dissipation holes (4), the bottom end of the bus duct body (13) is fixedly provided with a lower cover plate (2), an upper cover plate (1) is fixedly arranged at the top of the bus duct body (13), the upper cover plate (1) is provided with a plurality of heat dissipation holes (4), a socket (5) is fixedly arranged on the surface of the upper cover plate (1), a jack (6) is arranged on the surface of the socket (5), a fixing plate (7) is fixedly arranged on the front surface of the bus duct body (13), a fixing bolt (8) is fixedly arranged on the fixing plate (7), and a semiconductor shielding layer (9) is fixedly arranged on the bottom surface of the bus duct body (13).
2. An insulated busway according to claim 1, wherein: the partition plates (12) are uniformly distributed among the conductive copper bars (3), and rubber is embedded in the surface of each partition plate.
3. An insulated busway according to claim 1, wherein: the bus duct body (13) is made of magnesium-aluminum alloy, and epoxy polyester powder is sprayed on the surface of the bus duct body.
4. An insulated busway according to claim 1, wherein: the upper fixing tie (10) and the side fixing tie (11) are made of polytetrafluoroethylene materials.
5. An insulated busway according to claim 1, wherein: the semiconducting shield (9) is composed of a conductive polymer composite.
6. An insulated busway according to claim 1, wherein: the surface of the fixing plate (7) is made of conductive aluminum alloy metal.
7. An insulated busway according to claim 1, wherein: the heat dissipation holes (4) are provided with a plurality of heat dissipation holes, and fine heat conduction wires are inlaid in each heat dissipation hole (4).
CN201921116598.5U 2019-07-17 2019-07-17 Insulating bus duct Active CN209844494U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921116598.5U CN209844494U (en) 2019-07-17 2019-07-17 Insulating bus duct

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921116598.5U CN209844494U (en) 2019-07-17 2019-07-17 Insulating bus duct

Publications (1)

Publication Number Publication Date
CN209844494U true CN209844494U (en) 2019-12-24

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CN201921116598.5U Active CN209844494U (en) 2019-07-17 2019-07-17 Insulating bus duct

Country Status (1)

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CN (1) CN209844494U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117656606A (en) * 2024-01-30 2024-03-08 福建省晋江市泗农建材有限公司 High-resistance anti-reflection non-radiation ceramic heat-insulation composite board and production process thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117656606A (en) * 2024-01-30 2024-03-08 福建省晋江市泗农建材有限公司 High-resistance anti-reflection non-radiation ceramic heat-insulation composite board and production process thereof

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