CN209785893U - wafer cleaning equipment - Google Patents
wafer cleaning equipment Download PDFInfo
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- CN209785893U CN209785893U CN201921033242.5U CN201921033242U CN209785893U CN 209785893 U CN209785893 U CN 209785893U CN 201921033242 U CN201921033242 U CN 201921033242U CN 209785893 U CN209785893 U CN 209785893U
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Abstract
The utility model provides a wafer cleaning equipment, include: the liquid tank is used for containing cleaning liquid so as to immerse the wafer to be cleaned in the liquid tank containing the cleaning liquid for cleaning; the liquid inlet pipe is connected with the liquid tank and used for guiding the cleaning liquid into the liquid tank; the first water resistance meter is at least partially arranged in the liquid tank and is used for measuring the water resistance value R1 of the cleaning liquid in the liquid tank; and the control unit is respectively connected with the first water resistance meter and the liquid inlet pipe, and can control the connection/disconnection of the liquid inlet pipe according to the water resistance value R1, so that the quantification of cleaning time is realized, the waste of cleaning liquid is avoided, and the cleanliness of the wafer can be ensured.
Description
Technical Field
The utility model relates to a semiconductor technology field, more specifically say, the utility model relates to a wafer cleaning equipment.
Background
In the prior art, when a wafer is cleaned by a wafer cleaning device, chemical liquid medicine on the surface of the wafer is removed by flushing the cleaning liquid, the cleaning time of the device is mostly set according to the experience of an operator, and the set time is generally longer in order to clean the wafer, so that the waste of the cleaning liquid is easily caused; further, since there is no quantitative setting, when wafers of different numbers are simultaneously cleaned, there is a possibility that a problem of incomplete cleaning of the wafers may occur due to improper grasping of the cleaning time.
therefore, there is a need for an improved wafer cleaning apparatus.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems in the prior art, a wafer cleaning apparatus capable of quantifying a cleaning time is provided.
The utility model provides a wafer cleaning equipment, include: the liquid tank is used for containing cleaning liquid so as to immerse the wafer to be cleaned in the liquid tank containing the cleaning liquid for cleaning; the liquid inlet pipe is connected with the liquid tank and used for guiding the cleaning liquid into the liquid tank; the first water resistance meter is at least partially arranged in the liquid tank and is used for measuring the water resistance value R1 of the cleaning liquid in the liquid tank; and the control unit is respectively connected with the first water resistance meter and the liquid inlet pipe and can control the connection/disconnection of the liquid inlet pipe according to the water resistance value R1.
in the preferred technical scheme, whether the cleaning is continued is determined by taking the water resistance value R1 of the cleaning liquid as reference, so that the quantification of the cleaning time is realized.
the utility model discloses an among the preferred technical scheme, still include the fluid-discharge tube, the fluid-discharge tube is connected in order to be used for the waste liquid discharge liquid groove that will wash the wafer production with the cistern.
The utility model discloses an among the preferred technical scheme, the control unit have be used for to first water resistance meter measured data carry out the treater of handling and with treater electric connection to according to the processing result of treater, the automatically controlled switch that control feed liquor pipe intercommunication/cut.
The utility model discloses an among the preferred technical scheme, the control unit can control the intercommunication/of feed liquor pipe according to water resistance value R1 and default R and cut:
if R1 is less than R, the liquid inlet pipe is in a communicated state;
If R1 is equal to R, the liquid inlet pipe is in a cut-off state;
wherein the preset value R reflects the water resistance value of the pure cleaning liquid.
In the preferred embodiment, the on-off of the liquid inlet pipe is controlled according to the comparison result by comparing R1 with R, and since the water resistance value of the cleaning liquid is reduced when the chemical liquid exists in the cleaning liquid, it can be determined that the chemical liquid has been cleaned when the water resistance value R1 of the cleaning liquid is equal to the water resistance value R of the pure cleaning liquid.
the utility model discloses an among the preferred technical scheme, wafer cleaning equipment still includes the second water resistance meter, and the second water resistance meter is installed in the inlet pipe at least part for measure the water resistance value R2 of the interior washing liquid of inlet pipe.
the utility model discloses an among the preferred technical scheme, set for threshold value resistance R3, the control unit can be according to the intercommunication/the truncation of water resistance R1, water resistance R2 and threshold value resistance R3 control feed liquor pipe:
If R1-R2I is greater than R3, the liquid inlet pipe is in a communicated state;
If R1-R2 < R3, the liquid inlet pipe is in a cut-off state.
In the preferred embodiment, a threshold resistance value R3 is set, and an absolute value of a difference between R1 and R2 is compared with the threshold resistance value R3, so as to provide a threshold range to determine whether the wafer has been cleaned; because the cleaning liquid used in the actual process is difficult to be absolutely pure, that is, usually, R is not equal to R2, comparing R1 with R2 avoids errors which may be generated when R1 is compared with R, and in addition, setting the threshold resistance value R3 has the function of giving the allowable deviation between R1 and R2, that is, when | R1-R2| < R3, the wafer is judged to be cleaned, and the method is easier to realize compared with the technical scheme of capturing the moment when the numerical values of R1 and R2 are equal and carrying out industrial control.
The utility model discloses an among the preferred technical scheme, include:
And the third water resistance meter is at least partially arranged in the liquid discharge pipe and is used for measuring the water resistance value R4 in the liquid discharge pipe.
The utility model discloses an among the preferred technical scheme, the control unit can be according to the intercommunication/the truncation of water resistance R2 and water resistance R4 control feed liquor pipe:
if R2 is more than R4, the liquid inlet pipe is in a communicated state;
And if R2 is equal to R4, the liquid inlet pipe is in a cut-off state.
The utility model discloses an among the preferred technical scheme, be equipped with the valve on the feed liquor pipe, the valve can be opened/closed under the control of the control unit.
in the preferred technical solution of the present invention, the control unit can update the wafer cleaning process time according to the water resistance value R1.
In the better technical scheme, the control unit can update the process time for cleaning the wafer according to the water resistance value R1, and the energy consumption during wafer cleaning is reduced.
drawings
Fig. 1 is a schematic structural diagram of a wafer cleaning apparatus according to a preferred embodiment of the present invention.
description of the drawings: 1-a liquid bath; 2-liquid inlet pipe, 21-valve; 3-a liquid discharge pipe; 4-a first water resistance meter; 5-a wafer; 6-a second water resistance meter; 7-a third water resistance meter; a holder-8.
Detailed Description
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these technical solutions are only used for explaining the technical principles of the present invention, and are not intended to limit the scope of the present invention. And can be modified as needed by those skilled in the art to suit particular applications.
It should be noted that in the description of the preferred embodiments of the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", and the like, which indicate directions or positional relationships, are based on the directions or positional relationships shown in the drawings, which are for convenience of description only, and do not indicate or imply that the devices or components must have specific orientations, be constructed and operated in specific orientations, and therefore, should not be construed as limiting the present invention.
Fig. 1 shows a wafer cleaning apparatus according to a preferred embodiment of the present invention, which includes: a tank 1 for containing a washing liquid, typically deionized water; the cleaning device comprises a liquid inlet pipe 2 connected with a liquid tank 1 and used for introducing cleaning liquid into the liquid tank 1, and a liquid outlet pipe 3 connected with the liquid tank 1 and used for discharging waste liquid generated by cleaning a wafer 5 out of the liquid tank 1, wherein the cleaning liquid washes the wafer 5 through the liquid inlet pipe 2 and is discharged through the liquid outlet pipe 2 together with chemical liquid on the surface of the wafer 5, specifically, the wafer cleaning device can wash the wafer 5 by the dilution effect of the cleaning liquid, and can also utilize an additional cleaning device, such as a cleaning brush, as assistance to accelerate the separation of the wafer 5 and the chemical liquid attached to the surface and realize the rapid cleaning of the wafer 5; the wafer cleaning apparatus further includes a first water resistance meter 4 installed in the liquid tank 1, and a control unit (not shown) connected to the first water resistance meter 4 and the liquid inlet pipe 2, specifically, as long as the function of measuring the water resistance value in the liquid tank 1 can be achieved, the first water resistance meter 4 may be disposed partially in the liquid tank 1.
The control unit has a processor (not shown) for processing the measurement data of the first water resistance meter 4 and an electronic control switch (not shown) electrically connected to the processor, so as to control the connection/disconnection of the liquid inlet pipe 2 according to the processing result of the processor, the water resistance value measured by the first water resistance meter 4 is R1, a water resistance value reflecting pure cleaning liquid, i.e. a preset value R, is preset, and since the chemical liquid is dissolved in the cleaning liquid, the water resistance value of the cleaning liquid is reduced, when R1 ═ R, it can be determined that the chemical liquid does not exist in the cleaning liquid, i.e. the wafer 5 is cleaned, and similarly, when R1 < R, i.e. it is determined that the wafer 5 needs to be cleaned continuously, specifically, the control unit can control the connection/disconnection of the liquid inlet pipe 2 according to the water resistance value R1 and the preset value R: if R1 is less than R, the liquid inlet pipe 2 is in a communicated state; if R1 is R, make feed liquor pipe 2 be in the state of cuting, quantify wafer 5 cleaning time through the comparison of water resistance, the effectual waste of having prevented the washing liquid and the emergence of the unclean problem of washing, in addition, this kind of quantization mode is also suitable for when wasing multi-disc wafer 5 simultaneously, only need control the change of water resistance and need not to consider other variables.
It should be noted that, the water resistance value in the technical solution provided in this embodiment may also be a resistance value, or may also be other parameters such as a conductivity value and the like reflecting conductivity performance, such simple substitutions should be regarded as equivalents, and other preferred embodiments of this embodiment still use the water resistance value as a quantization basis for presentation, but this is not a limitation to the technical solution of this application.
Preferably, the wafer cleaning equipment further comprises a second water resistance meter 6 for measuring the water resistance value R2 of the cleaning liquid in the liquid inlet pipe 2, and the second water resistance meter 6 is at least partially arranged on the liquid inlet pipe 2.
specifically, in this preferred technical solution, a threshold resistance value R3 is set, and the control unit can control the connection/disconnection of the liquid inlet pipe according to the water resistance value R1, the water resistance value R2 and the threshold resistance value R3:
If R1-R2I is greater than R3, the liquid inlet pipe is in a communicated state;
If R1-R2 < R3, the liquid inlet pipe is in a cut-off state.
The setting of the threshold value R3 gives a threshold range to confirm whether the wafer is cleaned; because the cleaning liquid used in the actual process is difficult to be absolutely pure, that is, usually, R is not equal to R2, comparing R1 with R2 avoids errors which may be generated when R1 is compared with R, and in addition, setting the threshold resistance value R3 has the function of giving the allowable deviation between R1 and R2, that is, when | R1-R2| < R3, the wafer is judged to be cleaned, and the method is easier to realize compared with the technical scheme of capturing the moment when the numerical values of R1 and R2 are equal and carrying out industrial control.
Preferably, the wafer cleaning apparatus further comprises: a third water resistance meter 7 mounted at least partly in the discharge pipe 3 for measuring a water resistance value R4 in the discharge pipe 3.
specifically, the control unit can control the communication/cut-off of the liquid inlet pipe according to the water resistance value R2 and the water resistance value R4: if R2 is more than R4, the liquid inlet pipe is in a communicated state; and if R2 is equal to R4, the liquid inlet pipe is in a cut-off state.
In the preferred technical scheme, a specific scheme that the water resistance meter is arranged at different positions is given.
Preferably, a valve 21 is arranged on the liquid inlet pipe 2, and the valve 21 can be opened/closed under the control of the control unit, that is, the on/off of the valve 21 is controlled by the electric control switch.
preferably, the drain pipe 3 is provided with a drain valve 31, the drain valve 31 can be opened/closed under the control of the control unit, and the electric control switch simultaneously controls the on/off of the drain valve 31.
Specifically, when the wafer cleaning device simply relies on the washing of the cleaning solution to clean the wafer, the drain valve 31 may be in a normally open state; when other cleaning devices (not shown) are arranged in the wafer cleaning equipment, the electronic switch controls the drain valve 31 to be switched to a closed state when the cleaning devices clean, and after the cleaning devices finish acting, the electronic switch controls the drain valve 31 to be switched to an open state to drain liquid.
Preferably, the control unit is capable of updating the process time for cleaning the wafer 5 according to the water resistance value R1.
in the preferred technical solution, the control unit can update the process time for cleaning the wafer 5 according to the water resistance value R1, where the process mentioned here is the cleaning action of other cleaning devices configured in the wafer cleaning equipment to the wafer 5 except for rinsing the cleaning solution, such as the cleaning brush mentioned above, when the water resistance value R1 reaches the target water resistance value, the control unit determines that the wafer 5 has been cleaned, and at this time, the control unit sends an instruction to stop the cleaning action of the cleaning device, so that the energy consumption of the cleaning device is saved, and the cost is reduced.
Preferably, the wafer cleaning apparatus further comprises a holder 8 for holding the wafer 5 to maintain the position of the wafer 5 in the cleaning solution, in the preferred embodiment, the holder 8 is a tray, and in some alternative embodiments, the holding of the wafer 5 may also be realized by a clamp, such as a robot.
Claims (10)
1. a wafer cleaning apparatus, comprising:
The liquid tank is used for containing cleaning liquid so as to immerse the wafer to be cleaned in the liquid tank containing the cleaning liquid for cleaning;
The liquid inlet pipe is connected with the liquid tank and used for guiding the cleaning liquid into the liquid tank;
The first water resistance meter is at least partially arranged in the liquid tank and is used for measuring the water resistance value R1 of the cleaning liquid in the liquid tank; and
And the control unit is respectively connected with the first water resistance meter and the liquid inlet pipe and can control the connection/disconnection of the liquid inlet pipe according to the water resistance value R1.
2. The wafer cleaning apparatus according to claim 1, further comprising a drain connected to the liquid bath for draining waste liquid generated by cleaning the wafer out of the liquid bath.
3. The wafer cleaning apparatus as claimed in claim 2, wherein the control unit has a processor for processing the measurement data of the first water resistance meter and an electrically controlled switch electrically connected to the processor for controlling the connection/disconnection of the liquid inlet pipe according to the processing result of the processor.
4. The wafer cleaning apparatus according to claim 3, wherein the control unit is capable of controlling the connection/disconnection of the liquid inlet pipe according to a water resistance value R1 and a preset value R:
If R1 is less than R, the liquid inlet pipe is in a communicated state;
If R1 is equal to R, the liquid inlet pipe is in a cut-off state;
Wherein the preset value R reflects the water resistance value of the pure cleaning liquid.
5. The wafer cleaning apparatus of claim 3, further comprising:
and the second water resistance meter is at least partially arranged in the liquid inlet pipe and is used for measuring the water resistance R2 of the cleaning liquid in the liquid inlet pipe.
6. the wafer cleaning apparatus as claimed in claim 5, wherein a threshold value R3 is set, and the control unit can control the connection/disconnection of the liquid inlet pipe according to the water resistance R1, the water resistance R2 and the threshold value R3:
If R1-R2I is greater than R3, the liquid inlet pipe is in a communicated state;
if R1-R2 < R3, the liquid inlet pipe is in a cut-off state.
7. The wafer cleaning apparatus of claim 5, comprising:
and the third water resistance meter is at least partially arranged in the liquid discharge pipe and is used for measuring the water resistance value R4 in the liquid discharge pipe.
8. The wafer cleaning apparatus as claimed in claim 7, wherein the control unit is capable of controlling the connection/disconnection of the liquid inlet pipe according to a water resistance value R2 and a water resistance value R4:
If R2 is more than R4, the liquid inlet pipe is in a communicated state;
and if R2 is equal to R4, the liquid inlet pipe is in a cut-off state.
9. The wafer cleaning apparatus according to any one of claims 2 to 8, wherein a valve is provided on the liquid inlet pipe, and the valve can be opened/closed under the control of the control unit.
10. The wafer cleaning apparatus according to any one of claims 1 to 8, wherein the control unit is capable of updating the process time for wafer cleaning according to the water resistance value R1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921033242.5U CN209785893U (en) | 2019-07-03 | 2019-07-03 | wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921033242.5U CN209785893U (en) | 2019-07-03 | 2019-07-03 | wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209785893U true CN209785893U (en) | 2019-12-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921033242.5U Active CN209785893U (en) | 2019-07-03 | 2019-07-03 | wafer cleaning equipment |
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| CN (1) | CN209785893U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113644009A (en) * | 2021-07-15 | 2021-11-12 | 长江存储科技有限责任公司 | Cleaning liquid generation method and device and cleaning system control method and device |
-
2019
- 2019-07-03 CN CN201921033242.5U patent/CN209785893U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113644009A (en) * | 2021-07-15 | 2021-11-12 | 长江存储科技有限责任公司 | Cleaning liquid generation method and device and cleaning system control method and device |
| CN113644009B (en) * | 2021-07-15 | 2023-11-07 | 长江存储科技有限责任公司 | Cleaning liquid generating method and device and cleaning system control method and device |
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