CN209784266U - Split type ultrasonic flaw detection device - Google Patents
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- CN209784266U CN209784266U CN201920528592.2U CN201920528592U CN209784266U CN 209784266 U CN209784266 U CN 209784266U CN 201920528592 U CN201920528592 U CN 201920528592U CN 209784266 U CN209784266 U CN 209784266U
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Abstract
The utility model provides a split type ultrasonic flaw detection device, including data acquisition end and system processing end, the data acquisition end includes electric connection's in proper order first wireless communication module, be used for controlling the digital logic control module that produces ultrasonic signal, be used for to the data processing module that ultrasonic signal handled, be used for the data transceiver module of sending or receiving of ultrasonic signal and be used for sending ultrasonic signal's ultrasonic probe, digital logic control module, data processing module and data transceiver module electric connection each other; the system processing end comprises a second wireless communication module and a central processing unit, wherein the second wireless communication module is communicated with the first wireless communication module, and the central processing unit is electrically connected with the second wireless communication module and is used for processing data information sent by the data acquisition end. The utility model discloses enlarged split type ultrasonic flaw detection device's detection range, improved work efficiency and stability.
Description
Technical Field
The utility model relates to an industry field of detecting a flaw, concretely relates to split type ultrasonic flaw detection device.
Background
Ultrasonic flaw detection is a method for detecting the flaw of a part by using the characteristic that ultrasonic energy penetrates into the depth of a metal material and is reflected at the edge of an interface when the ultrasonic energy enters another section from the section. At present, because the ultrasonic flaw detector works in a high-temperature state for a long time, the sensitivity of the ultrasonic probe is reduced during flaw detection, so that the accuracy of acquired data is low, and the service life of the ultrasonic flaw detector is even influenced.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides an improve life, improve detection efficiency and enlarge detection range's split type ultrasonic flaw detection device solves the technical problem that above-mentioned exists, specifically adopts following technical scheme to realize.
the utility model provides a split type ultrasonic flaw detection device, which comprises a data acquisition end and a system processing end;
The data acquisition end comprises a first wireless communication module, a digital logic control module, a data processing module, a data transceiving module and an ultrasonic probe, wherein the first wireless communication module, the digital logic control module, the data processing module, the data transceiving module and the ultrasonic probe are sequentially and electrically connected, the digital logic control module is used for controlling the generation of ultrasonic signals, the data processing module is used for processing the ultrasonic signals, the data transceiving module is used for transmitting or receiving the ultrasonic signals, the ultrasonic probe is used for transmitting the ultrasonic signals, the data processing module is respectively and electrically connected with the digital logic control module and the data transceiving module, the data transceiving module is connected with the ultrasonic probe module through an ultrasonic probe connector, and the;
The system processing end comprises a second wireless communication module and a central processing unit, the second wireless communication module is communicated with the first wireless communication module, the central processing unit is connected with the second wireless communication module, and the central processing unit is used for processing data information sent by the data acquisition end.
as a further improvement of the above technical solution, the ultrasonic probe is detachably connected to the ultrasonic probe connector, and the ultrasonic probe connector further includes at least one connection channel for conducting the ultrasonic signal.
As a further improvement of the above technical solution, the data transceiver module includes an ultrasound transmitting port, an ultrasound receiving port, and a control port, the ultrasound transmitting port is connected to the ultrasound probe connector, the ultrasound receiving port is connected to the data processing module, and the control port is connected to the digital logic control module.
As a further improvement of the above technical solution, the data transceiver module employs a MAX14808 chip.
as a further improvement of the above technical solution, the data processing module includes an amplifying unit for amplifying the received ultrasonic signal, a filtering unit for filtering the ultrasonic signal, and a converting unit for converting the ultrasonic signal into a digital signal.
as a further improvement of the above technical solution, the data processing module employs an AD9278 chip.
As a further improvement of the above technical solution, the digital logic control module employs a 10AX027F34 chip, and the first wireless communication module and the second wireless communication module both employ MT7268 chips.
As a further improvement of the above technical solution, the system processing end further includes a data storage module electrically connected to the central processing unit, and the data storage module is configured to store the ultrasonic image and the data information obtained through processing by the central processing unit.
As a further improvement of the above technical solution, the central processing unit employs an SOM-3567 chip for converting the ultrasonic signal into an ultrasonic image, and performing image quality processing and image analysis processing on the ultrasonic image.
as a further improvement of the above technical solution, the system processing terminal further includes a touch screen electrically connected to the central processing unit, and the touch screen is configured to acquire a touch signal and display test information, and send a test instruction to the data acquisition terminal through the second wireless communication module.
The utility model discloses a split type ultrasonic inspection device, will the data acquisition end with system processing end components of a whole that can function independently sets up, has effectively reduced split type ultrasonic inspection device's whole calorific capacity has ensured ultrasonic probe's detectivity has improved split type ultrasonic inspection device data acquisition's accuracy has also improved split type ultrasonic inspection device's life. Digital logic control module only does simple signal control and handles, data transceiver module passes through ultrasonic probe connector with the detachable connection of ultrasonic probe has improved split type ultrasonic inspection device's installation and maintenance efficiency, the data acquisition end with system's processing end passes through first wireless communication module with communication connection is established to the second wireless communication module, can enlarge split type ultrasonic inspection device's detection range, reduces the manual measurement's of on-the-spot detection work load, has improved work efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a structural block diagram of the split ultrasonic flaw detection device of the present invention;
FIG. 2 is a block diagram of the system processing end of the present invention;
Fig. 3 is a circuit structure diagram of the ultrasonic probe connector of the present invention;
Fig. 4 is a circuit structure diagram of the data transceiver module of the present invention;
Fig. 5 is a circuit structure diagram of the data processing module of the present invention;
Fig. 6 is an application schematic diagram of the split ultrasonic flaw detection apparatus of the present invention.
Description of the main element symbols:
10-split ultrasonic flaw detection device; 100-a data acquisition end; 110-a first wireless communication module; 120-digital logic control module; 130-a data processing module; 131-a first port; 132-a second port; 140-a data transceiver module; 150-an ultrasound probe; 160-ultrasonic probe connector; 161-connecting channel; 170-ultrasound transmit port; 180-an ultrasound receiving port; 190-a control port; 200-a system processing terminal; 210-a second wireless communication module; 220-a central processing unit; 221-a data imaging module; 222-an image processing module; 223-an image analysis module; 230-a touch screen; 240-a data storage module; 300-a smart robot; 400-tablet computer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a split ultrasonic testing apparatus 10, which includes a data acquisition end 100 and a system processing end 200;
The data acquisition terminal 100 includes a first wireless communication module 110, a digital logic control module 120 for controlling generation of ultrasonic signals, a data processing module 130 for processing the ultrasonic signals, a data transceiver module 140 for transmitting or receiving the ultrasonic signals, and an ultrasonic probe 150 for transmitting the ultrasonic signals, which are electrically connected in sequence, wherein the data processing module 130 is electrically connected with the digital logic control module 120 and the data transceiver module 140, the data transceiver module 140 is connected with the ultrasonic probe 150 through an ultrasonic probe connector 160, and the ultrasonic probe connector 160 is used for conducting the ultrasonic signals;
The system processing terminal 200 includes a second wireless communication module 210 for receiving the data information sent by the first wireless communication module 110, and a central processing unit 220 connected to the second wireless communication module 210, where the central processing unit 220 is configured to process the data information sent by the data acquisition terminal 100.
Specifically, the data acquisition end 100 is composed of a first wireless communication module 110, a digital logic control module 120, a data processing module 130, a data transceiver module 140 and an ultrasonic probe 150, the system processing end 200 is composed of a second wireless communication module 210 and a central processing unit 220, and the data acquisition end 100 and the system processing end 200 establish communication connection through the first wireless communication module 110 and the second wireless communication module 210. The data acquisition end 100 and the system processing end 200 are separately arranged, under the control of the Digital logic control module 120, an ultrasonic signal generated by the data transceiver module 140 sends an ultrasonic signal to a workpiece to be detected through the ultrasonic probe 150, meanwhile, the ultrasonic probe 150 receives the ultrasonic signal reflected by the workpiece, and the ultrasonic signal is subjected to data processing through the data processing module 130, that is, the ultrasonic signal is subjected to Low Noise Amplifier (LNA) amplification, Variable Gain Amplifier (VGA) attenuation, Programmable Gain Amplifier (PGA) amplification, anti-aliasing filter (AAF), Analog-to-Digital Converter (ADC) acquisition, and the like. The processed ultrasonic signals are transmitted to the digital logic control module 120 for further processing (filtering the digital signals, etc.), and then the ultrasonic signal data acquired by the data acquisition terminal 100 is transmitted to the system processing terminal 200 through the first wireless communication module 110. Then, the system processing terminal 200 receives the ultrasonic signal through the second wireless communication module 210, and sends the ultrasonic signal to the central processing unit 220 for processing (filtering, amplifying, etc.).
The low-noise amplifier is an amplifier with a very low noise coefficient, and is used as a high-frequency or intermediate-frequency preamplifier (such as WIFI in a mobile phone, a computer or an iPad) of various radio receivers and an amplifying circuit of high-sensitivity electronic detection equipment. The variable gain amplifier is located at the back end of the data transceiver module 140, and since the signal existing in the front-end circuit of the data transceiver module 140, such as the low noise amplifier and the mixer, has been amplified to some extent, the amplitude of the signal when reaching the VGA is relatively large, so that the system has relatively high requirements on the input dynamic range and linearity of the VGA. The anti-aliasing filter is a low-pass filter, is used for reducing aliasing frequency components to a negligible degree in an output level, and the sampling frequency cannot be infinitely high or does not need to be infinitely high in engineering measurement. The data processing module 130 is provided with an analog-to-digital converter, and the analog-to-digital converter is used for converting continuously changing analog signals into discrete digital signals to obtain a digital form which is easy to store, process and transmit, so that the signals are conditioned, and the detection precision and efficiency of the split ultrasonic flaw detection device 10 are improved.
In this embodiment, the data acquisition terminal 100 may be configured to bridge signals, logically control signals, filter signals, process dynamic ranges of signals, process frequency responses of amplifiers, process signal amplitudes and process time-based linearity of signals, the first wireless communication module 110 and the second wireless communication module 210 may be WIFI modules wirelessly connected, the data information is ultrasonic data obtained by processing ultrasonic signals reflected by the workpiece and processed by the data processing module 130, the ultrasonic probe mainly includes a straight probe, an inclined probe, a probe with curvature, a focusing probe and a surface wave probe, the ultrasonic probe is a sheet-shaped piezoelectric wafer, and the piezoelectric wafer may generate a piezoelectric effect, which is the same as magnetism and related to temperature, that is, the piezoelectric effect can only be generated within a certain temperature range, beyond a certain temperature, the piezoelectric effect will disappear by itself. The split ultrasonic flaw detection device 10 of the present embodiment using the ultrasonic phased array detection technology can perform flaw detection on workpieces in the situations of climbing, building exterior walls, bridges, and the like. Digital logic control module 120 is the main heat-generating body of data acquisition end 100, central processing unit 220 is the main heat-generating body of system processing end 200, data acquisition end 100 with system processing end 200 components of a whole that can function independently sets up and can effectively reduce split type ultrasonic flaw detection device 10's operating temperature ensures ultrasonic probe 150's detectivity, thereby has improved the accuracy of data acquisition end 100 data acquisition has improved split type ultrasonic flaw detection device 10's job stabilization nature.
preferably, the ultrasonic probe 150 is detachably connected to the ultrasonic probe connector 160, and the ultrasonic probe connector 160 further includes at least one connecting channel 161 for conducting the ultrasonic signal.
Referring to fig. 3, the data transceiver module 140 is connected to the ultrasonic probe 150 through the ultrasonic probe connector 160, and it should be noted that, in the process of actually installing the split-type ultrasonic testing apparatus 10, the ultrasonic probe connector 160 has 32 connection channels, and according to the actual detection requirement, the digital logic control module 120 controls the data transceiver module 140 to select at least one of the connection channels 161 as connecting the ultrasonic probe 150 and the data transceiver module 140, so that when the data acquisition end 100 is installed and maintained, the ultrasonic signal is quickly conducted, the attenuation of the ultrasonic signal is reduced, the ultrasonic probe 150 with different specifications can be quickly replaced, the detection range of the split-type ultrasonic testing apparatus 10 is expanded, and the split-type ultrasonic testing apparatus 10 can be applied to different industrial detection fields, such as workpiece welds, rails, towers, etc.
Preferably, the data transceiver module 140 includes an ultrasonic transmitting port 170, an ultrasonic receiving port 180 and a control port 190, the ultrasonic transmitting port 170 is connected to the ultrasonic probe connector 160, the ultrasonic receiving port 180 is connected to the data processing module 130, and the control port 190 is connected to the digital logic control module 120.
Referring to fig. 4, the data transceiver module 140 employs a MAX14808 chip with a model number of U1, and the digital logic control module 120 is connected to the first wireless communication module 110 through a USB data line, so as to improve real-time performance and reliability of internal data transmission of the data acquisition terminal 100. The ultrasonic probe 150 may adopt a piezoelectric ceramic wafer, the digital logic control module 120 is connected to the control port 190 and is configured to control generation of an ultrasonic signal, the ultrasonic emission port 170 generates a high-voltage pulse under driving of the control port 190 to excite the piezoelectric ceramic wafer, main performance indexes of the ultrasonic emission port 170 include an emission voltage amplitude, an emission fall time, and an emission output impedance, and an emission output waveform mainly includes a sharp pulse, a negative square wave, and a positive square wave and a negative square wave in the field of nondestructive monitoring. It is understood that the data acquisition terminal 100 further includes a power circuit for supplying power to the various components and circuits. The ultrasonic transmitting port 170 drives the ultrasonic probe 150 through the ultrasonic probe connector 160 to generate a pulse with a certain waveform, and the ultrasonic receiving port 180 is used for receiving the reflected ultrasonic signal and sending the reflected ultrasonic signal to the data processing module 130.
In addition, the digital logic control module 120 further includes a combinational logic circuit and a sequential logic circuit, and it can be understood that in a digital logic control system, the output result depends on the combinational logic of the current input values, the output result is a sequential logic determined by the current input values and the past input values, the combinational logic does not include a storage element, and the sequential logic includes at least one storage element. Ultrasonic waves have various wave modes when propagating in a medium, and longitudinal waves, transverse waves, surface waves and plate waves are most commonly used in inspection; the longitudinal wave can be used for detecting the defects of inclusions, cracks, pipe shrinkage, white spots, layering and the like in metal cast ingots, blanks, medium plates, large forgings and parts with simpler shapes; the transverse wave can be used for detecting the defects of circumferential and axial cracks, scratches, air holes in welding seams, slag inclusion, cracks, incomplete penetration and the like in the pipe; surface defects on a simply shaped casting can be detected with surface waves; defects in the sheet can be detected with plate waves. In the present embodiment, taking the detection of the weld of the workpiece as an example, the split type ultrasonic testing apparatus 10 inspects the defect of the workpiece by using the characteristic that the ultrasonic energy penetrates into the depth of the metal material and is reflected at the edge of the interface when entering another section from the section, and when the ultrasonic beam enters the inside of the workpiece from the surface of the workpiece by the ultrasonic probe 150, the ultrasonic beam respectively generates a reflected wave when encountering the defect and the bottom surface of the workpiece, and forms a pulse waveform at the system processing end 200, and determines the position and size of the defect according to the pulse waveform.
Preferably, the data processing module 130 includes an amplifying unit for amplifying the received ultrasonic signal, a filtering unit for filtering the ultrasonic signal, and a converting unit for converting the ultrasonic signal into a digital signal.
referring to fig. 5, the data processing module 130 is an AD9278 chip with a model number of U5, the data processing module includes a first port 131 and a second port 132, the first port is used to connect with the ultrasonic transceiver circuit of the data transceiver module 140, the second port 132 is used to connect with the digital logic control module 120, the first port 131 is composed of multiple sets of circuits formed by capacitors, resistors, inductors, and diodes, the data processing module 130 amplifies, gains, attenuates, etc. signals through the circuits to obtain ultrasonic signals convenient to process, the second port 132 is composed of a digital-to-analog conversion circuit, and is used to convert the ultrasonic signals into digital signals and send the digital signals to the digital logic control module 120, and send the digital signals to the system processing terminal 200 through the first wireless communication module 110, and the digital logic control module 120 can send the ultrasonic signals collected by the data transceiver module 140 and the data processing The ultrasonic signals of the module processing 130 are synchronized to the system processing end 200, and high-speed transmission of the data information is also realized.
Preferably, the digital logic control module 120 employs a 10AX027F34 chip, and the first wireless communication module 110 and the second wireless communication module 210 both employ MT7268 chips.
the digital logic control module 120 is a 10AX027F34 chip with a model number of U2-9, the digital logic control module 120 is a Field-Programmable Gate Array (FPGA) chip, the first wireless communication module 110 and the second wireless communication module 210 are MT7268 chips with a model number of U29, and the first wireless communication module 110 and the second wireless communication module 210 are WIFI modules and are connected by a wireless communication protocol.
Preferably, the system processing terminal 200 further includes a data storage module 240 electrically connected to the central processing unit 220, and the data storage module 240 is configured to store the ultrasonic image and the data information obtained through the processing by the central processing unit 220.
Referring to fig. 2, in this embodiment, the data storage module 240 may be an electronic component with a storage function, such as an SD card, a memory card, and the like, and the data storage module 240 is preferably a hard disk with a capacity of 500G, in practical application, the central processing unit 220 and the data storage module 240 are installed on the tablet computer 400 together, so that a tester can visually check the test information of the workpiece, where the data information includes the position and the size of the weld of the workpiece, and the data storage module 240 may store a large amount of data information and facilitate the tester to manage the test information.
Preferably, the central processor 220 employs an SOM-3567 chip for converting the ultrasonic signal into an ultrasonic image, performing image quality processing on the ultrasonic image, and performing image analysis processing.
Referring to fig. 2 again, specifically, the central processing unit 220 employs an SOM-3567 chip, the central processing unit includes a data imaging module 221, an image processing module 222, and an image analysis module 223, which are connected in sequence, the central processing unit 220 processes the ultrasonic signal and the data information through an existing computer software program, the data imaging module 221 is configured to perform imaging processing on the data signal, that is, generate an ultrasonic image, the image processing module 222 performs image quality processing on the ultrasonic image, such as brightness, contrast, color, and the like of the ultrasonic image, and the image analysis module 223 is configured to perform analysis processing on the ultrasonic image, such as amplification, reduction, and the like of the ultrasonic image, when the system processing terminal 200 is offline.
Preferably, the system processing terminal 200 further includes a touch screen 230 electrically connected to the central processing unit 220, and the touch screen 230 is configured to acquire a touch signal and display test information, and send a test instruction to the data acquisition terminal 100 through the second wireless communication module 210.
Specifically, the touch screen 230 may display test information, a test menu, test distance information, and the like of the workpiece, the touch screen 230 is preferably an LED touch screen, the tester tests through the touch screen 230 to view the detected test information, the touch screen 230 sends a request to the central processor 220 according to an operation instruction of the tester, and acquires corresponding test information from the data storage module 240; when the tester selects the instruction of the test menu on the touch screen 230, the central processor 220 responds to the instruction and sends a test instruction to the data acquisition terminal 100 through the second wireless communication module 210. The digital logic control module 120 is connected to the first wireless communication module 110 through a communication port, in this embodiment, the communication port may be a USB port, or may also be a CAN port or an RS485 port, and the USB port may be powered on when data is transmitted to the first wireless communication module 110, so as to improve the working efficiency of the first wireless communication module 110.
Referring to fig. 6, in a specific application, the data acquisition terminal 100 may also be installed on a wearable device of a tester, and the system processing terminal 200 may be installed on a notebook computer, a mobile phone terminal, or the like. In this embodiment, the data acquisition end 100 is installed on an intelligent robot 300, the system processing end 200 is installed on a tablet pc 400, for example, to detect a welding seam of a steel rail, a tester controls the intelligent robot 300 to reach a detected point through a wireless remote controller, so as to debug and complete communication connection between the data acquisition end 100 and the system processing end 200, the tester finds a test menu on a touch screen 230 of the tablet pc 400 to click a test, the central processing unit 220 receives a test instruction sent by the touch screen 230, stores the test instruction and sends the test instruction to the first wireless communication module 110 through the second wireless communication module 210, the first wireless communication module 110 receives the test instruction, and the digital logic control module 120 controls the data transceiver module 140 and the ultrasonic probe 150 to generate an ultrasonic signal according to the test instruction, and transmits the ultrasonic signal to the steel rail, the data transceiver module 140 receives the ultrasonic signal reflected by the steel rail and forwards the ultrasonic signal to the data processing module 130, the data processing module 130 performs amplification, filtering and other processing on the reflected ultrasonic information, meanwhile, data information obtained from the processed ultrasonic signals is fed back to the system processing terminal 200 through the digital logic control module 120 and the first wireless communication module 110, the system processing terminal 200 converts the received data information into an ultrasonic image, that is, a waveform diagram is displayed on the touch screen 230, the touch screen 230 is further provided with coordinate axes and scales, so that the tester can visually check the ultrasonic image and analyze the data information, can also obtain the position and size of the weld of the steel rail, and display the detection result, that is, the qualified or unqualified steel rail and other characters or display the detection result in other forms. The data storage module 240 stores the data information sent by the data acquisition terminal 100 and the test information obtained from the data information processed by the system processing terminal 200, so that the tester can check and manage the data information conveniently. In addition, the tester views the ultrasonic image scanned by the data acquisition end 100 on the touch screen 230 in real time, may call the ultrasonic image to perform image analysis, and may also define a target image to perform local amplification or reduction, etc., so that the tester can clearly find the position of the defect of the weld of the steel rail.
the utility model provides a pair of split type ultrasonic flaw detection device 10, for prior art, through will data acquisition end 100 reaches the split type setting of system processing end 200 can be avoided like this split type ultrasonic flaw detection device 10's whole calorific capacity has also reduced split type ultrasonic flaw detection device 10's volume and weight have improved split type ultrasonic flaw detection device 10's detection precision has also improved split type ultrasonic flaw detection device 10's life. Data transceiver module 140 with ultrasonic probe 150 passes through ultrasonic probe connector 160 is connected, data acquisition end 100 can install lightly on intelligent robot 300, corresponding application development is done on general panel computer 400 in the mountable of system processing end 200, and the tester passes through panel computer 400 is controlled intelligent robot 300 detects, and when being difficult for being close the object that awaits measuring to the tester, enlarged split type ultrasonic flaw detection device 10's detection range has improved job stabilization nature.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention should be covered by the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A split type ultrasonic flaw detection device is characterized by comprising a data acquisition end and a system processing end;
The data acquisition end comprises a first wireless communication module, a digital logic control module, a data processing module, a data transceiving module and an ultrasonic probe, wherein the first wireless communication module, the digital logic control module, the data processing module, the data transceiving module and the ultrasonic probe are sequentially and electrically connected, the digital logic control module is used for controlling the generation of ultrasonic signals, the data processing module is used for processing the ultrasonic signals, the data transceiving module is used for transmitting or receiving the ultrasonic signals, the ultrasonic probe is used for transmitting the ultrasonic signals, the data processing module is respectively and electrically connected with the digital logic control module and the data transceiving module, the data transceiving module is connected with the ultrasonic probe through an ultrasonic probe connector, and the;
The system processing end comprises a second wireless communication module and a central processing unit, the second wireless communication module is communicated with the first wireless communication module, the central processing unit is connected with the second wireless communication module, and the central processing unit is used for processing data information sent by the data acquisition end.
2. The split-type ultrasonic testing apparatus of claim 1, wherein the ultrasonic probe is detachably connected to the ultrasonic probe connector, and the ultrasonic probe connector further comprises at least one connecting channel for conducting the ultrasonic signal.
3. The split-type ultrasonic testing apparatus according to claim 1, wherein the data transceiver module comprises an ultrasonic transmitting port, an ultrasonic receiving port and a control port, the ultrasonic transmitting port is connected to the ultrasonic probe connector, the ultrasonic receiving port is connected to the data processing module, and the control port is connected to the digital logic control module.
4. The split-type ultrasonic flaw detection device according to claim 3, wherein the data transceiver module employs a MAX14808 chip.
5. the split-type ultrasonic testing apparatus according to claim 1, wherein the data processing module includes an amplifying unit that amplifies a received ultrasonic signal, a filtering unit that filters the ultrasonic signal, and a converting unit that converts the ultrasonic signal into a digital signal.
6. The split-type ultrasonic flaw detection device according to claim 5, wherein the data processing module employs an AD9278 chip.
7. The split-type ultrasonic flaw detection device according to claim 1, wherein the digital logic control module employs a 10AX027F34 chip, and the first wireless communication module and the second wireless communication module each employ an MT7268 chip.
8. The split-type ultrasonic flaw detection device according to claim 1, wherein the system processing end further comprises a data storage module electrically connected to the central processing unit, and the data storage module is configured to store the ultrasonic image and the data information obtained through the processing by the central processing unit.
9. The split-type ultrasonic testing apparatus of claim 8, wherein the central processor employs an SOM-3567 chip for converting the ultrasonic signals into ultrasonic images, and performing image quality processing and image analysis processing on the ultrasonic images.
10. The split-type ultrasonic flaw detection device according to claim 1, wherein the system processing terminal further includes a touch screen electrically connected to the central processing unit, the touch screen is configured to acquire a touch signal and display test information, and send a test instruction to the data acquisition terminal through the second wireless communication module.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125554A (en) * | 2019-12-31 | 2021-07-16 | 中国石油天然气集团有限公司 | Ultrasonic detection system for pipeline corrosion |
| CN113933391A (en) * | 2021-10-13 | 2022-01-14 | 山东大学 | Piezoelectric ultrasonic guided wave detection device and detection method |
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2019
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113125554A (en) * | 2019-12-31 | 2021-07-16 | 中国石油天然气集团有限公司 | Ultrasonic detection system for pipeline corrosion |
| CN113933391A (en) * | 2021-10-13 | 2022-01-14 | 山东大学 | Piezoelectric ultrasonic guided wave detection device and detection method |
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