CN209768096U - Heat dissipation structure and electronic device - Google Patents
Heat dissipation structure and electronic device Download PDFInfo
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- CN209768096U CN209768096U CN201920240777.3U CN201920240777U CN209768096U CN 209768096 U CN209768096 U CN 209768096U CN 201920240777 U CN201920240777 U CN 201920240777U CN 209768096 U CN209768096 U CN 209768096U
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Abstract
The utility model discloses a heat radiation structure and have heat radiation structure's electron device. The heat dissipation structure is connected with the heat source and comprises a heat dissipation assembly and an adhesive layer. The heat dissipation assembly comprises a heat dissipation film and a metal ion deposition layer overlapped with the heat dissipation film. The adhesive layer is arranged on the heat dissipation assembly; the heat dissipation structure can be bent according to the shape of the heat source, and the heat dissipation assembly is attached to the heat source through the adhesive layer. The utility model discloses can buckle and cover on the heat source according to the shape of heat source, borrow this to reach comprehensive heat dissipation demand, avoid buckling the heat energy transmission that leads to that the damage that causes heat radiation structure leads to and interrupt, reduce the radiating effect.
Description
Technical Field
The utility model discloses a heat radiation structure and electron device who has this heat radiation structure.
Background
In recent years, the degree of integration of flat display devices or apparatuses (such as mobile phones, tablet computers, notebook computers, or servers) has become higher due to the development of process technologies, and thus, "heat dissipation" has been an indispensable function of these devices or apparatuses. Particularly, in the case of high power devices, the temperature of the electronic device may rapidly increase due to the large increase of heat energy generated during operation, and when the electronic device is subjected to an excessive temperature, the electronic device may be permanently damaged or the lifetime of the electronic device may be greatly reduced.
in order to avoid overheating of the electronic device, the prior art generally installs a heat dissipation structure to dissipate the heat generated by the electronic device by conduction, convection, radiation, and the like. The heat dissipation structure includes air cooling (heat dissipation fins plus fan), liquid cooling (liquid plus pump), heat pipe, semiconductor refrigeration, compressor refrigeration and heat dissipation film.
However, most of the prior art heat dissipation structures cannot change their shapes, and cannot be designed to be bent according to different heat source shapes to meet the overall heat dissipation requirements. Therefore, how to develop a heat dissipation structure more suitable for different heat source shapes to achieve the overall heat dissipation requirement has become one of the important issues.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat radiation structure and electron device who has this heat radiation structure can buckle and cover on the heat source according to the shape of heat source, reaches the heat dissipation demand of comprehensive, avoids causing the heat energy transmission interrupt that heat radiation structure's damage leads to because of buckling, reduces the radiating effect.
to achieve the above object, the heat dissipation structure according to the present invention is connected to a heat source, and includes a heat dissipation assembly and an adhesive layer. The heat dissipation assembly comprises a heat dissipation film and a metal ion deposition layer overlapped with the heat dissipation film. The adhesive layer is arranged on the heat dissipation assembly; the heat dissipation structure can be bent according to the shape of the heat source, and the heat dissipation assembly can be attached to the heat source through the adhesive layer.
To achieve the above object, an electronic device according to the present invention includes a heat source and a heat dissipation structure. The heat dissipation structure is connected with the heat source and comprises a heat dissipation assembly and an adhesive layer. The heat dissipation assembly comprises a heat dissipation film and a metal ion deposition layer overlapped with the heat dissipation film. The adhesive layer is arranged on the heat dissipation assembly; the heat dissipation structure can be bent according to the shape of the heat source, and the heat dissipation assembly can be attached to the heat source through the adhesive layer.
It should be noted that the utility model discloses an among heat radiation structure and the electronic device who has this heat radiation structure, contain the heat dissipation membrane through radiator unit and overlap the metal ion sedimentary deposit that sets up with the heat dissipation membrane to and the adhesion coating sets up on radiator unit, make radiator unit can buckle according to the shape of heat source outside, radiator unit also can be attached on the heat source through the adhesion coating. Therefore, the heat dissipation structure of the utility model can be bent according to the shape of the heat source and covered on the heat source, so as to meet the comprehensive heat dissipation requirement, avoid the interruption of heat energy transmission caused by the damage of the heat dissipation structure due to bending, and reduce the heat dissipation effect; furthermore, through the utility model discloses, except can dispelling the heat to the target heat source, go back accessible respectively putting to suitably use on different products, reach the different heat dissipation demands of large tracts of land or different shape equipment.
Drawings
Fig. 1 is a schematic view of a heat dissipation structure according to an embodiment of the present invention.
Fig. 2 is a schematic view of a heat dissipation structure according to various embodiments of the present invention.
Fig. 3A to fig. 5 are different schematic diagrams of the heat dissipation structure of the present invention applied to an electronic device.
Detailed Description
The heat dissipation structure and the electronic device having the same according to some embodiments of the present invention will be described with reference to the accompanying drawings, wherein like elements are denoted by like reference numerals.
the utility model discloses a heat radiation structure can apply to for example but not limited to relevant computer equipment in notebook computer, cell-phone, flat board and the server, or other electronic equipment to buckle and cover on the heat source according to the shape of heat source, except can reaching the heat dissipation demand of comprehensive, still can avoid buckling the heat energy transmission that leads to that the damage that causes heat radiation structure leads to and interrupt, reduce the radiating effect.
Fig. 1 is a schematic view of a heat dissipation structure according to an embodiment of the present invention. The heat dissipation structure 1 may be attached to or wrapped around a heat source of the electronic device to be connected to the heat source, so as to guide and dissipate heat generated by the heat source. The heat source may be a battery, a control chip, a motherboard, a Central Processing Unit (CPU), a memory, a display card, or a display panel of the electronic device, or other components or units that generate heat.
As shown in fig. 1, the heat dissipation structure 1 includes a heat dissipation assembly 11 and an adhesive layer 12. In addition, the heat dissipation structure 1 of the present embodiment may further include a protective layer 13.
The heat dissipation assembly 11 includes a heat dissipation film 111 and a metal ion deposition layer 112 overlapped with the heat dissipation film 111. Herein, the heat dissipation film 111 and the metal ion deposition layer 112 are stacked, and the metal ion deposition layer 112 is disposed on and covers the surface of the heat dissipation film 111. In some embodiments, a metal ion deposition layer 112 may be formed on the surface of the heat dissipation film 111 by electrodeposition (electrodeposition), such that the metal ion deposition layer 112 covers the heat dissipation film 111; in some embodiments, the metal ion deposition layer 112 may cover part or all of the surface of the heat dissipation film 111; in some embodiments, the metal ion Deposition layer 112 may be formed on the heat dissipation film 111 by, for example, electroplating, Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), or other suitable methods.
The material of the heat dissipation film 111 may include, for example and without limitation, graphene, carbon, artificial graphite, natural graphite, carbon nanotubes, or a thermally conductive metal, or a combination thereof, and the material of the metal ion deposition layer 112 may include, for example and without limitation, a highly thermally conductive metal material such as copper, aluminum, iron, silver, gold, or the like. In the present embodiment, the material of the heat dissipation film 111 is graphene, the material of the metal ion deposition layer 112 is copper, and a copper metal ion deposition layer 112 is formed on the surface of the heat dissipation film 111 made of graphene by electroplating. In the electroplating process, the anode may be copper metal, and the cathode may be a graphene film, so as to form a copper ion coating (metal ion deposition layer 112) on the surface of the graphene film by the electroplating process, so as to form a graphene/copper composite film (i.e. heat dissipation assembly 11) with good adhesion and heat dissipation capability. The bonding between the heat dissipation film 111 of graphene and the metal ion deposition layer 112 of copper is mainly a strong bonding force formed by increasing the electron density at the interface between the two, and the bonding morphology is mainly ionic bonding and Van der Waals force (Van der Waals force). In addition, the corrosion resistance of the graphene film layer can be utilized to protect the copper ion layer from oxidation at high temperature, so that the copper ion layer is protected. Specifically, the copper ion deposition layer formed by the electroplating process on the heat dissipation film 111 of graphene has the following advantages: a. the binding force of the two is quite good, and the strength is high; b. the copper deposition layer has good toughness and ductility, and is not easy to break when bent; c. good deep plating performance and leveling property.
The adhesive layer 12 is disposed on the heat dissipation assembly 11. In the present embodiment, the adhesive layer 12 is disposed on the surface of the heat dissipation film 111 of the heat dissipation assembly 11 facing away from the metal ion deposition layer 112, so that the heat dissipation assembly 11 can be attached (adhered) to heat sources with different shapes through the adhesive layer 12. Therefore, the heat of the heat source can be conducted to the heat dissipation element 111 through the adhesive layer 12, and the heat dissipation film 111 of the heat dissipation element 111 has good xy-plane thermal conductivity, so that the heat can be rapidly transferred along the extending direction of the surface of the heat dissipation film 111, and the heat energy can be rapidly dissipated to the outside. The adhesive layer 12 may be made of a thermally bonded adhesive material, and may include a combination of an adhesive such as but not limited to silicone, polyurethane, acrylate polymer, hot melt adhesive, or pressure sensitive adhesive, and a mixture of alumina, boron nitride, or zinc oxide, or a combination thereof. In some embodiments, the adhesive layer 12 is, for example, but not limited to, a double-sided tape.
In addition, the protection layer 13 is disposed on a side of the heat dissipation assembly 11 opposite to the adhesive layer 12. Herein, the passivation layer 13 is disposed on the surface of the metal ion deposition layer 112 facing away from the heat dissipation film 111 to protect the heat dissipation film 111 and the metal ion deposition layer 112 from being damaged by moisture or foreign matters. The protective layer 13 is, for example, but not limited to, black, and the material thereof may include, but is not limited to, organic materials such as polypropylene (PP), polyethylene terephthalate (PET), Polystyrene (PS), Polyurethane (PU), and inorganic materials, without limitation.
Therefore, when the heat dissipation structure 1 is applied to heat dissipation of an electronic device, the heat dissipation structure 1 can be manufactured to be matched with the shape of the heat source according to the shape of the heat source of the electronic device, and the heat dissipation structure 1 can be bent according to the shape of the heat source. In some embodiments, the heat dissipation structure 1 can be bent at a plurality of positions according to the shape of the heat source and attached (adhered) to the heat source through the adhesive layer 12, so that the heat generated by the heat source can be quickly conducted to the heat dissipation film 111 of the heat dissipation assembly 11 through the adhesive layer 12 and dissipated to the outside. In addition, by the characteristic that the metal ion deposition layer 112 is easy to bend and not easy to break, the angle at which the heat dissipation structure 1 can be bent according to the shape of the heat source can be 90 degrees, even more than 90 degrees, thereby protecting the heat dissipation assembly 11 from heat energy transmission interruption caused by damage caused by bending at different angles, and reducing the heat dissipation effect.
Fig. 2 is a schematic view of a heat dissipation structure according to various embodiments of the present invention. As shown in fig. 2, the heat dissipation structure 1a of the present embodiment is substantially the same as the heat dissipation structure 1 of the previous embodiment in terms of the component composition and the connection relationship of the components. The difference is that the heat dissipation assembly 11 'of the heat dissipation structure 1a of the present embodiment includes two metal ion deposition layers 112, 112', and the heat dissipation film 111 is disposed between the two metal ion deposition layers 112, 112 'to form a sandwich structure, and the adhesion layer 12 is disposed on a surface of the metal ion deposition layer 112' facing away from the heat dissipation film 111.
In some embodiments, another heat dissipation film may be disposed between the metal ion deposition layer 112' and the adhesive layer 12 to enhance the heat dissipation effect, which is not limited by the present invention. In addition, in some embodiments, heat dissipation structures with different thicknesses and sizes can be manufactured according to the remaining space of the internal components of the mobile phone or the pen-type computer housing, so as to meet the heat dissipation requirements of the thin electronic product.
Fig. 3A to fig. 5 are different schematic diagrams illustrating the application of the heat dissipation structure of the present invention to an electronic device.
In the application examples of fig. 3A and 3B, the heat dissipation structure 1 (or 1a) can be applied to the electronic device 2: such as heat dissipation of notebook computers (ultra-light thin pens). Fig. 3B is a schematic diagram of the inside of the housing in the dotted area of the electronic device 2 (notebook computer) in fig. 3A. In fig. 3B, the heat dissipation structure 1 covers the heat sources 21a, 21 c. The heat source 21a is, for example, a control circuit board of a touch pad, and the heat sources 21b and 21c are, for example, batteries of a notebook computer.
In the electronic device 2 of fig. 3B, the heat sources 21a, 21B, and 21c are covered with the heat dissipation structure 1 (or 1a) to dissipate heat. The heat dissipation structure 1 can be attached to and cover the surfaces of the heat sources 21a, 21b, and 21c (control board, battery) from the lower surfaces of the heat sources 21a, 21b, and 21c through an adhesive layer (not shown) according to the shapes of the heat sources 21a, 21b, and 21c by utilizing the flexibility of the heat dissipation assembly 11. Herein, the heat sources 21a, 21b, and 21c may include a plurality of surfaces 211, and the heat dissipation structure 1 is bent and attached to the plurality of surfaces 211, such that the heat dissipation structure 1 may generate at least one bent portion. In the present embodiment, the heat dissipation structure 1 is bent and generates 7 bent portions 14a to 14g (as shown by the dotted circles in fig. 3B). The bending angle of some of the bending portions, for example, the four bending portions 14a to 14d, is acute, and the bending angle of at least one of the bending portions, for example, the three bending portions 14e, 14f, 14g, may be between 85 degrees and 95 degrees, for example, 90 degrees (i.e., vertical bending).
In addition, in the application example of the electronic device 2a in fig. 4, a liquid crystal display device is taken as an example. Since the heat source 21 (including the plurality of leds 211 and the substrate 212) of the edge-type backlight module of the lcd device is located at the side of the backlight module (fig. 4 is located inside the right side of the outer frame 22 of the electronic device 2 a), the heat dissipation structure 1 (or 1a) can be attached to the side of the substrate 212 opposite to the leds 211, so as to guide the heat generated by the leds 211 when emitting light to the outside of the outer frame 22 through the heat dissipation structure 1 (or 1 a). In the present embodiment, in order to dissipate the heat generated by the heat source 21 to the outside of the electronic device 2a, the heat dissipation structure 1 generates three vertical bent portions 14h, 14i, and 14 j. Of course, the number of the bending portions is only an example, and is not used to limit the present invention.
In addition, in the application example of the electronic device 2b in fig. 5, the heat dissipation structure can be applied to a large-sized or large-area display, such as a large television or a television wall, to guide and dissipate heat generated by the large-area display. Here, in order to be applied to a large-sized television or a large-sized television wall, the heat dissipation assembly 11 ″ of the present embodiment may include a plurality of heat dissipation films 111, the plurality of heat dissipation films 111 are disposed side by side, and the metal ion deposition layer 112 is disposed on the plurality of heat dissipation films 111. The heat dissipation films 111 are arranged side by side, and may be arranged regularly (for example, in a matrix) or irregularly. In the present embodiment, the heat dissipation films 111 are arranged in parallel in a row, the metal ion deposition layer 112 is overlapped with the heat dissipation films 111 arranged in a row, a large adhesive layer 13 is further disposed on the upper side of the heat dissipation assembly 11 ″, and the protection layer 13 is further disposed on the surface of the metal ion deposition layer 112 opposite to the heat dissipation films 111. For example, the transverse width of each heat dissipation film 111 may be, for example, 60 cm, and the transverse width of the large-sized tv wall may be, for example, 300 cm, so that 5 heat dissipation films 111 may be arranged side by side and then subjected to an electroplating process to form a metal ion deposition layer 112 on the surfaces of the heat dissipation films 111 (the metal ion deposition layer 112 may also be formed on the other surfaces of the heat dissipation films 111), thereby obtaining the heat dissipation assembly 11 ″, and then the heat dissipation assembly is attached to the back surface of the large-sized tv wall by the protective layer 13, so as to rapidly guide and dissipate the heat emitted by the tv wall to the outside.
The embodiment of the foregoing package structure applied to an electronic device is only an example, and a person skilled in the art can apply the heat dissipation structure 1, 1a, or 1b to heat dissipation with different heat source shapes according to the foregoing description, so as to make the heat dissipation structure 1, 1a, or 1b generate different bending angles according to the shape of the heat source.
Furthermore, the utility model discloses still provide an electronic device, including heat source and heat radiation structure, heat radiation structure is connected with the heat source to can contain radiator unit and adhesion coating. The heat dissipation assembly comprises a heat dissipation film and a metal ion deposition layer overlapped with the heat dissipation film. The adhesive layer is arranged on the heat dissipation assembly; the heat dissipation structure can be bent according to the shape of the heat source, and the heat dissipation assembly can be attached to the heat source through the adhesive layer.
The electronic device may be, for example but not limited to, a mobile phone, a notebook computer, a tablet, a backlight module, a computer device in a server, or other electronic devices; the heat source of the electronic device may be a battery, a control chip, a motherboard, a CPU, a memory, a display card, or a display panel of the electronic device, or other components or units that generate heat, which is not limited in the present application.
Bearing, the beneficial effects of the utility model reside in that: the heat dissipation film can be protected from being damaged under bending at different angles by comprehensively covering a target heat source and utilizing the characteristic of bending resistance of the metal ion deposition layer, so that the heat energy is prevented from being transmitted and interrupted, and the heat dissipation effect is reduced; in addition, through aforementioned heat radiation structure, the utility model discloses except can dispelling the heat to the target object, go back accessible respectively putting to suitably use on different products, reach the different heat dissipation demands of large tracts of land or different shapes, equipment.
In summary, in the heat dissipation structure and the electronic device having the heat dissipation structure of the present invention, the heat dissipation assembly includes the heat dissipation film and the metal ion deposition layer overlapped with the heat dissipation film, and the adhesion layer is disposed on the heat dissipation assembly, so that the heat dissipation structure can be bent according to the shape of the heat source, and the heat dissipation assembly can also be attached to the heat source through the adhesion layer. Therefore, the heat dissipation structure of the utility model can be bent according to the shape of the heat source and covered on the heat source, so as to meet the comprehensive heat dissipation requirement, avoid the interruption of heat energy transmission caused by the damage of the heat dissipation structure due to bending, and reduce the heat dissipation effect; furthermore, through the utility model discloses, except can dispelling the heat to the target heat source, go back accessible respectively putting to suitably use on different products, reach the different heat dissipation demands of large tracts of land or different shapes, equipment.
The foregoing is by way of example only, and not limiting. All equivalent modifications and variations of the present invention without departing from the spirit and scope of the present invention should be considered as included in the present patent application.
Claims (10)
1. A heat dissipation structure connected with a heat source, comprising:
The heat dissipation assembly comprises a heat dissipation film and a metal ion deposition layer overlapped with the heat dissipation film; and
The adhesive layer is arranged on the heat dissipation assembly;
The heat dissipation structure can be bent according to the shape of the heat source, and the heat dissipation assembly is attached to the heat source through the adhesive layer.
2. The heat dissipation structure of claim 1, further comprising:
and the protective layer is arranged on one side of the heat dissipation assembly, which faces away from the adhesive layer.
3. The heat dissipating structure of claim 1, wherein the heat dissipating assembly comprises two metal ion deposition layers, and the heat dissipating film is disposed between the two metal ion deposition layers.
4. The heat dissipating structure of claim 1, wherein the heat dissipating assembly comprises a plurality of heat dissipating films, the plurality of heat dissipating films are disposed side by side, and the metal ion deposition layer is disposed on the plurality of heat dissipating films.
5. The heat dissipation structure of claim 1, wherein the heat source comprises a plurality of surfaces, and the heat dissipation structure is bent and attached to the plurality of surfaces through the adhesive layer, so that the heat dissipation structure generates at least one bent portion, and a bending angle of the at least one bent portion is between 85 degrees and 95 degrees.
6. An electronic device, comprising:
A heat source; and
a heat dissipation structure connected to the heat source, the heat dissipation structure including:
The heat dissipation assembly comprises a heat dissipation film and a metal ion deposition layer overlapped with the heat dissipation film; and
the adhesive layer is arranged on the heat dissipation assembly;
The heat dissipation structure can be bent according to the shape of the heat source, and the heat dissipation assembly is attached to the heat source through the adhesive layer.
7. The electronic device of claim 6, wherein the heat dissipation structure further comprises a protection layer disposed on a side of the heat dissipation assembly facing away from the adhesive layer.
8. the electronic device of claim 6, wherein the heat dissipation assembly comprises two metal ion deposition layers, and the heat dissipation film is disposed between the two metal ion deposition layers.
9. The electronic device of claim 6, wherein the heat dissipation assembly comprises a plurality of heat dissipation films, the plurality of heat dissipation films are arranged side by side, and the metal ion deposition layer is disposed on the plurality of heat dissipation films.
10. The electronic device according to claim 6, wherein the heat source comprises a plurality of surfaces, and the heat dissipation structure is bent and attached to the plurality of surfaces through the adhesive layer, so that the heat dissipation structure generates at least one bent portion, and a bending angle of the at least one bent portion is between 85 and 95 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920240777.3U CN209768096U (en) | 2019-02-26 | 2019-02-26 | Heat dissipation structure and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920240777.3U CN209768096U (en) | 2019-02-26 | 2019-02-26 | Heat dissipation structure and electronic device |
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| CN209768096U true CN209768096U (en) | 2019-12-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111174966A (en) * | 2020-01-06 | 2020-05-19 | 中国科学院微电子研究所 | Heat radiation structure and capacitive pressure sensor |
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2019
- 2019-02-26 CN CN201920240777.3U patent/CN209768096U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111174966A (en) * | 2020-01-06 | 2020-05-19 | 中国科学院微电子研究所 | Heat radiation structure and capacitive pressure sensor |
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