CN209756393U - Alignment printing system of crystal silicon double-sided solar cell - Google Patents
Alignment printing system of crystal silicon double-sided solar cell Download PDFInfo
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- CN209756393U CN209756393U CN201821756300.2U CN201821756300U CN209756393U CN 209756393 U CN209756393 U CN 209756393U CN 201821756300 U CN201821756300 U CN 201821756300U CN 209756393 U CN209756393 U CN 209756393U
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Abstract
The utility model discloses an aim at printing system of two-sided solar cell of crystal silicon, aim at printing system and include aligning device, lithography apparatus and bear and transport the conveyor of silicon chip, aligning device includes the main light source, locates the auxiliary light source of main light source side and be used for acquireing the camera of silicon chip surface image, conveyor is including the workstation that is used for bearing the silicon chip, the workstation is certainly aim at the device below and pass through, when the silicon chip is transported to aim at the device below, the main light source is located the silicon chip directly over and just to the silicon chip, the auxiliary light source is located the side top of silicon chip, the light beam that the main light source shines on the silicon chip with the formation is greater than zero and is less than 90 degrees contained angle between the light beam that the auxiliary light source shines on the silicon chip; the method is beneficial to accurate alignment of the laser mark points of the silicon wafer and accurate coverage of the aluminum grid lines, so that the alignment accuracy of the back aluminum grid lines during printing is improved.
Description
Technical Field
The utility model belongs to the solar cell field of making, concretely relates to two-sided solar cell's of crystalline silicon alignment printing system.
Background
In recent years, with the deep advance of energy-saving and emission-reducing policies, green and pollution-free solar photovoltaic power generation is more and more widely applied and is gradually known. The photovoltaic module is used as a basic unit of a power generation system, high unit area power generation capacity and low cost are the objects of priority attention of a plurality of photovoltaic owners, and the double-sided module technology is generated due to the characteristic of double-sided power generation. Polycrystal occupies a leading position in the photovoltaic market, a PERC (passivated emitter and rear cell) battery gradually replaces a conventional battery due to higher efficiency and higher technical maturity to obtain market approval, and the polycrystalline double-sided battery manufactured on the basis of the PERC battery can realize the effects of low cost and high power generation.
In the process of manufacturing the polycrystalline double-sided PERC battery, laser grooving needs to be carried out on the back surface, MARK points (laser MARK points) need to be manufactured, then accurate alignment is carried out in the process of screen printing of the aluminum grid lines, so that the laser grooving area is completely covered by the aluminum grid lines, and aluminum-silicon alloy is formed in the later high-temperature sintering process so as to lead out current. Due to the particularity of the polycrystalline grain boundary, corrosion structures with different crystal directions can be formed, so that the problems of blurring and poor alignment on a camera picture in the later printing process of laser manufacturing of the MARK point are caused. For this problem, no relevant solution is found for the description of the relevant patent.
At present, no patent for solving the problem is needed, and no complete solution for mass production is actually available, and the improvement direction is mainly to change a high-definition camera and grasp point judgment by a software improvement method. However, such improvements have the following disadvantages: the replacement of the high-definition camera requires additional large production cost investment, and the phenomena of missing printing and offset printing cannot be completely avoided. The grain boundary with the inherent characteristic of polycrystal is disordered, and the difference can be amplified in the process of removing the back damage by conventional etching, so that the contrast of MARK points in a printing camera is poor, and missing printing and offset printing occur.
SUMMERY OF THE UTILITY MODEL
to the above technical problem, the utility model aims at providing a two-sided solar cell's of brilliant silicon alignment printing system helps the accurate counterpoint of the laser mark point of silicon chip and the accurate cover of aluminium grid line to back of the body aluminium grid line's alignment precision when improving the printing.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an alignment printing system of two-sided solar cell of crystal silicon, alignment printing system includes aligning device, lithography apparatus and bears and transport the conveyor of silicon chip, aligning device includes the primary light source, locates the auxiliary light source of primary light source side and is used for acquireing the camera of silicon chip surface image, conveyor is including the workstation that is used for bearing the silicon chip, the workstation certainly aligning device below process, when the silicon chip is transported to when aligning the device below, the primary light source is located the silicon chip directly over and just to the silicon chip, the auxiliary light source is located the side top of silicon chip, the primary light source shine the silicon chip the light beam with form between the light beam that the auxiliary light source shines on the silicon chip and be greater than zero and be less than 90 degrees contained angle.
Further, the auxiliary light source is a visible light source or an infrared light source.
Further, the number of the auxiliary light sources is one or more.
Furthermore, the main light source is arranged beside the camera.
Furthermore, a packing paper is arranged on the workbench, and the silicon wafer is placed on the packing paper.
Furthermore, the conveying device further comprises a rotating mechanism capable of rotating, the workbench is connected to the rotating mechanism, and the workbench is driven by the rotating mechanism to sequentially pass through the aligning device and the printing equipment.
Furthermore, the number of the working tables is multiple, and the plurality of the working tables are arranged at equal intervals along the circumferential direction of the rotating mechanism.
The utility model adopts the above scheme, compare prior art and have following advantage:
The high-definition camera with extra high cost and the corresponding software updating and replacing cost do not need to be additionally increased, the problem of insufficient laser MARK definition caused by inconsistent multiple crystal orientation reflectivities of disordered intrinsic surfaces of polycrystal can be solved by adding the auxiliary light source with a certain angle in the back aluminum grid line printing accurate alignment process, and missing printing and offset printing in the production process are avoided.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a diagram of grain boundaries after etching of a polysilicon wafer in the prior art;
Fig. 2 is a schematic view of the image acquisition of the back side of the polycrystalline silicon wafer according to the present invention;
Fig. 3 is a schematic structural view of an alignment device according to the present invention;
Fig. 4 is a schematic top view of an alignment printing system according to the present invention;
Fig. 5a and 5b are the drawings of the polysilicon back surface after the improvement of the present invention and the prior art, respectively.
Detailed Description
The following detailed description of the preferred embodiments of the invention, taken in conjunction with the accompanying drawings, enables the advantages and features of the invention to be more readily understood by those skilled in the art. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. Furthermore, the technical features mentioned in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1, in order to improve the passivation effect of the passivation film on the back surface and improve the reflectivity of the back surface in the manufacture of a polycrystalline PERC cell, a treatment manner similar to polishing is often required for back surface etching (the manner may be alkaline heating etching, and the etching is also usually performed at a certain temperature by using a mixed solution of nitric acid and hydrofluoric acid), and two regions with obvious differences, namely a textured region (where vertical incident light is easily scattered and appears black when viewed from top) shown in S21 in fig. 1 and a textured region (where vertical incident light is easily reflected and appears white when viewed from top) shown in S22 appear in the appearance of the back surface formed by the influence of the anisotropy of polycrystalline grain boundaries. Therefore, the rear-end aluminum grid line printing is not clear when being aligned with a laser MARK point (hereinafter referred to as a MARK point) in the camera, and phenomena of missing printing and offset printing occur.
As shown in fig. 2, two regions with obvious differences, namely a textured region S21 (vertical incident light is easily scattered and appears black when viewed from above) and a textured region S22 (vertical incident light is easily reflected and appears white when viewed from above), which are caused by the difference of crystal orientations of the back surface of the battery S2 to be printed, generate scattered light A L12 when incident light A L1 emitted from a main light source enters the textured region S21, thereby reducing reflected light A L11; when the incident light B L2 emitted by the main light source is incident on the textured area S22, the L21 has no significant scattered light, so the intensity of the reflected light B L21 is strong. Therefore, the difference between the intensity of the reflected light A L11 and the intensity of the reflected light B L21 received by the camera S1 in the process of finding the alignment of the MARK points is large, so that the regional color difference in the shot picture is disordered, and the image of the MARK points is not easy to capture, so that missing printing and offset printing are caused. And in the utility model discloses in, increased one or more auxiliary light source S0, treat printing battery S2 according to certain angle and shine. The auxiliary light of the auxiliary light source is reflected by the mirror image in the suede area S22 and is not easy to be captured by the camera S1, and new scattered light formed in the suede area S21 is captured by the camera S1, so that the difference between the suede area S21 and the suede area S22 in a shot picture is relieved, and the position of a MARK point in the picture is highlighted.
Fig. 3 is a schematic diagram showing the structure of the alignment device, and fig. 4 is a schematic diagram showing the top view of the alignment printing system. Referring to fig. 3 to 4, the alignment printing system includes an alignment device 1, a printing apparatus 2, and a transfer device 3 for carrying and transporting a silicon wafer. The aligning device 1 comprises a main light source 11, an auxiliary light source 12 arranged beside the main light source 11 and a camera 13 used for acquiring the surface image of the silicon wafer 4, the conveying device 3 comprises a workbench 31 used for bearing the silicon wafer 4, a piece of packing paper 32 is arranged on the workbench 31, the silicon wafer 4 is placed on the packing paper 32, and the workbench 31 is positioned below the aligning device 1 and can pass below the aligning device 1. When the silicon wafer 4 is conveyed to the lower part of the aligning device 1, the main light source 11 is positioned right above the silicon wafer 4 and is opposite to the silicon wafer 4, the auxiliary light source 12 is positioned above the side of the silicon wafer 4, and an included angle which is larger than zero and smaller than 90 degrees, such as 45 degrees, is formed between the light beam irradiated on the silicon wafer 4 by the main light source 11 and the light beam irradiated on the silicon wafer 4 by the auxiliary light source 12. The auxiliary light source 12 is a visible light source or an infrared light source, and the number of the auxiliary light sources 12 is one or more. The camera 13 is arranged at the side of the main light source 11 arranged on the camera 13, or the two are integrated into a whole, and the main light source 11 is arranged at the outer edge of the camera 13. The silicon chip 4 is carried by the workbench 31, and after the silicon chip 4 is aligned according to the captured position of the laser mark point, the workbench 31 sends the silicon chip 4 into the printing equipment 2.
The conveying device 3 further includes a rotating mechanism 33 capable of rotating, and the working platform 31 is connected to the rotating mechanism 33 and is rotated by the rotating mechanism 33. The number of the tables 31 is plural, and they are arranged at equal intervals in the circumferential direction of the rotating mechanism 33. As shown in four in fig. 4, after the silicon wafer 4 on the worktable 31 is shot by the camera 13, the rotating mechanism 33 rotates 90 degrees, the silicon wafer 4 enters the next station along with the worktable 31, and the printing equipment 2 arranged at the next station prints a back aluminum grid line on the silicon wafer 4. A plurality of stations can be carried out simultaneously, and the efficiency is improved.
the utility model discloses an add the auxiliary light among the back aluminium grid line printing process, thoroughly solve because the inherent surperficial multiple crystal orientation reflectivity discordance of mixed and disorderly of polycrystal leads to laser MARK definition not enough, refer to 5a and 5b and show, improve the back crystal boundary difference and be not obvious, avoid the hourglass seal and the partial seal in the production process, realize the large-scale volume production of polycrystal double-sided battery, promote the high quality rate, reduce cost.
The utility model has the advantages that: the high-definition camera with high cost and the corresponding software updating and replacing cost do not need to be additionally increased, the auxiliary light source with a certain angle is added in the back aluminum grid line printing accurate alignment process, the problem that the laser MARK definition is not enough due to the fact that the multiple crystal orientation reflectivities of the inherent disordered surfaces of the polycrystal are inconsistent is thoroughly solved, and missing printing and offset printing in the production process are avoided. The utility model discloses not only solved the accurate key difficult problem of counterpointing of polycrystal double-sided battery back aluminium grid line printing, reduced the colour difference between back reflectivity and back of the body surface grain boundary simultaneously, made polycrystal double-sided battery back efficiency obtain further promotion, solved the outward appearance problem that back colour difference leads to simultaneously.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are preferred embodiments, which are intended to enable persons skilled in the art to understand the contents of the present invention and to implement the present invention, and thus, the protection scope of the present invention cannot be limited thereby. All equivalent changes or modifications made according to the principles of the present invention are intended to be covered by the scope of the present invention.
Claims (7)
1. An alignment printing system of a crystal silicon double-sided solar cell is characterized in that: the alignment printing system comprises an alignment device, a printing device and a conveying device for bearing and conveying the silicon wafer, wherein the alignment device comprises a main light source, an auxiliary light source arranged beside the main light source and a camera used for acquiring the surface image of the silicon wafer, the conveying device comprises a workbench used for bearing the silicon wafer, the workbench passes through the lower part of the alignment device, when the silicon wafer is conveyed to the lower part of the alignment device, the main light source is positioned right above the silicon wafer and right opposite to the silicon wafer, the auxiliary light source is positioned above the side of the silicon wafer, and an included angle which is larger than zero and smaller than 90 degrees is formed between a light beam irradiated on the silicon wafer by the main light source and a light beam irradiated on the silicon wafer by the auxiliary light.
2. The registered printing system according to claim 1, wherein: the auxiliary light source is a visible light source or an infrared light source.
3. The registered printing system according to claim 1, wherein: the number of the auxiliary light sources is one or more.
4. The registered printing system according to claim 1, wherein: the main light source is arranged at the side of the camera.
5. The registered printing system according to claim 1, wherein: and the workbench is provided with a packing paper, and the silicon wafer is placed on the packing paper.
6. The registered printing system according to claim 1, wherein: the conveying device further comprises a rotating mechanism capable of rotating, the workbench is connected to the rotating mechanism, and the workbench is driven by the rotating mechanism to sequentially pass through the aligning device and the printing equipment.
7. The registered printing system according to claim 6, wherein: the quantity of workstation is a plurality of, and is a plurality of the workstation is followed rotary mechanism's circumferencial direction is equidistant to be set up.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821756300.2U CN209756393U (en) | 2018-10-29 | 2018-10-29 | Alignment printing system of crystal silicon double-sided solar cell |
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| CN201821756300.2U CN209756393U (en) | 2018-10-29 | 2018-10-29 | Alignment printing system of crystal silicon double-sided solar cell |
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| CN209756393U true CN209756393U (en) | 2019-12-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112549808A (en) * | 2020-09-11 | 2021-03-26 | 苏州迈为科技股份有限公司 | Double-sheet printing method of solar cell |
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2018
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112549808A (en) * | 2020-09-11 | 2021-03-26 | 苏州迈为科技股份有限公司 | Double-sheet printing method of solar cell |
| CN112549808B (en) * | 2020-09-11 | 2023-09-12 | 苏州迈为科技股份有限公司 | Double-sheet printing method of solar cell |
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