CN209708151U - Fingerprint recognition mould group and electronic equipment - Google Patents

Fingerprint recognition mould group and electronic equipment Download PDF

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Publication number
CN209708151U
CN209708151U CN201920637362.XU CN201920637362U CN209708151U CN 209708151 U CN209708151 U CN 209708151U CN 201920637362 U CN201920637362 U CN 201920637362U CN 209708151 U CN209708151 U CN 209708151U
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CN
China
Prior art keywords
fingerprint recognition
mould group
wiring board
recognition mould
display screen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201920637362.XU
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Chinese (zh)
Inventor
薛飞
陈亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshanqiu Titanium Biometric Technology Co ltd
Original Assignee
Kunshan Q Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Q Technology Co Ltd filed Critical Kunshan Q Technology Co Ltd
Priority to CN201920637362.XU priority Critical patent/CN209708151U/en
Application granted granted Critical
Publication of CN209708151U publication Critical patent/CN209708151U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of fingerprint recognition mould group and electronic equipment, the fingerprint recognition mould group includes wiring board, fingerprint recognition chip and light processing element, the fingerprint recognition chip is set on the wiring board, the light processing element is set on the one side of the fingerprint recognition chip far from the wiring board, the fingerprint recognition chip is electrically connected at the wiring board, open up fluted on the wiring board, the fingerprint recognition chip is at least partially disposed in the groove.In the fingerprint recognition mould group and electronic equipment of the utility model, by being at least partially disposed in fingerprint recognition chip in groove, the thickness of fingerprint recognition mould group can be reduced.

Description

Fingerprint recognition mould group and electronic equipment
Technical field
The utility model relates to fingerprint identification technology fields, more particularly to a kind of fingerprint recognition mould group and electronic equipment.
Background technique
With the rapid development of electronics industry, the technical application of fingerprint recognition is very extensive, not only in gate inhibition, attendance checking system In it can be seen that fingerprint identification technology figure, have the application of more fingerprint recognitions in the market: such as laptop, hand Machine, automobile, bank paying etc..In the electronic products such as mobile phone, usually by fingerprint recognition mould group and display screen stack design, i.e., will The mobile phones components such as fingerprint recognition mould group are set to below display screen, can be increased the screen accounting of mobile phone viewing area in this way, be met people More and more demands.
However, the lower section that fingerprint recognition mould is mounted on display screen certainly will be will increase to the thickness of mobile phone, it is unfavorable for current electricity The frivolous requirement of sub- equipment.
The narration of front is to provide general background information, might not constitute the prior art.
Utility model content
The purpose of this utility model is to provide a kind of thinner thicknesses to be set with saving space-efficient fingerprint recognition mould group and electronics It is standby.
The utility model provides a kind of fingerprint recognition mould group, including wiring board, fingerprint recognition chip and light processing element, The fingerprint recognition chip is set on the wiring board, and the light processing element is set to the fingerprint recognition chip far from described On the one side of wiring board, the fingerprint recognition chip is electrically connected at the wiring board, opened up on the wiring board it is fluted, The fingerprint recognition chip is at least partially disposed in the groove.
In one embodiment, described matrix includes side wall, and the side wall is equipped with open corresponding with the notch section Oral area, the Hall element are set to the outside of the side wall, and are electrically connected at the opening portion with the electric conductor.
In one embodiment, the light processing element is optical filter.
In one embodiment, the light processing element is aperture camera lens, and the fingerprint recognition chip is far from described The side of wiring board is equipped with filter coating.
In one embodiment, the fingerprint recognition chip and the light processing element are set in the groove.
In one embodiment, the fingerprint recognition chip is electrically connected at the wiring board, the line by gold thread Road plate is equipped with the first pad, and the fingerprint recognition chip is equipped with the second pad, and the both ends of the gold thread are respectively welded in institute State the first pad and second pad.
In one embodiment, the groove includes the first slot and the second slot of connection, and first slot position is in described The bottom of wiring board, the size of second slot are greater than the size of first slot, the first slot of Yu Suoshu and second slot Junction forms step, and first pad is set at the step of the wiring board.
In one embodiment, the fingerprint recognition mould group further includes stiffening plate, the stiffening plate and the wiring board It is fixedly connected.
In one embodiment, the stiffening plate is embedded in the wiring board.
The utility model also provides a kind of electronic equipment, including display screen and above-mentioned fingerprint recognition mould group, and the fingerprint is known Other mould is mounted on the lower section of the display screen, and the display screen includes multiple pixel units, sets between the adjacent pixel unit There is gap.
In one embodiment, the size and shape of the size and shape Yu the display screen of the fingerprint recognition mould group Identical, the fingerprint recognition mould group is correspondingly arranged completely with the display screen;Alternatively, the size of the fingerprint recognition mould group is half The lower half portion of the display screen of electronic equipment is arranged in the size of a display screen, the fingerprint recognition mould group;Alternatively, The size of the fingerprint recognition mould group and the size for being less than the display screen, the fingerprint recognition mould group are arranged in the display screen A local location.
It, can by being at least partially disposed in fingerprint recognition chip in groove in this fingerprint recognition mould group and electronic equipment Reduce the thickness of fingerprint recognition mould group.
Detailed description of the invention
Fig. 1 is the assembling schematic diagram of the fingerprint recognition mould group of the utility model first embodiment.
Fig. 2 is the perspective exploded view of fingerprint recognition mould group shown in Fig. 1.
Fig. 3 is the cross-sectional view of fingerprint recognition mould group shown in Fig. 1.
Fig. 4 is the assembling schematic diagram of the fingerprint recognition mould group of the utility model second embodiment.
Fig. 5 is the perspective exploded view of fingerprint recognition mould group shown in Fig. 4.
Fig. 6 is the structural schematic diagram of the electronic equipment of the utility model 3rd embodiment.
Fig. 7 is the structural schematic diagram of the electronic equipment of the utility model fourth embodiment.
Fig. 8 is the structural schematic diagram of the electronic equipment of the 5th embodiment of the utility model.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below Embodiment is not intended to limit the scope of the present invention for illustrating the utility model.
First embodiment
It please join Fig. 1 and Fig. 2, the fingerprint recognition mould group of the utility model first embodiment, including wiring board 11, fingerprint recognition Chip 13 and light processing element 15.Fingerprint recognition chip 13 is set on wiring board 11, and light processing element 15 is known set on fingerprint On other one side of the chip 13 far from wiring board 11.Fingerprint recognition chip 13 is electrically connected at wiring board 11, to realize that fingerprint is known Signal transmission between other chip 13 and wiring board 11.In the present embodiment, light processing element 15 is optical filter, is used to filter Need the light wave of wave band.
Specifically, fingerprint recognition chip 13 can be optical finger print identification chip.Fingerprint recognition chip 13 is used to acquire light, And fingerprint pattern when being touched according to the intensity detection display screen of acquisition light, specifically, when finger is pressed into display screen table When face, the light that display panel issues is emitted on finger upwards, and incident ray gets to the epidermis back reflection of finger to fingerprint On identification chip 13, due to the presence of the lines on finger, the light intensity of different location reflection is different, according to different powers Light can reflect the fingerprint pattern on finger, realize fingerprint identification function.It is appreciated that fingerprint recognition chip 13 can also be Capacitance type fingerprint identification chip or infrared type fingerprint recognition chip, herein with no restrictions.
In this fingerprint recognition mould group, the camera lens of 13 top of fingerprint recognition chip is set to due to eliminating, it therefore reduces referring to Line identifies the thickness of mould group, has saved fingerprint recognition mould group the space occupied.
In the present embodiment, wiring board 11 includes body part 110 and the connecting plate 111 connecting with body part 110, connecting plate 111 can be flexible circuit board, convenient for wiring board 11 and other circuit connections.
In the present embodiment, please with reference to Fig. 3, fluted 112 are opened up on wiring board 11, fingerprint recognition chip 13 and light Processing element 15 is set in groove 112.By the way that fingerprint recognition chip 13 and light processing element 15 are set to groove 112 It is interior, the thickness of fingerprint recognition mould group can be further decreased.It is appreciated that groove 112 only can also be set to fingerprint recognition chip 13 Interior, light processing element 15 is still convexly equipped in 11 top of wiring board;Alternatively, a part of fingerprint recognition chip 13 is only set to groove In 112, the rest part and light processing element 15 of fingerprint recognition chip 13 are still convexly equipped in 11 top of wiring board;Or will only it refer to A part of line identification chip 13 and light processing element 15 is set in groove 112, and the rest part of light processing element 15 is still It is convexly equipped in 11 top of wiring board.That is, fingerprint recognition chip 13 is at least partially disposed in groove 112.
Specifically, groove 112 includes the first slot 1121 and the second slot 1123 of connection, and the first slot 1121 is located at wiring board 11 Bottom, the size of the second slot 1123 is greater than the size of the first slot 1121, in the junction of the first slot 1121 and the second slot 1123 Form step 113.
In the present embodiment, fingerprint recognition chip 13 is adhered on wiring board 11 by glue 16.
In the present embodiment, fingerprint recognition chip 13 is electrically connected at wiring board 11 by gold thread 17.Specifically, wiring board 11 It is equipped with the first pad 114, fingerprint recognition chip 13 is equipped with the second pad 132, and the both ends of gold thread 17 are respectively welded in first Pad 114 and the second pad 132.First pad 114 is set at the step 113 of wiring board 11, such first pad 114 and fingerprint 132 difference in height of the second pad on identification chip 13 is smaller, convenient for the welding of gold thread 17.
In the present embodiment, light processing element 15 passes through on the bonding of glue 18 and fingerprint recognition chip 13.
In the present embodiment, Fig. 3 please be join, fingerprint recognition mould group further includes stiffening plate 19, and stiffening plate 19 and wiring board 11 are fixed Connection, with the intensity of enhancement line plate 11.Specifically, stiffening plate 19 can pass through the modes such as injection molding (insert molding) It is integrally formed, and is embedded in wiring board 11 with wiring board 11.Stiffening plate 19 can be reinforcement steel plate.
Second embodiment
As shown in Figure 4 and Figure 5, the fingerprint of the fingerprint recognition mould group of the utility model second embodiment and first embodiment is known Other mould group is similar, and difference is, in second embodiment, optical processing elements 15 are aperture camera lens, and aperture camera lens is for reflecting light Line realizes optically focused so that the light of directive fingerprint recognition chip 13 be collimated.
In the present embodiment, fingerprint recognition chip 13 is equipped with filter coating far from the side of wiring board 11, needs wave with filtering The light wave of section, play the role of it is identical with optical filter in first embodiment, but since filter coating is plated in fingerprint recognition chip 13 On, without individual optical filter is arranged, it therefore reduces the thickness of fingerprint recognition mould group, has saved fingerprint recognition mould group The space occupied.
3rd embodiment
The utility model also provides a kind of electronic equipment, as shown in fig. 6, the electronic equipment of 3rd embodiment includes display screen 30 and the first embodiment or the second embodiment fingerprint recognition mould group 10, the size of fingerprint recognition mould group 10 and the size of display screen Identical with shape, fingerprint recognition mould group 10 is set to the lower section of display screen 30, and is correspondingly arranged completely with display screen 30, to make electricity Any position can carry out fingerprint recognition on the display screen 30 of sub- equipment.
In the present embodiment, display screen 30 includes multiple pixel units, and gap is equipped between adjacent pixel unit, anti-through finger The light penetrated is located at the fingerprint recognition chip 13 of 30 lower section of display screen through gap directive, can converge through the light in gap, therefore Even if being not provided with lenticule in fingerprint recognition mould group 10, fingerprint recognition mould group 10 can equally identify fingerprint pattern.
Fourth embodiment
As shown in fig. 7, the electronic equipment of fourth embodiment includes the finger of display screen and the first embodiment or the second embodiment Line identifies that mould group, the size of fingerprint recognition mould group are the size of half of display screen, and fingerprint recognition mould is mounted on the lower section of display screen, And the lower half portion of the display screen of electronic equipment is set, to make the range of half of screen under the display screen of electronic equipment can be into Row fingerprint recognition.
In the present embodiment, display screen 30 includes multiple pixel units, and gap is equipped between adjacent pixel unit, anti-through finger The light penetrated is located at the fingerprint recognition chip 13 of 30 lower section of display screen through gap directive, can converge through the light in gap, therefore Even if being not provided with lenticule in fingerprint recognition mould group 10, fingerprint recognition mould group 10 can equally identify fingerprint pattern.
5th embodiment
As shown in figure 8, the electronic equipment of the 5th embodiment includes the finger of display screen and the first embodiment or the second embodiment Line identifies mould group, and the size of fingerprint recognition mould group 10 and the size for being less than display screen, fingerprint recognition mould are mounted under display screen Side, a certain local location of the display screen of electronic equipment is arranged in fingerprint recognition mould group, to make display screen and optical finger print mould The corresponding position of group has the function of fingerprint recognition.
In the present embodiment, display screen 30 includes multiple pixel units, and gap is equipped between adjacent pixel unit, anti-through finger The light penetrated is located at the fingerprint recognition chip 13 of 30 lower section of display screen through gap directive, can converge through the light in gap, therefore Even if being not provided with lenticule in fingerprint recognition mould group 10, fingerprint recognition mould group 10 can equally identify fingerprint pattern.
In the accompanying drawings, for clarity, the size and relative size of layer and region can be exaggerated.It should be understood that working as When element such as layer, region or substrate are referred to as on " being formed in ", " setting exists " or " being located at " another element, which can be straight It connects and is arranged on another element, or there may also be intermediary elements.On the contrary, when element be referred to as " being formed directly into " or When on " being set up directly on " another element, intermediary element is not present.
Herein unless specifically defined or limited otherwise, term " installation ", " connected ", " connection " should do broad sense reason Solution, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can be mechanical connection, it can also be with It is electrical connection;It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary. For the ordinary skill in the art, the concrete meaning of above-mentioned term can be understood with concrete condition.
Herein, term " on ", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outside", " perpendicular Directly ", the orientation or positional relationship of the instructions such as "horizontal" is to be based on the orientation or positional relationship shown in the drawings, merely to expression skill The clear and description of art scheme is convenient, therefore should not be understood as limiting the present invention.
Herein, sequence adjective " first ", " second " for describing element etc. is used for the purpose of discriminative attributes class As element, be not meant to that the element described in this way must be according to given sequence or time, space, grade or other Limitation.
Herein, unless otherwise indicated, " multiple ", " several " are meant that two or more.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
Herein, the terms "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, are removed It comprising those of listed element, but also may include other elements that are not explicitly listed.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power Subject to the protection scope that benefit requires.

Claims (10)

1. a kind of fingerprint recognition mould group, which is characterized in that including wiring board (11), fingerprint recognition chip (13) and light processing elements Part (15), the fingerprint recognition chip (13) are set on the wiring board (11), and the light processing element (15) is set to described For fingerprint recognition chip (13) far from the one side of the wiring board (11), the fingerprint recognition chip (13) is electrically connected at institute It states wiring board (11), is opened up fluted (112) on the wiring board (11), the fingerprint recognition chip (13) is at least partially disposed in In the groove (112).
2. fingerprint recognition mould group as described in claim 1, which is characterized in that the light processing element (15) is optical filter.
3. fingerprint recognition mould group as described in claim 1, which is characterized in that the light processing element (15) is stenopeic spectacle Head, the fingerprint recognition chip (13) are equipped with filter coating far from the side of the wiring board (11).
4. fingerprint recognition mould group as claimed in any one of claims 1-3, which is characterized in that the fingerprint recognition chip (13) It is set in the groove (112) with the light processing element (15).
5. fingerprint recognition mould group as claimed in claim 4, which is characterized in that the fingerprint recognition chip (13) passes through gold thread (17) it is electrically connected at the wiring board (11), the wiring board (11) is equipped with the first pad (114), the fingerprint recognition core Piece (13) is equipped with the second pad (132), and the both ends of the gold thread (17) are respectively welded in first pad (114) and described Second pad (132).
6. fingerprint recognition mould group as claimed in claim 5, which is characterized in that the groove (112) includes the first slot of connection (1121) and the second slot (1123), first slot (1121) are located at the bottom of the wiring board (11), second slot (1123) size is greater than the size of first slot (1121), the first slot of Yu Suoshu (1121) and second slot (1123) Junction forms step (113), and first pad (114) is set at the step (113) of the wiring board (11).
7. fingerprint recognition mould group as described in claim 1, which is characterized in that the fingerprint recognition mould group further includes stiffening plate (19), the stiffening plate (19) is fixedly connected with the wiring board (11).
8. fingerprint recognition mould group as claimed in claim 7, which is characterized in that the stiffening plate (19) is embedded at the wiring board (11) in.
9. a kind of electronic equipment, which is characterized in that know including fingerprint described in display screen (30) and claim 1-8 any one Other mould group (10), the fingerprint recognition mould group (10) are set to the lower section of the display screen (30), and the display screen (30) includes more A pixel unit is equipped with gap between the adjacent pixel unit.
10. electronic equipment as claimed in claim 9, which is characterized in that the size and shape of the fingerprint recognition mould group (10) Identical as the size and shape of the display screen, the fingerprint recognition mould group (10) and the display screen (30) are completely corresponding to be set It sets;Alternatively, the size of the fingerprint recognition mould group is the size of half of display screen, the fingerprint recognition mould group is arranged in electricity The lower half portion of the display screen of sub- equipment;Alternatively, the size of the fingerprint recognition mould group (10) be less than the display screen Size, a local location of the display screen is arranged in the fingerprint recognition mould group.
CN201920637362.XU 2019-05-06 2019-05-06 Fingerprint recognition mould group and electronic equipment Expired - Fee Related CN209708151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920637362.XU CN209708151U (en) 2019-05-06 2019-05-06 Fingerprint recognition mould group and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920637362.XU CN209708151U (en) 2019-05-06 2019-05-06 Fingerprint recognition mould group and electronic equipment

Publications (1)

Publication Number Publication Date
CN209708151U true CN209708151U (en) 2019-11-29

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Application Number Title Priority Date Filing Date
CN201920637362.XU Expired - Fee Related CN209708151U (en) 2019-05-06 2019-05-06 Fingerprint recognition mould group and electronic equipment

Country Status (1)

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CN (1) CN209708151U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022056936A1 (en) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 Fingerprint recognition apparatus and electronic device
WO2022056935A1 (en) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 Fingerprint recognition apparatus and electronic device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022056936A1 (en) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 Fingerprint recognition apparatus and electronic device
WO2022056935A1 (en) * 2020-09-21 2022-03-24 深圳市汇顶科技股份有限公司 Fingerprint recognition apparatus and electronic device

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20201210

Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province

Patentee after: Kunshanqiu titanium biometric technology Co.,Ltd.

Address before: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Suzhou, Jiangsu Province, 215300

Patentee before: KUNSHAN Q TECHNOLOGY Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191129