CN209708151U - Fingerprint recognition mould group and electronic equipment - Google Patents
Fingerprint recognition mould group and electronic equipment Download PDFInfo
- Publication number
- CN209708151U CN209708151U CN201920637362.XU CN201920637362U CN209708151U CN 209708151 U CN209708151 U CN 209708151U CN 201920637362 U CN201920637362 U CN 201920637362U CN 209708151 U CN209708151 U CN 209708151U
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- CN
- China
- Prior art keywords
- fingerprint recognition
- mould group
- wiring board
- recognition mould
- display screen
- Prior art date
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- 230000003287 optical effect Effects 0.000 claims description 8
- 241000218202 Coptis Species 0.000 claims description 7
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910001294 Reinforcing steel Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 210000002615 epidermis Anatomy 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model provides a kind of fingerprint recognition mould group and electronic equipment, the fingerprint recognition mould group includes wiring board, fingerprint recognition chip and light processing element, the fingerprint recognition chip is set on the wiring board, the light processing element is set on the one side of the fingerprint recognition chip far from the wiring board, the fingerprint recognition chip is electrically connected at the wiring board, open up fluted on the wiring board, the fingerprint recognition chip is at least partially disposed in the groove.In the fingerprint recognition mould group and electronic equipment of the utility model, by being at least partially disposed in fingerprint recognition chip in groove, the thickness of fingerprint recognition mould group can be reduced.
Description
Technical field
The utility model relates to fingerprint identification technology fields, more particularly to a kind of fingerprint recognition mould group and electronic equipment.
Background technique
With the rapid development of electronics industry, the technical application of fingerprint recognition is very extensive, not only in gate inhibition, attendance checking system
In it can be seen that fingerprint identification technology figure, have the application of more fingerprint recognitions in the market: such as laptop, hand
Machine, automobile, bank paying etc..In the electronic products such as mobile phone, usually by fingerprint recognition mould group and display screen stack design, i.e., will
The mobile phones components such as fingerprint recognition mould group are set to below display screen, can be increased the screen accounting of mobile phone viewing area in this way, be met people
More and more demands.
However, the lower section that fingerprint recognition mould is mounted on display screen certainly will be will increase to the thickness of mobile phone, it is unfavorable for current electricity
The frivolous requirement of sub- equipment.
The narration of front is to provide general background information, might not constitute the prior art.
Utility model content
The purpose of this utility model is to provide a kind of thinner thicknesses to be set with saving space-efficient fingerprint recognition mould group and electronics
It is standby.
The utility model provides a kind of fingerprint recognition mould group, including wiring board, fingerprint recognition chip and light processing element,
The fingerprint recognition chip is set on the wiring board, and the light processing element is set to the fingerprint recognition chip far from described
On the one side of wiring board, the fingerprint recognition chip is electrically connected at the wiring board, opened up on the wiring board it is fluted,
The fingerprint recognition chip is at least partially disposed in the groove.
In one embodiment, described matrix includes side wall, and the side wall is equipped with open corresponding with the notch section
Oral area, the Hall element are set to the outside of the side wall, and are electrically connected at the opening portion with the electric conductor.
In one embodiment, the light processing element is optical filter.
In one embodiment, the light processing element is aperture camera lens, and the fingerprint recognition chip is far from described
The side of wiring board is equipped with filter coating.
In one embodiment, the fingerprint recognition chip and the light processing element are set in the groove.
In one embodiment, the fingerprint recognition chip is electrically connected at the wiring board, the line by gold thread
Road plate is equipped with the first pad, and the fingerprint recognition chip is equipped with the second pad, and the both ends of the gold thread are respectively welded in institute
State the first pad and second pad.
In one embodiment, the groove includes the first slot and the second slot of connection, and first slot position is in described
The bottom of wiring board, the size of second slot are greater than the size of first slot, the first slot of Yu Suoshu and second slot
Junction forms step, and first pad is set at the step of the wiring board.
In one embodiment, the fingerprint recognition mould group further includes stiffening plate, the stiffening plate and the wiring board
It is fixedly connected.
In one embodiment, the stiffening plate is embedded in the wiring board.
The utility model also provides a kind of electronic equipment, including display screen and above-mentioned fingerprint recognition mould group, and the fingerprint is known
Other mould is mounted on the lower section of the display screen, and the display screen includes multiple pixel units, sets between the adjacent pixel unit
There is gap.
In one embodiment, the size and shape of the size and shape Yu the display screen of the fingerprint recognition mould group
Identical, the fingerprint recognition mould group is correspondingly arranged completely with the display screen;Alternatively, the size of the fingerprint recognition mould group is half
The lower half portion of the display screen of electronic equipment is arranged in the size of a display screen, the fingerprint recognition mould group;Alternatively,
The size of the fingerprint recognition mould group and the size for being less than the display screen, the fingerprint recognition mould group are arranged in the display screen
A local location.
It, can by being at least partially disposed in fingerprint recognition chip in groove in this fingerprint recognition mould group and electronic equipment
Reduce the thickness of fingerprint recognition mould group.
Detailed description of the invention
Fig. 1 is the assembling schematic diagram of the fingerprint recognition mould group of the utility model first embodiment.
Fig. 2 is the perspective exploded view of fingerprint recognition mould group shown in Fig. 1.
Fig. 3 is the cross-sectional view of fingerprint recognition mould group shown in Fig. 1.
Fig. 4 is the assembling schematic diagram of the fingerprint recognition mould group of the utility model second embodiment.
Fig. 5 is the perspective exploded view of fingerprint recognition mould group shown in Fig. 4.
Fig. 6 is the structural schematic diagram of the electronic equipment of the utility model 3rd embodiment.
Fig. 7 is the structural schematic diagram of the electronic equipment of the utility model fourth embodiment.
Fig. 8 is the structural schematic diagram of the electronic equipment of the 5th embodiment of the utility model.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is described in further detail.Below
Embodiment is not intended to limit the scope of the present invention for illustrating the utility model.
First embodiment
It please join Fig. 1 and Fig. 2, the fingerprint recognition mould group of the utility model first embodiment, including wiring board 11, fingerprint recognition
Chip 13 and light processing element 15.Fingerprint recognition chip 13 is set on wiring board 11, and light processing element 15 is known set on fingerprint
On other one side of the chip 13 far from wiring board 11.Fingerprint recognition chip 13 is electrically connected at wiring board 11, to realize that fingerprint is known
Signal transmission between other chip 13 and wiring board 11.In the present embodiment, light processing element 15 is optical filter, is used to filter
Need the light wave of wave band.
Specifically, fingerprint recognition chip 13 can be optical finger print identification chip.Fingerprint recognition chip 13 is used to acquire light,
And fingerprint pattern when being touched according to the intensity detection display screen of acquisition light, specifically, when finger is pressed into display screen table
When face, the light that display panel issues is emitted on finger upwards, and incident ray gets to the epidermis back reflection of finger to fingerprint
On identification chip 13, due to the presence of the lines on finger, the light intensity of different location reflection is different, according to different powers
Light can reflect the fingerprint pattern on finger, realize fingerprint identification function.It is appreciated that fingerprint recognition chip 13 can also be
Capacitance type fingerprint identification chip or infrared type fingerprint recognition chip, herein with no restrictions.
In this fingerprint recognition mould group, the camera lens of 13 top of fingerprint recognition chip is set to due to eliminating, it therefore reduces referring to
Line identifies the thickness of mould group, has saved fingerprint recognition mould group the space occupied.
In the present embodiment, wiring board 11 includes body part 110 and the connecting plate 111 connecting with body part 110, connecting plate
111 can be flexible circuit board, convenient for wiring board 11 and other circuit connections.
In the present embodiment, please with reference to Fig. 3, fluted 112 are opened up on wiring board 11, fingerprint recognition chip 13 and light
Processing element 15 is set in groove 112.By the way that fingerprint recognition chip 13 and light processing element 15 are set to groove 112
It is interior, the thickness of fingerprint recognition mould group can be further decreased.It is appreciated that groove 112 only can also be set to fingerprint recognition chip 13
Interior, light processing element 15 is still convexly equipped in 11 top of wiring board;Alternatively, a part of fingerprint recognition chip 13 is only set to groove
In 112, the rest part and light processing element 15 of fingerprint recognition chip 13 are still convexly equipped in 11 top of wiring board;Or will only it refer to
A part of line identification chip 13 and light processing element 15 is set in groove 112, and the rest part of light processing element 15 is still
It is convexly equipped in 11 top of wiring board.That is, fingerprint recognition chip 13 is at least partially disposed in groove 112.
Specifically, groove 112 includes the first slot 1121 and the second slot 1123 of connection, and the first slot 1121 is located at wiring board 11
Bottom, the size of the second slot 1123 is greater than the size of the first slot 1121, in the junction of the first slot 1121 and the second slot 1123
Form step 113.
In the present embodiment, fingerprint recognition chip 13 is adhered on wiring board 11 by glue 16.
In the present embodiment, fingerprint recognition chip 13 is electrically connected at wiring board 11 by gold thread 17.Specifically, wiring board 11
It is equipped with the first pad 114, fingerprint recognition chip 13 is equipped with the second pad 132, and the both ends of gold thread 17 are respectively welded in first
Pad 114 and the second pad 132.First pad 114 is set at the step 113 of wiring board 11, such first pad 114 and fingerprint
132 difference in height of the second pad on identification chip 13 is smaller, convenient for the welding of gold thread 17.
In the present embodiment, light processing element 15 passes through on the bonding of glue 18 and fingerprint recognition chip 13.
In the present embodiment, Fig. 3 please be join, fingerprint recognition mould group further includes stiffening plate 19, and stiffening plate 19 and wiring board 11 are fixed
Connection, with the intensity of enhancement line plate 11.Specifically, stiffening plate 19 can pass through the modes such as injection molding (insert molding)
It is integrally formed, and is embedded in wiring board 11 with wiring board 11.Stiffening plate 19 can be reinforcement steel plate.
Second embodiment
As shown in Figure 4 and Figure 5, the fingerprint of the fingerprint recognition mould group of the utility model second embodiment and first embodiment is known
Other mould group is similar, and difference is, in second embodiment, optical processing elements 15 are aperture camera lens, and aperture camera lens is for reflecting light
Line realizes optically focused so that the light of directive fingerprint recognition chip 13 be collimated.
In the present embodiment, fingerprint recognition chip 13 is equipped with filter coating far from the side of wiring board 11, needs wave with filtering
The light wave of section, play the role of it is identical with optical filter in first embodiment, but since filter coating is plated in fingerprint recognition chip 13
On, without individual optical filter is arranged, it therefore reduces the thickness of fingerprint recognition mould group, has saved fingerprint recognition mould group
The space occupied.
3rd embodiment
The utility model also provides a kind of electronic equipment, as shown in fig. 6, the electronic equipment of 3rd embodiment includes display screen
30 and the first embodiment or the second embodiment fingerprint recognition mould group 10, the size of fingerprint recognition mould group 10 and the size of display screen
Identical with shape, fingerprint recognition mould group 10 is set to the lower section of display screen 30, and is correspondingly arranged completely with display screen 30, to make electricity
Any position can carry out fingerprint recognition on the display screen 30 of sub- equipment.
In the present embodiment, display screen 30 includes multiple pixel units, and gap is equipped between adjacent pixel unit, anti-through finger
The light penetrated is located at the fingerprint recognition chip 13 of 30 lower section of display screen through gap directive, can converge through the light in gap, therefore
Even if being not provided with lenticule in fingerprint recognition mould group 10, fingerprint recognition mould group 10 can equally identify fingerprint pattern.
Fourth embodiment
As shown in fig. 7, the electronic equipment of fourth embodiment includes the finger of display screen and the first embodiment or the second embodiment
Line identifies that mould group, the size of fingerprint recognition mould group are the size of half of display screen, and fingerprint recognition mould is mounted on the lower section of display screen,
And the lower half portion of the display screen of electronic equipment is set, to make the range of half of screen under the display screen of electronic equipment can be into
Row fingerprint recognition.
In the present embodiment, display screen 30 includes multiple pixel units, and gap is equipped between adjacent pixel unit, anti-through finger
The light penetrated is located at the fingerprint recognition chip 13 of 30 lower section of display screen through gap directive, can converge through the light in gap, therefore
Even if being not provided with lenticule in fingerprint recognition mould group 10, fingerprint recognition mould group 10 can equally identify fingerprint pattern.
5th embodiment
As shown in figure 8, the electronic equipment of the 5th embodiment includes the finger of display screen and the first embodiment or the second embodiment
Line identifies mould group, and the size of fingerprint recognition mould group 10 and the size for being less than display screen, fingerprint recognition mould are mounted under display screen
Side, a certain local location of the display screen of electronic equipment is arranged in fingerprint recognition mould group, to make display screen and optical finger print mould
The corresponding position of group has the function of fingerprint recognition.
In the present embodiment, display screen 30 includes multiple pixel units, and gap is equipped between adjacent pixel unit, anti-through finger
The light penetrated is located at the fingerprint recognition chip 13 of 30 lower section of display screen through gap directive, can converge through the light in gap, therefore
Even if being not provided with lenticule in fingerprint recognition mould group 10, fingerprint recognition mould group 10 can equally identify fingerprint pattern.
In the accompanying drawings, for clarity, the size and relative size of layer and region can be exaggerated.It should be understood that working as
When element such as layer, region or substrate are referred to as on " being formed in ", " setting exists " or " being located at " another element, which can be straight
It connects and is arranged on another element, or there may also be intermediary elements.On the contrary, when element be referred to as " being formed directly into " or
When on " being set up directly on " another element, intermediary element is not present.
Herein unless specifically defined or limited otherwise, term " installation ", " connected ", " connection " should do broad sense reason
Solution, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can be mechanical connection, it can also be with
It is electrical connection;It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary.
For the ordinary skill in the art, the concrete meaning of above-mentioned term can be understood with concrete condition.
Herein, term " on ", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outside", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal" is to be based on the orientation or positional relationship shown in the drawings, merely to expression skill
The clear and description of art scheme is convenient, therefore should not be understood as limiting the present invention.
Herein, sequence adjective " first ", " second " for describing element etc. is used for the purpose of discriminative attributes class
As element, be not meant to that the element described in this way must be according to given sequence or time, space, grade or other
Limitation.
Herein, unless otherwise indicated, " multiple ", " several " are meant that two or more.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Herein, the terms "include", "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, are removed
It comprising those of listed element, but also may include other elements that are not explicitly listed.
Above description is only a specific implementation of the present invention, but the protection scope of the utility model is not limited to
In this, anyone skilled in the art within the technical scope disclosed by the utility model, can readily occur in variation
Or replacement, it should be covered within the scope of the utility model.Therefore, the protection scope of the utility model should be with the power
Subject to the protection scope that benefit requires.
Claims (10)
1. a kind of fingerprint recognition mould group, which is characterized in that including wiring board (11), fingerprint recognition chip (13) and light processing elements
Part (15), the fingerprint recognition chip (13) are set on the wiring board (11), and the light processing element (15) is set to described
For fingerprint recognition chip (13) far from the one side of the wiring board (11), the fingerprint recognition chip (13) is electrically connected at institute
It states wiring board (11), is opened up fluted (112) on the wiring board (11), the fingerprint recognition chip (13) is at least partially disposed in
In the groove (112).
2. fingerprint recognition mould group as described in claim 1, which is characterized in that the light processing element (15) is optical filter.
3. fingerprint recognition mould group as described in claim 1, which is characterized in that the light processing element (15) is stenopeic spectacle
Head, the fingerprint recognition chip (13) are equipped with filter coating far from the side of the wiring board (11).
4. fingerprint recognition mould group as claimed in any one of claims 1-3, which is characterized in that the fingerprint recognition chip (13)
It is set in the groove (112) with the light processing element (15).
5. fingerprint recognition mould group as claimed in claim 4, which is characterized in that the fingerprint recognition chip (13) passes through gold thread
(17) it is electrically connected at the wiring board (11), the wiring board (11) is equipped with the first pad (114), the fingerprint recognition core
Piece (13) is equipped with the second pad (132), and the both ends of the gold thread (17) are respectively welded in first pad (114) and described
Second pad (132).
6. fingerprint recognition mould group as claimed in claim 5, which is characterized in that the groove (112) includes the first slot of connection
(1121) and the second slot (1123), first slot (1121) are located at the bottom of the wiring board (11), second slot
(1123) size is greater than the size of first slot (1121), the first slot of Yu Suoshu (1121) and second slot (1123)
Junction forms step (113), and first pad (114) is set at the step (113) of the wiring board (11).
7. fingerprint recognition mould group as described in claim 1, which is characterized in that the fingerprint recognition mould group further includes stiffening plate
(19), the stiffening plate (19) is fixedly connected with the wiring board (11).
8. fingerprint recognition mould group as claimed in claim 7, which is characterized in that the stiffening plate (19) is embedded at the wiring board
(11) in.
9. a kind of electronic equipment, which is characterized in that know including fingerprint described in display screen (30) and claim 1-8 any one
Other mould group (10), the fingerprint recognition mould group (10) are set to the lower section of the display screen (30), and the display screen (30) includes more
A pixel unit is equipped with gap between the adjacent pixel unit.
10. electronic equipment as claimed in claim 9, which is characterized in that the size and shape of the fingerprint recognition mould group (10)
Identical as the size and shape of the display screen, the fingerprint recognition mould group (10) and the display screen (30) are completely corresponding to be set
It sets;Alternatively, the size of the fingerprint recognition mould group is the size of half of display screen, the fingerprint recognition mould group is arranged in electricity
The lower half portion of the display screen of sub- equipment;Alternatively, the size of the fingerprint recognition mould group (10) be less than the display screen
Size, a local location of the display screen is arranged in the fingerprint recognition mould group.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920637362.XU CN209708151U (en) | 2019-05-06 | 2019-05-06 | Fingerprint recognition mould group and electronic equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920637362.XU CN209708151U (en) | 2019-05-06 | 2019-05-06 | Fingerprint recognition mould group and electronic equipment |
Publications (1)
Publication Number | Publication Date |
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CN209708151U true CN209708151U (en) | 2019-11-29 |
Family
ID=68649589
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Application Number | Title | Priority Date | Filing Date |
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CN201920637362.XU Expired - Fee Related CN209708151U (en) | 2019-05-06 | 2019-05-06 | Fingerprint recognition mould group and electronic equipment |
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CN (1) | CN209708151U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022056936A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
WO2022056935A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
-
2019
- 2019-05-06 CN CN201920637362.XU patent/CN209708151U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022056936A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
WO2022056935A1 (en) * | 2020-09-21 | 2022-03-24 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201210 Address after: 3 / F, factory building No.1, No.3, Taihong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Kunshanqiu titanium biometric technology Co.,Ltd. Address before: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Suzhou, Jiangsu Province, 215300 Patentee before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191129 |