CN209627801U - A kind of high-performance bending-type wiring board - Google Patents
A kind of high-performance bending-type wiring board Download PDFInfo
- Publication number
- CN209627801U CN209627801U CN201821877184.XU CN201821877184U CN209627801U CN 209627801 U CN209627801 U CN 209627801U CN 201821877184 U CN201821877184 U CN 201821877184U CN 209627801 U CN209627801 U CN 209627801U
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- CN
- China
- Prior art keywords
- copper foil
- carbon copper
- prepreg
- wiring board
- bending
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to rolling machine field more particularly to a kind of high-performance bending-type wiring boards, including glass cloth, the prepreg mutually be bonded with the glass cloth, the painting carbon copper foil mutually be bonded with the another side of the prepreg；The painting carbon copper foil is set as latticed；The bending part for applying carbon copper foil is covered with bending reinforcing chip far from the prepreg side；When the wiring board of the utility model encounters thermal shock, latticed painting carbon copper foil is just by the surface tension balance of upper and lower, left and right, to reduce the deformation for applying carbon copper foil, in addition, bending finishing strips are laid in the bent area for applying carbon copper foil, for reinforcing the intensity and flexibility of changeover portion, the wiring board of the utility model is made to can guarantee its good electric conductivity in the bent state.
Description
Technical field
The utility model relates to wiring board art more particularly to a kind of high-performance bending-type wiring boards.
Background technique
Wiring board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Currently used wiring board is divided into hardboard, soft board and Rigid Flex, wherein soft board and Rigid Flex are main
Connecting portion in electronic product, such as flex cable, liquid crystal module etc. are applied, soft board and Rigid Flex have compared to hardboard
Have the advantages that it is small in size, light-weight, bent flexure, stereoscopic three-dimensional assembling, still, soft board and Rigid Flex also have once
Property initial cost is high, changes and repair the disadvantages of relatively difficult, size is limited by production equipment, misoperation is easy to damage.
Utility model content
The purpose of this utility model mainly according to the deficiency present on, provides a kind of high-performance bending-type wiring board, replaces
It can be bent function, and guarantee its high-performance for soft board, the realization of soft or hard combination version.
To achieve the goals above, the technical solution of the utility model is:
A kind of high-performance bending-type wiring board, it is and described including glass cloth, the prepreg mutually be bonded with the glass cloth
The painting carbon copper foil that the another side of prepreg is mutually bonded；The painting carbon copper foil is set as latticed；The painting carbon copper foil
Bending part is covered with bending reinforcing chip far from the prepreg side.
Preferably, the glass cloth surface is equipped with epoxy coating.
Preferably, the bending reinforcing chip includes multiple the first parallel finishing strips and two the second parallel reinforcement
Item, the both ends of multiple first finishing strips are connected with second finishing strips respectively, first finishing strips and line
The doubling direction of road plate is parallel.
Preferably, the prepreg includes the first prepreg and the second prepreg, and the painting carbon copper foil includes
First applies carbon copper foil layer and the second painting carbon copper foil layer；The one side of the glass cloth is Nian Jie with first prepreg, the glass
The another side of glass cloth is Nian Jie with second prepreg, and the another side of first prepreg and described first applies carbon copper foil
Layer is mutually bonded, and the another side of second prepreg is mutually be bonded with the second painting carbon copper foil layer.
Preferably, described first carbon copper foil layer and the second painting carbon copper foil layer are applied respectively by multiple painting carbon being parallel to each other
Copper chaff composition, described first, which applies multiple painting carbon copper chaffs of carbon copper foil layer and described second, applies multiple painting carbon copper of carbon copper foil layer
Chaff forms latticed.
It preferably, further include the multiple plated through-holes for making wiring board electrical communication, the plated through-hole runs through the glass
Cloth, the prepreg, the painting carbon copper foil and the bending reinforcing chip.
Preferably, the hole wall of the plated through-hole is equipped with carbon dust layer, copper electroplating layer on the carbon dust layer.
Preferably, the prepreg is connected with the glass cloth by self-adhesion copper foil.
Preferably, the prepreg is mutually be bonded by acrylic size with the painting carbon copper foil.
Due to using above technical scheme, the utility model has the following beneficial effects: half is solid using glass cloth as bottom
Change piece and apply carbon copper foil and combined by adhesion mode, form the wiring board substrate of bendable, when wiring board is single-layer wire
When the plate of road, painting carbon copper foil is distributed in grid, when the wiring board of the utility model encounters thermal shock, latticed painting carbon copper
Paillon is just by the surface tension balance of upper and lower, left and right, to reduce the deformation for applying carbon copper foil, in addition, applying carbon copper
The bent area of paillon, which is laid with bending finishing strips, makes the wiring board of the utility model for reinforcing the intensity and flexibility of changeover portion
It can guarantee its good electric conductivity in the bent state.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model first embodiment；
Fig. 2 is the partial enlarged view of the utility model first embodiment；
Fig. 3 is the structural schematic diagram of the utility model second embodiment；
Fig. 4 is the partial enlarged view of the utility model second embodiment；
Fig. 5 is the top view of the utility model first embodiment.
In figure: 1, glass cloth；11, epoxy coating；2, prepreg；21, the first prepreg；22, the second half solid
Change piece；3, carbon copper foil is applied；31, first carbon copper foil layer is applied；32, second carbon copper foil layer is applied；4, reinforcing chip is bent；41, it first mends
Strong item；42, the second finishing strips；5, self-adhesion copper foil；6, plated through-hole.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
It removes, be fully described by, wherein the drawings are for illustrative purposes only and are merely schematic diagrams, rather than pictorial diagram, Bu Nengli
Solution is the limitation to this patent；In order to better illustrate the utility model embodiment, the certain components of attached drawing have omission, amplification
Or reduce, do not represent the size of actual product；It will be understood by those skilled in the art that certain known features and its explanation in attached drawing
May omit will be understood by.
The described embodiments are only a part of the embodiments of the utility model for the utility model, rather than whole implementation
Example.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without making creative work
The every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment is described in detail:
A kind of high-performance bending-type wiring board, such as Fig. 1, be the utility model first embodiment, including glass cloth 1, with
The prepreg 2 of 1 phase of the glass cloth bonding, the painting carbon copper foil 3 mutually be bonded with the another side of the prepreg 2 are described
It applies carbon copper foil 3 and is set as latticed；The bending part for applying carbon copper foil 3 is covered with bending far from 2 side of prepreg
Reinforcing chip 4.
It is bottom with glass cloth 1, wherein less than 25 μm, prepreg 2 and painting carbon copper foil 3 pass through the thickness of glass cloth 1
Adhesion mode combines, and forms the wiring board substrate of bendable, and when wiring board is single layer wiring board, applying carbon copper foil 3 is
Distributed in grid, latticed setting can be when the wiring board of the utility model encounter thermal shock, latticed painting carbon copper foil 3
Just by the surface tension balance of upper and lower, left and right, to reduce the deformation for applying carbon copper foil 3, in addition, applying carbon copper foil
3 bent area setting bending reinforcing chip 4 makes the wiring board of the utility model i.e. for reinforcing the intensity and flexibility of changeover portion
Make also to can guarantee its good electric conductivity in the bent state.
Further, 1 surface of glass cloth is equipped with epoxy coating 11, and the processing of glass cloth 1 can also be using leaching
The mode of stain, epoxy resin have low elasticity speciality, and the epoxy resin-impregnated in glass cloth 1 can reduce the rebound of glass cloth 1
Power makes this wiring board be less likely to occur to spring back in bending.
Further, the bending reinforcing chip 4 includes multiple the first parallel finishing strips 41 and two articles parallel the
Two finishing strips 42, the both ends of multiple first finishing strips 41 are connected with second finishing strips 42 respectively, and described
One finishing strips 41 are parallel with the doubling direction of wiring board.Bending reinforcing chip 4 is used to reinforce the intensity and flexibility of changeover portion, makes
The wiring board of the utility model can guarantee its good electric conductivity in the bent state, specifically, finishing strips 41 it
Between gap is set, light weight, flexibility is good, easy to implement, can effectively avoid wiring board fracture or wiring board is in bending
The fold for generating large area influences reinforcing effect.
Be the second embodiment of the utility model such as Fig. 3, a kind of high-performance bending-type wiring board, including glass cloth 1, with
The prepreg 2 of 1 phase of the glass cloth bonding, the painting carbon copper foil 3 mutually be bonded with the another side of the prepreg 2 are described
It applies carbon copper foil 3 and is set as latticed；The bending part for applying carbon copper foil 3 is covered with bending far from 2 side of prepreg
Reinforcing chip 4.Wherein, the prepreg 2 includes the first prepreg 21 and the second prepreg 22, the painting carbon copper foil 3
Carbon copper foil layer 31 and the second painting carbon copper foil layer 32 are applied including first；The one side of the glass cloth 1 and first prepreg 21
Bonding, the another side of the glass cloth 1 is Nian Jie with second prepreg 22, the another side of first prepreg 21 and
Described first applies 31 phase of carbon copper foil layer bonding, and the another side of second prepreg 22 applies 32 phase of carbon copper foil layer with described second
Bonding；Described first applies carbon copper foil layer 31 and the second painting carbon copper foil layer 32 respectively by multiple painting carbon copper chaffs being parallel to each other
Composition, described first, which applies multiple painting carbon copper chaffs of carbon copper foil layer 31 and described second, applies multiple painting carbon copper foils of carbon copper foil layer 32
Bar shaped is at latticed.The copper foil of existing double-layered circuit board mostly uses the same design, is easy the impact in thermal expansion in this way
Under make wiring board toward the same direction expansion cause wiring board to deform the phenomenon that, and the utility model by two sides painting carbon copper foil
Piece first applies carbon copper foil layer 31 and the second painting carbon copper foil layer 32 be designed to just be formed it is latticed, just by the surface on two sides
Power is in direction balance up and down, to reduce the significantly deformation of wiring board, applies the wiring board in relatively each face of carbon copper chaff
Angle be preferably 45 degree.
It further, further include connecting wiring board electrically in the first embodiment of the utility model and second embodiment
Logical multiple plated through-holes 6, the plated through-hole 6 run through the glass cloth 1, the prepreg 2, the painting carbon copper foil 3
And the bending reinforcing chip 4 realizes the electrical communication effect of the tow sides of double-layered circuit board by setting plated through-hole 6,
In, the region of bending reinforcing chip 4 is again provided with plated through-hole 6.
Further, in the first embodiment of the utility model and second embodiment, the hole wall of the plated through-hole 6
It is equipped with carbon dust layer, copper electroplating layer on the carbon dust layer.Carbon dust layer and layers of copper can further enhance the utility model circuit board
Electric conductivity.
Further, in the first embodiment of the utility model and second embodiment, the prepreg 2 with it is described
Glass cloth 1 is connected by self-adhesion copper foil 5.Self-adhesion copper foil 5 play the role of prepreg 2 is be bonded with glass cloth 1
Except, self-adhesion copper foil 5 also has good conductive property, and avoids other adhesive substances due to causing containing megohmite insulant
The loss of electrical property.
Further, in the first embodiment of the utility model and second embodiment, the prepreg 2 with it is described
It applies carbon copper foil 3 to be mutually bonded by acrylic size, the acrylic size is half fixed line state, and feature is without other
Ring, for thickness between 0.013mm to 0.05mm, the mobility of glue is less than 0.2mm, only serves connection in use
Effect, the effect without any insulation.
Obviously, above-described embodiment of the utility model patent is only intended to clearly illustrate made by the utility model patent
Citing, and it is not the restriction to the embodiment of the utility model patent.For those of ordinary skill in the art,
Other different forms of changes or modifications may be made based on the above description.There is no need and unable to all realities
The mode of applying is exhaustive.All any modifications made within the spirit and principle of the utility model patent and change equivalent replacement
Into etc., it should be included within the utility model scope of the claims.
Claims (9)
1. a kind of high-performance bending-type wiring board, it is characterised in that: including glass cloth (1), mutually be bonded with the glass cloth (1)
Prepreg (2), the painting carbon copper foil (3) mutually be bonded with the another side of the prepreg (2)；
The painting carbon copper foil (3) is set as latticed；
The bending part for applying carbon copper foil (3) is covered with bending reinforcing chip (4) far from the prepreg (2) side.
2. a kind of high-performance bending-type wiring board according to claim 1, it is characterised in that: glass cloth (1) surface
Equipped with epoxy coating (11).
3. a kind of high-performance bending-type wiring board according to claim 1, it is characterised in that: the bending reinforcing chip (4)
Including multiple parallel the first finishing strips (41) and two parallel the second finishing strips (42), multiple first finishing strips
(41) both ends are connected with second finishing strips (42) respectively, the folding line of the first finishing strips (41) and wiring board
Direction is parallel.
4. a kind of high-performance bending-type wiring board according to claim 1, it is characterised in that: prepreg (2) packet
The first prepreg (21) and the second prepreg (22) are included, the painting carbon copper foil (3) includes the first painting carbon copper foil layer (31)
And second apply carbon copper foil layer (32)；The one side of the glass cloth (1) is Nian Jie with the first prepreg (21), the glass cloth
(1) another side is Nian Jie with the second prepreg (22), the another side and described first of first prepreg (21)
It applies carbon copper foil layer (31) to be mutually bonded, the another side of second prepreg (22) applies carbon copper foil layer (32) with described second and mutually glues
It connects.
5. a kind of high-performance bending-type wiring board according to claim 4, it is characterised in that: described first applies carbon copper foil layer
(31) and second painting carbon copper foil layer (32) is made of multiple painting carbon copper chaffs being parallel to each other respectively, and described first applies carbon copper
Multiple painting carbon copper chaffs that multiple painting carbon copper chaffs of layers of foil (31) apply carbon copper foil layer (32) with described second form latticed.
6. according to claim 1 to a kind of high-performance bending-type wiring board described in 5 any one, it is characterised in that: further include
Make multiple plated through-holes (6) of wiring board electrical communication, the plated through-hole (6) runs through the glass cloth (1), the semi-solid preparation
Piece (2), the painting carbon copper foil (3) and the bending reinforcing chip (4).
7. a kind of high-performance bending-type wiring board according to claim 6, it is characterised in that: the plated through-hole (6)
Hole wall is equipped with carbon dust layer, copper electroplating layer on the carbon dust layer.
8. according to claim 1 to a kind of high-performance bending-type wiring board described in 5 any one, it is characterised in that: described half
Cured sheets (2) are connected with the glass cloth (1) by self-adhesion copper foil (5).
9. according to claim 1 to a kind of high-performance bending-type wiring board described in 5 any one, it is characterised in that: described half
Cured sheets (2) are mutually be bonded by acrylic size with the painting carbon copper foil (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821877184.XU CN209627801U (en) | 2018-11-15 | 2018-11-15 | A kind of high-performance bending-type wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821877184.XU CN209627801U (en) | 2018-11-15 | 2018-11-15 | A kind of high-performance bending-type wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209627801U true CN209627801U (en) | 2019-11-12 |
Family
ID=68443937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821877184.XU Expired - Fee Related CN209627801U (en) | 2018-11-15 | 2018-11-15 | A kind of high-performance bending-type wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209627801U (en) |
-
2018
- 2018-11-15 CN CN201821877184.XU patent/CN209627801U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20191122 Address after: Jiaxing City, Zhejiang province 314300 Xitang Haiyan County Yongning Bridge Street East Community Neighborhood Committee Patentee after: Jiaxing Bangbo Electronic Science & Technology Co., Ltd. Address before: 330500 Jiangxi province Nanchang Honggutan former Lake Avenue No. 999 No. 179 unit area incense Ting Room 302 Patentee before: Nanchang Jinxuan Technology Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191112 Termination date: 20201115 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |