CN209627690U - A kind of MEMS microphone and microphone connecting structure of Rimless equipment - Google Patents

A kind of MEMS microphone and microphone connecting structure of Rimless equipment Download PDF

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Publication number
CN209627690U
CN209627690U CN201822014441.3U CN201822014441U CN209627690U CN 209627690 U CN209627690 U CN 209627690U CN 201822014441 U CN201822014441 U CN 201822014441U CN 209627690 U CN209627690 U CN 209627690U
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China
Prior art keywords
substrate region
microphone
substrate
mems microphone
mems
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Application number
CN201822014441.3U
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Chinese (zh)
Inventor
叶菁华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yutaixin Microelectronics Technology Shanghai Co Ltd
Zilltek Technology Corp
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Yutaixin Microelectronics Technology Shanghai Co Ltd
Zilltek Technology Corp
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Application filed by Yutaixin Microelectronics Technology Shanghai Co Ltd, Zilltek Technology Corp filed Critical Yutaixin Microelectronics Technology Shanghai Co Ltd
Priority to CN201822014441.3U priority Critical patent/CN209627690U/en
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Publication of CN209627690U publication Critical patent/CN209627690U/en
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Abstract

A kind of MEMS microphone in Rimless equipment, including substrate, the substrate include first substrate region and the second substrate region, and Acoustic sensor, special integrated chip and MEMS chip is arranged in first substrate region, and multiple pads are arranged in the second substrate region;First substrate region and the second substrate region are set to the same side of the substrate;Acoustics through-hole is arranged in first substrate region back;It further include flexible circuit board for the microphone connecting structure of Rimless equipment, flexible circuit partitioned signal connects multiple pads of MEMS microphone to the circuit board of Rimless equipment;Acoustics register on acoustics through-hole and Rimless equipment;Increase its application range using MEMS microphone in a kind of Rimless equipment, such as smart phone, the high-new electronic technology field such as video camera is more described, and traditional MEMS microphone property is higher.

Description

A kind of MEMS microphone and microphone connecting structure of Rimless equipment
Technical field
The utility model relates to a kind of microphone products field more particularly to a kind of MEMS (Micro- of Rimless equipment Electro-Mechanical Systems, Micro Electro Mechanical System) microphone.
Background technique
The advantages that MEMS microphone has small in size at present, heat-resist, is easily integrated is widely used.One traditional The encapsulating structure of MEMS microphone generally includes MEMS chip and special integrated chip, and the two is arranged at circuit board and shell The cavity internal cavity being collectively formed is connected to structural outer by sound hole, and position is arranged MEMS microphone according to sound hole in people in the industry Structure is divided into the MEMS microphone of two kinds of structures of advance sound and laggard sound, and advance sound acoustic aperture is arranged on the shell, laggard speech hole On circuit boards, the general same laggard sound of chip has higher performance, furthermore the MEMS microphone package of advance sound for setting Structure and preparation method thereof the deficiencies of there are at high cost, step is complicated, technology difficulty is high.
Summary of the invention
For some drawbacks and limitation of MEMS microphone universal now, now provide a kind of laggard sound structure it is simple, Improve the MEMS microphone and microphone connecting structure in a kind of Rimless equipment of quality.
Specific technical solution is as follows:
MEMS microphone in a kind of Rimless equipment, which is characterized in that including substrate, the substrate includes first substrate Acoustic sensor is arranged in region and the second substrate region, the first substrate region, and multiple welderings are arranged in the second substrate region Disk, the pad are evenly distributed on the second substrate region;The first substrate region and the second substrate region setting In the same side of the substrate;Acoustics through-hole is set on the first substrate region.
Preferably, MEMS chip and dedicated IC chip, a metal cover body are also set up on the first substrate region Cover the Acoustic sensor, the dedicated IC chip and the MEMS chip.
Preferably, dust-proof stratum reticulare is arranged in first substrate region back, and the dust-proof stratum reticulare covers the acoustics through-hole.
Preferably, the substrate is in long strip.
It further include flexible circuit board for the microphone connecting structure of Rimless equipment, the flexible circuit partitioned signal connects Multiple pads of the MEMS microphone are connect to the circuit board of the Rimless equipment.
Acoustics register on the acoustics through-hole and the Rimless equipment.
Preferably, the MEMS microphone further includes support member, the fixed MEMS microphone of the support member To the Rimless equipment.
Preferably, the MEMS microphone is the microphone of laggard sound.
Preferably, the dust-proof stratum reticulare is using dust-proof stratum reticulare made of silica-base material.
Preferably, the MEMS microphone can be used in Rimless equipment.
The beneficial effect of above-mentioned utility model is:
1) MEMS microphone in a kind of Rimless equipment is used to increase its application range, such as smart phone, camera shooting The high-new electronic technology field such as machine.
2) higher using the MEMS microphone traditional MEMS microphone property.
Detailed description of the invention
Fig. 1 is the MEMS microphone structure general illustration in a kind of Rimless equipment described in the utility model.
Fig. 2 is the MEMS microphone device figure in a kind of Rimless equipment described in the utility model.
Fig. 3 is the MEMS microphone Facad structure figure in a kind of Rimless equipment described in the utility model.
Fig. 4 is the MEMS microphone bottom surface structure figure in a kind of Rimless equipment described in the utility model.
In attached drawing: 1, MEMS microphone;2, support member;3, flexible circuit board;4, acoustics through-hole;5, Rimless equipment; 6, IC chip;7, first substrate region;8, dust-proof stratum reticulare;9, a metal cover body;10, Acoustic sensor;11, the second base Plate region;12, MEMS chip
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work Under every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can To be combined with each other.
1 to attached drawing 3 and specific embodiment, the utility model is described in further detail with reference to the accompanying drawing, but not as this reality With novel restriction.
As shown, the MEMS microphone in a kind of Rimless equipment includes: including substrate, the substrate includes the first base Acoustic sensor 10, the second substrate region 11 is arranged in plate region 7 and the second substrate region 11, the first substrate region 7 Multiple pads are set, and the pad is evenly distributed on the second substrate region;The first substrate region 7 and second base Plate region 11 is set to the same side of the substrate;Acoustics through-hole 4 is set on the first substrate region 7.
In the preferred embodiment of the utility model, 6 He of dedicated IC chip is also set up on the first substrate region 7 MEMS chip 12, a metal cover body 9 cover the Acoustic sensor 10, the dedicated IC chip 6 and the MEMS Chip 12.
In the preferred embodiment of the utility model, dust-proof stratum reticulare 8, the Air Filter are set on the first substrate region 7 The 8 covering acoustics through-hole 4 of layer, the entrance for sound.
In the preferred embodiment of the utility model, the substrate is in long strip.
It further include flexible circuit board 3 for the microphone connecting structure of Rimless equipment, 3 signal of flexible circuit board Multiple pads of the MEMS microphone 1 are connected to the circuit board of the Rimless equipment 5.
In the preferred embodiment of the utility model, the acoustics through-hole 4 and the acoustics opening pair in the Rimless equipment 5 Together.
In the preferred embodiment of the utility model, the MEMS microphone 1 further includes support member 2, the support portion Part 2 fixes the MEMS microphone 1 to the Rimless equipment 5.
In the preferred embodiment of the utility model, the MEMS microphone 1 is the microphone of laggard sound, before more traditional MEMS microphone into sound has better performance.
In the preferred embodiment of the utility model, the dust-proof stratum reticulare 8, can using dust-proof stratum reticulare made of silica-base material Waterproof and high temperature resistant.
In the preferred embodiment of the utility model, the MEMS microphone can be used in Rimless equipment.
The foregoing is merely the utility model preferred embodiment, be not intended to limit the embodiments of the present invention and Protection scope should can appreciate that all in the utility model specification and diagram to those skilled in the art Hold made equivalent replacement and obviously change obtained scheme, the protection model of the utility model should all be included in In enclosing.

Claims (9)

1. a kind of MEMS microphone of Rimless equipment, which is characterized in that including substrate, the substrate includes first substrate region With the second substrate region, Acoustic sensor is arranged in the first substrate region, and multiple pads, institute is arranged in the second substrate region It states pad and is evenly distributed on the second substrate region;The first substrate region and the second substrate region are set to described The same side of substrate;Acoustics through-hole is set on the first substrate region.
2. MEMS microphone according to claim 1, which is characterized in that also set up dedicated collection on the first substrate region At circuit chip and MEMS chip, a metal cover body covers the Acoustic sensor and the dedicated IC chip.
3. MEMS microphone according to claim 1, which is characterized in that Air Filter is arranged in first substrate region back Layer, the dust-proof stratum reticulare cover the acoustics through-hole.
4. MEMS microphone according to claim 1, which is characterized in that the substrate is in long strip.
5. being used for the microphone connecting structure of Rimless equipment, which is characterized in that including MEMS Mike as claimed in claim 3 Wind,
It further include flexible circuit board, the flexible circuit partitioned signal connects multiple pads of the MEMS microphone to described The circuit board of Rimless equipment,
Acoustics register on the acoustics through-hole and the Rimless equipment.
6. microphone connecting structure according to claim 5, which is characterized in that it further include support member, the support portion Part fixes the MEMS microphone to the Rimless equipment.
7. microphone connecting structure according to claim 5, which is characterized in that the MEMS microphone is the wheat of laggard sound Gram wind.
8. microphone connecting structure according to claim 5, which is characterized in that the dust-proof stratum reticulare uses silica-base material system At dust-proof stratum reticulare.
9. microphone connecting structure according to claim 5, which is characterized in that the MEMS microphone is set for Rimless It is standby.
CN201822014441.3U 2018-12-03 2018-12-03 A kind of MEMS microphone and microphone connecting structure of Rimless equipment Active CN209627690U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822014441.3U CN209627690U (en) 2018-12-03 2018-12-03 A kind of MEMS microphone and microphone connecting structure of Rimless equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822014441.3U CN209627690U (en) 2018-12-03 2018-12-03 A kind of MEMS microphone and microphone connecting structure of Rimless equipment

Publications (1)

Publication Number Publication Date
CN209627690U true CN209627690U (en) 2019-11-12

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Application Number Title Priority Date Filing Date
CN201822014441.3U Active CN209627690U (en) 2018-12-03 2018-12-03 A kind of MEMS microphone and microphone connecting structure of Rimless equipment

Country Status (1)

Country Link
CN (1) CN209627690U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109327784A (en) * 2018-12-03 2019-02-12 钰太芯微电子科技(上海)有限公司 A kind of MEMS microphone of Rimless equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109327784A (en) * 2018-12-03 2019-02-12 钰太芯微电子科技(上海)有限公司 A kind of MEMS microphone of Rimless equipment
CN109327784B (en) * 2018-12-03 2024-03-29 钰太芯微电子科技(上海)有限公司 MEMS microphone of borderless equipment

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