CN209607697U

CN209607697U - A kind of novel semi-conductor encapsulating mould and packaging system

Info

Publication number: CN209607697U
Application number: CN201920826112.0U
Authority: CN
Inventors: 房波
Original assignee: Qingdao Zhongcheng Precision Mould Co Ltd
Current assignee: Qingdao Zhongcheng Precision Mould Co Ltd
Priority date: 2019-06-03
Filing date: 2019-06-03
Publication date: 2019-11-08
Anticipated expiration: 2029-06-03

Abstract

The utility model relates to sealed in unit technical fields, and disclose a kind of novel semi-conductor encapsulating mould and packaging system, solves encapsulating mould currently on the market, under powerful injection pressure, substrate and chip can deform, cause the fracture of chip or substrate, thus the problem of causing the failure of product function, it includes upper module, the upper module bottom offers capacity chamber, upper module bottom offers upper impression far from the side of capacity chamber, upper module bottom is provided with lower module, the utility model, by being provided with buffer spring, telescopic rod, mounting table and sliding slot, biggish injection molding pressure can be generated in injection molding, pressure can squeeze mounting table at this time, certain buffering effect can be played by being arranged so that, then mounting table can carry out certain extruding to buffer spring and telescopic rod, side buffer protection is carried out again in this way, It is avoided under powerful injection pressure well in this way, substrate and chip can deform.

Description

A kind of novel semi-conductor encapsulating mould and packaging system

Technical field

The utility model belongs to sealed in unit technical field, specially a kind of novel semi-conductor encapsulating mould and encapsulation dress It sets.

Background technique

Currently, in field of semiconductor package, injection molding is the technology of comparative maturity, mold mainly include upper mold and Lower mold.Injection molding process mainly divides three steps, the package substrate for having pasted chip is put into lower die die cavity first, and be put into plastic packaging Material；Then upper mold is closed, and mold is heated, plastic packaging material is heated to be melted, and under the promotion of syringe, the plastic packaging material of thawing injects Die cavity wraps up the chip on package substrate；Last plastic packaging material is cooled and solidified and is fully integrated together with package substrate, to core Piece forms protection.

But encapsulating mould currently on the market, under powerful injection pressure, substrate and chip can deform, and cause The fracture of chip or substrate, to cause the failure of product function.

Summary of the invention

For above situation, to overcome the shortcomings of existing technologies, the utility model provides a kind of novel semi-conductor Encapsulation Moulds Tool and packaging system, the encapsulating mould of effective solution currently on the market, under powerful injection pressure, substrate and chip meeting It deforms, causes the fracture of chip or substrate, thus the problem of causing the failure of product function.

To achieve the above object, the utility model provides the following technical solutions: a kind of novel semi-conductor encapsulating mould and envelope Assembling device, including upper module, the upper module bottom offer capacity chamber, and upper module bottom is offered far from the side of capacity chamber Upper impression, upper module bottom are provided with lower module, and lower module surface side offers inlet, and inlet internal activity is equipped with Injection molding machine, lower module top side offer the lower impressions to match with upper impression, and lower impressions internal slide is provided with mounting table, It is placed with substrate at the top of mounting table, substrate top is placed with chip, and mounting table bottom is fixedly installed with telescopic rod, telescopic rod bottom It is fixedly mounted on lower impressions inside bottom, telescopic rod surface is socketed with buffer spring, is fixedly mounted on placement at the top of buffer spring Platform bottom, buffer spring bottom are fixedly mounted on lower impressions surface.

Preferably, the telescopic rod is provided with four groups, and buffer spring surface is coated with antirust agent.

Preferably, the mounting table two sides are fixedly installed with sliding block, and mo(u)ld top half cavity wall two sides are offered to match with sliding block Sliding slot.

Preferably, the upper module two sides of the bottom offer seal groove, and seal groove inner wall two sides open up fluted.

Preferably, two sides are fixedly installed with the sealing block to match with seal groove, sealing block surface at the top of the lower module It is coated with preservative.

Preferably, the sealing block two sides are fixedly installed with the filling block to match with groove, and the material of filling block is resistance to Mill property rubber material.

Compared with prior art, the utility model has the beneficial effects that

1) it, at work, by being provided with buffer spring, telescopic rod, mounting table and sliding slot, can be generated in injection molding larger Injection molding pressure, pressure can squeeze mounting table at this time, and certain buffering effect can be played by being arranged so that, then mounting table can be right Buffer spring and telescopic rod carry out certain extruding, have carried out side buffer protection again in this way, have been avoided well strong in this way Under big injection pressure, substrate and chip can deform, and cause the fracture of chip or substrate, to cause the mistake of product function Effect；

2), by being provided with seal groove, sealing block, groove and filling block, while passing through seal groove and sealing in injection molding Block closure, plays the sealing effect of any in this way, when sealing block and seal groove are closed, so that filling block squeezes into inside grooves, In this way when external force is bigger, groove is bonded tighter with filling block, effectively raises the sealing effect of module entirety in this way, It avoids injection molding solution well to flow back, to cause the waste of resource.

Detailed description of the invention

Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:

Fig. 1 is the overall structure figure of the utility model；

Fig. 2 is the lower impressions cross-sectional view of the utility model；

Fig. 3 is enlarged diagram at the A of the utility model；

In figure: 1, upper module；2, capacity chamber；3, upper impression；4, lower module；5, inlet；6, injection molding machine；7, lower impressions； 8, mounting table；9, substrate；10, chip；11, telescopic rod；12, buffer spring；13, seal groove；14, groove；15, sealing block；16, Filling block.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment；Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Embodiment one, is provided by Fig. 1, Fig. 2 and Fig. 3, and the utility model includes upper module 1, and 1 bottom of upper module offers appearance Chamber 2 is measured, storage effect, 1 bottom of upper module well is played and offers upper impression 3 far from the side of capacity chamber 2, convenient for quick Packaging effect is completed, 1 bottom of upper module is provided with lower module 4, and 4 surface side of lower module offers inlet 5, convenient for solution It rapidly enters, 5 internal activity of inlet is equipped with injection molding machine 6, and 4 top side of lower module is offered to match with upper impression 3 Lower impressions 7,7 internal slide of lower impressions are provided with mounting table 8, are put into convenient for chip 10, and substrate 9, base are placed at the top of mounting table 8 Chip 10 is placed at the top of plate 9,8 bottom of mounting table is fixedly installed with telescopic rod 11, and 11 bottom of telescopic rod is fixedly mounted on mo(u)ld bottom half 7 inside bottom of chamber, 11 surface of telescopic rod are socketed with buffer spring 12, and 8 bottom of mounting table is fixedly mounted at the top of buffer spring 12, 12 bottom of buffer spring is fixedly mounted on 7 surface of lower impressions, plays good buffer protection effect.

Embodiment two, on the basis of example 1, telescopic rod 11 are provided with four groups, and 12 surface of buffer spring is coated with anti- Rust agent, effectively extends service life.

Embodiment three, on the basis of example 1,8 two sides of mounting table are fixedly installed with sliding block, 3 inner wall two sides of upper impression The sliding slot to match with sliding block is offered, is moved up and down convenient for mounting table 8.

Example IV, on the basis of example 1,1 two sides of the bottom of upper module offer seal groove 13, in seal groove 13 Wall two sides open up fluted 14, play good sealing effect.

Embodiment five, on the basis of example 1,4 top two sides of lower module are fixedly installed with to match with seal groove 13 Sealing block 15,15 surface of sealing block is coated with preservative, effectively raises sealing function.

Embodiment six, on the basis of example 1,15 two sides of sealing block are fixedly installed with to be filled out with what groove 14 matched Block 16 is filled, the material of filling block 16 is wearability rubber material, has good sealing effect.

Working principle: when work, pass through injection molding machine 6 first for plastic solution by being injected into upper impression 3 and lower impressions 7 Portion can generate biggish injection molding pressure in injection molding, pressure can squeeze mounting table 8 at this time so effectively to being packaged Pressure, certain buffering effect can be played by being arranged so that, then mounting table 8 can carry out certain squeeze to buffer spring 12 and telescopic rod 11 Pressure has carried out side buffer protection again in this way, has been avoided under powerful injection pressure well in this way, substrate 9 and chip 10 It can deform, cause the fracture of chip 10 or substrate 9, to cause the failure of product function, while in injection molding by close Sealing groove 13 and sealing block 15 are closed, and play the sealing effect of any in this way, when sealing block 15 and seal groove 13 are closed, so that filling out Block 16 is filled to squeeze into inside groove 14, in this way when external force is bigger, groove 14 be bonded with filling block 16 it is tighter, it is effective in this way The sealing effect of module entirety is improved, injection molding solution is avoided well and flows back, to cause the waste of resource.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims

1. a kind of novel semi-conductor encapsulating mould and packaging system, including upper module (1), it is characterised in that: the upper module (1) Bottom offers capacity chamber (2), and upper module (1) bottom offers upper impression (3) far from the side of capacity chamber (2), upper module (1) Bottom is provided with lower module (4), and lower module (4) surface side offers inlet (5), and inlet (5) internal activity is equipped with Injection molding machine (6), lower module (4) top side offer the lower impressions (7) to match with upper impression (3), slide inside lower impressions (7) It is dynamic to be provided with mounting table (8), it is placed with substrate (9) at the top of mounting table (8), is placed with chip (10), mounting table at the top of substrate (9) (8) bottom is fixedly installed with telescopic rod (11), and telescopic rod (11) bottom is fixedly mounted on lower impressions (7) inside bottom, telescopic rod (11) surface is socketed with buffer spring (12), is fixedly mounted on mounting table (8) bottom, buffer spring at the top of buffer spring (12) (12) bottom is fixedly mounted on lower impressions (7) surface.

2. a kind of novel semi-conductor encapsulating mould according to claim 1 and packaging system, it is characterised in that: described flexible Bar (11) is provided with four groups, and buffer spring (12) surface is coated with antirust agent.

3. a kind of novel semi-conductor encapsulating mould according to claim 1 and packaging system, it is characterised in that: the placement Platform (8) two sides are fixedly installed with sliding block, and upper impression (3) inner wall two sides offer the sliding slot to match with sliding block.

4. a kind of novel semi-conductor encapsulating mould according to claim 1 and packaging system, it is characterised in that: the upper mold Block (1) two sides of the bottom offer seal groove (13), and seal groove (13) inner wall two sides open up fluted (14).

5. a kind of novel semi-conductor encapsulating mould according to claim 1 and packaging system, it is characterised in that: the lower die Two sides are fixedly installed with the sealing block (15) to match with seal groove (13) at the top of block (4), and sealing block (15) surface is coated with anti-corrosion Agent.

6. a kind of novel semi-conductor encapsulating mould according to claim 5 and packaging system, it is characterised in that: the sealing Block (15) two sides are fixedly installed with the filling block (16) to match with groove (14), and the material of filling block (16) is wearability rubber Material.