CN209561433U - A kind of solar chip - Google Patents
A kind of solar chip Download PDFInfo
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- CN209561433U CN209561433U CN201822191945.2U CN201822191945U CN209561433U CN 209561433 U CN209561433 U CN 209561433U CN 201822191945 U CN201822191945 U CN 201822191945U CN 209561433 U CN209561433 U CN 209561433U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model relates to technical field of solar, more particularly to a kind of solar chip, the solar chip includes first electrode, second electrode and conductive tie layers, and the first electrode includes the first base material layer, the first conductive layer and photoelectric conversion layer being cascading；The second electrode includes the second substrate layer and the second conductive layer being stacked；The photoelectric conversion layer is connected with second substrate layer by the conductive tie layers.This solar chip provided by the utility model without encapsulating again, and preparation section is relatively easy, and production efficiency is relatively high.
Description
Technical field
The utility model relates to solar chip technical fields, and in particular to a kind of solar chip.
Background technique
With the enhancing of energy conservation and environmental awareness, the popularity rate of the clean energy resourcies such as solar energy is higher and higher, and solar chip is
Part and parcel in device of solar generating.Current solar chip is usually connected by two electrodes and is formed, thus in the sun
Energy chip is after the completion of preparation, it is necessary to integrally Reseal to solar chip, this makes the preparation work of solar chip
Sequence is relatively complicated, is unfavorable for promoting the production efficiency of solar chip.
Utility model content
(1) technical problem to be solved by the utility model is: solar chip still needs to seal again after preparation is completed
Dress, preparation section is relatively complicated, and production efficiency is relatively low.
(2) technical solution
In order to realize above-mentioned technical problem, the utility model provides a kind of solar chip comprising: first electrode,
The first electrode includes the first base material layer, the first conductive layer and photoelectric conversion layer being cascading；
Second electrode, the second electrode include the second substrate layer and the second conductive layer being stacked；
Conductive tie layers, the photoelectric conversion layer and second substrate layer are connected by the conductive tie layers.
Optionally, at least one of the first base material layer and second substrate layer are made of material water-proof material.
Optionally, the coefficient of permeability of the material water-proof material is not more than 10﹣ 2cm/s。
Optionally, solar chip provided herein further includes alignment layers, the first base material layer and described first
The alignment layers are provided between conductive layer, the alignment layers have positioning groove, and it is described fixed that first conductive layer is set to
In the groove of position.
Optionally, solar chip provided herein further includes alignment layers, second conductive layer and described second
The alignment layers are provided between substrate layer, the alignment layers have positioning groove, and it is described fixed that second conductive layer is set to
In the groove of position.
Optionally, the alignment layers are made of light-sensitive emulsion.
Optionally, the first electrode further includes light-absorption layer, and the light-absorption layer is set to the first base material layer and described
Between first conductive layer.
Optionally, the light-absorption layer is made of the high molecular material of black.
Optionally, the first electrode further includes heat dissipating layer, the heat dissipating layer be set to the first base material layer with it is described
Between light-absorption layer.
Optionally, in the first electrode and the second electrode, at least one includes metallic silver.
Beneficial effect
In solar chip provided by the utility model, first electrode and second electrode respectively include first base material layer and
Second substrate layer, and then after solar chip preparation is completed, first base material layer and the second substrate layer can be the first electricity
Pole and second electrode provide protective effect, so that the solar chip is not necessarily to encapsulate again, and first electrode and second electrode are straight
Conductive tie layers connection was connected, simplifies the preparation section of solar chip, preparation process is simple, this can promote the sun
The production efficiency of energy chip.
Detailed description of the invention
The advantages of the utility model is above-mentioned and/or additional aspect will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the schematic cross-section of first electrode in solar chip provided by the utility model embodiment；
Fig. 2 is the schematic cross-section of second electrode in solar chip provided by the utility model embodiment；
Fig. 3 is the schematic cross-section of solar chip provided by the utility model embodiment；
Fig. 4 is the schematic diagram of part-structure in solar chip provided by the utility model embodiment；
Fig. 5 is a kind of flow chart of the preparation method of solar chip provided by the utility model embodiment；
Fig. 6 is another flow chart of the preparation method of solar chip provided by the utility model embodiment；
Fig. 7 is another flow chart of the preparation method of solar chip provided by the utility model embodiment；
Fig. 8 is another flow chart of the preparation method of solar chip provided by the utility model embodiment；
Fig. 9 is another flow chart of the preparation method of solar chip provided by the utility model embodiment.
Appended drawing reference
1- alignment layers；
2- conductive layer；
3- substrate layer；
4- heat dissipating layer；
5- light-absorption layer；
6- photoelectric conversion layer；
7- conductive tie layers.
Specific embodiment
In order to be more clearly understood that the above objects, features, and advantages of the utility model, with reference to the accompanying drawing and have
The utility model is further described in detail in body embodiment.It should be noted that in the absence of conflict, this reality
It can be combined with each other with the feature in novel embodiment and embodiment.
As shown in Figure 1-3, the utility model provides a kind of solar chip, preparation section is relatively easy, production efficiency
It is higher.The solar chip includes first electrode and second electrode, and first electrode includes first base material layer, the first conductive layer and light
Electric conversion layer, second electrode include the second substrate layer and the second conductive layer, optionally, first base material layer and the second substrate layer
To be made of same material, thus for the ease of solar chip provided by the utility model is described, and it is convenient for
Understanding to following descriptions hereafter unifies to substitute first base material layer by substrate layer and the second substrate layer correspondingly passes through conduction
Layer replaces the first conductive layer and the second conductive layer.First electrode and second electrode are provided with substrate layer 3, thus completing entirely
After the encapsulation process of photovoltaic module, without carrying out additional package to photovoltaic module again, this can reduce adding for photovoltaic module
Work process, to achieve the purpose that improving production efficiency.Wherein, the photoelectric conversion layer 6 in first electrode can be by conduction even
Layer 7 is connect to connect with the substrate layer 3 in second electrode.Conductive tie layers 7 can by OCA (Optically Clear Adhesive,
Optical cement) etc. formed, the adhesive effect of this bonding agent is preferable, to guarantee substantially will not between first electrode and second electrode
There is separation situation, and optical cement is colorless and transparent, light transmission rate has the generating efficiency for promoting solar chip 90% or more
Larger help；This bonding agent can be in the at a temperature of completion solidification of room temperature, and has the characteristics that cure shrinkage is small, thus right
The processing environment of solar chip it is of less demanding, be conducive to the production cost for further decreasing solar chip.
In order to further ensure the waterproof effect of solar chip provided by the utility model, first electrode and the second electricity
In extremely, the substrate layer 3 of at least one can be not more than 10 by coefficient of permeability﹣ 2The material water-proof material of cm/s is made.Preferably, this is practical
The first electrode of solar chip provided by novel and the substrate layer 3 of second electrode can be made of aforementioned material water-proof material,
To further promote the waterproof performance of entire solar chip.Specifically, substrate layer 3 can be by the film system that blocks water of setting thickness
At this can also promote the deformability of solar chip, so that the solar chip can be according to installation site not
Together, change the structure and shape of itself, flexibly to break solar chip substantially to using region and install the conditions such as landform
Limitation；Meanwhile the weight of entire solar chip can also be reduced to a certain extent the substrate layer 3 made of film that blocks water, from
And promote the properties of product and competitiveness of solar chip.More specifically, the thickness of substrate layer 3 can according to the actual situation really
It is fixed, it is not construed as limiting herein.
Certainly, as shown in figure 3, being removed in the first electrode and second electrode of solar chip provided by the utility model
It further include conductive layer 2 etc. except substrate layer 3.Conductive layer 2 is connect with substrate layer 3, in order to be promoted between conductive layer 2 and substrate layer 3
Connection reliability further include optionally alignment layers 1 in solar chip provided by the utility model, first base material layer and
Alignment layers 1 can be set between first conductive layer, alignment layers also can be set between the second substrate layer and the second conductive layer
1, and positioning groove (not shown) is provided on alignment layers 1, to make the conductive layer 2 of first electrode and second electrode
To be set in corresponding aforementioned positioning groove, and then guarantee between the first conductive layer and first base material layer and second is conductive
Higher connection reliability is all had between layer and the second substrate layer, and then promotes the overall performance of entire photovoltaic module.
In order to reduce the overall processing time of solar chip, further, the alignment layers 1 for carrying conductive layer 2 can
To be made of light-sensitive emulsion, in the preparation process of solar chip, the light-sensitive emulsion of liquid, can be rapid under ultraviolet irradiation
Solidification, to play the role of fixed and carry conductive layer 2, this can greatly reduce the overall processing time of solar chip,
And then promote the production efficiency of solar chip.
Preferably, as shown in Figure 1, in the first electrode of solar chip, a side surface of substrate layer 3 is folded to be equipped with light-absorption layer
5, light-absorption layer 5 can promote the power generation performance of entire photovoltaic module.Journey is bonded between conductive layer 2 and light-absorption layer 5 in order to be promoted
Degree, conductive layer 2 can be connect by materials such as hot melt adhesive with light-absorption layer 5；Alternatively, light-absorption layer 5 can also by other means with
Conductive layer 2 connects, and is not construed as limiting herein.The temperature of entire solar chip is excessively high in order to prevent, and generates not to generating efficiency
Benefit influences, it is preferable that heat dissipating layer 4 is also provided between the substrate layer 3 and light-absorption layer 5 of first electrode, by heat dissipating layer 4
Radiating and cooling effect, promote the generating efficiency of solar chip；Optionally, light-absorption layer 5 can be using dark color, preferably black
High molecular material be made, to promote the extinction efficiency of light-absorption layer 5, achieve the purpose that promoted solar chip generating efficiency.
Specifically, heat dissipating layer 4, light-absorption layer 5 and photoelectric conversion layer 6 can be formed in the using the modes such as coevaporation method or sputtering method
On the substrate layer 3 of one electrode, and in order to guarantee that above-mentioned three has more preferably working performance, it can prepare under vacuum conditions scattered
Thermosphere 4, light-absorption layer 5 and photoelectric conversion layer 6, and during forming light-absorption layer 5, the temperature that can control forming ring border exists
Between 250 DEG C -400 DEG C, pressure is 20 megapascal, to further promote the performance of light-absorption layer 5.As shown in Fig. 2, solar chip
Second electrode in, conductive layer 2 can be formed in the surface of substrate layer 3, and conductive layer 2 can be copper wire, in order to promote itself and base
The laminating degree of material layer 3, conductive layer 2 can be connect by hot melt adhesive etc. with substrate layer 3, alternatively, the conductive layer 2 in second electrode
It can also be connect by alignment layers 1 with substrate layer 3.In addition, in order to guarantee that solar chip can normally and efficiently generate electricity
Work, heat dissipating layer 4, light-absorption layer 5 and photoelectric conversion layer 6, which can be set into, to be completely covered on the basis of respective molding.
In order to promote the generating efficiency of solar chip, electric energy can also be reduced in solar chip, it is especially conductive
Loss in layer 2.Preferably, in the first electrode and second electrode of solar chip provided by the utility model, at least one
The conductive layer 2 of person may include metallic silver, and the resistivity of metallic silver is smaller, to reduce damage when electric current transmits in conductive layer
Consumption achievees the purpose that promote generating efficiency.Preferably, the conductive layer 2 of first electrode and second electrode may each comprise metallic silver,
It is highly preferred that the conductive layer 2 of first electrode and second electrode can be only by metallic silver to make electric energy in solar chip
Interior loss is preferably minimized, and then makes the solar chip in the case where other conditions are constant, and generating efficiency reaches highest.Tool
Body, conductive layer 2 can be formed for metallic silver wire, and it can also be bonded journey by the promotions such as hot melt adhesive and substrate layer 3 etc.
Degree；Alternatively, conductive layer 2 can also be formed with the progress of the process of solar chip, as it can be by the metal of liquid
The certain process of galactic longitude is formed by curing, in this regard, can be not construed as limiting determines according to actual conditions herein.
Based on solar chip provided by any of the above-described embodiment, the utility model also provides a kind of solar chip
Preparation method, as shown in figure 5, the utility model provides a kind of specific embodiment of preparation method:
Step S1, preparation stacks gradually the first electrode formed by first base material layer, the first conductive layer and photoelectric conversion layer；
Step S2, the second electrode formed is laminated by the second substrate layer and the second conductive layer in preparation；
Step S3, the first surface of the second substrate layer is connected by the first surface of conductive tie layers and photoelectric conversion layer.
Specifically, the substrate layer of first electrode and second electrode can be made of material water-proof material, and correspondingly, conductive layer can
To be made of metal material, such as metallic copper or metallic silver, photoelectric conversion layer can be by CIGS (CuInxGa (- x) Se) material systems
At, and photoelectric conversion layer can be formed on the conductive layer of first electrode by modes such as coevaporation method or sputtering methods, thus shape
The first electrode stacked gradually at first base material layer, the first conductive layer and photoelectric conversion layer；Correspondingly, the shape on the second substrate layer
Second electrode can be formed at the second conductive layer, may then pass through the upper smearing in photoelectric conversion layer and/or the second substrate layer
It is used to form the glue of conductive tie layers, such as OCA (Optically Clear Adhesive, optical cement), then passes through connection
The encapsulation process of entire photovoltaic module, and prepared photovoltaic module tool can be completed in photoelectric conversion layer and the second substrate layer
Standby waterproof performance, substantially without encapsulating again, working efficiency is higher.
It should be noted that absolute time sequencing, ability is not present in above-described embodiment between step S1 and step S2
Field technique personnel in the actual operation process, sequencing that can determines according to actual conditions between step S1 and step S2,
It is not further qualified herein.
In order to promote the connection reliability between the first conductive layer and first base material layer, optionally, as shown in fig. 6, this reality
With the specific embodiment of novel offer another kind packaging method, wherein step S1 can also include: S11, In in above-described embodiment
The first surface setting of first base material layer has the alignment layers and S12, the first conduction of setting in positioning groove of positioning groove
Layer.
Specifically, alignment layers can be made of light-sensitive emulsion, can form the positioning with positioning groove using particular mold
Layer, then can form the first conductive layer in aforementioned positioning groove, correspondingly, in the preparation process of preparation first electrode,
The first alignment layers can be made to be set between first base material layer and photoelectric conversion layer, and make positioning groove towards photoelectric conversion layer,
To guarantee the normal work of entire photovoltaic module, in this case, the preparation process of first electrode further includes S13, preparation
The first electrode being cascading by first base material layer, alignment layers, the first conductive layer and photoelectric conversion layer.Correspondingly, first
The preparation sequence of substrate layer, alignment layers and photoelectric conversion layer can also determines according to actual conditions herein not limit this specifically
It is fixed.
In order to further enhance the power generation performance of entire photovoltaic module, it is preferable that photovoltaic group provided by the utility model
Part can also include light-absorption layer, in turn, as shown in fig. 7, the utility model provides another specific embodiment of the preparation method,
It includes, and S14, light-absorption layer and S15 is arranged, in the first surface setting the of light-absorption layer in the first surface of the first conductive layer
One substrate layer.
Specifically, light-absorption layer can preferably be made of the high molecular material of black of dark color, to provide for photoelectric conversion layer
Excellent luminous energy can be by modes such as coevaporation method or sputtering methods, in first base material layer in the preparation process of first electrode
Upper formation light-absorption layer, and the first conductive layer is formed on the surface of light-absorption layer, the surface of the first conductive layer is also formed with photoelectricity and turns
Change layer.Correspondingly, in this case, the preparation process of first electrode further include S16, preparation by first base material layer, light-absorption layer,
The first electrode that first conductive layer and photoelectric conversion layer stack gradually.
Provided preparation method based on the above embodiment, as shown in figure 8, the embodiment makes into one a upper embodiment
Step is improved, i.e., adds heat dissipating layer in the first electrode, and heat dissipating layer is set between light-absorption layer and first base material layer, in turn, this reality
With novel provided preparation method further include: S17, light-absorption layer first surface setting heat dissipating layer and S18, radiating
First base material layer is arranged in the first surface of layer.
Specifically, heat dissipating layer can also be formed in first base material layer and heat dissipating layer using modes such as coevaporation method or sputtering methods
Between, so that the heat dissipation performance of photovoltaic module provided by the utility model is promoted, further to promote the hair of the photovoltaic module
Electrical property.Correspondingly, the preparation process of first electrode can also include: S19, formed first base material layer, heat dissipating layer, light-absorption layer,
The first electrode that first conductive layer and photoelectric conversion layer stack gradually.
Similarly, in order to guarantee to have reliable connection relationship between the second substrate layer and the second conductive layer, this is practical new
Type makes further improvement for first embodiment, and as shown in figure 9, the utility model provides another tool of the preparation method
Body embodiment, step S2 can also include: S21, the second substrate layer first surface setting have positioning groove alignment layers,
And S22, the second conductive layer is set in positioning groove.
Specifically, which can also be made of light-sensitive emulsion, and specific structure and size can be according to the second bases
The actual size of material layer determines.In this case, the preparation process of second electrode can also include S23, form the second substrate
The second electrode that layer, alignment layers and the second conductive layer stack gradually.
It should be noted that the above-mentioned multiple embodiments of the utility model can guarantee photovoltaic module energy according to actual needs
It is freely combined in the case where normal work, in this regard, being not construed as limiting herein.
In the description of the present invention, it should be noted that the orientation or positional relationship of the instructions such as term " on ", "lower"
To be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of describing the present invention and simplifying the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot manage
Solution is limitations of the present invention.In addition, term " first ", " second " are used for description purposes only, and should not be understood as indicating
Or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connection ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be direct connection, can also by intermediary indirect communication,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.In addition, in the description of the present invention, unless otherwise indicated, " multiples' " contains
Justice is two or more.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all practical at this
Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the utility model
Within the scope of shield.
Claims (10)
1. a kind of solar chip characterized by comprising
First electrode, the first electrode include the first base material layer, the first conductive layer and photoelectric conversion layer being cascading；
Second electrode, the second electrode include the second substrate layer and the second conductive layer being stacked；
Conductive tie layers, the photoelectric conversion layer and second substrate layer are connected by the conductive tie layers.
2. solar chip according to claim 1, which is characterized in that the first base material layer and second substrate layer
At least one of be made of material water-proof material.
3. solar chip according to claim 2, which is characterized in that the coefficient of permeability of the material water-proof material is not more than 10﹣ 2cm/s。
4. solar chip according to claim 1, which is characterized in that further include alignment layers, the first base material layer and
The alignment layers are provided between first conductive layer, the alignment layers have positioning groove, the first conductive layer setting
In in the positioning groove.
5. solar chip according to claim 4, which is characterized in that further include another alignment layers, described second leads
Another described alignment layers are provided between electric layer and second substrate layer, another described alignment layers are with another positioning
Groove, second conductive layer are set in another described positioning groove.
6. solar chip according to claim 4 or 5, which is characterized in that the alignment layers are made of light-sensitive emulsion.
7. solar chip according to claim 1, which is characterized in that the first electrode further includes light-absorption layer, described
Light-absorption layer is set between the first base material layer and first conductive layer.
8. solar chip according to claim 7, which is characterized in that the light-absorption layer by black high molecular material system
At.
9. solar chip according to claim 7, which is characterized in that the first electrode further includes heat dissipating layer, described
Heat dissipating layer is set between the first base material layer and the light-absorption layer.
10. solar chip according to claim 1, which is characterized in that in the first electrode and the second electrode,
At least one includes metallic silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822191945.2U CN209561433U (en) | 2018-12-20 | 2018-12-20 | A kind of solar chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822191945.2U CN209561433U (en) | 2018-12-20 | 2018-12-20 | A kind of solar chip |
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| Publication Number | Publication Date |
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| CN209561433U true CN209561433U (en) | 2019-10-29 |
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ID=68304041
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| CN201822191945.2U Active CN209561433U (en) | 2018-12-20 | 2018-12-20 | A kind of solar chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899251A (en) * | 2022-04-25 | 2022-08-12 | 苏州诺菲纳米科技有限公司 | Low-cost and efficient preparation method of solar cell grid line electrode |
-
2018
- 2018-12-20 CN CN201822191945.2U patent/CN209561433U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899251A (en) * | 2022-04-25 | 2022-08-12 | 苏州诺菲纳米科技有限公司 | Low-cost and efficient preparation method of solar cell grid line electrode |
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Effective date of registration: 20201224 Address after: No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Beijing Huihong Technology Co., Ltd Address before: 517000 High-tech Five Road of Heyuan High-tech Development Zone, Guangdong Province Patentee before: GUANGDONG HANERGY THIN-FILM SOLAR Co.,Ltd. |
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Effective date of registration: 20211102 Address after: No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Dongjun new energy Co.,Ltd. Address before: No.31 Yanqi street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee before: Beijing Huihong Technology Co., Ltd |
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