CN209497683U - A kind of insertion mount type multi-layer PCB board - Google Patents
A kind of insertion mount type multi-layer PCB board Download PDFInfo
- Publication number
- CN209497683U CN209497683U CN201821383677.8U CN201821383677U CN209497683U CN 209497683 U CN209497683 U CN 209497683U CN 201821383677 U CN201821383677 U CN 201821383677U CN 209497683 U CN209497683 U CN 209497683U
- Authority
- CN
- China
- Prior art keywords
- layer
- groove
- pcb board
- outer plate
- mounting groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000003780 insertion Methods 0.000 title claims abstract description 27
- 230000037431 insertion Effects 0.000 title claims abstract description 27
- 238000009422 external insulation Methods 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000010410 layer Substances 0.000 claims description 88
- 229920001971 elastomer Polymers 0.000 claims description 9
- 239000000806 elastomer Substances 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 241000446313 Lamella Species 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 9
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model system provides a kind of insertion mount type multi-layer PCB board, including center plate, the two sides of center plate are respectively provided with an outer plate, and center plate includes insulated substrate, the two sides of insulated substrate are respectively provided with a center line layer, and outer plate includes external insulation layer and layer outside the circuit；The first device embedded groove is equipped in outer plate, the first device embedded groove includes the first recessing groove and the first mounting groove, and the radius of the first recessing groove is greater than the radius of the first mounting groove, and the bottom of the first mounting groove exposes center line layer；The second device embedded groove is equipped in center plate and outer plate, the second device embedded groove includes the second recessing groove and the second mounting groove, and the radius of the second recessing groove is greater than the radius of the second mounting groove, and the bottom of the second mounting groove exposes layer outside the circuit.The utility model can the insertion installation of supplied for electronic component, the stability of installation can be effectively improved, avoid electronic component poor contact, large radius allows bit architecture to can be avoided generation short circuit.
Description
Technical field
The utility model relates to multi-layer PCB boards, specifically disclose a kind of insertion mount type multi-layer PCB board.
Background technique
Pcb board is also known as printed circuit board, is the supplier of electronic component electrical connection.Circuit board is used for every field
In, possess unshakable status in the electronics industry.Multi-layer PCB board is made up of core plate and prepreg of pressing.
Pcb board can install various electronic components in application on it, and the mounting means of electronic component is broadly divided into
Two kinds: patch type and direct insertion, direct insertion installation is mainly used for single layer pcb board, and multi-layer PCB board mainly passes through the side of patch
Formula installs electronic component.In the prior art, patch type installation is usually the surface that electronic component is installed on to pcb board, patch
Electronic component loaded on pcb board surface, which is easy to happen, to fall off, and electronic component is easy to happen displacement when being collided, thus
It will lead to and pcb board poor contact, the stability of reduction pcb board entirety.
Utility model content
Based on this, it is necessary to be directed to prior art problem, provide a kind of insertion mount type multi-layer PCB board, peace can be embedded in
Electronic component is filled, the stability of electronic component installation can be effectively improved.
To solve prior art problem, the utility model discloses a kind of insertion mount type multi-layer PCB board, including central plate
Block, the two sides of center plate are respectively provided with an outer plate, and center plate includes insulated substrate, and the two sides of insulated substrate are respectively provided in one
Heart line layer, outer plate include the external insulation layer and layer outside the circuit being stacked, and layer outside the circuit is located at external insulation layer far from center
The side of plate is equipped with conductive communication column between different center line layers and layer outside the circuit；
Be equipped with the first device embedded groove in outer plate, the first device embedded groove include concentric connection the first recessing groove and
First mounting groove, the radius of the first recessing groove are greater than the radius of the first mounting groove, and the first recessing groove and the first mounting groove pass through respectively
The layer outside the circuit and external insulation layer in same outer plate are worn, the bottom of the first mounting groove exposes center line layer；
It is equipped with the second device embedded groove in center plate and outer plate, the second device embedded groove includes the of concentric connection
Two recessing grooves and the second mounting groove, the radius of the second recessing groove are greater than the radius of the second mounting groove, and the second recessing groove is therethrough
One outer plate and center plate, external insulation layer of second mounting groove in another outer plate, the bottom of the second mounting groove
Expose layer outside the circuit.
Further, several elastomers are equipped in external insulation layer.
Further, elastomer is rubber ball body.
Further, two layers outside the circuit are equipped with waterproof layer far from the side of center plate.
Further, waterproof layer is heat conductive silica gel lamella.
Further, the second recessing groove also extends through waterproof layer.
Further, it is equipped with an antidetonation slot at the both sides of the edge of outer plate, the two sides of center plate and outer plate are all provided with
There is a protection side panel, the both ends of protection side panel are respectively and fixedly provided with a limited block, and limited block is connect by spring with the bottom of antidetonation slot.
Further, the depth of antidetonation slot is d, outer plate with a thickness of D, d < D, the side wall of antidetonation slot is covered with insulation and protects
Sheath.
The utility model has the following beneficial effects: the utility model discloses a kind of insertion mount type multi-layer PCB board, it is special to be arranged
Insertion mounting structure, can supplied for electronic component insertion installation, can effectively improve electronic component installation stability, avoid
Electronic component falls off or poor contact due to collision, can effectively ensure that the performance of pcb board, large radius allow bit architecture can
The more convenient operation for installing insertion, while can be avoided generation short circuit, size radius groove is aligned with line layer or insulating layer, energy
Enough reduce difficulty of processing, additionally it is possible to improve the stability of pcb board structure, the overall structure of pcb board is simple, and cost of manufacture is lower.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Appended drawing reference are as follows: center plate 10, conductive communication column 101, insulated substrate 11, center line layer 12, outer plate 20,
External insulation layer 21, elastomer 211, layer outside the circuit 22, waterproof layer 221, antidetonation slot 23, insulating protective layer 231, the insertion of the first device
Slot 30, the first mounting groove 32, the second device embedded groove 40, the second recessing groove 41, the second mounting groove 42, is prevented first recessing groove 31
Protect side plate 50, limited block 51, spring 52.
Specific embodiment
For the feature, technological means and specific purposes achieved, function that can further appreciate that the utility model, below
The utility model is described in further detail in conjunction with attached drawing and specific embodiment.
With reference to Fig. 1.
The utility model embodiment discloses a kind of insertion mount type multi-layer PCB board, including center plate 10, center plate 10
Two sides be respectively provided with an outer plate 20, center plate 10 includes insulated substrate 11, and the two sides of insulated substrate 11 are respectively provided with a center
Line layer 12, outer plate 20 include the external insulation layer 21 and layer outside the circuit 22 being stacked, and layer outside the circuit 22 is located at external insulation layer
21 sides far from center plate 10 are equipped with conductive communication column 101, press between different center line layer 12 and layer outside the circuit 22
Conductive communication column 101 is arranged in demand, can be realized the electric connection between different sandwich circuits；
It is equipped with the first device embedded groove 30 in outer plate 20, the first device embedded groove 30 includes the first of concentric connection allowing
Position slot 31 and the first mounting groove 32, the radius of the first recessing groove 31 are greater than the radius of the first mounting groove 32,31 He of the first recessing groove
First mounting groove 32 extends through layer outside the circuit 22 and external insulation layer 21 in same outer plate 20, the bottom of the first mounting groove 32
Center line layer 12 is exposed, the center line layer 12 exposed is located in insulated substrate 11 close to first mounting groove 32
Side；
The second device embedded groove 40 is equipped in center plate 10 and outer plate 20, the second device embedded groove 40 includes concentric
The second recessing groove 41 and the second mounting groove 42 of connection, the radius of the second recessing groove 41 are greater than the radius of the second mounting groove 42, the
An outer plate 20 and center plate 10, the second mounting groove 42 run through in another outer plate 20 two recessing grooves 41 therethrough
The bottom of external insulation layer 21, the second mounting groove 42 exposes layer outside the circuit 22, and the layer outside the circuit 22 exposed is in second peace
In outer plate 20 where tankage 42, electronic component passes through recessing groove and is welded in mounting groove, can effectively with corresponding line
Road floor realize electrical connection, while the recessing groove of large radius can effectively avoid occurring between All other routes layer and electronic component it is short
Road can effectively ensure that each welding is reliable.
Special insertion mounting structure is arranged in the utility model, can supplied for electronic component insertion installation, can effectively improve
The stability of electronic component installation, avoids electronic component from falling off or poor contact due to collision, can effectively ensure pcb board
Performance, large radius allow bit architecture can make insertion install more convenient operation, while can be avoided generation short circuit, big smaller part
Diameter slot is aligned with line layer or insulating layer, can reduce difficulty of processing, additionally it is possible to the stability of pcb board structure is improved, pcb board
Overall structure is simple, and cost of manufacture is lower.
In the present embodiment, several elastomers 211 are equipped in external insulation layer 21, it is preferable that elastomer 211 is ball
Body can effectively improve the toughness of pcb board entirety, can reduce the probability that pcb board is fractured by collision.
In the present embodiment, two layers outside the circuit 22 are equipped with waterproof layer 221, waterproof layer far from the side of center plate 10
221 energy effective protection layers outside the circuit 22, can effectively avoid layer outside the circuit 22 by extraneous moisture attacks.
In the present embodiment, waterproof layer 221 is heat conductive silica gel lamella, and heat-conducting silica gel sheet has good heating conduction, prevents
Aqueous energy and insulation performance can effectively improve pcb board entirety while avoiding layer outside the circuit 22 by extraneous moisture attacks
Heat dissipation effect improves the working performance of pcb board.
In the present embodiment, the second recessing groove 41 also extends through waterproof layer 221.When electronic component is installed, waterproof layer is poked
221 are inserted into electronic component or waterproof layer 221 is run through by the second recessing groove 41 always.
In the present embodiment, an antidetonation slot 23, center plate 10 and outer plate are equipped at the both sides of the edge of outer plate 20
20 two sides are equipped with a protection side panel 50, and the both ends of protection side panel 50 are respectively and fixedly provided with a limited block 51, and limited block 51 passes through bullet
Spring 52 is connect with the bottom of antidetonation slot 23, pcb board when by violent oscillatory motion, what center plate 10 and outer plate 20 formed
By spring 52 and limited block 51 relative motion can occur for entirety, can be avoided center plate 10 and outer plate 20 form it is whole
Body is directly collided, and effectively pcb board can be avoided to be damaged.
In the present embodiment, the depth of antidetonation slot 23 be d, outer plate 20 with a thickness of D, d < D, the i.e. bottom of antidetonation slot 23
In external insulation layer 21, can effectively avoid contact with center line layer 21 influences the normal use of pcb board, antidetonation slot 23
Side wall is covered with insulating protective layer 231, can be avoided spring 52 and causes to damage to the layer structure in pcb board in reciprocating motion,
It can be avoided the normal use that spring 52 contacts layer outside the circuit 22 and influences pcb board simultaneously.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (8)
1. a kind of insertion mount type multi-layer PCB board, which is characterized in that including center plate (10), the center plate (10)
Two sides are respectively provided with an outer plate (20), and the center plate (10) includes insulated substrate (11), and the two of the insulated substrate (11)
Side is respectively provided with a center line layer (12), and the outer plate (20) includes the external insulation layer (21) and layer outside the circuit being stacked
(22), the layer outside the circuit (22) is located at side of the external insulation layer (21) far from the center plate (10), different institutes
It states and is equipped with conductive communication column (101) between center line layer (12) and the layer outside the circuit (22)；
The first device embedded groove (30) is equipped in the outer plate (20), the first device embedded groove (30) includes concentric company
The radius of logical the first recessing groove (31) and the first mounting groove (32), first recessing groove (31) is greater than first mounting groove
(32) radius, first recessing groove (31) and first mounting groove (32) extend through in the same outer plate (20)
The layer outside the circuit (22) and the external insulation layer (21), the bottom of first mounting groove (32) exposes the center line
Road floor (12)；
The second device embedded groove (40), the second device insertion are equipped in the center plate (10) and the outer plate (20)
Slot (40) includes the second recessing groove (41) and the second mounting groove (42) of concentric connection, the radius of second recessing groove (41)
Greater than the radius of second mounting groove (42), second recessing groove (41) an outer plate (20) and institute therethrough
It states center plate (10), the external insulation layer of second mounting groove (42) in another described outer plate (20)
(21), the bottom of second mounting groove (42) exposes the layer outside the circuit (22).
2. a kind of insertion mount type multi-layer PCB board according to claim 1, which is characterized in that the external insulation layer (21)
It is interior to be equipped with several elastomers (211).
3. a kind of insertion mount type multi-layer PCB board according to claim 2, which is characterized in that the elastomer (211) is
Rubber ball body.
4. a kind of insertion mount type multi-layer PCB board according to claim 1, which is characterized in that two layers outside the circuit
(22) side far from the center plate (10) is equipped with waterproof layer (221).
5. a kind of insertion mount type multi-layer PCB board according to claim 4, which is characterized in that the waterproof layer (221) is
Heat conductive silica gel lamella.
6. a kind of insertion mount type multi-layer PCB board according to claim 4, which is characterized in that second recessing groove
(41) waterproof layer (221) are also extended through.
7. a kind of insertion mount type multi-layer PCB board according to claim 1, which is characterized in that the outer plate (20)
It is equipped with an antidetonation slot (23) at both sides of the edge, it is anti-that the two sides of the center plate (10) and the outer plate (20) are equipped with one
It protects side plate (50), the both ends of the protection side panel (50) are respectively and fixedly provided with a limited block (51), and the limited block (51) passes through spring
(52) it is connect with the bottom of the antidetonation slot (23).
8. a kind of insertion mount type multi-layer PCB board according to claim 7, which is characterized in that the antidetonation slot (23)
Depth is d, the outer plate (20) with a thickness of D, d < D, the side wall of the antidetonation slot (23) is covered with insulating protective layer
(231)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821383677.8U CN209497683U (en) | 2018-08-24 | 2018-08-24 | A kind of insertion mount type multi-layer PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821383677.8U CN209497683U (en) | 2018-08-24 | 2018-08-24 | A kind of insertion mount type multi-layer PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209497683U true CN209497683U (en) | 2019-10-15 |
Family
ID=68150759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821383677.8U Expired - Fee Related CN209497683U (en) | 2018-08-24 | 2018-08-24 | A kind of insertion mount type multi-layer PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209497683U (en) |
-
2018
- 2018-08-24 CN CN201821383677.8U patent/CN209497683U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191015 |