CN209448993U - Highly integrated power circuit board and electric appliance - Google Patents
Highly integrated power circuit board and electric appliance Download PDFInfo
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- CN209448993U CN209448993U CN201821791644.7U CN201821791644U CN209448993U CN 209448993 U CN209448993 U CN 209448993U CN 201821791644 U CN201821791644 U CN 201821791644U CN 209448993 U CN209448993 U CN 209448993U
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- highly integrated
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- integrated power
- pin
- solder joint
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Abstract
The utility model provides highly integrated power circuit board and electric appliance.Wherein, highly integrated power circuit board includes: substrate;Pin, the pin arrangement is on the outer edge of the substrate;Driving circuit, the driving circuit is set on the substrate, the first side on the driving circuit is equipped with the first solder joint, on the driving circuit with described first at adjacent second on be equipped with the second solder joint, and described first while and it is described second while intersection point be connected with the pin by wiring close to the pin, first solder joint and second solder joint.Inventor's discovery, first solder joint and the second solder joint can be shortened into the length of arrangement wire between driving circuit and pin close to pin setting, reduce the area that wiring occupies, improve the quality of signal transmission, and other power device (such as insulated gate bipolar transistor etc.) layout areas in highly integrated power module are larger, so that the radiating efficiency of highly integrated power module is high.
Description
Technical field
The utility model relates to technical field of electric appliances, specifically, being related to highly integrated power circuit board and electric appliance.
Background technique
Currently, the wiring solder joint that driving circuit is connect with external pin has a certain distance apart from external pin, so that
Be routed between driving circuit and external pin it is too long, cause wiring occupy substrate portion space, lead to insulated gate bipolar crystal
The layout area of pipe is reduced, and the heat dissipation of insulated gate bipolar transistor is influenced, so that its reliability is low.Therefore, driving circuit with
Connection type between external pin has much room for improvement.
Utility model content
The utility model is intended to solve at least some of the technical problems in related technologies.For this purpose, this reality
It is to propose a kind of simply highly integrated power circuit board of structure and electric appliance, the highly integrated power circuit with a novel purpose
Wiring in plate between driving circuit and external pin is shorter, wiring footprint area is less, signal transmission more efficient and heat dissipation effect
Rate is higher.
In the one aspect of the utility model, the utility model provides a kind of highly integrated power circuit board.According to this reality
With novel embodiment, which includes: substrate;Pin, the pin arrangement is in the outside of the substrate
On edge;Driving circuit, the driving circuit are set on the substrate, and the first side on the driving circuit is equipped with the first weldering
Point, on the driving circuit with described first at adjacent second on be equipped with the second solder joint, and first side and described
The intersection point on the second side is connected with the pin by wiring close to the pin, first solder joint and second solder joint.Hair
First solder joint and the second solder joint can be shortened the cloth wire length between driving circuit and pin close to pin setting by bright people's discovery
Degree reduces the area that wiring occupies, and improves the quality of signal transmission, and other power device (examples in highly integrated power module
Such as insulated gate bipolar transistor) layout area is larger, so that the radiating efficiency of highly integrated power module is high, and then improves high
The reliability of integrated power module, prolongs its service life.
Embodiment according to the present utility model, first side and the wide of the substrate are in 30~60 degree of angles.It is advantageous as a result,
In the length for shortening the wiring between driving circuit and pin.
Embodiment according to the present utility model, first side and the wide of the substrate are in 45 degree of angles.More favorably subtract as a result,
The distance between solder joint and pin on small driving circuit are more advantageous to the length for shortening the wiring between driving circuit and pin
Degree.
Embodiment according to the present utility model has multiple described first be arranged along its length on first side
Solder joint has multiple second solder joints arranged along its length on second side.Thus, it is possible to realize driving circuit
It is good between pin to be electrically connected, so that driving signal transmission quality is high.
Embodiment according to the present utility model, first solder joint and second solder joint are close to first side and described
The intersection point on the second side is arranged.The distance between the solder joint on driving circuit and pin are short as a result, corresponding length of arrangement wire also compared with
Short, wiring area occupied is small, is conducive to improve signal transmission quality, and provide more wiring spaces for other power devices,
Be conducive to improve the radiating efficiency of power device.
Embodiment according to the present utility model, first solder joint and second solder joint and the pin correspond.
It is electrically connected yield height between driving circuit and pin as a result, signal transmission quality is high.
Embodiment according to the present utility model, the driving circuit are square.Driving circuit structure is simple as a result, easily
In realization, area occupied is smaller, provides more wiring spaces for other power devices, is conducive to the heat dissipation effect for improving power device
Rate.
Embodiment according to the present utility model, the driving circuit include fan drive circuit and compressor drive circuit.
Wiring area occupied as a result, in fan drive circuit and compressor drive circuit is small, provides more for other power devices
Wiring space is conducive to the radiating efficiency for improving power device.
Embodiment according to the present utility model, which further comprises: rectifier bridge, the rectifier bridge
If one end on the substrate;On PFC element and compressor bridge drive, the PFC element and
Bridge driving sets the other end on the substrate far from the rectifier bridge, blower driving on compressor, and the blower driving is located at
On the substrate and it is located on the rectifier bridge and the PFC element and compressor between bridge driving;Under compressor
Bridge drives, and bridge driving sets on the substrate and is located at the rectifier bridge and the PFC element under the compressor
And on compressor between bridge driving, wherein the driving circuit sets on the substrate and is located at the rectifier bridge and the function
On rate factor correcting element and compressor between bridge driving.As a result, by the higher rectifier bridge of calorific value, PFC element
It is separately positioned on the both ends relatively far apart of substrate with bridge driving on compressor, it is possible to prevente effectively from calorific value is assembled, simultaneously will
Bridge driving and driving circuit setting are in rectifier bridge and PFC member under the relatively low blower driving of calorific value, compressor
On part and compressor between bridge driving, the calorific value in operational process is effectively avoided to accumulate, running temperature is lower, so that power device
The reliability of part is effectively ensured and service life is longer, and in addition the distribution of above-mentioned power device is compact, and integrated level is high,
The high reliablity that power device connects between each other, area occupied is smaller, can make full use of space, is conducive in unified control
The reliability of power device is stated, exploitation, maintenance are easy, and substantially reduce the cost of highly integrated power circuit board.
In the another aspect of the utility model, the utility model provides a kind of electric appliance.Implementation according to the present utility model
Example, the electric appliance have mentioned-above highly integrated power circuit board.Inventors have found that the working efficiency of the electric appliance is higher,
The temperature of the electric appliance is lower in operational process, the excessively high phenomenon of temperature hardly occurs, and service life is longer, in longer use
It is able to maintain preferable service performance in the process, cost is relatively low.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of the highly integrated power circuit board in the utility model one embodiment;
Fig. 2 is the structural schematic diagram of the highly integrated power circuit board in another embodiment of the utility model.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
In the one aspect of the utility model, the utility model provides a kind of highly integrated power circuit board.According to this reality
With novel embodiment, referring to Fig.1, which includes: substrate 100;Pin 200, the pin 200 are arranged
On the outer edge of the substrate 100;Driving circuit 300, the driving circuit 300 are located on the substrate 100, the driving
The first side 310 on circuit 300 is equipped with the first solder joint 311, adjacent with first side 310 on the driving circuit 300
Second side 320 is equipped with the second solder joint 321, and described first while 310 and it is described second while 320 intersection point 301 close to described
Pin 200, first solder joint 311 and second solder joint 321 are connected with the pin 200 by wiring 400.Invention human hair
It is existing, the first solder joint and the second solder joint can be shortened into the length of arrangement wire between driving circuit and pin close to pin setting, reduced
It is routed the area occupied, improves the quality of signal transmission, and other power devices (such as insulated gate in highly integrated power module
Bipolar junction transistor etc.) layout area is larger, so that the radiating efficiency of highly integrated power module is high, and then improve highly integrated power
The reliability of module, prolongs its service life.
Embodiment according to the present utility model, with reference to Fig. 1, first solder joint 311 and second solder joint 321 are close to institute
State first while 310 and it is described second while 320 intersection point setting.The distance between the solder joint on driving circuit and pin are short as a result,
Corresponding length of arrangement wire is also shorter, and wiring area occupied is small, is conducive to improve signal transmission quality, and mention for other power devices
For more wiring spaces, be conducive to the radiating efficiency for improving power device.
Embodiment according to the present utility model has on first side 310 and is arranged along its length with reference to Fig. 1
Multiple (such as three etc.) first solder joints 311 have the multiple (examples arranged along its length on second side 320
Such as three) second solder joint 321.Thus, it is possible to realize it is good between driving circuit and pin be electrically connected so that driving
Signal transmission quality is high.Embodiment according to the present utility model, first solder joint 311 and second solder joint 321 with it is described
Pin 400 corresponds.It is electrically connected yield height between driving circuit and pin as a result, signal transmission quality is high.It needs to illustrate
, referring to Fig.1, the first solder joint 311 refers to that a solder joint is one corresponding with the second solder joint 321 and the one-to-one correspondence of pin 200
Pin pin 201.Embodiment according to the present utility model is routed and can be divided between multiple first solder joints and pin on first side
It Wei not H1N1, H2N2, H3N3;Multiple second solder joints on second side and the wiring between pin can be respectively L1N1, L2N2,
Wiring can be respectively L1N1, L2N2, L3N3, the second side between L3N3 or multiple first solder joints and pin on the first side
On multiple second solder joints and pin between wiring can be respectively H1N1, H2N2, H3N3.Thus, it is possible to realize efficient
The input of driving signal.
Embodiment according to the present utility model, in order to which the distance between solder joint and pin, optimization wiring is effectively reduced
Mode, referring to Fig.1, first side 310 and the substrate 100 wide 110 in 30~60 degree (such as 30 degree, 35 degree, 40 degree,
45 degree, 50 degree, 55 degree, 60 degree etc.) angle.The positional relationship of the first side and substrate favorably reduces the solder joint on driving circuit as a result,
The distance between pin is conducive to the length for shortening the wiring between driving circuit and pin.In some of the utility model
In preferred embodiment, first side and the wide of the substrate are in 45 degree of angles.More favorably reduce the solder joint on driving circuit as a result,
The distance between pin is more advantageous to the length for shortening the wiring between driving circuit and pin.
Embodiment according to the present utility model, the driving circuit are square.Driving circuit structure is simple as a result, easily
In realization, area occupied is smaller, provides more wiring spaces for other power devices, is conducive to the heat dissipation effect for improving power device
Rate.
Embodiment according to the present utility model, the driving circuit 300 include fan drive circuit (not shown) and compression
Drive circuit (not shown).Wiring area occupied as a result, in fan drive circuit and compressor drive circuit is small, is other
Power device provides more wiring spaces, is conducive to the radiating efficiency for improving power device.
Embodiment according to the present utility model, referring to Fig. 2, which further comprises: rectifier bridge
500, the rectifier bridge 500 is located at one end on the substrate 100;Bridge drives on PFC element 600 and compressor
700, bridge driving 700 is located on the substrate 100 far from the rectifier bridge on the PFC element 600 and compressor
500 other end, blower driving 900, the blower driving 900 are located on the substrate 100 and are located at 500 He of rectifier bridge
On the PFC element 600 and compressor between bridge driving 700;Bridge driving 800 under compressor, under the compressor
Bridge driving 800 is located on the substrate 100 and is located at the rectifier bridge 500 and the PFC element 600 and compression
On machine between bridge driving 700, wherein the driving circuit 300 is located on the substrate 100 and is located at 500 He of rectifier bridge
On the PFC element 600 and compressor between bridge driving 700.As a result, by by the higher rectifier bridge of calorific value
The both ends of substrate are separately positioned on bridge driving on PFC element and compressor, while calorific value is relatively low
Bridge driving and driving circuit are arranged on rectifier bridge and PFC element and compressor bridge and drive under blower driving, compressor
Between dynamic, it is possible to prevente effectively from calorific value is assembled, the whole fever of highly integrated power circuit board reduced, operational process is effectively avoided
In calorific value accumulation, running temperature is lower, so that the reliability of power device is effectively ensured and service life is longer, separately
The distribution of outer above-mentioned power device is compact, and integrated level is high, the high reliablity that power device connects between each other, area occupied
It is smaller, space can be made full use of, the reliability of the unified above-mentioned power device of control is conducive to, exploitation, maintenance are easy, drop significantly
The cost of low highly integrated power circuit board.
Embodiment according to the present utility model, referring to Fig. 2, blower driving 900 has first horizontal segment 901 and vertical section
902, driving circuit 300 has the second horizontal segment 301 and third horizontal segment 302 being staggered, and the setting of first horizontal segment 901 exists
The top of third horizontal segment 302 and the left side for being located at the second horizontal segment 301,800 setting of bridge driving is in the second level under compressor
The lower section of section 301 and the right side for being located at third horizontal segment 302, above-mentioned set-up mode can significantly improve power device as a result,
Integrated level is conducive to the reliability of unified control power device so that the reliability connected between device significantly improves.
It should be noted that vertically referring to the direction parallel with up and down direction, level refers to parallel with left and right directions
Direction.It is understood that above-mentioned upper and lower, left and right is used to explain the application, and it should not be understood as the limitation to the application.
Embodiment according to the present utility model, bridge driving 700 can be set in the top of PFC600 on compressor, can also be with
The lower section of PFC600 is set, as long as can satisfy requirement, those skilled in the art can flexibly be selected according to actual needs
It selects.
Embodiment according to the present utility model, referring to Fig. 2, along the direction far from the rectifier bridge 500, the substrate
Bridge under the rectifier bridge 500, blower driving 900, the driving circuit 300, the compressor is sequentially arranged on 100 to drive
800 and the PFC element 600 and compressor on bridge driving 700.As a result, in two higher power of calorific value
Calorific value lesser power device is set between device, the high power component hypotelorism to generate heat can be prevented, effectively avoid heat
Amount aggregation improves the reliability of each power device, and the above-mentioned arrangement of power device is conducive to bridge on compressor and drives
With under compressor bridge driving between carry out wiring.
Embodiment according to the present utility model, highly integrated power circuit board further include connecting wire, resistive element and capacitor
At least one of element, the connecting wire, the sky of the resistive element and capacity cell setting on the substrate
Remaining region.Thus, it is possible to make full use of the space of spare area, integrated level, the reliability of highly integrated power circuit board are improved, is dropped
Low cost reduces automatically controlled volume.It should be noted that spare area refers to the region not covered by power device.
Embodiment according to the present utility model, by power device, connecting wire, resistive element and capacity cell according to above-mentioned
Arrangement mode installation terminate after, be packaged with the same shell, can be obtained that integrated level is high, area occupied is small, heat dissipation
High-efficient highly integrated power circuit board can unify the reliability of control power device, and exploitation, maintenance difficulty are small, at low cost.
Embodiment according to the present utility model, the material for forming substrate includes the highly heat-conductive materials such as aluminium, ceramics, is had as a result,
It is generated conducive to export power device (including PFC element, rectifier bridge, compressor inverter and blower inverter)
Heat, improve radiating efficiency.Embodiment according to the present utility model is additionally provided with insulation between substrate and power device
Layer, copper foil cabling, green oil layer, device bonding pad etc., thus, it is possible to guarantee that power device works normally.
In the another aspect of the utility model, the utility model provides a kind of electric appliance.Implementation according to the present utility model
Example, the electric appliance have mentioned-above highly integrated power circuit board.Inventors have found that the working efficiency of the electric appliance is higher,
The temperature of the electric appliance is lower in operational process, the excessively high phenomenon of temperature hardly occurs, and service life is longer, in longer use
It is able to maintain preferable service performance in the process, cost is relatively low.
Embodiment according to the present utility model, above-mentioned electric appliance can for air-conditioning, washing machine, refrigerator, electromagnetic oven etc., and its
In highly integrated power circuit board the function that highly integrated power circuit board has described in preceding sections may be implemented.According to this
One specific embodiment of utility model, by taking air-conditioning as an example, air-conditioning in addition to include mentioned-above high collection power at circuit board it
It outside can also include essential to the conventional air-conditionings such as blower, compressor, heat exchanger, orifice union, wind guide component, chassis, panel
Structure or component, no longer excessively repeat herein.Embodiment according to the present utility model, the type of air-conditioning can be hanging, cabinet type
Deng.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside",
The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " is based on the figure
Orientation or positional relationship is merely for convenience of describing the present invention and simplifying the description, rather than the dress of indication or suggestion meaning
It sets or element must have a particular orientation, be constructed and operated in a specific orientation, therefore should not be understood as to the utility model
Limitation.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.The meaning of " plurality " is at least two, such as two in the description of the present invention,
It is a, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral;It can be
Mechanical connection, is also possible to be electrically connected;It can be directly connected, two can also be can be indirectly connected through an intermediary
The interaction relationship of connection or two elements inside element, unless otherwise restricted clearly.For the common skill of this field
For art personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature is in the second feature " on " or " down "
It can be that the first and second features directly contact or the first and second features are by intermediary mediate contact.Moreover, first is special
Sign can be fisrt feature above the second feature " above ", " above " and " above " and be directly above or diagonally above the second feature, or only
Indicate that first feature horizontal height is higher than second feature.Fisrt feature under the second feature " below ", " below " and " below " can be with
It is that fisrt feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the utility model.In the present specification, to the schematic table of above-mentioned term
It states and is necessarily directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be with
It can be combined in any suitable manner in any one or more of the embodiments or examples.In addition, without conflicting with each other, this field
Technical staff can by the feature of different embodiments or examples described in this specification and different embodiments or examples into
Row combination and combination.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
Inside it can make changes, modifications, alterations, and variations to the above described embodiments.
Claims (10)
1. a kind of highly integrated power circuit board characterized by comprising
Substrate;
Pin, the pin arrangement is on the outer edge of the substrate;
Driving circuit, the driving circuit are set on the substrate, and the first side on the driving circuit is equipped with the first solder joint,
On the driving circuit with described first at adjacent second on be equipped with the second solder joint, and first side and described second
The intersection point on side is connected with the pin by wiring close to the pin, first solder joint and second solder joint.
2. highly integrated power circuit board according to claim 1, which is characterized in that the width on first side and the substrate
Spending direction is in 30~60 degree of angles.
3. highly integrated power circuit board according to claim 1 or 2, which is characterized in that first side and the substrate
Width direction be in 45 degree of angles.
4. highly integrated power circuit board according to claim 1, which is characterized in that have along its length on first side
Multiple first solder joints of direction setting,
There are multiple second solder joints arranged along its length on second side.
5. highly integrated power circuit board according to claim 1 or 4, which is characterized in that first solder joint and described
Two solder joints close to described first while and it is described second while intersection point setting.
6. highly integrated power circuit board according to claim 5, which is characterized in that first solder joint and second weldering
Point is corresponded with the pin.
7. highly integrated power circuit board according to claim 1, which is characterized in that the driving circuit is square.
8. highly integrated power circuit board according to claim 1, which is characterized in that the driving circuit includes blower driving
Circuit and compressor drive circuit.
9. highly integrated power circuit board according to claim 1 or 8, which is characterized in that further comprise:
Rectifier bridge, the rectifier bridge set one end on the substrate;
Bridge drives on PFC element and compressor, and bridge driving is located on the PFC element and compressor
Far from the other end of the rectifier bridge on the substrate, blower driving, the blower, which drives, to be set on the substrate and is located at institute
It states on rectifier bridge and the PFC element and compressor between bridge driving;
Bridge drives under compressor, and bridge driving sets on the substrate and is located at the rectifier bridge and the power under the compressor
On factor correcting element and compressor between bridge driving,
Wherein, the driving circuit sets on the substrate and is located at the rectifier bridge and the PFC element and pressure
On contracting machine between bridge driving.
10. a kind of electric appliance, which is characterized in that the electrical device has the right to require highly integrated power electricity described in any one of 1-9
Road plate.
Priority Applications (1)
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CN201821791644.7U CN209448993U (en) | 2018-10-31 | 2018-10-31 | Highly integrated power circuit board and electric appliance |
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CN201821791644.7U CN209448993U (en) | 2018-10-31 | 2018-10-31 | Highly integrated power circuit board and electric appliance |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109121297A (en) * | 2018-10-31 | 2019-01-01 | 广东美的制冷设备有限公司 | Highly integrated power circuit board and electric appliance |
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2018
- 2018-10-31 CN CN201821791644.7U patent/CN209448993U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109121297A (en) * | 2018-10-31 | 2019-01-01 | 广东美的制冷设备有限公司 | Highly integrated power circuit board and electric appliance |
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