CN209446093U - A kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment - Google Patents
A kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment Download PDFInfo
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- CN209446093U CN209446093U CN201821872453.3U CN201821872453U CN209446093U CN 209446093 U CN209446093 U CN 209446093U CN 201821872453 U CN201821872453 U CN 201821872453U CN 209446093 U CN209446093 U CN 209446093U
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Abstract
A kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment, including shell, for the piezoelectric ceramic vibration sensor of high frequency monitoring, for MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and the power supply of low frequency monitoring；Power supply is piezoelectric ceramic vibration sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit power supply；Power supply, piezoelectric ceramic vibration sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit are all connected on pcb board；Shell is hollow cylinder, is unlimited in the bottom surface of cylinder, open bottom surface is fixed with pedestal；Piezoelectric ceramic vibration sensor, MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and pcb board are all fixed on the hollow interior of cylinder；The material of pedestal is the heat-conducting of hard；The probe of temperature sensor is closely connected on pedestal；The probe of piezoelectric ceramic vibration sensor is closely connected on pedestal.The present apparatus can monitoring data multiplicity.
Description
Technical field
The utility model belongs to monitoring technical field, the high/low frequency vibration measuring of specifically a kind of low-power consumption and temperature measuring equipment.
Background technique
In modern industry field management, equipment condition monitoring is important requirement, and more and normality requires.Usually come
It says, many equipment (especially traditional equipment) are when manufacturing and designing and without self-test monitoring component, such as dynamic equipment bearing
Vibration, temperature monitoring etc., this is not easy to these equipment to be included in management system system.And existing equipment is transformed
Extremely difficult, the assembling structure that especially need to much monitor is all more accurate, further increases transformation difficulty.And modern industry management
In, equipment condition monitoring has been normality demand, and the vibration and temperature monitoring for dynamic equipment bearing are the weights in status monitoring
Point.When realizing, first have to affix one's name to vibration and temperature monitoring equipment in upper side.
Summary of the invention
In order to solve the above-mentioned problems in the prior art, the utility model proposes a kind of new equipment monitoring device,
It is specific as follows without being modified the monitoring that vibration, temperature can be realized for equipment dynamic for majority:
A kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment are passed including shell, for the piezoelectric ceramic vibration of high frequency monitoring
Sensor, MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and the power supply monitored for low frequency；Power supply is pressure
Electroceramics vibrating sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit power supply；Power supply, piezoelectricity pottery
Porcelain vibrating sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit are all connected on pcb board；
The shell is hollow cylinder, is unlimited in the bottom surface of cylinder, open bottom surface is fixed with pedestal；Piezoelectricity pottery
Porcelain vibrating sensor, MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and pcb board are all fixed on cylinder
It is hollow in；
The material of the pedestal is the heat-conducting of hard；The probe of the temperature sensor is closely connected on pedestal；It is described
The probe of piezoelectric ceramic vibration sensor is closely connected on pedestal；
The output end of the piezoelectric ceramic vibration sensor, MEMs sensor and infrared temperature probe all connects data
The data input pin of processing circuit；The data input pin of the data output end connection communication circuit of data processing circuit.
Further, the telecommunication circuit is ZigBee communication module；The antenna of ZigBee communication module is connected to shell
On outer wall, connected between antenna and the connecting terminal of ZigBee communication module by waveguide.
Further, the power supply is battery.
Further, the pcb board has main PCB plate and two pieces of auxiliary pcb board, two pieces of pcb board electrical connections；The main PCB plate exists
On, auxiliary pcb board under,
The main body of the piezoelectric ceramic vibration sensor is welded on the bottom surface of main PCB plate, the master of electroceramics vibrating sensor
Body passes through the through-hole in auxiliary pcb board center from top to bottom, and the probe of electroceramics vibrating sensor is closely attached to base top surface；The battery
It is connected to the top surface of main PCB plate；On the ZigBee communication module connection main PCB plate；
The MEMs sensor is welded on auxiliary pcb board top surface；
Temperature sensor is welded on auxiliary pcb board bottom surface, and temperature sensor be clipped in auxiliary pcb board bottom surface and base top surface it
Between, the probe of temperature sensor is closely connected in base top surface.
Further, the pedestal is the magnetic absorbing seat being made of magnet.
Further, the data processing circuit is analog to digital conversion circuit；Analog-digital conversion circuit as described also has enabled electricity
Road；
The trigger signal output end of MEMs sensor connects the trigger signal input terminal of enabled circuit；
Piezoelectric ceramic vibration sensor connects the input terminal of analog to digital conversion circuit with the output end of temperature sensor；
The data input pin of the output end connection communication circuit of analog to digital conversion circuit；It is defeated that MEMs sensor obtains digital signal
The data input pin of outlet connection communication circuit.
It is analog quantity since sensor is collected, here, digital quantity is converted to subsequent list by analog to digital conversion circuit
Member.Here, the required precision of analog-to-digital conversion is not also high, using 16.
For the considerations of reducing cost using existing original part, in Project Realization, the function of data processing circuit here
Energy can be by chip microcontroller.The signal input part of single-chip microcontroller is not (if tool has A/D conversion function, corresponding input terminal
Mouthful before plus A/D converter) connection three sensors output end.The triggering of the input terminal connection MEMs sensor of single-chip microcontroller
Signal output end.The data of single-chip microcontroller output are launched by ZigBee communication module.
The principles of the present invention are, by pedestal (magnetic absorbing seat) present apparatus integral installation (absorption) in equipment corresponding positions
It sets.By the rigid connection of the probe and structure division of piezoelectric ceramic vibration sensor, the high-frequency vibration that equipment transmits is sensed, and
Be converted to electric signal；The low-frequency vibration that MEMs sensor sensing is transmitted to equipment, and be converted to electric signal；The spy of temperature sensor
Head detection pedestal is conducted through the temperature for the measured position come, and is converted to electric signal；By data processing circuit the high/low frequency vibration of survey
Dynamic, thermometric electric signal is converted to digital signal to (ZigBee) communication module.Here, MEMs sensor according to its own function/
Performance characteristics can also trigger the overall work of this monitoring device in addition to highdensity continuous low frequency monitors.
Further, the power supply is rechargable power supplies.Since the low power consumption characteristic of present apparatus MEMs and triggering are specific, make
For complete machine when by side apparatus (intermittent work equipment) off working state, the machine is also in off working state, operating power consumption substantially
It is very low.
The present apparatus uses mature rechargable power supplies, not high to the life requirements of rechargable power supplies, and safeguards letter
It is single.
Further, the magnetic absorbing seat includes main magnet and divides magnet；The main magnet is disc-shape, it is in piezoelectric ceramics
The underface of the probe of vibrating sensor；
Described point of magnet has multiple, they are rotatably connected on the periphery of main magnet, and surround the axisymmetrical of main magnet.
Further, the main magnet and the connection structure for dividing magnet are as follows: including platen and connecting rod；It is provided at the edge of platen
First notch of opening up spherical cap shape is provided with slot on the wall of the first notch；The edge of described point of magnet is provided with opening court
Under spherical cap shape the second notch, be provided with slot on the wall of the second notch；The head end of the connecting rod is connected separately with and first and second
The corresponding ball of notch geometry, connecting rod it is forward and backward respectively platen and divide magnet slot in；Two balls are lacked first and second respectively
In mouthful.
Since the device location of present apparatus application might have the curved surface of out-of-flatness, so, it is inhaled using multiple points of magnet
It monitors near position, main magnet is held using connecting rod, keeps the present apparatus relatively stable.
Compared with prior art, present apparatus size is small and exquisite, monitoring data are various, can better extract impact signal.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the present apparatus；
Fig. 2 is the electric schematic illustration of present apparatus embodiment；
Fig. 3 is the main magnet of the present apparatus and the attachment structure schematic diagram for dividing magnet；
Fig. 4 is the structural schematic diagram of the second barbed portion (the first notch is identical as the principle of the second notch)；
In figure: shell 1, magnetic absorbing seat 2, main PCB plate 3, auxiliary pcb board 4, piezoelectric ceramic vibration sensor 5, MEMs sensor 6,
Temperature sensor 7, the antenna 9 of ZigBee communication module, main magnet 10, divides magnet 11, platen 12, connecting rod 13, first at battery 8
Notch 14, the second notch 15, ball 16, slot 17.
Specific embodiment
This case is further illustrated with specific embodiment with reference to the accompanying drawing:
Such as Fig. 1,2, a kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment, including shell, for the piezoelectricity pottery of high frequency monitoring
Porcelain vibrating sensor, MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and the power supply monitored for low frequency；
Power supply is piezoelectric ceramic vibration sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit power supply；Electricity
Source, piezoelectric ceramic vibration sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit are all connected to PCB
On plate；
The shell is hollow cylinder, is unlimited in the bottom surface of cylinder, open bottom surface is fixed with pedestal；Piezoelectricity pottery
Porcelain vibrating sensor, MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and pcb board are all fixed on cylinder
It is hollow in；
The material of the pedestal is the heat-conducting of hard；The probe of the temperature sensor is closely connected on pedestal；It is described
The probe of piezoelectric ceramic vibration sensor is closely connected on pedestal；
The output end of the piezoelectric ceramic vibration sensor, MEMs sensor and infrared temperature probe all connects data
The data input pin of processing circuit；The data input pin of the data output end connection communication circuit of data processing circuit.
The telecommunication circuit is ZigBee communication module；The antenna of ZigBee communication module is connected on the outer wall of shell,
It is connected between antenna and the connecting terminal of ZigBee communication module by waveguide.
The power supply is battery.
The pcb board has main PCB plate and two pieces of auxiliary pcb board, two pieces of pcb board electrical connections；The main PCB plate is in upper, auxiliary PCB
Plate under,
The main body of the piezoelectric ceramic vibration sensor is welded on the bottom surface of main PCB plate, the master of electroceramics vibrating sensor
Body passes through the through-hole in auxiliary pcb board center from top to bottom, and the probe of electroceramics vibrating sensor is closely attached to base top surface；The battery
It is connected to the top surface of main PCB plate；On the ZigBee communication module connection main PCB plate；
The MEMs sensor is welded on auxiliary pcb board top surface；
Temperature sensor is welded on auxiliary pcb board bottom surface, and temperature sensor be clipped in auxiliary pcb board bottom surface and base top surface it
Between, the probe of temperature sensor is closely connected in base top surface.
The data processing circuit is analog to digital conversion circuit；Analog-digital conversion circuit as described also has enabled circuit；
The trigger signal output end of MEMs sensor connects the trigger signal input terminal of enabled circuit；
Piezoelectric ceramic vibration sensor connects the input terminal of analog to digital conversion circuit with the output end of temperature sensor；
The data input pin of the output end connection communication circuit of analog to digital conversion circuit；It is defeated that MEMs sensor obtains digital signal
The data input pin of outlet connection communication circuit.
The power supply is rechargable power supplies.
Such as Fig. 3,4, the pedestal is the magnetic absorbing seat being made of magnet.Magnetic absorbing seat includes main magnet and divides magnet；The master
Magnet is disc-shape, it is in the underface of the probe of piezoelectric ceramic vibration sensor；
Described point of magnet has multiple, they are rotatably connected on the periphery of main magnet, and surround the axisymmetrical of main magnet.
The main magnet and the connection structure for dividing magnet are as follows: including platen and connecting rod；Opening court is provided at the edge of platen
On spherical cap shape the first notch, be provided with slot on the wall of the first notch；The edge of described point of magnet is provided with downward opening ball
Second notch of crown shape is provided with slot on the wall of the second notch；The head end of the connecting rod is connected separately with and the first and second notch shape
The corresponding ball of shape, connecting rod it is forward and backward respectively platen and divide magnet slot in；Two balls are respectively in the first and second notches.
It waits in specific implementation, the present apparatus is based primarily upon IEEE 802.15.4 Radio Transmission Technology (ZigBee), piezoelectric type
Vibration measurement technique, MEMs sensor, contact temperature monitoring technology, compact structure design, by multiple functional units, integration
Into the structural body of a very little.
Consider that many factors, the processing units such as miniature compact, low-power consumption have selected the low-power consumption MCU of ST company that can meet
It is required that；Transmitting unit selects the AT86RF212 of Atmel company, is based on sub-G frequency range, while embedded IEEE802.15.4 association
View；MEMs sensor selects the ADXL362 of ADI, and operating power consumption is low, and 200Hz low frequency end is believed in band vibration thresholding offence
Number, it can continuously measure.
Claims (9)
1. a kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment, it is characterized in that including shell, for the piezoelectric ceramics of high frequency monitoring
Vibrating sensor, MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and the power supply monitored for low frequency；Electricity
Source is piezoelectric ceramic vibration sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit power supply；Power supply,
Piezoelectric ceramic vibration sensor, MEMs sensor, temperature sensor, data processing circuit and telecommunication circuit are all connected to pcb board
On；
The shell is hollow cylinder, is unlimited in the bottom surface of cylinder, open bottom surface is fixed with pedestal；Piezoelectric ceramic vibrator
Dynamic sensor, MEMs sensor, temperature sensor, data processing circuit, telecommunication circuit and pcb board are all fixed in cylinder
In sky；
The material of the pedestal is the heat-conducting of hard；The probe of the temperature sensor is closely connected on pedestal；The piezoelectricity
The probe of ceramic vibrating sensor is closely connected on pedestal；
The output end of the piezoelectric ceramic vibration sensor, MEMs sensor and infrared temperature probe all connects data processing
The data input pin of circuit；The data input pin of the data output end connection communication circuit of data processing circuit.
2. the high/low frequency vibration measuring of low-power consumption according to claim 1 and temperature measuring equipment, it is characterized in that the telecommunication circuit is
ZigBee communication module；The antenna of ZigBee communication module is connected on the outer wall of shell, antenna and ZigBee communication module
It is connected between connecting terminal by waveguide.
3. the high/low frequency vibration measuring of low-power consumption according to claim 2 and temperature measuring equipment, it is characterized in that the power supply is battery.
4. the high/low frequency vibration measuring of low-power consumption according to claim 3 and temperature measuring equipment, it is characterized in that the pcb board has main PCB
Plate and two pieces of auxiliary pcb board, two pieces of pcb boards electrical connections；The main PCB plate upper, auxiliary pcb board under,
The main body of the piezoelectric ceramic vibration sensor is welded on the bottom surface of main PCB plate, and the main body of electroceramics vibrating sensor is certainly
Across the through-hole in auxiliary pcb board center under above, the probe of electroceramics vibrating sensor is closely attached to base top surface；The battery connection
In the top surface of main PCB plate；On the ZigBee communication module connection main PCB plate；
The MEMs sensor is welded on auxiliary pcb board top surface；
Temperature sensor is welded on auxiliary pcb board bottom surface, and temperature sensor is clipped between auxiliary pcb board bottom surface and base top surface, temperature
The probe for spending sensor is closely connected in base top surface.
5. the high/low frequency vibration measuring of low-power consumption according to claim 1 and temperature measuring equipment, it is characterized in that the pedestal is by magnet
The magnetic absorbing seat of composition.
6. the high/low frequency vibration measuring of low-power consumption according to claim 1 and temperature measuring equipment, it is characterized in that the data processing circuit
It is analog to digital conversion circuit；Analog-digital conversion circuit as described also has enabled circuit；
The trigger signal output end of MEMs sensor connects the trigger signal input terminal of enabled circuit；
Piezoelectric ceramic vibration sensor connects the input terminal of analog to digital conversion circuit with the output end of temperature sensor；
The data input pin of the output end connection communication circuit of analog to digital conversion circuit；MEMs sensor obtains digital signal output end
The data input pin of connection communication circuit.
7. the high/low frequency vibration measuring of low-power consumption according to claim 1 and temperature measuring equipment, it is characterized in that the power supply is chargeable
Power supply.
8. the high/low frequency vibration measuring of low-power consumption according to claim 5 and temperature measuring equipment, it is characterized in that the magnetic absorbing seat includes master
Magnet and divide magnet；The main magnet is disc-shape, it is in the underface of the probe of piezoelectric ceramic vibration sensor；
Described point of magnet has multiple, they are rotatably connected on the periphery of main magnet, and surround the axisymmetrical of main magnet.
9. the high/low frequency vibration measuring of low-power consumption according to claim 8 and temperature measuring equipment, it is characterized in that the main magnet and dividing magnetic
The connection structure of iron are as follows: including platen and connecting rod；The first notch of opening up spherical cap shape is provided at the edge of platen, the
Slot is provided on the wall of one notch；The edge of described point of magnet is provided with the second notch of downward opening spherical cap shape, the second notch
Wall on be provided with slot；The head end of the connecting rod is connected separately with ball corresponding with the first and second notch geometry, and forward and backward point of connecting rod
Not in platen and the slot for dividing magnet；Two balls are respectively in the first and second notches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821872453.3U CN209446093U (en) | 2018-11-14 | 2018-11-14 | A kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821872453.3U CN209446093U (en) | 2018-11-14 | 2018-11-14 | A kind of high/low frequency vibration measuring of low-power consumption and temperature measuring equipment |
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| CN209446093U true CN209446093U (en) | 2019-09-27 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114199366A (en) * | 2020-09-18 | 2022-03-18 | 青岛正维科技信息有限公司 | Vibration state monitoring system |
| US20220373515A1 (en) * | 2019-10-25 | 2022-11-24 | Molex, Llc | Ultrasonic patch transducer for monitoring the condition of a structural asset |
-
2018
- 2018-11-14 CN CN201821872453.3U patent/CN209446093U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20220373515A1 (en) * | 2019-10-25 | 2022-11-24 | Molex, Llc | Ultrasonic patch transducer for monitoring the condition of a structural asset |
| EP4049019A4 (en) * | 2019-10-25 | 2024-03-20 | Molex, LLC | Ultrasonic patch transducer for monitoring the condition of a structural asset |
| CN114199366A (en) * | 2020-09-18 | 2022-03-18 | 青岛正维科技信息有限公司 | Vibration state monitoring system |
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