CN209419982U - Printed circuit board and electronic device - Google Patents
Printed circuit board and electronic device Download PDFInfo
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- CN209419982U CN209419982U CN201821451362.2U CN201821451362U CN209419982U CN 209419982 U CN209419982 U CN 209419982U CN 201821451362 U CN201821451362 U CN 201821451362U CN 209419982 U CN209419982 U CN 209419982U
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Abstract
This application discloses a kind of printed circuit board and electronic devices, and wherein printed circuit board includes: the conductive adhesion layer that printed circuit board includes: core plate component, radiator and be electrically connected core receiving plate component and radiator.Wherein, core plate component, including the first core plate and the second core plate stacked gradually, the first core plate and the second core plate are formed with the accommodating space being connected；Radiator is accommodated in accommodating space；Radiator forms the first gap and the second gap being connected with the second core plate；Conductive adhesion layer is set in the first gap and the second gap, is electrically connected between radiator and metal layer by conductive adhesion layer.By all inserting conductive adhesion layer in the first gap and the second gap, the bond area of radiator and core plate can be increased, so that radiator fixation is stronger.
Description
Technical field
This application involves technical field of integrated circuits, more particularly to a kind of printed circuit board and electronic device.
Background technique
Printed circuit board (Printed Circuit Board, abbreviation PCB) is important electronic component, is electronics industry
One of critical elements.Almost every kind of electronic equipment, it is small arrive electronic watch, calculator, arrive greatly computer, communication electronic device,
Military issue weapons system, to realize the electric interconnection between them, will use printing as long as there is the electronic components such as integrated circuit
Circuit board.Therefore, printed circuit board role in field of circuit technology is more and more important.And with electronic equipment volume
Continuous diminution, the function of electronic device is gradually perfect, to realize the peace of more electronic components in a lesser space
Dress, the fever that certainly will will cause circuit board are continuously increased, so solving the heat dissipation problem of circuit board becomes especially urgent.
It solves the above problems, existing method is by being internally embedded Metal Substrate and printed circuit board in printed circuit board
The heating device on surface is attached, and accelerates the heat dissipation of heating device by Metal Substrate.However, Metal Substrate is in insertion printed circuit
Intralamellar part usually will appear the problem of fixed unstable damage so as to cause entire printed circuit board.
Utility model content
The application provides a kind of printed circuit board and electronic device, with solve in the prior art Metal Substrate in insertion printing electricity
Road intralamellar part usually will appear the problem of fixed unstable damage so as to cause entire printed circuit board.
In order to solve the above technical problems, the technical solution that the application uses is: a kind of printed circuit board is provided,
In, printed circuit board includes:
Core plate component, including the first core plate and the second core plate stacked gradually, the one of close first core plate on the second core plate
Side is provided with metal layer, and the first through slot through the first core plate is offered on the first core plate, and offers on the second core plate and pass through
Second through slot of two core plates, the first through slot and the second through slot communicate with each other to form an accommodating space；
Radiator is accommodated in accommodating space；The first gap is formed between radiator and the metal layer of the second core plate,
And the second gap is formed between the inner wall of the second through slot, and the first gap communicates with each other with the second gap；And
Conductive adhesion layer is set in the first gap and the second gap, by conductive viscous between radiator and metal layer
Tie layer electrical connection.
In order to solve the above technical problems, another technical solution that the application uses is: a kind of electronic device is provided, wherein
Electronic device includes any printed circuit board and heating device above, and heating device is installed on the second core plate back to the
One core plate side, and connect with radiator.
Above-described embodiment has the beneficial effect that by between radiator and the first gap and second of the second core plate formation
Conductive adhesion layer is all inserted in gap, can increase the bond area of radiator and core plate, so that radiator fixation is more firm
Gu.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of the entirety sectional view of one embodiment of printed circuit board provided by the present application；
Fig. 2 is the core plate component of printed circuit board shown in Fig. 1 and the structural schematic diagram that radiator is cooperatively connected；
Fig. 3 is a kind of structural schematic diagram of the entirety sectional view of another embodiment of printed circuit board provided by the present application；
Fig. 4 is a kind of structural schematic diagram of the entirety sectional view of another embodiment of printed circuit board provided by the present application；
Fig. 5 is a kind of structural schematic diagram of the entirety sectional view of one embodiment of electronic device provided by the present application；
Fig. 6 is a kind of structural schematic diagram of the entirety sectional view of another embodiment of electronic device provided by the present application；
Fig. 7 is a kind of structural schematic diagram of the entirety sectional view of another embodiment of electronic device provided by the present application.
Specific embodiment
Below by the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described implementation
Example is merely a part but not all of the embodiments of the present application.Based on the embodiment in the application, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model of the application protection
It encloses.
Fig. 1 to Fig. 2 is please referred to, in the present embodiment, the printed circuit board 100 is generally can include: core plate component 10, embedding
Radiator 20 and conductive adhesion layer 30 in core plate component 10, and radiator 20 passes through the conductive adhesion layer 30 and core
Board group part 10 connects.
Wherein, core plate component 10 may include the first core plate 12 and the second core plate 14 being cascading.Wherein, this first
The quantity of core plate 12 can be multiple, and multiple first core plates 12 can be cascading.For example, first in the embodiment of diagram
The quantity of core plate 12 is two.Certainly, in other embodiments, the quantity of second core plate 14 may be multiple.
In embodiment shown in FIG. 1, which includes two layers of first core plates 12 and one layer of second core plate 14, and the
The sequence of one core plate 12 and the second core plate 14 stacked gradually is the first core plate 12, the first core plate 12 and the second core plate 14.
As shown in Figure 1, in the present embodiment, the first core plate 12 may include core plate medium 120 and be located at core plate medium 120 to
The metal layer 122 of few side.
Similarly, the second core plate 14 may include core plate medium 140 and the metal layer positioned at at least side of core plate medium 140
142。
The selection of the material of core plate medium 120 and 140 can be selected according to the Functional Design of each layer of core plate.Core plate medium
Material can be fissipation factor (DF, DampingFactor) lesser material suitable for radio circuit, such as ceramic base high frequency
Material or polytetrafluoroethylene (PTFE) etc.；Or the biggish material of fissipation factor suitable for custom circuit, such as FR-4 (including epoxy
Resin).
In the present embodiment, core plate medium 120 and 140 removes the material system that can be passed through by the radiofrequency signal of permission certain frequency
It at outer, can also be made of thermosetting material, and core plate medium 120 and 140 first passes through heat treatment for solidification in advance, therefore the core plate is situated between
The shape of matter 120 and 140 is fixed, will not deformation occurs again during subsequent heat.Certainly, in other embodiments, should
Core plate medium may be the thermoplastic material softened after heating.
Wherein, thermosetting material refers to: the material can soften flowing when heating for the first time, be heated to certain temperature, produce
Biochemical reaction makes interlinkage solidify and be hardened；It is this variation be it is irreversible, hereafter, when heating again, which cannot be again
Softening is flowed.
Common thermosetting material include but is not limited to allyl resin, epoxy resin, heat-curable urethane, organosilicon or
Polysiloxanes etc..These resins can be formed by the reaction product of polymerisable compound, and the polymerisable compound includes at least
A kind of oligomeric urethane (methyl) acrylate.In general, oligomeric urethane (methyl) acrylate is more (methyl) propylene
Acid esters.Term " (methyl) acrylate " is used to refer to the ester of acrylic acid and methacrylic acid, and with generally refer to (methyl)
" poly- (methyl) acrylate " of acrylate polymer compares, and " more (methyl) acrylate " refers to including more than one
The molecule of (methyl) acrylate group.Most commonly, more (methyl) acrylate are two (methyl) acrylate, but
It is contemplated that using three (methyl) acrylate, four (methyl) acrylate etc..
Further, the second core plate 14 is provided with metal layer 142 adjacent to 12 side of the first core plate.
In the present embodiment, the metal layer 122,142 on first core plate 12 and the second core plate 14 all can be layers of copper.Its
In, copper has good conductive property, and is the most common line material of printed circuit board 100.To every one first core plate 12 and
Two core plates 14 carry out patterned process, required line pattern can be obtained, and can be by metal layer 122 according to Functional Design
It is signals layer 144 and ground plane with 142 points；Wherein the pattern of signals layer 144 is complicated compared with the pattern of ground plane.In general, signals layer
144 be the layer being used to form where a plurality of metallic circuit of the electrical connection between electronic device；Ground plane leads to for being connected to ground
It is often the layer in large area continuous metal region.
Optionally, it is grounded with radiator 20 by the metal layer 142 that conductive adhesion layer 30 is connect on the second core plate 14
Layer, that is, be indirectly electrically connected radiator 20 with the ground plane realization on the second core plate 14.In this way, can make to connect
Stratum directly passes through the stepped construction of sandwich and radiator 20 is electrically connected, to be directly grounded, can shorten ground connection
Thus path promotes the earthing effect of the electronic device to be grounded on printed circuit board 100, and ground connection stability.
Optionally, refering to fig. 1, the opposite two sides of the core plate medium 140 of second core plate 14 are provided with metal layer 142.
Wherein, the metal layer 142 on the second core plate 14 close to 12 side of the first core plate is ground plane, and away from the another of first core plate 12
The metal layer 144 of side is the first signals layer 144.
Fig. 1 and Fig. 2 is further regarded to, in the present embodiment, through slot 16 can be offered on the core plate component 10, for accommodating
The radiator 20 and conductive adhesion layer 30.
In the present embodiment, the first through slot 161 is offered on the first core plate 12, wherein the first through slot 161 is along the first core
The thickness direction of plate 12 runs through entire first core plate 12.The second through slot 162, similarly, second are offered on the second core plate 14
Through slot 162 runs through entire second core plate 14 along the thickness direction of the second core plate 14.The first core plate 12 and the second core plate 14 successively
When stacking, the first through slot 161 on every one first core plate 12 is mutually aligned with the second through slot 162 on every one second core plate 14,
So that the first through slot 161 and the second through slot 162 communicate with each other to form an accommodating space, to accommodate radiator 20.The present embodiment
In, radiator 20 is at least partially housed in the first through slot 161 and the second through slot 162 is formed by accommodating space.Wherein,
The sectional dimension of one through slot 161 is greater than the sectional dimension of the second through slot 162.
In the present embodiment, radiator 20 includes the first radiating part 21 to match with the first through slot 161, and is led to second
The second radiating part 22 that slot 162 matches.Wherein, the first radiating part 21 is placed in the first through slot 161, and the second radiating part 22 holds
It is placed in the second through slot 162.Accordingly, the cross-sectional area of the first radiating part 21 is similarly greater than the cross section of the second radiating part 22
Product.
After radiator 20 is placed in above-mentioned accommodating space, between radiator 20 and the metal layer 142 of the second core plate 14
The first gap 173 is formed, and forms the second gap 175 between the inner wall of the second through slot 162.First gap 173 and second
Gap 175 communicates with each other, for conductive adhesion layer 30 to be arranged.
Wherein, conductive adhesion layer 30 includes the first subconductivity adhesive layer 31 and the second subconductivity adhesive layer 32.First son is led
Electric adhesive layer 31 is placed in the first gap 173, is used for metal layer 142 (ground plane) is Nian Jie with radiator 20 and is electrically connected
It connects.Second subconductivity adhesive layer 32 is placed in the second gap 175, bonding with radiator 20 for increasing by the second core plate 14
Area, so that the connection between the second core plate 14 and radiator 20 is stronger.
In the present embodiment, since the sectional dimension of the first through slot 161 is greater than the sectional dimension of the second through slot 162, first dissipates
Hot portion 21 and the second radiating part 22 are respectively contained in the first through slot 161 and the second through slot 162, therefore can be by radiator 20
It is set as raised structure.Specifically it is to be understood that the second radiating part 22 is the boss being arranged on the first radiating part 21；
Wherein, the section of radiator 20 can be T-shaped, or can also be L-shaped.In the present embodiment, conductive adhesion layer 30 can be set
Set on the second radiating part 22 and the step surface of the first radiating part 21 formation, thus reinforce the second core plate 14 and radiator 20 it
Between bonding strength, improve its connection reliability.
Wherein, the cross-sectional area of the first subconductivity adhesive layer 31 is less than or equal to viscous with the first subconductivity on radiator 20
Tie the area on the surface that layer 31 contacts.I.e. the marginal portion of the first subconductivity adhesive layer 31 without departing from radiator 20 edge,
Enter in the first through slot 161 to prevent from being formed the conductive material of the first subconductivity adhesive layer 31, is led to avoid there is the first son
Electric adhesive layer 31 directly contacts with the metal layer 122 on the first core plate 12 and causes the problem for short circuit occur.
In the present embodiment, it can also be connected by adhesive layer between the first core plate 12 and the second core plate 14.When the first core plate
When 12 quantity is multiple, adhesive layer connection again may be by between multiple first core plates 12.Wherein, adhesive layer includes first
Adhesive layer 18 and the second adhesive layer 19.
Specifically, the first adhesive layer 18 is arranged between the first core plate 12 and the second core plate 14 and glues around the first subconductivity
Layer 31 is tied to be arranged.Referring to Fig. 1,18 part of the first adhesive layer is arranged between the first core plate 12 and the second core plate 14, another portion
Set up separately and sets between the second core plate 14 and the first radiating part 21.
Further, third space 177, and second are also formed between radiator 20 and the inner wall of the first through slot 161
Adhesive layer 19 is set in third space 177, for the first core plate 12 and radiator 20 to be bonded.
In the present embodiment, the first adhesive layer 18 and the second adhesive layer 19 are integrally formed.First adhesive layer 18 and second
Adhesive layer 19 can be cohesive material, and be specifically as follows thermosetting material, such as prepreg.First adhesive layer 18 and
The material of two adhesive layers 19 can be identical.The material of adhesive layer (the first i.e. above-mentioned adhesive layer 18 and the second adhesive layer 19) with and
The difference of the material of core plate medium 120 and 140 is that adhesive layer uses the thermosetting material without Overheating Treatment.Therefore, to viscous
When closing layer heating, adhesive layer can melt, and then by two neighboring first core plate 12, two neighboring second core plate 14, and each other
The first adjacent core plate 12 and the bonding of the second core plate 14.
In other embodiments, which can also be made of thermoplastic material.Wherein, thermoplastic material refers to: heat
Thermoplastic plastic refers to the plastics with heating and softening, hardening by cooling characteristic.Soften when heating so that flowing, cooling is hardened, this mistake
Journey is reversible, and can be repeated.Common thermoplastic material includes but is not limited to polyethylene, polypropylene, polyvinyl chloride, gathers
Styrene, polyformaldehyde, poly- carbonic acid junket, polyamide, acrylics, other polyenes invade its copolymer, it is poly- mock, polyphenylene oxide,
Chlorinated polyether etc..Molecular resin chain is all line style or branched structure in thermoplastic, is produced between strand without chemical bond
Raw, softening flowing when heating, the cooling process being hardened is physical change.
In an example, the thermoplastic material may include: polyketone, Nomex, polyimides, polyetherimide,
Polyamidoimide, polyphenylene sulfide, polyphenylsulfone, fluoropolymer, polybenzimidazoles, their derivative or their combination.
In another example, which may include a kind of polymer, such as polyketone, thermoplastic polyimide, gather
Etherimide, polyphenylene sulfide, polyether sulfone, polysulfones, polyamidoimide, their derivative or their combination.
In a further example, which can also include polyketone, such as polyether-ether-ketone, polyether-ketone, polyether ketone ketone, gather
Ether ether ketone ketone, their derivative or their combination.A kind of illustrative thermoplastic fluoropolymer includes: fluorinated ethylene
Propylene, polytetrafluoroethylene (PTFE), polyvinylidene fluoride, perfluoro alkoxy, the one of tetrafluoroethene, hexafluoropropene and vinylidene fluoride
Kind trimer, polychlorotrifluoroethylene, ethylene-tetrafluoroethylene copolymer, ethylene-chlorotrifluoro-ethylene copolymer or their times
What is combined.
Further, referring to Fig. 1, printed circuit board 100, which is further offered from the first signals layer 144, extends to ground connection
The via hole 50 of layer, and the conductive layer 52 of electrical connection the first signals layer 144 and ground plane is provided in via hole 50.By using
First signals layer 144 and ground plane are directly connected to by the mode of conductive through hole, can be further improved the first signals layer 144 ground connection
Stability.
Wherein, via hole 50 can extend past ground plane by the first signals layer 144, and extend in radiator 20,
And via hole 50 offsets one from another with conductive adhesion layer 30.
In other examples, via hole 50 can also be extended past ground plane by the first signals layer 144, and run through and led
It is extended in radiator 20 after electric adhesive layer 30.Wherein, via hole 50 can run through entire radiator 20；Or conducting
Hole 50 can also be partially driven into radiator 20 or via hole 50 or be partially driven into conductive adhesion layer 30, without
It is connect with radiator 20.
In another embodiment, which can also include at least one third core plate 15, and third core plate
15 are stacked at second core plate 14 away from 12 side of the first core plate.Each third core plate 15 may include core plate medium and be located at the core
The metal layer of plate medium at least side.
In the present embodiment, when the quantity of the third core plate 15 is multiple, in all third core plates 15 with the second core
The metal layer on the side of the second core plate 14 of the maximum third core plate of the distance of plate 14 is second signal layer (that is, most
The outer metal layers of outer layer third core plate are signals layer).
Referring to Fig. 3, wherein printed circuit board 100 includes a third core plate 15, third core plate 15 is arranged in the second core
Plate 14 deviates from the side of the first core plate 12, and is sequentially overlapped setting with the second core plate 14 and the first core plate 12.
In the present embodiment, third core plate 15 includes third through slot 151, and third core plate 15, the second core plate 14 and first
After core plate 12 is superposed, third through slot 151 is connected with the second through slot 162 and the first through slot 161, so that it is empty to form accommodating
Between, for radiator 20 to be arranged.
Wherein, third through slot 151 can be identical with the sectional dimension of the second through slot 162, so that the second of radiator 20
Radiating part 22 protrudes into third through slot 151 after penetrating through the second through slot 162.
Alternatively, third through slot 151 can be different from the sectional dimension of the second through slot 162, i.e., the second of radiator 20 dissipates
The side of hot portion 22 back to the first radiating part 21 also has third radiating part, and third radiating part is placed in third through slot 151.
Wherein, deviate from the one of second core plate on maximum third core plate with the second core plate 14 in third core plate 15
Side is provided with second signal layer 146.Printed circuit board 100 further offers from second signal layer 146 and extends to ground plane
Via hole 50；The conductive layer 52 of electrical connection second signal layer 146 and ground plane is again provided in the via hole 50.
Identical with embodiment above, the via hole 50 in the present embodiment can equally be extended by second signal layer 146 to pass through
Ground plane is crossed, and is extended in radiator 20, and via hole 50 offsets one from another with conductive adhesion layer 30.Alternatively, via hole 50
Ground plane can also be extended past by second signal layer 146, and is extended in radiator 20 after conductive adhesion layer 30.
In the present embodiment, metal layer of the third core plate 15 close to 14 side of the second core plate does not connect directly with conductive adhesion layer 30
Touching, to prevent short circuit problem, can wherein be separated between the metal layer and conductive adhesion layer 30 by adhesive layer.
Referring to Fig. 4,100 two sides of printed circuit board are also each provided with a metal cover layer in another embodiment of the application
1441, metal cover layer 1441 is used to cover the opening of accommodating space, so as to prevent between conductive adhesion layer 30 and third
The second adhesive layer 19 in gap 177 is overflowed from the opening of accommodating space.
Specifically as shown in figure 4, wherein the second core plate 14 is arranged in back to the one of the first core plate 12 in a metal cover layer 1441
Side surface, another metal cover layer 1441 be arranged in the first farthest core plate 12 of the second core plate of distance 14 back to the second core plate 14
Side surface.By setting double layer of metal capping layer 1441, radiator 20 can be sealed in accommodating space, so that
Radiator 20 and the fixation of entire core plate component 10 are stronger.Meanwhile accommodating space is covered by metal cover layer 1441
Opening, can prevent conductive adhesion layer 30 and the second adhesive layer 19 from the opening of accommodating space overflow.
In the present embodiment, metal cover layer 1441 can be simultaneously with the metal layer on the first core plate or the second core plate
Molding, either can also separately form with the metal layer on the first core plate or the second core plate.Wherein when metal cover layer 1441
When separately being formed with the metal layer on the first core plate or the second core plate, metal cover layer 1441 can by way of plating at
Type, and it is covered on radiator 20 and corresponding core plate surface, to realize the fixation of radiator 20 Yu entire core plate component 10
Connection.
Further, in other examples, metal cover layer 1441 can also by be bonded or weld etc. modes at
Type is on the surface of printed circuit board 100.
Further, it is different from the prior art, present invention also provides a kind of electronic devices, referring to Fig. 5, electronic device
300 include any printed circuit board 100 and being set to the heating device 200 of 100 side of printed circuit board above.Its
In, heating device 200 can for generate heat component or in which part include generation heat component, e.g. electric parts,
Application processor or IC chip etc..
Please continue to refer to Fig. 5, when 100 not set third core plate of printed circuit board, heating device 200 is arranged in the second core
Plate 14 back to the side of the first core plate 12, and heating device 200 with and the first signals layer 144 of its ipsilateral setting be electrically connected.Its
In, heating device 200 is also connect with radiator 20.It can accelerate the heat dissipation of heating device 200 by radiator 20, thus
Prevent thermal accumlation.
Wherein, heating device 200 includes electronic device 210 and radiating block 220, and electronic device 210 and radiating block 220
Fixed and electrical connection.
In the present embodiment, radiating block 220 can be metal shell, and the inside of radiating block 220 is arranged in electronic device 210
In cavity.Wherein, electronic device 210 can weld or using conductive adhesive by way of be fixed in radiating block 220.
The outside of radiating block 220 is provided with metab 221, and radiating block 220 is connect by metab 221 with radiator 20.
Wherein, metab 221 again may be by welding or connecting by the way of conductive adhesive with radiator 20.
Further, radiating block 220 can also include connection terminal 222, and the radiating block 220 passes through connection terminal 222
It is electrically connected with the first signals layer 144.Wherein, connection terminal 222 can be pad, correspondingly, set on the second core plate 14
It is equipped with the welding position to match with connection terminal 222, by the way that connection terminal 222 to be welded on above-mentioned welding position and first
Signals layer 144 realizes electrical connection.
Referring to Fig. 6, heating device 200 is arranged in third core plate when printed circuit board 100 is provided with third core plate 15
15 back to the side of the second core plate 14, and is electrically connected on third core plate 15 with its ipsilateral second signal layer 146.Wherein, it sends out
The structure and set-up mode of thermal device 200 can with it is identical above, this will not be repeated here.
Further, referring to Fig. 7,100 two sides of printed circuit board equally can be set and identical metal cover above
Layer 1441.Wherein, heating device 200 can be set in wherein one layer of metal cover layer 1441 back to the side of radiator 20,
And heating device 200 can be by being fixedly connected after fixing with this metal cover layer 1441 with radiator 20.The heating device
200 with 1441 can be equally fixedly connected using welding or by conducting resinl, to realize heating device 200 and radiator
20 electrical connection.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (15)
1. a kind of printed circuit board characterized by comprising
Core plate component, including the first core plate and the second core plate stacked gradually, close first core plate on second core plate
Side be provided with metal layer, the first through slot through first core plate, and the second core plate are offered on first core plate
On offer the second through slot for passing through second core plate, first through slot and second through slot communicate with each other to form an accommodating
Space；
Radiator is accommodated in the accommodating space；Between the radiator and the metal layer of second core plate
The first gap is formed, and forms the second gap between the inner wall of second through slot, and first gap and described second
Gap communicates with each other；And
Conductive adhesion layer is set in first gap and second gap, the radiator and the metal layer it
Between be electrically connected by the conductive adhesion layer.
2. printed circuit board according to claim 1, which is characterized in that the conductive adhesion layer includes being located at described first
The first subconductivity adhesive layer in gap and the second subconductivity adhesive layer in second gap；First son is led
The cross-sectional area of electric adhesive layer is less than or equal to the surface contacted on the radiator with the first subconductivity adhesive layer
Area.
3. printed circuit board according to claim 2, which is characterized in that further include positioned at first core plate and described the
Between two core plates and around the first adhesive layer of the first subconductivity adhesive layer setting, for by first core plate and described
The bonding of second core plate.
4. printed circuit board according to claim 3, which is characterized in that the radiator is interior with first through slot
It is also formed with third space between wall, and is provided with the second adhesive layer in the third space.
5. printed circuit board according to claim 4, which is characterized in that first adhesive layer and second adhesive layer
It is prepreg, and first adhesive layer and second adhesive layer are integrally formed.
6. printed circuit board according to claim 1, which is characterized in that the quantity of first core plate is multiple and more
A first core plate stacks gradually；All first through slot alignment settings of multiple first core plates are to accommodate described dissipate
Thermal is at least partly.
7. printed circuit board according to claim 6, which is characterized in that the metal layer is ground plane；Second core
Side on plate away from first core plate is additionally provided with the first signals layer；
The printed circuit board further offers the via hole that the ground plane is at least extended to from first signals layer；Institute
State the conductive layer for being provided in via hole and being electrically connected first signals layer and the ground plane.
8. printed circuit board according to claim 7, which is characterized in that the via hole extends from first signals layer
It by the ground plane, and extends in the radiator, and the via hole offsets one from another with the conductive adhesion layer.
9. printed circuit board according to claim 7, which is characterized in that the via hole extends from first signals layer
By the ground plane, the conductive adhesion layer, and extend in the radiator.
10. printed circuit board according to claim 1, which is characterized in that the sectional dimension of first through slot is greater than institute
State the sectional dimension of the second through slot, the radiator includes the first radiating part to match with first through slot, and with institute
State the second radiating part that the second through slot matches；
First gap, second heat dissipation are formed between first radiating part and the metal layer of second core plate
Second gap is formed between portion and the inner wall of second through slot.
11. printed circuit board according to claim 1, which is characterized in that the printed circuit board two sides are each provided with one
Metal cover layer, the metal cover layer cover the opening of the accommodating space.
12. printed circuit board according to claim 1, which is characterized in that further include being stacked at second core plate to deviate from
At least one third core plate of first core plate side；
Deviate from the side of second core plate in all third core plates on maximum third core plate with second core plate
It is provided with second signal layer；The metal layer is ground plane, and the printed circuit board is further offered from the second signal
Layer at least extends to the via hole of the ground plane；It is provided with the electrical connection second signal layer in the via hole and described connects
The conductive layer on stratum.
13. a kind of electronic device, which is characterized in that including printed circuit board such as of any of claims 1-11, with
And heating device；The heating device is installed on second core plate back to first core plate side, and fills with the heat dissipation
Set connection.
14. electronic device according to claim 13, which is characterized in that the heating device includes electronic device and dissipates
Heat block；The electronic device is fixed and is electrically connected with the radiating block, and is electrically connected with the signals layer of second core plate；It is described
Radiating block is also fixed and is electrically connected with the radiator.
15. electronic device according to claim 13, which is characterized in that the printed circuit board two sides are each provided with a gold medal
Belong to capping layer, the metal cover layer covers the opening of the accommodating space；Wherein one layer of metal cover layer is arranged in institute
It states between heating device and the radiator, the heating device is fixed and is electrically connected with the radiator.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821451362.2U CN209419982U (en) | 2018-09-05 | 2018-09-05 | Printed circuit board and electronic device |
| TW108201644U TWM583663U (en) | 2018-02-09 | 2019-01-31 | Printed circuit board and electronic apparatus |
| TW108103936A TWI713419B (en) | 2018-02-09 | 2019-01-31 | Printed circuit board and method of manufacturing the same and electronic apparatus |
| US16/264,713 US10652992B2 (en) | 2018-02-09 | 2019-02-01 | Printed circuit board, method for manufacturing the same and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821451362.2U CN209419982U (en) | 2018-09-05 | 2018-09-05 | Printed circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209419982U true CN209419982U (en) | 2019-09-20 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110636690A (en) * | 2019-10-23 | 2019-12-31 | 昆山沪利微电有限公司 | Heat dissipation substrate structure and manufacturing method thereof |
| CN110708864A (en) * | 2019-10-16 | 2020-01-17 | 生益电子股份有限公司 | Printed circuit board containing heat dissipation medium and preparation method thereof |
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
| WO2023025099A1 (en) * | 2021-08-27 | 2023-03-02 | 中兴通讯股份有限公司 | Pcb printed circuit board |
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2018
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110708864A (en) * | 2019-10-16 | 2020-01-17 | 生益电子股份有限公司 | Printed circuit board containing heat dissipation medium and preparation method thereof |
| CN110708864B (en) * | 2019-10-16 | 2021-06-25 | 生益电子股份有限公司 | Printed circuit board containing heat dissipation medium and preparation method thereof |
| CN110636690A (en) * | 2019-10-23 | 2019-12-31 | 昆山沪利微电有限公司 | Heat dissipation substrate structure and manufacturing method thereof |
| CN110636690B (en) * | 2019-10-23 | 2020-12-11 | 昆山沪利微电有限公司 | Heat dissipation substrate structure and manufacturing method thereof |
| CN112822876A (en) * | 2020-12-28 | 2021-05-18 | 广州广合科技股份有限公司 | Printed circuit board embedded with three-dimensional metal base and processing method thereof |
| WO2023025099A1 (en) * | 2021-08-27 | 2023-03-02 | 中兴通讯股份有限公司 | Pcb printed circuit board |
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