CN209400244U - Semiconductor refrigerating test cabinet - Google Patents
Semiconductor refrigerating test cabinet Download PDFInfo
- Publication number
- CN209400244U CN209400244U CN201920112591.XU CN201920112591U CN209400244U CN 209400244 U CN209400244 U CN 209400244U CN 201920112591 U CN201920112591 U CN 201920112591U CN 209400244 U CN209400244 U CN 209400244U
- Authority
- CN
- China
- Prior art keywords
- water
- semiconductor refrigerating
- liquid cooling
- semiconductor
- constant temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides a kind of semiconductor refrigerating test cabinet, including cabinet body, the testboard for placing semiconductor refrigerating mechanism is installed on the cabinet body, the test cabinet further includes testing and control mechanism and the recirculated water constant temperature mechanism, the induction mechanism that connect respectively with testing and control mechanism；The water route of recirculated water returns to recirculated water constant temperature mechanism after passing through semiconductor refrigerating mechanism and testboard respectively after coming out from recirculated water constant temperature mechanism；The induction mechanism includes the multiple inductive components for being installed in recirculated water constant temperature mechanism, the water route of recirculated water and semiconductor refrigerating mechanism respectively.The mechanism of the utility model is simple, can be adapted to multiclass semiconductor refrigerating mechanism, and test process is simple, can effectively improve the efficiency of test and reduce the cost of test, simple and convenient.
Description
Technical field
The utility model relates to electronic refrigeration equipment technical field more particularly to a kind of semiconductor refrigerating test cabinets.
Background technique
The Performance Test System and device of traditional semiconductor refrigerating mould group are fairly simple, and performance test is all simply to take
It builds, and test macro is all independent.Each based semiconductor refrigeration module is opposite a test macro configured with it, and every
A test macro is separated from each other, without any association.And test macro is complicated, and is all adjusted with a large amount of electricity auxiliary heating
Save temperature.Existing test macro energy consumption is larger, reaches that the counterbalance effect time is longer, the overlapping investment of resource, specifically: one
The part-structure overlapping of a little test macros, is completed sometimes according to needing even to combine two or more test macro
Work, not only time-consuming in this way but also trouble, and it is larger to the investment of test macro.
Utility model content
The utility model in order to solve the technical problem, provides a kind of semiconductor refrigerating test cabinet.
The utility model provides a kind of semiconductor refrigerating test cabinet, including cabinet body, is installed on the cabinet body for putting
The testboard of semiconductor refrigerating mechanism is set, the test cabinet further includes testing and control mechanism and connect respectively with testing and control mechanism
Recirculated water constant temperature mechanism, induction mechanism；The water route of recirculated water passes through semiconductor system after coming out from recirculated water constant temperature mechanism respectively
Recirculated water constant temperature mechanism is returned to after cold structure and testboard；The induction mechanism include be installed in respectively recirculated water constant temperature mechanism,
The water route of recirculated water and multiple inductive components of semiconductor refrigerating mechanism.
Further, the recirculated water constant temperature mechanism include water tank, for water tank with water water filling water pump, be liquid in water tank
Heating water tanks mechanism that body is heated is connect with water tank for the drawing water to semiconductor refrigerating mechanism by the liquid pump in water tank
Water pump.
Further, the heating water tanks mechanism includes the heater strip being installed in water tank and the heating that connect with heater strip
Control mechanism, the heating control mechanisms are connect with testing and control mechanism.
Further, the semiconductor refrigerating mechanism includes liquid cooling component, is installed in partly leading for liquid cooling component
Body cooling assembly and the radiating subassembly for being connected to the separate side connecting with liquid cooling component of semiconductor refrigerating component, described half
Conductor cooling assembly includes multiple semiconductor chilling plates and connect the control for driving semiconductor chilling plate with semiconductor chilling plate
Component processed；The cold end of the semiconductor chilling plate is connect with Control device of liquid cooling, and hot end is connect with radiating subassembly.
Further, the water outlet of the recirculated water constant temperature mechanism is connect with semiconductor refrigerating mechanism by first pipe,
The water inlet end of the recirculated water constant temperature mechanism is connect with semiconductor refrigerating mechanism by second pipe；It is set in the middle part of the first pipe
There is flow control valve, one end that first pipe is connect with semiconductor refrigerating mechanism is equipped with the first solenoid valve, and connect with testboard
One end be equipped with second solenoid valve；It is connected with unidirectional three-way valve between the second pipe and semiconductor refrigerating mechanism, testboard,
The one end connecting with recirculated water constant temperature mechanism is equipped with third solenoid valve.
Further, the induction mechanism includes be installed in one end that first pipe is connect with recirculated water constant temperature mechanism
One water temperature inductor is installed in second water temperature inductor and first of the first pipe before the first solenoid valve and second solenoid valve
Hydraulic inductor and it is installed in the third water temperature inductor for the side that second pipe is connect with semiconductor refrigerating mechanism, first respectively
Water flow inductor, the second hydraulic inductor.
Further, the liquid cooling component includes being equipped with the liquid cooling case of hollow cavity and closing with the liquid cooling case lid
Cover board is installed with multi-disc the first liquid cooling fin in the hollow cavity of the liquid cooling case, and the first liquid cooling fin is by hollow cavity
Bottom extend towards on the outside of hollow cavity；The side that the cover board is connect with liquid cooling case be equipped with the second liquid cooling fin, described second
Liquid cooling fin is extended by cover board towards the direction of liquid cooling case；When lid closes, the first liquid cooling fin and the second liquid cooling fin transpostion interval.
Further, the radiating subassembly includes the heat sink connecting with the hot end of semiconductor chilling plate and is installed in heat dissipation
The radiating fin of the separate side connecting with semiconductor chilling plate of plate, the radiating fin are extended outwardly by heat sink；It is described to dissipate
Hot component external is equipped with air incubator.
Further, the induction mechanism includes the air temperature sensor being installed in air incubator.
Further, the water tank is equipped with drain valve；The induction mechanism further includes the water connecting with testing and control mechanism
Position inductor, the water level sensor are installed in water tank.
The beneficial effects of the utility model are: the utility model in test cabinet by being arranged recirculated water constant temperature mechanism and sense
Mechanism is answered, by recirculated water constant temperature mechanism, recirculated water is pumped from recirculated water constant temperature mechanism to semiconductor refrigerating mechanism, recirculated water warp
After semiconductor refrigerating mechanism, it can be cooled down by semiconductor refrigerating mechanism, then flow circuit returns to recirculated water constant temperature machine again
In structure, heating water tanks mechanism is equipped in recirculated water constant temperature mechanism, it can be in recirculated water constant temperature mechanism by heating water tanks mechanism
Recirculated water heated so that the temperature that recirculated water is kept constant；And felt by water route of the induction mechanism to recirculated water
It should monitor, the temperature of each position in water route can be measured, thus by testing and control mechanism to induction mechanism data collected
It is analyzed, show whether the effect of semiconductor refrigerating mechanism meets the requirements；The mechanism of this test cabinet is simple, can be adapted to multiclass
Semiconductor refrigerating mechanism, test process is simple, can effectively improve the efficiency of test and reduce the cost of test, simple and convenient.
Detailed description of the invention
Fig. 1 is the schematic diagram of one embodiment of the utility model semiconductor refrigerating test cabinet.
Fig. 2 is the perspective view of one embodiment of the utility model semiconductor refrigerating test cabinet.
Fig. 3 is the perspective view of another embodiment of the utility model semiconductor refrigerating test cabinet.
Fig. 4 is the perspective view of the semiconductor refrigerating mechanism of one embodiment of the utility model semiconductor refrigerating test cabinet.
Fig. 5 is the solid of the semiconductor refrigerating mechanism of another embodiment of the utility model semiconductor refrigerating test cabinet
Figure.
Fig. 6 is the solid of the semiconductor refrigerating mechanism of the further embodiment of the utility model semiconductor refrigerating test cabinet
Figure.
Fig. 7 is the solid of the semiconductor refrigerating mechanism of further embodiment again of the utility model semiconductor refrigerating test cabinet
Figure.
Fig. 8 is the perspective view of the radiating subassembly of one embodiment of the utility model semiconductor refrigerating test cabinet.
Fig. 9 is the perspective view of the cover board of one embodiment of the utility model semiconductor refrigerating test cabinet.
Figure 10 is the perspective view of the liquid cooling case of one embodiment of the utility model semiconductor refrigerating test cabinet.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, it is intended to for explaining the utility model, and should not be understood as to the utility model
Limitation.
In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " suitable
The orientation or positional relationship of the instructions such as hour hands ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, merely to just
In description the utility model and simplify description, rather than the device or element of indication or suggestion meaning there must be specific side
Position is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. terms shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood as the case may be
Concrete meaning in the present invention.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to
Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above "
One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.First is special
Sign is directly below and diagonally below the second feature including fisrt feature under the second feature " below ", " below " and " below ", or only
Indicate that first feature horizontal height is less than second feature.
The utility model is described in further detail below by specific embodiment combination attached drawing.
As shown in Fig. 1 ~ Figure 10, the utility model provides a kind of semiconductor refrigerating test cabinet, including cabinet body 5, the cabinet
Be installed with the testboard 51 for placing semiconductor refrigerating mechanism 2 on body 5, the test cabinet further include testing and control mechanism 4 and
Recirculated water constant temperature mechanism, the induction mechanism being connect respectively with testing and control mechanism 4；The water route of recirculated water is from recirculated water constant temperature mechanism
Respectively by returning to recirculated water constant temperature mechanism after semiconductor refrigerating mechanism 2 and testboard 51 after out；The induction mechanism includes
It is installed in multiple inductive components of recirculated water constant temperature mechanism, the water route of recirculated water and semiconductor refrigerating mechanism 2 respectively.
The utility model passes through recirculated water constant temperature machine by the way that recirculated water constant temperature mechanism and induction mechanism are arranged in test cabinet
Structure pumps recirculated water to semiconductor refrigerating mechanism 2 from recirculated water constant temperature mechanism, and recirculated water can lead to after semiconductor refrigerating mechanism 2
It crosses semiconductor refrigeration mechanism 2 to be cooled down, then flow circuit returns in recirculated water constant temperature mechanism again, in recirculated water constant temperature mechanism
Equipped with 11 heating mechanism of water tank, the recirculated water in recirculated water constant temperature mechanism can be heated by 11 heating mechanism of water tank,
So that the temperature that recirculated water is kept constant；And induction monitoring is carried out by water route of the induction mechanism to recirculated water, water can be measured
The temperature of each position in road is obtained and is partly led to be analyzed by testing and control mechanism 4 induction mechanism data collected
Whether the effect of body refrigeration mechanism 2 meets the requirements；The mechanism of this test cabinet is simple, can be adapted to multiclass semiconductor refrigerating mechanism 2,
Test process is simple, can effectively improve the efficiency of test and reduce the cost of test, simple and convenient.
In one alternate embodiment, the recirculated water constant temperature mechanism include water tank 11, for water tank 11 fill the water water filling water
Pump 12,11 heating mechanism of water tank heated for the liquid in water tank 11 are connect for by the liquid in water tank 11 with water tank 11
Body pumps the water pump 14 that draws water to semiconductor refrigerating mechanism 2.11 heating mechanism of water tank includes the heating being installed in water tank 11
Silk and the heating control mechanisms connecting with heater strip, the heating control mechanisms are connect with testing and control mechanism 4.The water tank 11
Equipped with drain valve.In the present embodiment, filled the water by water filling water pump 12 to water tank 11, the water pump 14 that draws water can be by following in water tank 11
Ring water pump is to semiconductor refrigerating mechanism 2, and 11 heating mechanism of water tank can heat the recirculated water of water tank 11, so that circulation
The water temperature of water is kept constant, and is tested convenient for subsequent semiconductor refrigeration mechanism 2, simple and convenient.
In one alternate embodiment, the semiconductor refrigerating mechanism 2 includes liquid cooling component 21, to be installed in liquid cold
But the semiconductor refrigerating component of component 21 and it is connected to the separate side connecting with liquid cooling component 21 of semiconductor refrigerating component
Radiating subassembly, the semiconductor refrigerating component includes that multiple semiconductor chilling plates 25 and connecting with semiconductor chilling plate 25 are used for
Drive the control assembly of semiconductor chilling plate 25；The cold end of the semiconductor chilling plate 25 is connect with Control device of liquid cooling, hot end
It is connect with radiating subassembly.The liquid cooling component 21 include equipped with hollow cavity liquid cooling case 211 and with the liquid cooling case 211
The cover board 212 closed is covered, is installed with the first liquid cooling of multi-disc fin 2111, first liquid in the hollow cavity of the liquid cooling case 211
Cold fin 2111 is extended by the bottom of hollow cavity towards hollow cavity outside；The side that the cover board 212 is connect with liquid cooling case 211
Equipped with the second liquid cooling fin 2121, the second liquid cooling fin 2121 is extended by cover board 212 towards the direction of liquid cooling case 211；Lid
When conjunction, 2121 transpostion interval of the first liquid cooling fin 2111 and the second liquid cooling fin.The radiating subassembly includes and semiconductor refrigerating
The heat sink 221 and be installed in dissipating for the separate side connecting with semiconductor chilling plate 25 of heat sink 221 that the hot end of piece 25 connects
Hot fin 222, the radiating fin 222 are extended outwardly by heat sink 221；Air incubator is equipped with outside the radiating subassembly
23.The utility model passes through the semiconductor chilling plate 25 that semiconductor refrigerating mechanism 2 is equipped with, according to Peltier principle, so that partly leading
25 both ends of body cooling piece can freeze respectively and generate heat, and the cold end of refrigeration is connect with liquid cooling mechanism, is passed through
The coolant liquid of liquid cooling mechanism can carry out cooling down under the action of semiconductor chilling plate 25, simple and convenient, heat dissipation effect
Fruit is good, noise is small, does not vibrate, environmental protection；Installation maintenance is easy simultaneously；And cooling mechanism is connected in the hot end of semiconductor chilling plate 25
22, it convenient for radiating by cooling mechanism 22 to hot end, avoids the temperature of semiconductor chilling plate 25 excessively high, can effectively improve
The performance and stability of device.Liquid cooling case 211 and cover board 212 are set, so that liquid refrigerating mechanism is detachably installed, are also convenient for clear
It washes and uses；And the first liquid cooling fin 2111 and the second liquid cooling fin 2121 be set, it can effectively increase and be connect with coolant liquid
Contacting surface product, further increases the cooling effect of liquid cooling mechanism, simple and convenient；And liquid cooling slot is set, convenient for the stream of coolant liquid
It is logical, can in parallel can also include but is not limited to serial communication, the cross section of liquid cooling slot between multiple liquid cooling slots it is round, rectangular or
Sun flower pattern；Encapsulation process between liquid cooling case 211 and cover board 212 includes but is not limited to electric welding, soldering, friction welding (FW), sealing ring
Locking, adhesive means.Cooling mechanism 22 is set, is radiated convenient for the hot end to semiconductor chilling plate 25, and radiating fin is set
Piece 222 can increase heat dissipation area, simple and convenient.The cooling mechanism of the semiconductor refrigerating further includes radiator fan 24, described to dissipate
Fan guard is equipped on the outside of Hot-air fan 24；Radiator fan 24 is set, the radiating fin 222 of radiating subassembly can be further driven to
Between air flowing, effectively increase the heat dissipation performance of radiating subassembly, it is simple and convenient, and the quantity of radiator fan 24 is adjustable.
In one alternate embodiment, the water outlet of the recirculated water constant temperature mechanism and semiconductor refrigerating mechanism 2 pass through the
The connection of one pipeline, the water inlet end of the recirculated water constant temperature mechanism are connect with semiconductor refrigerating mechanism 2 by second pipe；Described
Flow control valve is equipped in the middle part of one pipeline, one end that first pipe is connect with semiconductor refrigerating mechanism 2 is equipped with the first solenoid valve K1,
And the one end connecting with testboard 51 is equipped with second solenoid valve K2；The second pipe and semiconductor refrigerating mechanism 2, testboard 51
Between be connected with unidirectional three-way valve K4, the one end being connect with recirculated water constant temperature mechanism be equipped with third solenoid valve K3.In the present embodiment,
Be arranged multiple switch, convenient for recirculated water flow direction and flow monitor and adjust, be convenient for subsequent test.
In one alternate embodiment, the induction mechanism includes being installed in first pipe to connect with recirculated water constant temperature mechanism
One end the first water temperature inductor T1, be installed in second of first pipe before the first solenoid valve K1 and second solenoid valve K2
Water temperature inductor T2 and the first hydraulic inductor P1 and it is installed in the side that second pipe is connect with semiconductor refrigerating mechanism 2 respectively
Third water temperature inductor T3, the first water flow inductor L1, the second hydraulic inductor P2.The induction mechanism includes being installed in
Air temperature sensor in air incubator 23.The induction mechanism further includes the water level sense connecting with testing and control mechanism 4
Device 6 is answered, the water level sensor 6 is installed in water tank 11.In the present embodiment, the first water temperature inductor T1 can be to water tank 11
Recirculated water is detected, and water temperature is seen whether in constant range, consequently facilitating heating control mechanisms control 11 heater of water tank
Structure heat to recirculated water；Second water temperature inductor T2 can be measured into the water temperature before semiconductor refrigerating mechanism 2
Size, third water temperature inductor T3 can measure the water temperature size of the recirculated water come out from semiconductor refrigerating mechanism 2, pass through second
The data comparison of water temperature inductor T2 and third water temperature inductor T3, can feed back out semiconductor refrigerating mechanism 2 to recirculated water
Cooling effect；And air temperature sensor can be monitored the temperature of radiating subassembly, can effectively avoid semiconductor refrigerating
2 temperature of mechanism is excessively high, to influence to use, can also detect the heat dissipation effect of semiconductor refrigerating mechanism 2.Water level sensor 6 can
The recirculated water monitored in water tank 11 is high-order, when water shortage, can issue signal so that filling the water water pump 12 to water tank 11
Interior water filling can issue signal and stop filling the water into water tank 11 when water is enough, simple and convenient.
In the description of this specification, reference term " embodiment ", " some embodiments ", " an implementation
The description of example ", " some embodiments ", " example ", " specific example " or " some examples " etc. means to combine the embodiment or example
Particular features, structures, materials, or characteristics described are contained at least one embodiment or example of the utility model.At this
In specification, schematic expression of the above terms be may not refer to the same embodiment or example.Moreover, description is specific
Feature, structure, material or feature can be combined in any suitable manner in any one or more of the embodiments or examples.
The above content is combine specific embodiment further detailed description of the utility model, and it cannot be said that
The specific implementation of the utility model is only limited to these instructions.For the utility model person of an ordinary skill in the technical field
For, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made.
Claims (10)
1. a kind of semiconductor refrigerating test cabinet, including cabinet body, which is characterized in that be installed on the cabinet body for placing semiconductor
The testboard of refrigeration mechanism, the test cabinet further include testing and control mechanism and the recirculated water that connect respectively with testing and control mechanism
Constant temperature mechanism, induction mechanism；The water route of recirculated water from recirculated water constant temperature mechanism come out after respectively by semiconductor refrigerating mechanism and
Recirculated water constant temperature mechanism is returned to after testboard；The induction mechanism includes being installed in recirculated water constant temperature mechanism, recirculated water respectively
Multiple inductive components of water route and semiconductor refrigerating mechanism.
2. semiconductor refrigerating test cabinet as described in claim 1, which is characterized in that the recirculated water constant temperature mechanism includes water
Case, for water tank with water water filling water pump, be the liquid in water tank heated heating water tanks mechanism, connect with water tank for will
The water pump that draws water of liquid pump in water tank to semiconductor refrigerating mechanism.
3. semiconductor refrigerating test cabinet as claimed in claim 2, which is characterized in that the heating water tanks mechanism includes being installed in
Heater strip in water tank and the heating control mechanisms connecting with heater strip, the heating control mechanisms and testing and control mechanism connect
It connects.
4. semiconductor refrigerating test cabinet as described in claim 1, which is characterized in that the semiconductor refrigerating mechanism includes liquid
Cooling component, the semiconductor refrigerating component for being installed in liquid cooling component and to be connected to semiconductor refrigerating component separate cold with liquid
But component connection side radiating subassembly, the semiconductor refrigerating component include multiple semiconductor chilling plates and with semiconductor system
The cold control assembly connected for driving semiconductor chilling plate；The cold end and Control device of liquid cooling of the semiconductor chilling plate connect
It connects, hot end is connect with radiating subassembly.
5. semiconductor refrigerating test cabinet as claimed in claim 4, which is characterized in that the water outlet of the recirculated water constant temperature mechanism
It is connect with semiconductor refrigerating mechanism by first pipe, the water inlet end and semiconductor refrigerating mechanism of the recirculated water constant temperature mechanism are logical
Cross second pipe connection；Flow control valve is equipped in the middle part of the first pipe, first pipe is connect with semiconductor refrigerating mechanism
One end is equipped with the first solenoid valve, and the one end connecting with testboard is equipped with second solenoid valve；The second pipe and semiconductor system
It is connected with unidirectional three-way valve between cold structure, testboard, the one end connecting with recirculated water constant temperature mechanism is equipped with third solenoid valve.
6. semiconductor refrigerating test cabinet as claimed in claim 5, which is characterized in that the induction mechanism includes being installed in first
The first water temperature inductor of one end that pipeline is connect with recirculated water constant temperature mechanism is installed in first pipe in the first solenoid valve and
The second water temperature inductor and the first hydraulic inductor before two solenoid valves and it is installed in second pipe and semiconductor refrigerating respectively
Third water temperature inductor, the first water flow inductor, the second hydraulic inductor of the side of mechanism connection.
7. semiconductor refrigerating test cabinet as claimed in claim 4, which is characterized in that the liquid cooling component includes in being equipped with
The liquid cooling case of cavity body and the cover board closed with the liquid cooling case lid, are installed with the first liquid of multi-disc in the hollow cavity of the liquid cooling case
Cold fin, the first liquid cooling fin are extended by the bottom of hollow cavity towards hollow cavity outside；The cover board and liquid cooling case connect
The side connect is equipped with the second liquid cooling fin, and the second liquid cooling fin is extended by cover board towards the direction of liquid cooling case；When lid closes, the
One liquid cooling fin and the second liquid cooling fin transpostion interval.
8. semiconductor refrigerating test cabinet as claimed in claim 4, which is characterized in that the radiating subassembly includes and semiconductor system
The heat sink of cold hot end connection and the radiating fin for being installed in the separate side connecting with semiconductor chilling plate of heat sink, institute
Radiating fin is stated to be extended outwardly by heat sink；Air incubator is equipped with outside the radiating subassembly.
9. semiconductor refrigerating test cabinet as claimed in claim 8, which is characterized in that the induction mechanism includes being installed in air
Air temperature sensor in insulating box.
10. semiconductor refrigerating test cabinet as claimed in claim 2, which is characterized in that the water tank is equipped with drain valve；The sense
Answering mechanism further includes the water level sensor connecting with testing and control mechanism, and the water level sensor is installed in water tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920112591.XU CN209400244U (en) | 2019-01-23 | 2019-01-23 | Semiconductor refrigerating test cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920112591.XU CN209400244U (en) | 2019-01-23 | 2019-01-23 | Semiconductor refrigerating test cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209400244U true CN209400244U (en) | 2019-09-17 |
Family
ID=67898878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920112591.XU Active CN209400244U (en) | 2019-01-23 | 2019-01-23 | Semiconductor refrigerating test cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209400244U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110736972A (en) * | 2019-11-15 | 2020-01-31 | 上海禾赛光电科技有限公司 | Laser radar's heat radiation structure and laser radar |
| CN113624525A (en) * | 2021-07-22 | 2021-11-09 | 浙江先导热电科技股份有限公司 | Refrigeration performance test system suitable for semiconductor water-cooling type refrigeration module |
-
2019
- 2019-01-23 CN CN201920112591.XU patent/CN209400244U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110736972A (en) * | 2019-11-15 | 2020-01-31 | 上海禾赛光电科技有限公司 | Laser radar's heat radiation structure and laser radar |
| CN110736972B (en) * | 2019-11-15 | 2022-03-04 | 上海禾赛科技有限公司 | Laser radar's heat radiation structure and laser radar |
| CN113624525A (en) * | 2021-07-22 | 2021-11-09 | 浙江先导热电科技股份有限公司 | Refrigeration performance test system suitable for semiconductor water-cooling type refrigeration module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209400244U (en) | Semiconductor refrigerating test cabinet | |
| CN208317253U (en) | A kind of frequency converter control cabinet | |
| CN207604121U (en) | Liquid-cooled cabinet, whole machine cabinet and whole machine cabinet server | |
| CN201533219U (en) | Cooling system and motor controller comprising the same | |
| CN106059323A (en) | Cooling system of frequency converter | |
| CN208523134U (en) | A kind of embedded runner liquid cooling heat-exchanger rig of printed circuit board | |
| CN209496858U (en) | A kind of High Frequency IGBT Module | |
| CN102316709A (en) | Vehicle-mounted high-power liquid cooling equipment | |
| CN209071570U (en) | A kind of battery heat dissipation device of automobile services | |
| CN207021890U (en) | A kind of high frequency switch power | |
| CN201561603U (en) | Refrigeration and heating device | |
| CN201805315U (en) | Cooling system and motor controller including same | |
| CN206310548U (en) | The cold electric cooking apparatus of liquid | |
| CN209710567U (en) | The liquid cooling system of Double-working-condition on islands and reefs | |
| CN209605477U (en) | Domestic beverage is classified refrigeration equipment | |
| CN201948482U (en) | Electric heating and cooling mat | |
| CN109855386B (en) | Industrial water chilling unit | |
| CN207457969U (en) | A kind of server liquid cooling apparatus | |
| CN208174521U (en) | A kind of frequency converter automatic cooling system | |
| CN206347778U (en) | One kind heating refrigerating plant | |
| CN112751105A (en) | Spray type liquid cooling power battery thermal management system based on nozzle disc type arrangement | |
| CN208805414U (en) | One kind efficiently catching up with sour refrigerator and vacuum acid-dispelling instrument | |
| CN111595056A (en) | Drinking liquid refrigeration equipment | |
| CN209626049U (en) | A kind of high current volumetric ratio water-cooling type capacitance module | |
| CN214650584U (en) | Condensed water collecting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |