CN209388800U - A kind of encapsulating type shell type structure and electronic component - Google Patents
A kind of encapsulating type shell type structure and electronic component Download PDFInfo
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- CN209388800U CN209388800U CN201920392715.4U CN201920392715U CN209388800U CN 209388800 U CN209388800 U CN 209388800U CN 201920392715 U CN201920392715 U CN 201920392715U CN 209388800 U CN209388800 U CN 209388800U
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Abstract
The utility model relates to electronic device manufacturing technology field, in particular to a kind of encapsulating type shell type structure and electronic component, wherein encapsulating type shell type structure includes shell, pin and encapsulation medium；The shell is hollow cavity structure；The encapsulation medium is filled in the space in shell；The pin extends to shell exterior by encapsulation medium from interior of shell.A kind of encapsulating type shell type structure provided by the utility model, can be applied to a variety of electronic components, such as ceramic capacitor and zinc oxide varistor；While meeting its requirement on electric performance, it realizes the optimization of manufacture craft, whole crawl, transfer, installation convenient and efficient and is mounted on whole stability after circuit board, and its scale styling representation is more for extensive adaptability, the space utilization rate that circuit board can be promoted, meets the needs of market.In addition, the utility model additionally provides a kind of electronic component.
Description
Technical field
The utility model relates to electronic device manufacturing technology field, in particular to a kind of encapsulating type shell type structure and electronics member
Device.
Background technique
As under the increasingly frivolous trend of development in Hi-Tech and electronic product, the internal structure of electronic product is increasingly compact,
And electronic component also receives the influence of the trend as one of essential constituent of electronic product；Currently, in order to
The requirement of internal structure more compactization for meeting the increasingly lightening of electronic product and deriving is realized empty inside electronic product
Between more effectively utilize, higher requirement is then made for the stability after the installation and installation of electronic component, is not only needed
It is fast and accurately installed, after installation is complete, it is also necessary to avoid other electronic components with periphery from adversely affecting,
Such as collide.
Capacitor is a kind of common electronic component, the various electricity such as all TVs, mobile phone/phone charger, computer
Mechanical, electrical sub- equipment, can find the trace of capacitor.Its basic structural formula by two metal electrodes adjacent to each other, and
Among it every an insulator (medium), then it is packaged and constitutes capacitor.
Zinc oxide varistor is its resistance value of one kind as application voltage increases and is in non-linear reduced resistor,
With the ability for inhibiting and absorbing overvoltage surge.It generally uses zinc oxide chip, and setting is in dielectric chip (or medium
Substrate) upper and lower surface electrode.
Such as: as illustrated in fig. 1 and 2, at present common ceramic capacitor or zinc oxide varistor be disc chip,
Powdered epoxy resin encapsulation, the component shape are that irregular shape is easy to appear inclination when installing on circuit boards, are stablized
Property it is poor, installation is complicated, and it is conventional produce installation and be using lasting pipelining, once there is installation dislocation, fall off or
Inclination is generated after person's installation and is then easy to cause rosin joint, solder skip etc., is flowed into subsequent workshop section and is continued operation, eventually results in product not
It is good, influence production yield.
CN208127033U " a kind of moisture-proof safety ceramic capacitor " discloses a kind of moisture-proof safety ceramic capacitor,
Publication date is on November 20th, 2018, the ceramic capacitor mainly by potsherd, lead-foot-line, protective layer, waterproof layer, buffer body and
Plastic Package layer composition, is made by a series of workshop sections, compared with prior art, solves existing safety ceramic capacitor and is easy
Dampness, buffering effect is poor, and surface is easy the problems such as impaired with circuit board friction.But capacitor made of above scheme assigns into
When on circuit board, it is easy to appear that inclination, stability are poor, and when buffer body is damaged, it will cause rub with circuit board or other devices
It is impaired that wiping leads to capacitor, or even influences other devices on circuit board.
Also, the electronic components such as the capacitor or zinc oxide varistor of prior art preparation, seal chip
Dress then needs to increase multiple processes such as die sinking, filling, so that process flow is increasingly complex, increases cost.
Utility model content
For solve electronic component of the existing technology is difficult to install, be easy inclination after installation the problems such as, and adapt to
Present surface mounting technique demand for development provides a kind of encapsulating type shell type structure, with good structural stability, installation
Simply, it is suitble to surface mounting technology, and low manufacture cost, improves the reliability of product.
To achieve the above object, the utility model uses following technical scheme:
A kind of encapsulating type shell type structure, including shell, encapsulation medium and pin；The shell is hollow cavity structure；Institute
State the space that encapsulation medium is filled in shell；The pin extends to shell exterior by encapsulation medium from interior of shell.
On the basis of above structure, further, the shell is that the rectangular parallelepiped structure of inner hollow or one side are open
And the rectangular parallelepiped structure of inner hollow.
On the basis of above structure, further, the pin is plug-in type pin.
On the basis of above structure, further, the pin is patch type pin.
On the basis of above structure, further, the encapsulation medium is epoxy resin, in silicone resin, polyurethane
It is a kind of.
The utility model additionally provides a kind of electronic component, using the encapsulating type shell type structure；It further include electronics
Component body, the electronic component ontology are set to the encapsulating shell formula inside configuration.
On the basis of above structure, further, the electronic component ontology further includes electronic component chip, institute
It states electronic component chip to be electrically connected with the pin and is by electrode slice, the pin and the electrode for being located at electronic component outer body
Piece connection.
On the basis of above structure, further, the electronic component ontology is ceramic capacitor, zinc oxide pressure-sensitive
One of resistor.
On the basis of above structure, further, the electronic component chip is one of disk, square piece.
A kind of encapsulating type shell type structure provided by the utility model compared with prior art, has the advantage that and uses
The electronic component of the encapsulating type shell type structure, by hollow cavity structural housing, encapsulation medium, electronic component sheet in structure
The structure composition of body and pin, shape are rule body structure, and the setting of the structure keeps this electronic component manufacture craft more simple
Easily, and in transferred product and installation process, it is more easier to grab, more convenient and applicable surface mounting technology is installed,
It will not influence the electrical property of electronic component ontology itself simultaneously, and it is whole more for stability after being mounted on circuit board, no
Being easy to happen inclination leads to rosin joint, solder skip or influences other devices.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the front view of existing conventional ceramic capacitor/common zinc oxide piezoresistor；
Fig. 2 is the top view of existing conventional ceramic capacitor/common zinc oxide piezoresistor；
Fig. 3 is a kind of electronic component structural schematic diagram using encapsulating type shell type structure provided by the utility model；
Fig. 4 is a kind of horizontal wire type structure of the electronic component using encapsulating type shell type structure provided by the utility model
Make schematic diagram；
Fig. 5 is a kind of vertical wire type structure of the electronic component using encapsulating type shell type structure provided by the utility model
Make schematic diagram；
Fig. 6 is a kind of Horizontal Surface attachment of electronic component using encapsulating type shell type structure provided by the utility model
Type organigram；
Fig. 7 is a kind of vertical surface mount of the electronic component using encapsulating type shell type structure provided by the utility model
Type organigram；
Fig. 8 is a kind of organigram of encapsulating type shell type structure provided by the utility model.
Appended drawing reference:
100 shell, 200 encapsulation medium, 300 pin
400 electronic component ontology, 410 electronic component chip, 420 electrode slice
500 encapsulating type shell type structures
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The range of the utility model protection.
In the description of the present invention, it should be noted that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitations of the present invention.In addition, term " first ", " second " are used for description purposes only, and should not be understood as instruction or
Imply relative importance.
The utility model provides a kind of encapsulating type shell type structure, as shown in figure 8, including shell 100,200 and of encapsulation medium
Pin 300；The shell 100 is hollow cavity structure；The encapsulation medium 200 is filled in the space in shell 100；It is described to draw
Foot 300 extends to outside shell 100 inside shell 100 by encapsulation medium 200.
Specifically, when above-mentioned encapsulating type shell type structure is used as embodiment in being applied to electronic component, such as Fig. 3 and Fig. 8
It is shown, including encapsulating type shell type structure 500 and electronic component ontology 400, the setting of electronic component ontology 400 is in encapsulating
The inside of type shell type structure 500.
In the present embodiment, the electronic component ontology 400 is ceramic capacitor.It is understood that in other implementations
In example, the electronic component ontology 400 or other electronic components, such as zinc oxide varistor.
Specifically, the electronic component ontology 400 further includes electronic component chip 410, the electronic component core
Piece 410 is electrically connected by electrode slice 420 with pin 300, the pin 300 and the electricity for being located at 400 outside of electronic component ontology
Pole piece 420 connects, and the connection type of the pin 300 and electrode slice 420 can carry out adaptability selection according to the actual situation, such as
Be welded to connect etc..
Encapsulating type shell type structure provided by the utility model is applied in electronic component, as shown in figure 3, passing through hollow cavity
Body structural housing 100, encapsulation medium 200 wrap up electronic component ontology 400 and part pin 300 and are full of entire shell 100
It inside, can be directly to the electronics member device being placed in the encapsulating type shell type structure 500 without being opened in technique production
Part ontology 400 is potted, and is reduced costs, and in structure, is realized whole firm, is less prone to electronic component ontology
400 loosening is to cause damaged in collision, secondly as the shape of shell 100 is rule body structure, therefore, the contour structures
Design so that by the electronic component installation on circuit boards during, either manually installed or mechanical automation
Installation, is all more easier, and installation speed is faster, more efficient, and after being mounted on circuit board, whole more for stability, no
Be easy to happen inclination, misplace, falling off the problems such as causing rosin joint, solder skip or even influences other processes.
Preferably, said structure design can also be actually needed in process of production according to electronic component, and selection is
No application encapsulating type shell type structure 500 realizes flexibly production；Meanwhile it is molding as depicted in figs. 1 and 2 general for having produced
Logical ceramic capacitor or common zinc oxide piezoresistor, due to not being able to satisfy simple to install, the features such as structural stability is strong without
Method is effectively used, thus the product scrapped or reset, it can also be to above-mentioned conventional ceramic electricity by this programme
Container or zinc oxide varistor carry out increasing shell 100 and encapsulating, so that recycling is realized, not only in response to green ring
It protects, the strategy of sustainable development, solves the Utilizing question of industrial waste, can also further decrease ceramic capacitor or oxidation
The production cost of zinc piezoresistor；Preferably, the encapsulating of above-mentioned conventional ceramic capacitor can select to encapsulate according to actual needs
Medium 200, such as epoxy resin, silicone resin, polyurethane, or glue is selected, the use of glue can further reduce the cost.
Specifically, the electronic component chip 410 is preferably one of disk, square piece, it is to be understood that described
The specific setting of 410 shape of electronic component chip can carry out other adaptability selections, such as triangle according to actual needs
Deng.
Specifically, as a preferred embodiment, 100 structure of shell is preferably the rectangular parallelepiped structure or one of inner hollow
The rectangular parallelepiped structure of face opening and inner hollow, but according to actual needs, the setting of 100 shape of shell can carry out
The selection of other adaptability, such as hollow cylindrical structure.
Specifically, as a preferred embodiment, as shown in figure 4, electronic component can be set to horizontal rectangular parallelepiped structure,
As shown in figure 5, electronic component may be arranged as vertical rectangular structure, above by adjustment 100 specific configuration of shell with
The specific mounting design of adaptive circuit plate, can make the shape of electronic component more flexible, more adaptable, more effectively
Utilize the space of circuit board.
Specifically, as a preferred embodiment, the pin 300 is plug-in type pin；As another preferred embodiment, institute
Stating pin 300 is patch type pin.Specifically, in the present embodiment, as shown in Fig. 4 and Fig. 5, respectively wire type Horizontal electronic
Component and the vertical electronic component of wire type, the wire type Horizontal electronic component and the vertical electronic component of wire type are adopted
Pin 300 be plug-in type pin, and above-mentioned vertical and horizontal design can effectively change electronic component height and
Occupied area needs to select to be installed by adaptability in production according to circuit board installation, with meet in follow-up process for
Electronic component is lightening and the requirement of high-density installation；In addition, for wire type electronic component according to specific implementation situation,
Pin 300 can also be subjected to bending installation, while the whole height that electronic component is effectively reduced, not influence electronics also
Itself function of component；As shown in Figure 6 and Figure 7, respectively Horizontal Surface pasting type electronic component and vertical surface mount
The pin that type electronic component, the Horizontal Surface pasting type electronic component and vertical surface labeling type electronic component use
300 be patch type pin, and above-mentioned a variety of preferred embodiments can carry out corresponding adaptability selection according to the demand of circuit board.Tool
Body, the pin 300 in the present embodiment, as shown in Fig. 4, Fig. 5, Fig. 6, Fig. 7, in setting preferably 2, but according to reality
Border installation needs, and can carry out the selection of other adaptability and be configured, such as 4,6,8.
Specifically, the encapsulation medium 200 is one of epoxy resin, silicone resin, polyurethane.
It as shown in Figure 4, Figure 5, Figure 6 and Figure 7, is the ceramic capacitor that encapsulating type shell type structure is used in the present embodiment
Size, proof voltage energy and capacitance characteristic are as shown in the table:
Table 1: horizontal wire type ceramic capacitor size, proof voltage energy and capacitance characteristic table
Table 2: vertical wire type ceramic capacitor size, proof voltage energy and capacitance characteristic table
Table 3: surface-mounting ceramic capacitor sizes, proof voltage energy and capacitance characteristic table
The present embodiment capacitor A1-D1, A2-D2, A3-D3 utilize Agilent4288 model at room temperature (25 ± 3 DEG C)
Capacitance meter, the condenser capacity tested under the conditions of 1KHz/1Vrms or 1MHz/1Vrms；It is surveyed using the insulation pressure resistance of CS2671A type
Try instrument test capacitors proof voltage.
It as shown in Figure 4, Figure 5, Figure 6 and Figure 7, is that the pressure-sensitive of encapsulating type shell type structure is used in another embodiment of the utility model
The size and pressure sensitive voltage of resistor are as shown in the table:
Table 4: horizontal wire type zinc oxide varistor size and pressure sensitive voltage table
Table 5: vertical wire type zinc oxide varistor size and pressure sensitive voltage table
Table 6: surface attaching type zinc oxide varistor size and pressure sensitive voltage table
The present embodiment zinc oxide varistor A4-D4, A5-D5, A6-D6 utilize TTK type at room temperature (25 ± 3 DEG C)
Number varistor tester, the pressure sensitive voltage value obtained by test under the conditions of DC 1.0mA.
Although more herein used such as shell, encapsulation medium, pin, electronic component ontology, electronics member device
The terms such as part chip, electrode slice, encapsulating type shell type structure, but it does not exclude the possibility of using other terms.Use these arts
Language is used for the purpose of being more convenient to describe and explain the essence of the utility model；It is construed as any additional limitation
It is all contrary to the spirit of the present invention.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (9)
1. a kind of encapsulating type shell type structure, it is characterised in that: including shell (100), encapsulation medium (200) and pin (300)；
The shell (100) is hollow cavity structure；
The encapsulation medium (200) is filled in the space in shell (100)；
It is external that the pin (300) extends to shell (100) by encapsulation medium (200) inside shell (100).
2. encapsulating type shell type structure according to claim 1, it is characterised in that: the shell (100) is inner hollow
The rectangular parallelepiped structure of rectangular parallelepiped structure or one side opening and inner hollow.
3. encapsulating type shell type structure according to claim 1, it is characterised in that: the pin (300) is plug-in type pin.
4. encapsulating type shell type structure according to claim 1, it is characterised in that: the pin (300) is patch type pin.
5. encapsulating type shell type structure according to claim 1, it is characterised in that: the encapsulation medium (200) is asphalt mixtures modified by epoxy resin
One of rouge, silicone resin, polyurethane.
6. a kind of electronic component, it is characterised in that: use encapsulating type shell type structure as described in any one in claim 1-5；
It further include electronic component ontology (400), the electronic component ontology (400) is set to the encapsulating type shell type structure
(500) internal.
7. a kind of electronic component according to claim 6, it is characterised in that: the electronic component ontology (400) is also
Including electronic component chip (410), the electronic component chip (410) is electrically connected by electrode slice (420) with pin (300)
It connects, the pin (300) connect with the electrode slice (420) being located on the outside of electronic component ontology (400).
8. a kind of electronic component according to claim 6, it is characterised in that: the electronic component ontology (400) is
One of ceramic capacitor, zinc oxide varistor.
9. a kind of electronic component according to claim 7, it is characterised in that: the electronic component chip (410) is
One of disk, square piece.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201920392715.4U CN209388800U (en) | 2019-03-26 | 2019-03-26 | A kind of encapsulating type shell type structure and electronic component |
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| CN201920392715.4U CN209388800U (en) | 2019-03-26 | 2019-03-26 | A kind of encapsulating type shell type structure and electronic component |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931192A (en) * | 2019-11-06 | 2020-03-27 | 兴勤（常州）电子有限公司 | Integrated miniaturized patch piezoresistor |
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2019
- 2019-03-26 CN CN201920392715.4U patent/CN209388800U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931192A (en) * | 2019-11-06 | 2020-03-27 | 兴勤（常州）电子有限公司 | Integrated miniaturized patch piezoresistor |
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