CN209330515U - A kind of novel heat-conducting clay - Google Patents
A kind of novel heat-conducting clay Download PDFInfo
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- CN209330515U CN209330515U CN201821543138.6U CN201821543138U CN209330515U CN 209330515 U CN209330515 U CN 209330515U CN 201821543138 U CN201821543138 U CN 201821543138U CN 209330515 U CN209330515 U CN 209330515U
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- heat
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- plate
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Abstract
The utility model discloses a kind of novel heat-conducting clay, including gluing mud layer, middle clay layer and lower clay layer；It is provided with heat-conductive bracket between the gluing mud layer and middle clay layer, heat-conductive bracket is provided between middle clay layer and lower clay layer, two heat-conductive brackets are identical；The thickness ratio of the gluing mud layer, middle clay layer and lower clay layer is (1-2): (2-4): (1-2).The heat-conductive bracket includes heat-conducting plate, and the upper surface and lower end surface of heat-conducting plate are symmetrically arranged with several connecting plates.The utility model is designed reasonably, production is simple, whole design and installation, has the effect of guaranteeing in the case where guaranteeing that overall structure is firm thermally conductive, while also having the function of being easy to fixed, can apply in each electronic component, suitable for popularization.
Description
Technical field
The utility model belongs to clay field, more specifically to a kind of novel heat-conducting clay.
Background technique
With the miniaturization of integrated circuit and highly integrated, the packing density of electronic component continues to increase, and is providing
While powerful use function, increased dramatically for its operating power consumption and calorific value is also resulted in.High temperature will be to electronics member device
Stability, reliability and the service life of part generate harmful influence, and for example excessively high temperature can jeopardize the node of semiconductor, damage electricity
The linkage interface on road increases the resistance value of conductor and mechanical stress is caused to damage.There is data to suggest that since CPU caused by overheating loses
Effect accounts for the ratio 55% of CPU failure sum.Even for single communication device or electronic building brick, operating temperature is every to increase 10
DEG C, reliability just reduces 50%.Therefore, optimum performance and ensure high reliability in order to play device, it is necessary to ensure that hair
Heat caused by thermoelectron component can timely be discharged.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of novel heat-conducting clay, if
Rationally, production is simple, whole design and installation for meter, have the effect of guaranteeing in the case where guaranteeing that overall structure consolidates it is thermally conductive,
Also have the function of being easy to fixed simultaneously, can apply in each electronic component, is suitable for promoting.
To achieve the above object, the utility model provides following technical solution:
A kind of novel heat-conducting clay, it is characterised in that: including gluing mud layer, middle clay layer and lower clay layer；The gluing
It is provided with heat-conductive bracket between mud layer and middle clay layer, heat-conductive bracket is provided between middle clay layer and lower clay layer, two are led
Hot bracket is identical；The thickness ratio of the gluing mud layer, middle clay layer and lower clay layer is (1-2): (2-4): (1-2)；Institute
Stating heat-conductive bracket includes heat-conducting plate, and the upper surface and lower end surface of heat-conducting plate are symmetrically arranged with several connecting plates.
As a kind of technical solution of optimization, the heat-conducting plate include the upper thermal conductive metal plate set gradually from top to bottom,
It is symmetrically arranged on the outer surface of heat conductive insulating rubber sheet gasket and lower thermal conductive metal plate, upper thermal conductive metal plate and lower thermal conductive metal plate
Several connecting plates.
As a kind of technical solution of optimization, the connecting plate is the connecting plate made of thermal conductive metallic material；Connecting plate
It is integrally designed and manufactures with upper thermal conductive metal plate, and connecting plate and lower thermal conductive metal plate integrated design manufacture.
As a kind of technical solution of optimization, the upper heat-conducting metal version, lower thermal conductive metal plate and connecting plate are by not
Become rusty plate body made of Steel material or aluminum alloy materials.
By adopting the above-described technical solution, compared with prior art, the utility model is designed reasonably, production is simple, whole
Body design and installation, have the effect of guaranteeing in the case where guaranteeing that overall structure is firm thermally conductive, while also having and being easy to fixed
Effect, can apply in each electronic component, be suitable for promote.
The utility model is described further referring to drawings and examples.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of embodiment of the utility model.
Specific embodiment
Embodiment
As shown in Figure 1, a kind of novel heat-conducting clay, including gluing mud layer 1, middle clay layer 6 and lower clay layer 7.On described
It is provided with heat-conductive bracket between clay layer 1 and middle clay layer 6, is provided with heat-conductive bracket between middle clay layer 7 and lower clay layer 8,
Two heat-conductive brackets are identical.The thickness ratio of the gluing mud layer, middle clay layer and lower clay layer is (1-2): (2-4): (1-
2)。
The heat-conductive bracket includes heat-conducting plate, and the upper surface and lower end surface of heat-conducting plate are symmetrically arranged with several connecting plates 2.Institute
Stating heat-conducting plate includes the upper thermal conductive metal plate 3 set gradually from top to bottom, heat conductive insulating rubber sheet gasket 4 and lower thermal conductive metal plate 5,
Several connecting plates 2 are symmetrically arranged on the outer surface of upper thermal conductive metal plate and lower thermal conductive metal plate.The connecting plate 2 is by thermally conductive
Connecting plate made of metal material.Connecting plate and upper thermal conductive metal plate integrated design manufacture, and connecting plate and lower thermal conductive metal plate
Integrated design manufacture.The upper heat-conducting metal version, lower thermal conductive metal plate and connecting plate are by stainless steel material or aluminium alloy
Plate body made of material.
The utility model is designed reasonably, production is simple, whole design and installation, has and is guaranteeing the firm feelings of overall structure
Guarantee thermally conductive effect under condition, while also having the function of being easy to fixed, can apply in each electronic component, suitable for pushing away
Extensively.
The protection scope of the utility model is not limited merely to above-described embodiment, skill belonging to the idea of the present invention
Art scheme belongs to the protection scope of the utility model.It should be pointed out that for those skilled in the art,
Several improvements and modifications under the premise of the utility model principle are not departed from, these improvements and modifications also should be regarded as the utility model
Protection scope.
Claims (4)
1. a kind of novel heat-conducting clay, it is characterised in that: including gluing mud layer, middle clay layer and lower clay layer；The upper clay
It is provided with heat-conductive bracket between layer and middle clay layer, heat-conductive bracket is provided between middle clay layer and lower clay layer, two thermally conductive
Bracket is identical；The thickness ratio of the gluing mud layer, middle clay layer and lower clay layer is (1-2): (2-4): (1-2)；It is described
Heat-conductive bracket includes heat-conducting plate, and the upper surface and lower end surface of heat-conducting plate are symmetrically arranged with several connecting plates.
2. a kind of novel heat-conducting clay according to claim 1, it is characterised in that: the heat-conducting plate include from top to bottom according to
Upper thermal conductive metal plate, heat conductive insulating rubber sheet gasket and the lower thermal conductive metal plate of secondary setting, upper thermal conductive metal plate and lower heat-conducting metal
Several connecting plates are symmetrically arranged on the outer surface of plate.
3. a kind of novel heat-conducting clay according to claim 2, it is characterised in that: the connecting plate is by heat-conducting metal material
Connecting plate made of expecting；Connecting plate and upper thermal conductive metal plate integrated design manufacture, and connecting plate is integrally set with lower thermal conductive metal plate
Meter manufacture.
4. a kind of novel heat-conducting clay according to claim 3, it is characterised in that: the upper thermal conductive metal plate, under it is thermally conductive
Metal plate and connecting plate are the plate bodys made of stainless steel material or aluminum alloy materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821543138.6U CN209330515U (en) | 2018-09-20 | 2018-09-20 | A kind of novel heat-conducting clay |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821543138.6U CN209330515U (en) | 2018-09-20 | 2018-09-20 | A kind of novel heat-conducting clay |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209330515U true CN209330515U (en) | 2019-08-30 |
Family
ID=67707129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821543138.6U Active CN209330515U (en) | 2018-09-20 | 2018-09-20 | A kind of novel heat-conducting clay |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209330515U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111439008A (en) * | 2019-12-10 | 2020-07-24 | 华北水利水电大学 | High-temperature-resistant rubber material and preparation method thereof |
-
2018
- 2018-09-20 CN CN201821543138.6U patent/CN209330515U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111439008A (en) * | 2019-12-10 | 2020-07-24 | 华北水利水电大学 | High-temperature-resistant rubber material and preparation method thereof |
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