CN209312738U - Wafer alignment device - Google Patents
Wafer alignment device Download PDFInfo
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- CN209312738U CN209312738U CN201821353717.4U CN201821353717U CN209312738U CN 209312738 U CN209312738 U CN 209312738U CN 201821353717 U CN201821353717 U CN 201821353717U CN 209312738 U CN209312738 U CN 209312738U
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- 230000001960 triggered effect Effects 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 8
- 239000000470 constituent Substances 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000274 adsorptive effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a kind of wafer alignment devices.The wafer alignment device of the utility model includes: mounting table, to install chip；Rotation drive device rotates the mounting table；Generation device is triggered, the angle change caused by because of mounting table rotation generates trigger signal；Camera section shoots the image of chip according to the generation of the trigger signal of the triggering generation device；Triaxial driving apparatus moves the mounting table dimensionally；And control unit, the camera section, the triaxial driving apparatus and the rotation drive device are controlled.
Description
Technical field
The utility model relates to a kind of wafer alignment devices.
Background technique
Recently, with the wide variety of semiconductor package body, a kind of following encapsulation technology is being developed: on chip
After manufacturing semiconductor package body, each semiconductor package body singulation (singulation) is manufactured at single package body unit
Semiconductor package body.
In encapsulation procedure, the chip for being formed with semiconductor package body is installed in mounting table, and cutting part is in mounting table
On chip is processed and chip is cut into single semiconductor package body unit.Cutting part can in mounting table with crystalline substance
The consistent mode of the cutting line of piece processes chip, and cutting operation is executed in a manner of not contacting with mounting table.So
And in the case where the chip of circular in shape, it is difficult to be accurately aligned with chip and mounting table, therefore chip is being installed to load
When setting on platform, a possibility that chip is not installed to mounting table accurately, is higher.
In particular, previous wafer alignment device is judged using sensor elements such as laser sensor or infrared sensors
Whether chip is aligned.Nearest chip is in thickness gradually thinning trend, therefore to generate warpage existing for the chip for being mounted on mounting table
As, thus previous sensor type wafer alignment device create the problem that there is a situation where accurately identify chip and it is right
Quasi- efficiency reduces.
Utility model content
[utility model will solve the problems, such as]
The utility model provides a kind of wafer alignment device.
[means solved the problems, such as]
The wafer alignment device of one embodiment includes: mounting table, to install chip；Rotation drive device makes the load
Set platform rotation；Generation device is triggered, the angle change caused by because of mounting table rotation generates trigger signal；Camera section,
The image of chip is shot according to the generation of the trigger signal of the triggering generation device；Triaxial driving apparatus makes the mounting
Platform dimensionally moves；And control unit, the camera section, the triaxial driving apparatus and the rotation drive device are controlled
System.
The control unit can calculate the center of chip, base according to the image of the Waffer edge taken by the camera section
The triaxial driving apparatus is controlled and is aligned in calculated result the center of chip.
The camera section can continuously shoot the image of Waffer edge in the state of fixation.
The control unit can determine the groove of chip according to the image of the Waffer edge taken by the camera section
(notch) or plane (flat), the rotation drive device is controlled and is aligned based on the definitive result the direction of chip.
The wafer alignment device may also include the adsorption section that chip is adsorbed onto the mounting table.
What the wafer alignment device may additionally include fixed wafer when the mounting table dimensionally moves is fixed temporarily portion.
The portion of being fixed temporarily may include according to identical angle multiple support rods separated from each other.
[effect of utility model]
The wafer alignment device and wafer aligned method of the utility model provide one kind to easy to quickly to quasi-crystalline substance
The device and method of piece, the chip are as thin as generating the degree of warping phenomenon.The wafer alignment device and chip of the utility model
Alignment methods can be replaced using common photographic device previous optical sensor arrangement export warpage chip center and
It is modified.
Detailed description of the invention
Fig. 1 is the figure for being diagrammatically denoted by the wafer alignment device of an embodiment.
Fig. 2 to Fig. 7 is the figure for being diagrammatically denoted by the wafer aligned method of an embodiment.
Specific embodiment
With reference to the embodiment that attached drawing is described in detail together the advantages of the utility model, feature and reach described
The method of advantage and feature becomes clear.It should be understood, however, that the utility model can be realized in a variety of forms, do not limit
In embodiment shown below, including include the utility model thought and technical scope in all transformation, equivalent or
Substitute.Embodiment shown below is in order to completely disclose the utility model and completely to skill belonging to the utility model
Those of ordinary skill in art field informs the scope of utility model and provides.When being illustrated to the utility model, sentencing
Break for relevant well-known technique illustrate the purport that can obscure the utility model in the case where, description is omitted.
Term used in the utility model is only to illustrate specific embodiment, is not intended to limit originally practical new
Type.As long as not conclusivelying show other meanings in the text, the expression of odd number includes the expression of plural number.In this application, " packet
Include " or the terms such as " having " be understood to mean that there are feature recorded in specification, number, step, movement, compositions to want
Element, part or its etc. combination, and non-predetermined exclude one or more other features, number, step, movement, composition
Element, part or its etc. combined there is a possibility that or additional possibility.First, second equal terms can be used for illustrating various structures
At element, but constituent element is not limited to the term.The term is only to distinguish over other compositions for a constituent element
It is used for the purpose of element.
Hereinafter, being illustrated in detail to the embodiments of the present invention referring to attached drawing, it is being described with reference to the accompanying drawings
When, identical symbol is assigned to identical or corresponding constituent element and omits its repeated explanation.
Fig. 1 is the figure for being diagrammatically denoted by the wafer alignment device 100 of an embodiment.Referring to Fig.1, wafer alignment device
100 may include the mounting table 111 for supporting wafer W A, adsorption section 112, the rotation drive device for driving mounting table 111 to be acted
121, triaxial driving apparatus 122, control unit 130, the triggering generation device 131 for generating triggering, camera section 140 and including multiple
Support rod 151,152 is fixed temporarily portion 150.
Wafer W A is the object for carrying out semiconductor machining, i.e. workpiece.Wafer W A may include comprising including silicon (Si)
Semiconductor source material, but raw material are not limited.The shape of wafer W A may be, for example, round, and but not limited to this.
The mountable wafer W A of mounting table 111.The shape of mounting table 111 may be, for example, cylindrical shape, and but not limited to this.
Mounting table 111 can carry out rotation or mobile along 3 axis (x-axis, y-axis, z-axis).It is mobile by mounting table 111, it is installed to mounting table
111 wafer W A can be moved together.Mounting table 111 can be by coordinate information of the rotary motion export to be directed at wafer W A, can
Pass through the alignment of 3 axis Motor execution wafer W A.
Adsorption section 112 connect with mounting table 111 and applies pressure to the wafer W A installed, so as to adsorb wafer W A
To mounting table 111.For example, adsorption section 112 can be vacuum pump.The upper side of mounting table 111 contacted with wafer W A can form use
With the hole adsorbed.For example, the upper side of mounting table 111 has multiple holes, adsorption section is drawn by the hole fluid
112, so as to apply adsorptive pressure to wafer W A.Whether the driving of adsorption section 112 can be controlled by control unit 130.For example, absorption
Wafer W A can be adsorbed onto mounting table in (on) state of connection in the case where mounting table 111 is rotated by portion 112
111, in the case where mounting table 111 carries out 3 axis movement in (off) state of disconnection without wafer W A is adsorbed onto mounting table 111.
Rotation drive device 121 can be such that mounting table 111 rotates.Rotation drive device 121 may include connecting with mounting table 111
And the motor etc. for rotating mounting table 111.Rotation drive device 121 can be controlled by control unit 130.For example, to wafer W A's
In the case that alignment is measured, rotation drive device 121 can be such that mounting table 111 revolves by the control of control unit 130
Three-sixth turn.For example, rotation drive device 121 can pass through control unit 130 in the case where the alignment at the center of wafer W A terminates
Control and so that mounting table 111 is rotated angle appropriate with towards desired direction alignment indentation.
Triaxial driving apparatus 122 can be such that mounting table 111 moves along 3 x-axis, y-axis, z-axis axis.Triaxial driving apparatus 122 can
Motor, the sliding unit etc. for making mounting table 111 mobile including connecting with mounting table 111.Triaxial driving apparatus 122 can be by controlling
Portion 130 controls.For example, triaxial driving apparatus 122 can pass through control unit 130 after the measurement of the alignment of wafer W A
Control and move the position of mounting table 111 along 3 axis so that the center of wafer W A is consistent with the center of mounting table 111.
Control unit 130 can control the movement of each component of wafer alignment device 100.For example, control unit 130 is controllable
Adsorption section 112, rotation drive device 121, triaxial driving apparatus 122, triggering generation device 131 and camera section 140.Control unit
130 can be handled and be exported the centre coordinate of wafer W A to the image data of the wafer W A taken by camera section 140.Control
Portion 130 can the centre coordinate of centre coordinate based on derived wafer W A and mounting table 111 adsorption section 112, Three-axis drive are filled
It sets 122 to be controlled, and is directed at the center of mounting table 111 Yu wafer W A.In addition, control unit 130 can be based on by camera section 140
The image data of the wafer W A taken and the coordinate for exporting the groove of wafer W A.Control unit can based on derived groove coordinate and
Adsorption section 112, rotation drive device 121 are controlled, so that the groove of wafer W A is towards desired direction.
Control unit 130 can control rotation drive device 121 and revolve mounting table 111 with fixed angular speed
Turn.Control unit 130 control can trigger generation device 131 while controlling mounting table 111 and being rotated, thus whenever mounting table
Trigger signal is generated when 111 rotation fixed angle.The trigger signal generated by triggering generation device 131 can be transferred to camera section
140, the camera section shooting area (reference at edge of the shooting including wafer W A whenever receiving trigger signal of camera section 140
Fig. 2).
Control unit 130 can the centre coordinate based on mounting table 111 and the edge coordinate and phase by the shooting acquisition of camera section 140
The centre coordinate of machine portion shooting area and the centre coordinate for obtaining wafer W A.Control unit 130 can be using the center of export wafer W A
The processing algorithm of coordinate describes the processing algorithm in Fig. 3 below.
Control unit 130 can be such that mounting table 111 is rotated by 360 ° to obtain the centre coordinate of wafer W A, can also be in order to improve
Accuracy and rotate 720 degree, 1080 degree.Control unit 130 in order to promoted export wafer W A centre coordinate speed, change
Make the angle change degree for triggering the mounting table 111 that generation device 131 generates trigger signal.Control unit 130 exports to be promoted
The speed of the centre coordinate of wafer W A changes the size for the angular speed that mounting table 111 rotates.
Triggering generation device 131 can be produced when mounting table 111 rotates fixed angle according to the control of control unit 130
The raw trigger signal for shooting camera section 140.Trigger generation device 131 can for the independent constituent element of control unit 130,
Or the internal factors of control unit 130, it is not limited to special embodiment.Generation device 131 is triggered it is contemplated that triggering letter
Number reach camera section 140 and trigger signal is generated by the time delay of 140 actual photographed wafer W A of camera section.Control can be passed through
The considerations of portion 130 processed realizes this time delay.
Camera section 140 can be set in a manner of forming the camera section shooting area at the edge including wafer W A.Camera section
140 can be common device for filming image.For example, camera section 140 may include the photographic device of visible light region.Camera section 140
It can be arranged on the basis of wafer W A edge and shoot camera section shooting area to vertical upper.Camera section 140 can be solid
Wafer W A is shot in the state of fixed.The image data taken can be transferred to by camera section 140 by the control of control unit 130
Control unit 130.
Camera section 140 can shoot wafer W A when receiving from the trigger signal that triggering generation device 131 transmits.Pass through
The combination of this triggering generation device 131 and camera section 140, can also without other infrared sensor or laser sensor and only
Using common photographic device according to periodic angle shot wafer W A.In addition, camera section 140 is formed including wafer W A
The camera section shooting area at edge and obtain image data, so even slightly generate warping phenomenon because wafer W A is relatively thin,
The coordinate at the edge of wafer W A can be obtained in a manner of including corresponding error.
Previous laser sensor or infrared sensor is arranged by every in a manner of the fringe region of wafer W A, but has
Following disadvantage: in the case where chip warpage, the fringe region of chip is easy to be detached from and nothing on the outside of the sensing region of sensor
Method successfully realizes the sensing to be directed at chip.In contrast to this, the wafer alignment device 100 of the utility model is with common
Camera section 140, and have the advantages that unrelated with the warpage slightly of wafer W A and can ensure that fast and accurately wafer W A
Center.
Being fixed temporarily portion 150 is the fixation member with the movement of mounting table 111 independently fixed wafer WA.In control unit
130 in order to be aligned mounting table 111 center and wafer W A center and make mounting table 111 carry out it is mobile in the case where, it is interim solid
Determining portion 150 can fix in such a way that wafer W A is mobile not with mounting table 111.For example, being fixed temporarily portion 150 may include multiple
Strut 151,152.Support rod 151,152 can be arranged in a manner of separating each other according to fixed angle.For example, three supports
Bar 151,152 can be arranged in a manner of separating each other according to 120 degree.In the case where mounting table 111 is equipped with wafer W A,
Support rod 151,152 can be located at the lower part of wafer W A.Pass through triaxial driving apparatus in mounting table 111 in order to be directed at wafer W A
In the case that 122 move to vertical lower direction, wafer W A is moved because of support rod 151,152 and is fixed, and mounting table 111 exists
It, can be to in-plane adjusting position after individually being moved towards lower part direction.In the case where mounting table 111 is equipped with wafer W A,
It is fixed temporarily the lower part that wafer W A is arrived in the setting of portion 150, in the case where mounting table 111 vertically carries out mobile, can be in can
The integral shape of fixed wafer WA is not limited to the example of the support rod 151,152.For example, being fixed temporarily portion 150 can be
The support member of annular.
Fig. 2 to Fig. 7 is the figure for being diagrammatically denoted by the wafer aligned method of an embodiment.
The wafer aligned method of the present embodiment can include:
(1) the step of wafer W A being installed to mounting table 111；
(2) the step of rotating mounting table 111；
(3) the step of edge of wafer W A of rotation being shot according to the trigger signal；
(4) the step of image taken being analyzed and exports the center of wafer W A；And
(5) center based on derived wafer W A and the step of being directed at wafer W A in mounting table 111.
In addition, the wafer aligned method may also include (1- after the step of wafer W A is installed to mounting table 111 by (1)
2) the step of wafer W A being adsorbed onto mounting table 111.
In addition, (5) are directed at the step of wafer W A can include:
The step of (5-1) moves in the vertical direction mounting table 111 and fixed wafer WA；
(5-2) moves mounting table 111 in the horizontal direction and makes the center of wafer W A and the consistent step in center of mounting table 111
Suddenly；And
The step of (5-3) moves in the vertical direction mounting table 111 and wafer W A is installed to mounting table 111.
In addition, the step of edge of (3) shooting wafer W A, can continuously shoot crystalline substance for camera section 140 in the state of fixation
The step of image at the edge piece WA.
It is determined in addition, the wafer aligned method may also include (6) according to the image at the edge of the wafer W A taken
The groove (notch) or plane (flat) of wafer W A, the step of being directed at the direction of wafer W A based on the definitive result.
Referring to Fig. 2, rotation drive device 121 is driven by the control of control unit 130, so as to make mounting table 111 by
It is rotated according to fixed angular speed.For example, control unit 130 can be such that mounting table 111 is rotated by 360 °.
By driving 112 wafer W A of adsorption section to be adsorbed onto mounting table 111, therefore chip is rotated by mounting table 111
WA can also rotate together according to angular speed identical with the angular speed of mounting table 111.By the control of control unit 130, triggering is produced
Generating apparatus 131 is contemplated that the angular speed of mounting table 111 and generates trigger signal when mounting table 111 rotates fixed angle.
Trigger signal can be transferred to camera section 140, and when wafer W A rotates fixed angle, camera section 140 continuously shoots chip
The edge of WA.The image data taken can be transferred to control unit 130 by camera section 140.
Referring to Fig. 3, chip centre coordinate WA_C (Wx, Wy) and mounting table 111 centre coordinate ST_C (X1, Y1) no
In the state of consistent, wafer W A in camera section shooting area rotation can be shot by rotating camera section 140 by mounting table 111
Edge part.At this point, the straight line of the centre coordinate ST_C (X1, Y1) of camera section centre coordinate (X2, Y2) and mounting table 111 will be connected
The edge coordinate (X3, Y3) of wafer W A is defined as with the intersection point at the edge of wafer W A.Control unit 130 can be by handling picture number
According to and export the centre coordinate WA_C (Wx, Wy) of chip.Hereinafter, to control unit 130 export chip centre coordinate WA_C (Wx,
Wy an embodiment) is illustrated.
Length definition between the edge coordinate (X3, Y3) of the centre coordinate ST_C (X1, Y1) and wafer W A of mounting table 111
For Lr, the centre coordinate ST_C (X1, Y1) of mounting table 111 and the length of camera section centre coordinate (X2, Y2) are defined as L.Mounting
Platform 111 on the basis of ST_C (X1, Y1) to rotate, so even mounting table 111 rotates, ST_C (X1, Y1) is also fixed.In addition,
Since camera section 140 is fixed, camera section centre coordinate (X2, Y2) is fixed.Therefore, the centre coordinate ST_C of mounting table 111
Length, that is, the L of (X1, Y1) and camera section centre coordinate (X2, Y2) is constant.That is, mounting table 111 centre coordinate ST_C (X1,
Y1 the Y2 of Y1 and camera section centre coordinate (X2, Y2)) are mutually the same.It is set as becoming by camera section centre coordinate (X2, Y2)
When the coordinate of benchmark is (0,0), following relationship can be met.
Y1=Y2=Y3=0
Length Lr between the edge coordinate (X3, Y3) of the centre coordinate ST_C (X1, Y1) and wafer W A of mounting table 111 is
The value changed according to the rotation of mounting table 111, therefore be parameter.Therefore, Lr can according to the rotation angle of mounting table 111 and
With different values.When the rotation angle of mounting table 111 is defined as T, Lr is represented by LrT(herein, T is rotation angle
Degree).For example, in the case where triggering generation device 131 generates trigger signal when mounting table changes 1 degree, whenever mounting
Platform 111 become 1 degree, 2 degree, 3 degree ..., 360 degree when, camera section 140 shoots camera section shooting area, therefore Lr can have
Lr1、Lr2、Lr3、…、Lr360Deng 360 data sets.
By this method will rotation angle T be expressed as index in the case where, the wafer aligned method of the present embodiment meet with
Lower mathematical expression.
LrT=L-X3T
At this point, when using the plane for vertically overlooking wafer W A as benchmark, if indicating edge using polar coordinate system
Coordinate can be expressed as (LrT, T).If indicating the polar coordinate system again with orthogonal coordinate system, following number can be expressed as
Formula.
xT=LrT×cos(T)
yT=LrT×sin(T)
The wafer W A vertically overlooked top view be circular situation under, indicated with the orthogonal coordinate system
Edge coordinate (xT, yT) round equation should be met.
(xT- Wx)2+(yT- Wy)2=r2
xT 2+yT 2- 2Wx × xT+2Wy×yT+Wx2+Wy2- r2=0
Herein, if by xTCoefficient be that -2Wx is defined as c, by yTCoefficient, that is, 2Wy be defined as d, will be as constant
Wx2+Wy2- r2It is defined as e, then meets following formula.
c×xT+d×yT+ e=-xT 2- yT 2
In above-mentioned formula, xT、yTTo have the matrix data of different numerical value according to rotation angle T, therefore can be by upper
State the value that formula carries out matrix calculating and exports c, d, e.For example, being rotated by 360 ° mounting table, if it is assumed that whenever making mounting table
The trigger signal of triggering generation device is generated when the angle of 1 degree of rotation, then T can be 1 to 360 natural number, can be formed as follows
Matrix operation.
Parameter c, d, e can be exported by matrix operation as described above, thus can export the centre coordinate of actual wafer i.e.
(Wx, Wy).
Above-mentioned operation is premised on following situation: even if generating because warpage caused by the wafer W A of circular shape is relatively thin is existing
As the shape of the wafer W A from top is similarly round.In analog result and experimental result, with a thickness of 200 μm with
Under wafer W A warped shapes it is rounded, therefore quickly and accurately by operation method control unit 130 as described above
Export the centre coordinate (Wx, Wy) of wafer W A.
However, the wafer W A from top shape be elliptical situation under, can be utilized in above-mentioned export process
The centre coordinate that elliptic function exports wafer W A is (Wx, Wy), is not limited to above-described embodiment.In addition to this, using table
Show centre coordinate i.e. (Wx, the Wy) of the function export wafer W A of the shape of the warpage of the wafer W A from top.
Referring to fig. 4 to fig. 6, control unit 130 can so that derived chip centre coordinate (Wx, Wy) and mounting table
Centre coordinate (X1, Y1) consistent mode controls constituent element.
Referring to Fig. 4, control unit 130 can control triaxial driving apparatus 122 and move mounting table 111 along the z-axis direction.This
When, wafer W A can be fixed without integrally moving with mounting table 111 by being fixed temporarily portion 150.
Referring to Fig. 5, control unit 130 can control triaxial driving apparatus 122 and move mounting table along x-axis and y axis direction,
The centre coordinate (X1, Y1) of the centre coordinate (Wx, Wy) and mounting table that make wafer W A is consistent.
Referring to Fig. 6, control unit 130 can proceed as follows control: controlling triaxial driving apparatus 122 and make to load
Platform 111 moves along the z-axis direction, consistent in the centre coordinate (Wx, Wy) of chip and the centre coordinate (X1, Y1) of mounting table 111
Under state, mounting table 111 and wafer W A are adsorbed again.For example, triaxial driving apparatus 122 can be lifted mounting table 111, and make chip
WA is separate to be fixed temporarily portion 150.For example, triaxial driving apparatus 122 can control adsorption section 112 and adsorb mounting table 111 and chip
WA。
Referring to Fig. 7,130 rotation-controlled driving device 121 of control unit and rotate mounting table 111.Control unit 130 can make
Mounting table 111 rotates desired angle, so as to the groove or plane on the surface of desired direction alignment wafer W A.
The above description of the utility model is example, and the those of ordinary skill in technical field belonging to the utility model answers
It is understood that can not change the utility model technical idea or essential feature and be easily deformed as other specific forms.Cause
This, it should be understood that embodiment as described above is example in all respects, and does not have limited meaning.For example, explanation is single
The each component of one type can also be implemented with dispersing morphology, and in the same manner, illustrating also can be with knot for distributed constituent element
The form of conjunction is implemented.
The scope of the utility model is defined by the appended claims, and not above-mentioned detailed description, should be interpreted that root
According to the meaning of claims, range and its equivalents, the derived form for having altered or deforming is included in practical
In novel range.
Claims (7)
1. a kind of wafer alignment device characterized by comprising
Mounting table, to install chip；
Rotation drive device rotates the mounting table；
Generation device is triggered, the angle change caused by because of mounting table rotation generates trigger signal；
Camera section shoots the image of the chip according to the generation of the trigger signal of the triggering generation device；
Triaxial driving apparatus moves the mounting table dimensionally；And
Control unit controls the camera section, the triaxial driving apparatus and the rotation drive device.
2. wafer alignment device according to claim 1, which is characterized in that the control unit is clapped according to by the camera section
The image for the Waffer edge taken the photograph calculates the center of the chip, is controlled based on calculated result to the triaxial driving apparatus
Make and be aligned the center of the chip.
3. wafer alignment device according to claim 2, which is characterized in that the camera section is continuous in the state of fixation
Ground shoots the image of the Waffer edge.
4. wafer alignment device according to claim 1, which is characterized in that the control unit is clapped according to by the camera section
The image for the Waffer edge taken the photograph determines the groove or plane of the chip, drives fill to the rotation based on the definitive result
Set the direction for being controlled and being aligned the chip.
5. wafer alignment device according to claim 1, which is characterized in that further include that the chip is adsorbed onto the load
Set the adsorption section of platform.
6. wafer alignment device according to claim 1, which is characterized in that further include when the mounting table is moved
The fixed chip is fixed temporarily portion.
7. wafer alignment device according to claim 6, which is characterized in that the portion of being fixed temporarily includes according to identical
Angle multiple support rods separated from each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0140807 | 2017-10-27 | ||
| KR1020170140807A KR20190047216A (en) | 2017-10-27 | 2017-10-27 | Wafer calibrating Device and Wafer calibrating Method |
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| Publication Number | Publication Date |
|---|---|
| CN209312738U true CN209312738U (en) | 2019-08-27 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821353717.4U Active CN209312738U (en) | 2017-10-27 | 2018-08-22 | Wafer alignment device |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20190047216A (en) |
| CN (1) | CN209312738U (en) |
| TW (1) | TW201917493A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112018023A (en) * | 2019-05-31 | 2020-12-01 | 东京毅力科创株式会社 | Positioning device and positioning method |
| CN113916171A (en) * | 2021-10-08 | 2022-01-11 | 魅杰光电科技(上海)有限公司 | Material deviation value detection method and system, compensation method and system and storage medium |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118248612A (en) * | 2024-05-28 | 2024-06-25 | 德沪涂膜设备(苏州)有限公司 | Crystal silicon alignment method, crystal silicon alignment system and coating equipment |
-
2017
- 2017-10-27 KR KR1020170140807A patent/KR20190047216A/en not_active Application Discontinuation
-
2018
- 2018-08-07 TW TW107127378A patent/TW201917493A/en unknown
- 2018-08-22 CN CN201821353717.4U patent/CN209312738U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112018023A (en) * | 2019-05-31 | 2020-12-01 | 东京毅力科创株式会社 | Positioning device and positioning method |
| CN112018023B (en) * | 2019-05-31 | 2024-03-22 | 东京毅力科创株式会社 | Positioning device and positioning method |
| CN113916171A (en) * | 2021-10-08 | 2022-01-11 | 魅杰光电科技(上海)有限公司 | Material deviation value detection method and system, compensation method and system and storage medium |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190047216A (en) | 2019-05-08 |
| TW201917493A (en) | 2019-05-01 |
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