CN209283511U - A kind of MEMS microphone that signal-to-noise ratio is high - Google Patents
A kind of MEMS microphone that signal-to-noise ratio is high Download PDFInfo
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- CN209283511U CN209283511U CN201920106643.2U CN201920106643U CN209283511U CN 209283511 U CN209283511 U CN 209283511U CN 201920106643 U CN201920106643 U CN 201920106643U CN 209283511 U CN209283511 U CN 209283511U
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Abstract
The utility model discloses a kind of MEMS microphones that signal-to-noise ratio is high, including lower layer's pcb board and with the upper housing of accommodating chamber, the upper housing is fixed on the top of lower layer's pcb board, the MEMS chip and asic chip positioned at accommodating chamber are placed at the top of lower layer's pcb board, the asic chip is located at the right side of MEMS chip, it is electrically connected between the MEMS chip and asic chip by the first bonding gold thread, the asic chip is electrically connected by the second bonding gold thread and lower layer's pcb board.The utility model is while being arranged U-shaped channel on lower layer's pcb board, one end of U-shaped channel and the bottom for being located at MEMS chip, the other end of U-shaped channel is connected to gas-guide tube, thus so that voice signal is directly reached the bottom of MEMS chip by microphone acoustic aperture, with the packaged type of advance sound, realize the back of microphone into sound function, to expand the volume into sound cavity, the signal-to-noise ratio for effectively improving microphone improves the practicability of MEMS microphone, is worth of widely use.
Description
Technical field
The utility model relates to MEMS microphone technical field, specially a kind of MEMS microphone that signal-to-noise ratio is high.
Background technique
MEMS (Micro Electro Mechanical System) microphone is the microphone based on MEMS technology manufacture, is briefly exactly an electricity
Container is integrated on micro- silicon wafer, can be manufactured using Surface Mount technique, be able to bear very high Reflow Soldering temperature, be easy with
CMOS technology and other voicefrequency circuits are integrated, and there is improved noise removing performance and good RF and EMI to inhibit energy
Whole potential of MEMS microphone use the product of this technology to embody in numerous applications there are also to be excavated
In the application of many advantages, especially middle and high end mobile phone.
MEMS microphone is the microphone based on MEMS technology manufacture, since its is small in size, properties of product stability of characteristics, and mesh
It is preceding to have widely applied in various intelligent terminals, but traditional MEMS microphone is using advance sound mode when being carried out into sound,
It is small into sound cavity, causes its noise relatively low, reduces the practicability of MEMS microphone.
Utility model content
The purpose of this utility model is to provide a kind of MEMS microphone that signal-to-noise ratio is high, has signal-to-noise ratio height and dust-proof
Advantage solves traditional MEMS microphone when carrying out using advance sound mode into sound, small into sound cavity, leads to its noise
Relatively low problem.
To achieve the above object, the utility model provides the following technical solutions: a kind of MEMS microphone that signal-to-noise ratio is high, packet
Lower layer's pcb board and the upper housing with accommodating chamber are included, the upper housing is fixed on the top of lower layer's pcb board, lower layer's pcb board
Top be placed with MEMS chip and asic chip positioned at accommodating chamber, the asic chip is located at the right side of MEMS chip, institute
It states and is electrically connected between MEMS chip and asic chip by the first bonding gold thread, the asic chip passes through the second bonding gold thread
It is electrically connected with lower layer's pcb board, the left side at the top of the upper housing offers microphone acoustic aperture.
The inside of lower layer's pcb board offers U-shaped channel, and the U-shaped channel includes the first groove, the second groove and company
The position of through-hole, first groove is aligned with microphone acoustic aperture, and second groove is located at the bottom of MEMS chip, the company
Through-hole is provided with gas-guide tube, the top of the gas-guide tube for being connected to the first groove and the second groove, the inner cavity of first groove
Portion extends to the inner cavity of microphone acoustic aperture and is fixedly connected with upper housing, and the microphone acoustic aperture is adapted with gas-guide tube, described
Gas-guide tube is adapted with the first groove.
Preferably, the bottom surface of the gas-guide tube is set as scarf, and the top of the scarf and the top of intercommunicating pore are right
Together, the bottom end of the scarf is aligned with the bottom of intercommunicating pore.
Preferably, the bottom of lower layer's pcb board is fixedly connected with microphone pad, and the quantity of the microphone pad is
Two, the bottom of lower layer's pcb board is symmetrically arranged in two microphone pads.
Preferably, the MEMS chip and asic chip pass through bonded adhesives and are fixedly connected with lower layer pcb board, the air guide
The top and bottom end of pipe surface pass through adhesive and are fixedly connected respectively with upper housing and lower layer's pcb board.
Preferably, the top of the upper housing and position of corresponding microphone acoustic aperture is pasted with water proof and dust proof net.
Preferably, the upper housing is concave barrier shell.
Preferably, the section of the microphone acoustic aperture, gas-guide tube, the first groove, the second groove and intercommunicating pore is circle.
Preferably, the upper housing includes rectangle frame shell and upper layer pcb board, the top and upper layer of the rectangle frame shell
Pcb board is fixedly connected, and the bottom of the rectangle frame shell is fixedly connected with lower layer's pcb board.
Preferably, the section of the microphone acoustic aperture, gas-guide tube, the first groove, the second groove and intercommunicating pore is pros
Shape.
Compared with prior art, the beneficial effects of the utility model are as follows:
The utility model provides a kind of MEMS microphone that signal-to-noise ratio is high, and the same of U-shaped channel is arranged on lower layer's pcb board
When, one end of U-shaped channel and the bottom for being located at MEMS chip, the other end of U-shaped channel are connected to gas-guide tube, thus believe sound
The bottom that MEMS chip number can be directly reached by microphone acoustic aperture the back of microphone is realized with the packaged type of advance sound
Into sound function, to expand the volume into sound cavity, the signal-to-noise ratio of microphone is effectively improved, MEMS microphone is improved
Practicability is worth of widely use.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is a kind of main view sectional view for the MEMS microphone that signal-to-noise ratio is high provided by the utility model embodiment 1；
Fig. 2 is the stereoscopic schematic diagram of Tu1Zhong lower layer pcb board；
Fig. 3 is the stereoscopic schematic diagram of gas-guide tube in Fig. 1；
Fig. 4 is a kind of main view sectional view for the MEMS microphone that signal-to-noise ratio is high provided by the utility model embodiment 2；
Fig. 5 is the stereoscopic schematic diagram of Tu4Zhong lower layer pcb board；
Fig. 6 is the stereoscopic schematic diagram of gas-guide tube in Fig. 4.
It is marked in attached drawing as follows:
1, lower layer's pcb board；11, the first groove；12, the second groove；13, intercommunicating pore；201, accommodating chamber；210, concave barrier
Shell；220, rectangle frame shell；230, upper layer pcb board；3, microphone pad；4, MEMS chip；5, asic chip；6, the first key
Alloy wire；7, the second bonding gold thread；8, microphone acoustic aperture；9, gas-guide tube；91, scarf；10, water proof and dust proof net.
Specific embodiment
In order to enable the objectives, technical solutions, and advantages of the embodiments of the present invention are clearer, below in conjunction with this reality
With the attached drawing of new embodiment, the technical solution of the utility model embodiment is clearly and completely described.Obviously, it is retouched
The embodiment stated is a part of the embodiment of the utility model, instead of all the embodiments.It is practical new based on described sheet
The embodiment of type, those of ordinary skill in the art's every other embodiment obtained under the premise of being not necessarily to creative work,
It fall within the protection scope of the utility model.
Unless otherwise defined, the technical term or scientific term that the utility model uses are should be belonging to the utility model
The ordinary meaning that personage in field with general technical ability is understood." first ", " second " used in the utility model and
Similar word is not offered as any sequence, quantity or importance, and is used only to distinguish different component parts." comprising "
Either the similar word such as "comprising" means to occur element or object before the word and covers to appear in the word presented hereinafter
Element perhaps object and its equivalent and be not excluded for other elements or object.The similar word such as " connection " or " connected " is simultaneously
Non-limiting but may include electrical connection in physics or mechanical connection, either direct or indirectly.
"upper", "lower", "left", "right" etc. are only used for indicating relative positional relationship, after the absolute position for being described object changes, then should
Relative positional relationship may also correspondingly change.
The embodiments of the present invention are described in detail with reference to the accompanying drawing, but the utility model is not limited to this
A little specific embodiments.
Embodiment 1: please referring to shown in Fig. 1-3, and the utility model provides a kind of technical solution: a kind of MEMS that signal-to-noise ratio is high
Microphone, the upper housing including lower layer's pcb board 1 and with accommodating chamber 201, upper housing are fixed on the top of lower layer's pcb board 1, under
The top of layer pcb board 1 is placed with MEMS chip 4 and asic chip 5 positioned at accommodating chamber 201, and asic chip 5 is located at MEMS chip
4 right side is electrically connected between MEMS chip 4 and asic chip 5 by the first bonding gold thread 6, and asic chip 5 passes through the second key
Alloy wire 7 and lower layer's pcb board 1 are electrically connected, and the left side at the top of upper housing offers microphone acoustic aperture 8.
The inside of lower layer's pcb board 1 offers U-shaped channel, and U-shaped channel includes the first groove 11, the second groove 12 and is connected to
The position in hole 13, the first groove 11 is aligned with microphone acoustic aperture 8, and the second groove 12 is located at the bottom of MEMS chip 4, intercommunicating pore 13
It is provided with gas-guide tube 9 for being connected to the first groove 11 and the second groove 12, the inner cavity of the first groove 11, the top of gas-guide tube 9 is prolonged
Extend to the inner cavity of microphone acoustic aperture 8 and be fixedly connected with upper housing, microphone acoustic aperture 8 is adapted with gas-guide tube 9, gas-guide tube 9 with
First groove 11 is adapted.
In the present embodiment: the bottom surface of gas-guide tube 9 is set as scarf 91, the top of scarf 91 and the top of intercommunicating pore 13
Alignment, the bottom end of scarf 91 is aligned with the bottom of intercommunicating pore 13.
In the present embodiment: the bottom of lower layer's pcb board 1 is fixedly connected with microphone pad 3, and the quantity of microphone pad 3 is
Two, the bottom of lower layer's pcb board 1 is symmetrically arranged in two microphone pads 3.
In the present embodiment: MEMS chip 4 and asic chip 5 are fixedly connected by bonded adhesives with lower layer pcb board 1, air guide
The top and bottom end on 9 surface of pipe pass through adhesive and are fixedly connected respectively with upper housing and lower layer's pcb board 1.
In the present embodiment: the top of the upper housing and position of corresponding microphone acoustic aperture 8 is pasted with water proof and dust proof net 10 passes through
The setting of water proof and dust proof net 10 avoids foreign matter and enters in microphone, prevents microphone from making pollution, effectively protects Mike
Wind extends the service life of microphone.
In the present embodiment: upper housing is concave barrier shell 210.
In the present embodiment: the section of microphone acoustic aperture 8, gas-guide tube 9, the first groove 11, the second groove 12 and intercommunicating pore 13
It is circle.
Embodiment 2 please refers to shown in Fig. 4-6, the present embodiment the difference from embodiment 1 is that:
Upper housing includes rectangle frame shell 220 and upper layer pcb board 230, top and the upper layer pcb board of rectangle frame shell 220
230 are fixedly connected, and the bottom of rectangle frame shell 220 is fixedly connected with lower layer pcb board 1, microphone acoustic aperture 8, gas-guide tube 9, first
The section of groove 11, the second groove 12 and intercommunicating pore 13 is square, and is arranged by square, so that gas-guide tube 9 and upper layer
The connection of pcb board 230 and lower layer's pcb board 1 is more stable, secured.
Working principle: on lower layer's pcb board 1 be arranged U-shaped channel while, the second groove 12 of U-shaped channel be located at
First groove 11 of the bottom of MEMS chip, U-shaped channel is connected to gas-guide tube 9, thus voice signal is allow to pass through microphone
Acoustic aperture 8, gas-guide tube 9 and U-shaped channel reach the bottom of MEMS chip 4, with the packaged type of advance sound, realize the back of microphone into
Sound function effectively improves the signal-to-noise ratio of microphone to expand the volume into sound cavity.
A kind of MEMS microphone that signal-to-noise ratio is high provided by the embodiments of the present application is described in detail above.Herein
Applying specific case, the principle and implementation of this application are described, and the explanation of above example is only intended to help
Understand the application.Meanwhile for those skilled in the art, according to the thought of the application, in specific embodiment and using model
Place that there will be changes, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (9)
1. a kind of MEMS microphone that signal-to-noise ratio is high, special including lower layer's pcb board (1) and with the upper housing of accommodating chamber (201)
Sign is: the upper housing is fixed on the top of lower layer's pcb board (1), is placed with to be located at the top of lower layer's pcb board (1) and hold
Receive the MEMS chip (4) and asic chip (5) of chamber (201), the asic chip (5) is located at the right side of MEMS chip (4), described
It is electrically connected between MEMS chip (4) and asic chip (5) by the first bonding gold thread (6), the asic chip (5) passes through the
Two bondings gold thread (7) and lower layer's pcb board (1) are electrically connected, and the left side at the top of the upper housing offers microphone acoustic aperture (8)；
The inside of lower layer's pcb board (1) offers U-shaped channel, and the U-shaped channel includes the first groove (11), the second groove
(12) it is aligned with intercommunicating pore (13), the position of first groove (11) with microphone acoustic aperture (8), the second groove (12) position
In the bottom of MEMS chip (4), the intercommunicating pore (13) is for being connected to the first groove (11) and the second groove (12), and described first
The inner cavity of groove (11) is provided with gas-guide tube (9), extends to the inner cavity of microphone acoustic aperture (8) simultaneously at the top of the gas-guide tube (9)
It is fixedly connected with upper housing, the microphone acoustic aperture (8) is adapted with gas-guide tube (9), the gas-guide tube (9) and the first groove
(11) it is adapted.
2. a kind of high MEMS microphone of signal-to-noise ratio according to claim 1, it is characterised in that: the gas-guide tube (9)
Bottom surface is set as scarf (91), and the top of the scarf (91) is aligned with the top of intercommunicating pore (13), the scarf
(91) bottom end is aligned with the bottom of intercommunicating pore (13).
3. a kind of high MEMS microphone of signal-to-noise ratio according to claim 1, it is characterised in that: lower layer's pcb board (1)
Bottom be fixedly connected with microphone pad (3), the quantity of the microphone pad (3) is two, two microphone pads (3)
Bottom of the symmetrical setting in lower layer's pcb board (1).
4. a kind of high MEMS microphone of signal-to-noise ratio according to claim 1, it is characterised in that: the MEMS chip (4)
It is fixedly connected by bonded adhesives with lower layer's pcb board (1) with asic chip (5), the top and bottom end on gas-guide tube (9) surface
It is fixedly connected respectively with upper housing and lower layer's pcb board (1) by adhesive.
5. a kind of high MEMS microphone of signal-to-noise ratio according to claim 1, it is characterised in that: the top of the upper housing
And the position of corresponding microphone acoustic aperture (8) is pasted with water proof and dust proof net (10).
6. a kind of high MEMS microphone of signal-to-noise ratio according to claim 1, it is characterised in that: the upper housing is spill
It shields shell (210).
7. a kind of high MEMS microphone of signal-to-noise ratio according to claim 6, it is characterised in that: the microphone acoustic aperture
(8), the section of gas-guide tube (9), the first groove (11), the second groove (12) and intercommunicating pore (13) is circle.
8. a kind of high MEMS microphone of signal-to-noise ratio according to claim 1, it is characterised in that: the upper housing includes square
Shape frame shell (220) and upper layer pcb board (230), the top and upper layer pcb board (230) of the rectangle frame shell (220) are fixed to be connected
It connects, the bottom of the rectangle frame shell (220) is fixedly connected with lower layer's pcb board (1).
9. a kind of high MEMS microphone of signal-to-noise ratio according to claim 8, it is characterised in that: the microphone acoustic aperture
(8), the section of gas-guide tube (9), the first groove (11), the second groove (12) and intercommunicating pore (13) is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920106643.2U CN209283511U (en) | 2019-01-22 | 2019-01-22 | A kind of MEMS microphone that signal-to-noise ratio is high |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920106643.2U CN209283511U (en) | 2019-01-22 | 2019-01-22 | A kind of MEMS microphone that signal-to-noise ratio is high |
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| CN209283511U true CN209283511U (en) | 2019-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920106643.2U Active CN209283511U (en) | 2019-01-22 | 2019-01-22 | A kind of MEMS microphone that signal-to-noise ratio is high |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110482477A (en) * | 2019-09-10 | 2019-11-22 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
| CN111031462A (en) * | 2019-11-12 | 2020-04-17 | 山东新港电子科技有限公司 | Preposition back sound cavity MEMS MIC |
| CN111314830A (en) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone with high signal-to-noise ratio and production method thereof |
| JP7451778B1 (en) | 2023-01-05 | 2024-03-18 | 八重洲無線株式会社 | Microphone installation method in portable wireless communication equipment |
-
2019
- 2019-01-22 CN CN201920106643.2U patent/CN209283511U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110482477A (en) * | 2019-09-10 | 2019-11-22 | 苏州敏芯微电子技术股份有限公司 | Silicon microphone packaging structure and its packaging method |
| CN111031462A (en) * | 2019-11-12 | 2020-04-17 | 山东新港电子科技有限公司 | Preposition back sound cavity MEMS MIC |
| CN111314830A (en) * | 2019-12-07 | 2020-06-19 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone with high signal-to-noise ratio and production method thereof |
| CN111314830B (en) * | 2019-12-07 | 2021-02-19 | 朝阳聚声泰（信丰）科技有限公司 | MEMS microphone with high signal-to-noise ratio and production method thereof |
| JP7451778B1 (en) | 2023-01-05 | 2024-03-18 | 八重洲無線株式会社 | Microphone installation method in portable wireless communication equipment |
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