CN209261999U - One kind being used for optical splitter wafer patch clamp for machining - Google Patents
One kind being used for optical splitter wafer patch clamp for machining Download PDFInfo
- Publication number
- CN209261999U CN209261999U CN201822046164.4U CN201822046164U CN209261999U CN 209261999 U CN209261999 U CN 209261999U CN 201822046164 U CN201822046164 U CN 201822046164U CN 209261999 U CN209261999 U CN 209261999U
- Authority
- CN
- China
- Prior art keywords
- upper cover
- wafer
- shaped support
- carrying platform
- optical splitter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 29
- 238000003754 machining Methods 0.000 title claims abstract description 8
- 238000005452 bending Methods 0.000 claims abstract description 8
- 238000003780 insertion Methods 0.000 claims abstract description 3
- 230000037431 insertion Effects 0.000 claims abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 6
- 238000012545 processing Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses one kind to be used for optical splitter wafer patch clamp for machining, including C-shaped support, base rail, wafer carrying platform, vacuum chuck, vacuum pipeline, upper cover guide post, upper cover, Level tune module, lower pressure screw rod；C-shaped support includes bracket base and bending bracket, and two base rails are equipped on the bracket base of C-shaped support；Wafer carrying platform bottom is embedded in base rail, and vacuum chuck is equipped in the middle part of wafer carrying platform, and vacuum pipeline connects vacuum chuck, and the angle of wafer carrying platform upper surface four is equipped with upper cover guide post；The angle of upper cover lower surface four is equipped with the guide hole for the insertion of upper cover guide post；Level tune module is placed on cap upper surface；The bending bracket front end of C-shaped support is equipped with lower pressure screw rod, is located at right above Level tune module.The utility model one kind is used for optical splitter wafer patch clamp for machining, can be effectively controlled the uniformity of the interbed glue of optical splitter wafer and cover board.
Description
Technical field
The utility model relates to one kind to be used for optical splitter wafer patch clamp for machining.
Background technique
For optical splitter as the core devices in passive optical network, effect is to realize the distribution of optical power.Mainstream at present
Optical splitter be based primarily upon two kinds of technology types: fused tapered and planar type optical waveguide.Planar type optical waveguide optical splitter
It is reproducible since it is small with device size, it is suitable for increasingly occupying leading position the features such as large-scale production.For flat
For the optical-waveguide-type light branching unit module of face, optical branching-device chip therein involves great expense, and optical splitter wafer is processed into
The production cost of particle chip is equally also relatively high, needs to improve processing efficiency and processing quality by optimization processing technology,
Just it is able to satisfy the control of production cost.
The manual operation that optical splitter wafer patch process before this uses always, it is unstable due to manual operation
Property, there is bubble phenomenon in uneven thickness, the glue-line of generally existing patch glue-line.If occurring bubble in glue-line, necessarily affect
The stability of optical splitter individual particle, it is necessary to which glue on cleaning wafer patch again, production efficiency is low, and does over again
Required glue consumptive material equally also increases patch cost.
Utility model content
The purpose of this utility model is to provide one kind to be used for optical splitter wafer patch clamp for machining, can be effectively controlled light
The uniformity of the interbed glue of splitter wafer and cover board, and patch quality and effect can be improved to avoid bubble is generated in glue-line
Rate reduces optical splitter wafer production processing cost.
To achieve the goals above, the technical solution of the utility model is to design one kind to add for optical splitter wafer patch
Clamping apparatus, including C-shaped support, base rail, wafer carrying platform, vacuum chuck, vacuum pipeline, upper cover guide post, upper cover, horizontal tune
Save module, lower pressure screw rod；The C-shaped support includes bracket base and bending bracket, is equipped on the bracket base of C-shaped support
Two base rails；In the wafer carrying platform bottom insertion base rail, vacuum chuck, vacuum are equipped in the middle part of wafer carrying platform
Conduit connects vacuum chuck, and the angle of wafer carrying platform upper surface four is equipped with upper cover guide post；On the angle of the upper cover lower surface four
Equipped with the guide hole being inserted into for upper cover guide post；The Level tune module is placed on cap upper surface；The bending of the C-shaped support
Bracket front end is equipped with lower pressure screw rod, is located at right above Level tune module.
Advantages and beneficial effects of the utility model lie in that the utility model one kind is processed for optical splitter wafer patch
Fixture, the patch processing of the optical splitter wafer of applicable various model specifications, can be effectively controlled optical splitter wafer and cover board
Interbed glue uniformity, and can improve patch quality and efficiency to avoid bubble is generated in glue-line, it is brilliant to reduce optical splitter
Circle production and processing cost.
Detailed description of the invention
Fig. 1 is the schematic diagram of C-shaped support.
Fig. 2 is the schematic diagram of wafer carrying platform.
Fig. 3 is the schematic diagram of upper cover.
Fig. 4 is the schematic diagram of Level tune module.
Fig. 5 is the overall schematic of the utility model.
Wherein, C-shaped support 1, base rail 2, wafer carrying platform 3, vacuum chuck 4, vacuum pipeline 5, upper cover guide post 6, on
Lid 7, Level tune module 8, lower pressure screw rod 9.
Specific embodiment
With reference to the accompanying drawings and examples, specific embodiment of the present utility model is further described.Implement below
Example is only used for clearly illustrating the technical solution of the utility model, and cannot be used as a limitation the protection model of limitation the utility model
It encloses.
Embodiment:
One kind be used for optical splitter wafer patch clamp for machining, including C-shaped support 1, base rail 2, wafer carrying platform 3,
Vacuum chuck 4, vacuum pipeline 5, upper cover guide post 6, upper cover 7, Level tune module 8, lower pressure screw rod 9；The C-shaped support 1 includes
There are bracket base and bending bracket, two base rails 2 are equipped on the bracket base of C-shaped support 1；The wafer carrying platform 3
Bottom is embedded in base rail 2, and vacuum chuck 4 is equipped in the middle part of wafer carrying platform 3, and vacuum pipeline 5 connects vacuum chuck 4, wafer
The plummer angle of 3 upper surface four is equipped with upper cover guide post 6；The upper cover angle of 7 lower surface four is equipped with inserts for upper cover guide post 6
The guide hole entered；The Level tune module 8 is placed on 7 upper surface of upper cover；The bending bracket front end of the C-shaped support 1 is equipped with down
Screw rod 9 is pressed, is located at right above Level tune module 8.
In use, optical splitter wafer patch to be processed is placed in wafer carrying platform 3, vacuum chuck 4 is firmly adsorbed
Optical splitter wafer patch coating glue and covers cover board on optical splitter wafer patch；Then upper cover 7 is pressed in cover board
On, upper cover 7 is placed on wafer carrying platform 3 using the upper cover guide post 6 in wafer carrying platform 3 ensures wafer in the process
3 uniform stressed of plummer places Level tune module 8 in upper cover 7, lower pressure screw rod 9 is then adjusted, so that under lower pressure screw rod 9
End is against 8 upper surface of Level tune module, and generates certain stress.When discovery glue-line has bubble that Level tune module can be used
It adjusts wafer coverplate stress point and squeezes out glue-line bubble.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
For art personnel, without deviating from the technical principle of the utility model, several improvements and modifications can also be made, these change
It also should be regarded as the protection scope of the utility model into retouching.
Claims (1)
1. one kind is used for optical splitter wafer patch clamp for machining, it is characterised in that: held including C-shaped support, base rail, wafer
Microscope carrier, vacuum chuck, vacuum pipeline, upper cover guide post, upper cover, Level tune module, lower pressure screw rod；The C-shaped support includes
Bracket base and bending bracket, are equipped with two base rails on the bracket base of C-shaped support；The wafer carrying platform bottom is embedding
Enter in base rail, vacuum chuck is equipped in the middle part of wafer carrying platform, vacuum pipeline connects vacuum chuck, wafer carrying platform upper surface
Four angles are equipped with upper cover guide post；The angle of the upper cover lower surface four is equipped with the guide hole for the insertion of upper cover guide post；The water
Flat adjustment module is placed on cap upper surface；The bending bracket front end of the C-shaped support is equipped with lower pressure screw rod, is located at Level tune
Right above module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822046164.4U CN209261999U (en) | 2018-12-07 | 2018-12-07 | One kind being used for optical splitter wafer patch clamp for machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822046164.4U CN209261999U (en) | 2018-12-07 | 2018-12-07 | One kind being used for optical splitter wafer patch clamp for machining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209261999U true CN209261999U (en) | 2019-08-16 |
Family
ID=67562366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822046164.4U Expired - Fee Related CN209261999U (en) | 2018-12-07 | 2018-12-07 | One kind being used for optical splitter wafer patch clamp for machining |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209261999U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111897049A (en) * | 2020-08-27 | 2020-11-06 | 四川天邑康和通信股份有限公司 | Automatic chip mounting production process for optical splitter chip |
-
2018
- 2018-12-07 CN CN201822046164.4U patent/CN209261999U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111897049A (en) * | 2020-08-27 | 2020-11-06 | 四川天邑康和通信股份有限公司 | Automatic chip mounting production process for optical splitter chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190816 |