CN209197200U - A kind of quick cooler - Google Patents
A kind of quick cooler Download PDFInfo
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- CN209197200U CN209197200U CN201821858502.8U CN201821858502U CN209197200U CN 209197200 U CN209197200 U CN 209197200U CN 201821858502 U CN201821858502 U CN 201821858502U CN 209197200 U CN209197200 U CN 209197200U
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- heat
- radiator
- conduction cooling
- cooling column
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Abstract
The utility model relates to fluid refrigeration technical fields, more particularly to a kind of quick cooler, including semiconductor cooler, with the hot end of semiconductor cooler against radiator, with the cold end of semiconductor cooler against conduction cooling column and be set around conduction cooling column lateral wall hollow coil pipe.Compared with existing quickly cooling unit, the quick cooler of the utility model is avoided using equipment such as compressor, condenser and evaporators, structure is simple, semiconductor cooler it is small in size, and the process of refrigerastion of semiconductor cooler without refrigerant can continuous work, when work will not generate vibration, noise as compressor, long service life, installation is simple, less energy-consuming, and use cost is low.
Description
Technical field
The present invention relates to fluid refrigeration technical fields, and in particular to a kind of quick cooler.
Background technique
Semiconductor cooler (abbreviation TEC) is made using the Peltier effect of semiconductor material, so-called Po Er
Note effect refers to, when the galvanic couple that direct current is made up of two kinds of semiconductor materials, one end is absorbed heat (cold end), other end heat release
The phenomenon that (hot end).Temperature control scheme based on TEC has many advantages, such as small in size easily controllable, has widely in semiconductor field
Using.
Part population is liked drinking cold drink, such as cold water, jelly beverage, ice beer, is by the way that ice cube drop is added under normal conditions
The temperature of low cold drink, to drink the low cold drink of temperature, but cold drink minimum temperature on the rocks also can only achieve zero degree, Er Qiebing
Block has also watered down the taste of the drinks such as jelly beverage, ice beer.Also occurs quickly cooling equipment, such as Chinese patent literature in the prior art
A kind of dual-cooling type device for beer on draft (application number: 201610887573.X) is disclosed, which includes cabinet, is set in cabinet
There is the refrigerating circuit including compressor, condenser and evaporator, there is the cold storage cavity that can place fat, evaporator energy in cabinet
It is enough to freeze to cold storage cavity, it is additionally provided with wine outlet duct in cabinet, is fixed with out wine faucet outside cabinet, wine outlet duct outer end and described
Wine faucet is connected out and its inner end with fat for being connected, and cold storage cavity is single-chamber cell structure, is equipped with refrigeration in cold storage cavity
Pipe, refrigerator pipes are connected in above-mentioned refrigerating circuit and are formed with the evaporator in parallel, and refrigerator pipes and wine outlet duct pass through spiral shell side by side
Rotation mode is coiled into the quickly cooling unit of cylindric or oval tubular；But it needs to use compressor, condenser and evaporator, and structure is multiple
Miscellaneous, occupied space is big, and compressor energy consumption is big, and use cost is high.
Summary of the invention
In order to overcome shortcoming and defect existing in the prior art, the purpose of the present invention is to provide a kind of quick cooler,
Compared with existing quickly cooling unit, quick cooler of the invention is avoided using the equipment such as compressor, condenser and evaporator, structure
Simply, semiconductor cooler is small in size, and the process of refrigerastion of semiconductor cooler without refrigerant can continuous work, work
Vibration, noise will not be generated when making as compressor, long service life, installation is simple, less energy-consuming, and use cost is low.
The purpose of the invention is achieved by the following technical solution: a kind of quick cooler, including semiconductor cooler, with partly lead
The hot end of chiller against radiator, with the cold end of semiconductor cooler against conduction cooling column and be set around conduction cooling column
Lateral wall hollow coil pipe.
Preferably, the conduction cooling column includes hollow tube and gas medium, the both ends of the hollow tube be closed with
Cavity is constituted, the gas medium is located in cavity.
Preferably, the inner wall of the hollow tube is in smooth shape.
Preferably, the hollow tube is metal tube.
Preferably, the gas medium is tetrafluoroethane gas medium, chloro-tetrafluoroethane's gas medium, Difluoroethane gas
One of body medium, chlorodifluoroethane gas medium or pentafluoropropane gas medium.
Preferably, the radiator is passive heat radiation device or active radiator.
Preferably, the radiator include with the hot end of semiconductor cooler against heat-pipe radiator.
Preferably, the heat-pipe radiator include with the hot end of semiconductor cooler against heat sink, by multiple heat dissipations
The heat-transfer pipe of the evenly distributed radiating part of fin and the connection heat sink and radiating part.
Preferably, one end of the heat-transfer pipe is arranged in the heat sink, and the other end of the heat-transfer pipe is arranged in described
Radiating part.
Preferably, the radiator further includes the radiator fan abutted with radiating part.
The beneficial effects of the present invention are: quick cooler of the invention, fluid input hollow coil pipe and around conduction cooling column streams
Dynamic, semiconductor cooler generates hot end and cold end after being powered using Peltier effect, by the hot end of semiconductor cooler against scattered
Thermal, the heat that semiconductor refrigerating is released via radiator rapid cooling, by the cold end of semiconductor cooler against lead
Cold column, the heat of conduction cooling column are constantly quickly absorbed by the cold end of semiconductor cooler, so that the temperature of conduction cooling column is quickly reduced,
Using heat transfer principle, the heat of fluid is constantly conducted via hollow coil pipe to conduction cooling column, so that the temperature of fluid is substantially reduced,
Compared with existing quickly cooling unit, quick cooler of the invention is avoided using the equipment such as compressor, condenser and evaporator, structure
Simply, semiconductor cooler is small in size, and the process of refrigerastion of semiconductor cooler without refrigerant can continuous work, work
Vibration, noise will not be generated when making as compressor, long service life, installation is simple, less energy-consuming, and use cost is low；In addition,
The heat conduction efficiency of conduction cooling column is high, and the heat of conduction cooling column can be quickly transmitted to the cold end of semiconductor cooler, the operation is stable
Property it is high.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is main view of the invention.
Appended drawing reference are as follows: 1, semiconductor cooler；2, heat-pipe radiator；21, heat sink；22, heat-transfer pipe；23, radiating part；
3, conduction cooling column；4, hollow coil pipe；5, radiator fan.
Specific embodiment
For the ease of the understanding of those skilled in the art, the present invention is made below with reference to examples and drawings 1-2 further
Explanation, the content that embodiment refers to not is limitation of the invention.
Embodiment 1
As shown in Figs. 1-2, a kind of quick cooler, including semiconductor cooler 1, with the hot end of semiconductor cooler 1 against
Radiator, with the cold end of semiconductor cooler 1 against conduction cooling column 3 and be set around conduction cooling column 3 lateral wall it is hollow
Coil pipe 4.
When practical operation, fluid inputs hollow coil pipe 4 and flows around conduction cooling column 3, and semiconductor cooler 1 utilizes Peltier
Effect generates hot end and cold end after being powered, the heat that the hot end of semiconductor cooler 1 is released against radiator, semiconductor refrigerating
Amount via radiator rapid cooling, by the cold end of semiconductor cooler 1 against conduction cooling column 3, the heat of conduction cooling column 3 is constantly
It is quickly absorbed by the cold end of semiconductor cooler 1, to quickly reduce the temperature of conduction cooling column 3, using heat transfer principle, fluid
Heat is constantly conducted via hollow coil pipe 4 to conduction cooling column 3, so that the temperature of fluid is substantially reduced, compared with existing quickly cooling unit,
Quick cooler of the invention is avoided using equipment such as compressor, condenser and evaporators, and structure is simple, semiconductor cooler 1
It is small in size, and the process of refrigerastion of semiconductor cooler 1 without refrigerant can continuous work, when work, will not be as compressor
Vibration, noise are generated like that, and long service life, installation is simple, less energy-consuming, and use cost is low；In addition, the heat of conduction cooling column 3 passes
It leads high-efficient, the heat of conduction cooling column 3 can quickly be transmitted to the cold end of semiconductor cooler 1, job stability is high.In this implementation
Example in, the hollow coil pipe 4 be food-grade stainless steel pipe, the both ends of the hollow coil pipe 4 be opening, the fluid be water,
The liquid such as beverage, beer；In other embodiments, the fluid is the gases such as steam, air, carbon dioxide.
The conduction cooling column 3 includes hollow tube and gas medium, and the both ends of the hollow tube are closed to constitute and hold
Chamber, the gas medium are located in cavity.
In the present embodiment, the working principle of the conduction cooling column 3 is: the end thereof contacts semiconductor cooler 1 of conduction cooling column 3
Cold end, the gas medium releasing heat close to cold end, according to " PV/T=nR, wherein P is pressure, and V is volume, and T is temperature, and n is
The amount of the substance of gas, R are constant ", in closed cavity, the constancy of volume of gas medium, temperature and pressure declines, with
The other end of conduction cooling column 3 forms the temperature difference, and the temperature difference at 3 both ends of conduction cooling column causes the gas medium at 3 both ends of conduction cooling column to form height
The difference (i.e. pressure difference) of low pressure, at this point, gas medium is from one end of high pressure carrying heat, to one end of low pressure, (conduction cooling column 3 is connect
Touch one end of cold source) it flows and accumulates, an end pressure of former low pressure rises, and accumulation while discharges latent heat, when the one of former low pressure
When end pressure is higher than an end pressure of former high pressure, the gas medium reverse flow of heat is discharged, from one end of former low pressure to original
One end of high pressure is flowed and is accumulated, and accumulation while absorbs the heat of fluid in hollow coil pipe 4, so that the heat of fluid is reduced,
The temperature of fluid is reduced, using the principle cycle operation of pressure difference, the heat of fluid is constantly passed to via conduction cooling column 3 and partly led
The cold end of chiller 1, to reduce the temperature of fluid.Conduction cooling column 3 of the invention avoids the research and development think of using capillary structure
Road, conduction cooling column 3 are installed with gas medium, and there is no liquid and gaseous phase changes, greatly shorten the time of heat transfer, utilize gas
Principle of differential pressure, heat transfer efficiency are high.
The inner wall of the hollow tube is in smooth shape.
In the present embodiment, the hollow tube of inner wall smooth is set, flow resistance of the gas medium in cavity is reduced, from
And heat transfer efficiency is improved, and compared with capillary structure is arranged in existing conduction cooling column 3, the inner wall smooth of hollow tube of the invention, drop
Low processing cost reduces difficulty of processing, improves production efficiency, reduce flow resistance, improve heat transfer efficiency, is existing
There is the result that technology is unexpected.The coefficient of friction of the inner wall of the thermally conductive tube body is in 0.1-0.2.
The hollow tube is metal tube.
The hollow tube uses metal tube, the height of thermal conductivity ratio plastic tube, and the heat for being conducive to conduction cooling column 3 passes
It passs, specifically, metal tube is one of copper pipe, aluminum pipe or steel pipe, and the linear expansion coefficient of one side metal tube is small, is
The 1/5-1/15 of plastic tube will not cause stress fatigue to rupture because of excessive due to expanding with heat and contract with cold, another aspect metal tube it is strong
Degree is big, and the pressure-resistant degree of metal tube is higher than the pressure-resistant degree of plastic tube body in the case where same wall thickness, it is furthermore preferred that described
Hollow tube is copper pipe.
The gas medium be tetrafluoroethane gas medium, chloro-tetrafluoroethane's gas medium, Difluoroethane gas medium,
One of chlorodifluoroethane gas medium or pentafluoropropane gas medium.
It in the present embodiment, can be in conduction cooling at a temperature of -20 DEG C to 200 DEG C using any one of the above gas medium
Heat is transmitted in the form of a vapor in column 3, if temperature is lower than -20 DEG C, gas medium is easy liquefaction, leads to conduction cooling of the invention
Column 3 is unable to normal operation, and heat transfer efficiency is low, is easy to make the pressure of gas medium in cavity excessive if temperature is higher than 200 DEG C and makes
Conduction cooling column 3 ruptures, and damages conduction cooling column 3.It is furthermore preferred that the gas medium is tetrafluoroethane gas medium, in absolute pressure
It, can be in -50 DEG C of low temperature applied to conduction cooling column 3 of the invention still to keep gaseous state under 29.89KPa pressure, at a temperature of -50 DEG C
It remains to work normally under environment, utilizes the cold end and hollow coil pipe 4 of differential pressure principle of the invention and semiconductor cooler 1
Fluid heat transferring.Compared with the existing conduction cooling column 3 for pouring liquid water, gas medium of the invention begins in -20 DEG C or more of temperature
Gaseous state is kept eventually, will not be solidified and be caused heat transfer efficiency very poor, in other words, conduction cooling column 3 of the invention can be in -20 DEG C of conditions
Lower cold conduction efficiency is much higher than the cold conduction efficiency of the existing conduction cooling column 3 for pouring liquid water.
Further, the preparation method of the conduction cooling column 3 includes the following steps: the hollow tube for taking inner wall smooth, will in
Opening is arranged in the other end of the processing closed at one end of blank pipe body, hollow tube, then to hollow tube vacuumize process, then exists
A certain amount of gas medium is injected under 1.5-3.0MPa pressure, and then the opening of the hollow tube is done at ultrasonic compressing
Reason is to get conduction cooling column 3.The preparation method is easy to operate, easy to control, and high production efficiency, production cost is low, can be used for extensive
Production；The purpose vacuumized is to take air away, avoids air impact from passing to performance, while air being avoided to mix with gas medium
After cause security risk, injected under 1.5-3.0MPa pressure a certain amount of gas medium make the cavity of vacuum state from negative pressure become
At positive pressure, vacuum state disappears, and generates pressure difference for cavity and provides basis；It injects after the completion of gas medium, to the hollow tube
The opening of body does closure processing so that conduction cooling column 3 under 2.5-3.5MPa pressure No leakage, without fragmentation, pressure resistance.In 1.5-
The volume that gas medium is injected under 3.0MPa pressure accounts for the 1/8-1/12 of cavity volume, mass concentration of the gas medium in cavity
Reach 30-300mg/cm3If the mass concentration of gas medium is excessively high, the temperature liter of the gas medium in temperature-rise period of conduction cooling column 3
High, pressure increases, and the effect of gas circulation is poor, substantially reduces heat-transfer effect, and is used to be easy when high temperature heat transfer because of gas
The absolute pressure of medium, which crosses 3 fragmentation of ambassador's conduction cooling column, to be caused to damage；If the mass concentration of gas medium is too low, in heat transfer process
The gas medium for carrying heat is few, reduces heat transfer efficiency, it is preferred that the volume that gas medium is injected under 2.5MPa pressure accounts for
The 1/10 of cavity volume；Closure processing is formed using ultrasonic compressing, under the collective effect of supersonic oscillations and pressure, is promoted
Molecule diffusion, the opening of hollow tube is combined together under the action of molecular attraction, thus achieve the effect that closure, it is existing
The closed manners used using liquid water as the conduction cooling column 3 of medium is hot-forming, but medium of the invention is gas medium, heating
After be easy to make gas leakage to remove, cause gas injection rate to reduce and reduce conduction efficiency.
The radiator is passive heat radiation device or active radiator.
The passive heat radiation device is aluminum profile heat radiator or copper material radiator, and the active radiator is in aluminum profile
Radiator fan 5 is connected on the basis of radiator or copper material radiator, the heat dissipation effect of active radiator compares passive heat radiation
The heat dissipation effect of device is more preferable, and the present embodiment uses active radiator, and the hot end of semiconductor cooler 1 is quickly radiated, avoided
The heat in hot end backflows to cold end, influences refrigeration effect.
Specifically, the radiator include with the hot end of semiconductor cooler 1 against heat-pipe radiator 2.
In the present embodiment, the radiator uses heat-pipe radiator 2, promotes the hot end of semiconductor cooler 1 faster
Ground heat dissipation, avoids the heat in hot end from backflowing to cold end, influences refrigeration effect.
Further, the heat-pipe radiator 2 include with the hot end of semiconductor cooler 1 against heat sink 21, by more
The heat-transfer pipe 22 of the evenly distributed radiating part 23 of a radiating fin and the connection heat sink 21 and radiating part 23.
In the present embodiment, the heat that heat sink 21 absorbs is transferred to radiating part 23 via heat-transfer pipe 22, by multiple heat dissipations
The heat dissipation area of the evenly distributed radiating part 23 of fin is big, improves heat transfer efficiency, enhances heat dissipation effect, improves semiconductor cooler
The radiating efficiency in 1 hot end.Preferably, the quantity of the radiating fin is 50.
One end of the heat-transfer pipe 22 is arranged in the heat sink 21, and the other end of the heat-transfer pipe 22 is arranged in described dissipate
Hot portion 23.
In the present embodiment, compared with the both ends of heat-transfer pipe abut heat sink 21 and radiating part 23 respectively, the heat-transfer pipe
22 both ends are arranged in heat sink 21 and radiating part 23 respectively, and the contact area of heat-transfer pipe 22 and heat sink 21 and radiating part 23 is more
Greatly, not only there is contact at the both ends of heat-transfer pipe 22, but also the side wall of heat-transfer pipe 22 still has contact, and heat transfer area is bigger, is more advantageous to
Heat-transfer pipe 22 conducts heat, and improves heat transfer efficiency, enhances heat dissipation effect, improves the radiating efficiency in the hot end of semiconductor cooler 1.
Further, the radiator further includes the radiator fan 5 abutted with radiating part 23.
In the present embodiment, radiator fan 5 pushes radiating part 23 quickly to shed heat, promotes the heat dissipation of radiating part 23, mentions
High heat transfer efficiency enhances heat dissipation effect；The bottom surface of the radiator fan 5 is fixedly connected with the top surface of radiating part 23.
2 performance test of embodiment
The quick cooler for taking 3 embodiments 1 is divided into A group, B group, C group, limits the specification of A group conduction cooling column 3 as φ 10*
500mm, the diameter of hollow coil pipe 4 are 4mm, and the length after hollow coil pipe 4 stretches is 1000mm；The specification of B group conduction cooling column 3 is φ
10*500mm, the diameter of hollow coil pipe 4 are 4mm, and the length after hollow coil pipe 4 stretches is 1000mm；The specification of C group conduction cooling column 3
For φ 10*500mm, the diameter of hollow coil pipe 4 is 4mm, and the length after hollow coil pipe 4 stretches is 1400mm；To 3 groups of quick coolers
The feed inlet of hollow coil pipe 4 25 DEG C of water is passed through with certain flow rate, test the temperature of its water outlet in the discharge port of hollow coil pipe 4
Degree, test result is as follows shown in table:
| The flow velocity (m/s) of water | The initial temperature (DEG C) of water | Leaving water temperature (DEG C) | |
| A group | 0.5 | 25 | 4.3 |
| B group | 1 | 25 | 15.7 |
| C group | 0.5 | 25 | 0.9 |
There is upper table it is found that the quickly cooling effect of the quick cooler is good.
Above-described embodiment is the preferable implementation of the present invention, and in addition to this, the present invention can be realized with other way,
Do not depart under the premise of present inventive concept it is any obviously replace it is within the scope of the present invention.
Claims (10)
1. a kind of quick cooler, it is characterised in that: including semiconductor cooler, with the hot end of semiconductor cooler against heat dissipation
Device, with the cold end of semiconductor cooler against conduction cooling column and be set around conduction cooling column lateral wall hollow coil pipe.
2. a kind of quick cooler according to claim 1, it is characterised in that: the conduction cooling column includes hollow tube and gas
Body medium, the both ends of the hollow tube are closed to constitute cavity, and the gas medium is located in cavity.
3. a kind of quick cooler according to claim 2, it is characterised in that: the inner wall of the hollow tube is in smooth shape.
4. a kind of quick cooler according to claim 2, it is characterised in that: the hollow tube is metal tube.
5. a kind of quick cooler according to claim 2, it is characterised in that: the gas medium is tetrafluoroethane gas Jie
Matter, chloro-tetrafluoroethane's gas medium, Difluoroethane gas medium, chlorodifluoroethane gas medium or pentafluoropropane gas are situated between
One of matter.
6. a kind of quick cooler according to claim 1, it is characterised in that: the radiator be passive heat radiation device or
Active radiator.
7. a kind of quick cooler according to claim 1, it is characterised in that: the radiator includes and semiconductor refrigerating
The hot end of device against heat-pipe radiator.
8. a kind of quick cooler according to claim 7, it is characterised in that: the heat-pipe radiator includes and semiconductor system
The hot end of cooler against heat sink, by the evenly distributed radiating part of multiple radiating fins and the connection heat sink and heat dissipation
The heat-transfer pipe in portion.
9. a kind of quick cooler according to claim 8, it is characterised in that: one end of the heat-transfer pipe is arranged in described dissipate
Hot plate, the other end of the heat-transfer pipe are arranged in the radiating part.
10. a kind of quick cooler according to claim 8, it is characterised in that: the radiator further includes and radiating part
The radiator fan of abutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821858502.8U CN209197200U (en) | 2018-11-12 | 2018-11-12 | A kind of quick cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821858502.8U CN209197200U (en) | 2018-11-12 | 2018-11-12 | A kind of quick cooler |
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| Publication Number | Publication Date |
|---|---|
| CN209197200U true CN209197200U (en) | 2019-08-02 |
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ID=67411241
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821858502.8U Active CN209197200U (en) | 2018-11-12 | 2018-11-12 | A kind of quick cooler |
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| CN (1) | CN209197200U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109341136A (en) * | 2018-11-12 | 2019-02-15 | 东莞市迅阳实业有限公司 | A kind of quick cooler |
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2018
- 2018-11-12 CN CN201821858502.8U patent/CN209197200U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109341136A (en) * | 2018-11-12 | 2019-02-15 | 东莞市迅阳实业有限公司 | A kind of quick cooler |
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