CN209148831U - The test device of light emitting device, test wafer - Google Patents
The test device of light emitting device, test wafer Download PDFInfo
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- CN209148831U CN209148831U CN201790000047.5U CN201790000047U CN209148831U CN 209148831 U CN209148831 U CN 209148831U CN 201790000047 U CN201790000047 U CN 201790000047U CN 209148831 U CN209148831 U CN 209148831U
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model section Example provides the test device of a kind of light emitting device, test wafer.Light emitting device includes: container, optical processing structure and the light source towards optical processing structure transmitting for the test light of test with an end face；Optical processing structure includes at least the first equal mating plate of the test equalizing light rays for issuing light source, and the first equal mating plate is mounted in container；Light source is mounted on end face；Wherein, test light is irradiated to wafer to be measured after optical processing structure.Using the embodiment of utility model, light emitting device can be made to generate the higher light source of the uniformity, luminous device structure is simple, at low cost, figure is smaller is easily mounted on wafer test machine；Multi-bit parallel test is carried out simultaneously convenient for efficient.
Description
Technical field
The utility model relates to detection technique field, in particular to the test device of a kind of light emitting device, test wafer.
Background technique
Photodiode wafer be it is a kind of change very sensitive semiconductor devices to light, have been widely used for various
Occasion, such as it is applied to optical detector, Medical Devices.Therefore, the performance of photodiode wafer is most important, therefore needs to light
Quick diode wafer is tested.Currently, it is brilliant generally to generate uniform light intensity irradiation photodiode using a set of light emitting device
Circle, to carry out multi-bit parallel test to it.
Inventor has found the prior art, and at least there are the following problems: existing for testing shining for photosensitive diode wafer
Device be all it is very large-scale, it is expensive；Simultaneously, it has not been convenient to be mounted on photodiode wafer test machine, can not efficiently into
The test of row multi-bit parallel；And it needs to be installed to circuit board on light emitting device and test, need to have made to order, cannot give birth in batches
It produces.
Utility model content
A kind of test device for being designed to provide light emitting device, test wafer of the utility model section Example, will
Test light is handled by optical processing structure, can be so that light emitting device generates the higher light source of the uniformity, light emitting device
Structure is simple, at low cost, figure is smaller is easily mounted on wafer test machine；Multi-bit parallel survey is carried out simultaneously convenient for efficient
Examination.
One embodiment of the utility model provides a kind of light emitting device, comprising: container, light with an end face
The light source of processing structure and the test light towards optical processing structure transmitting for testing；Optical processing structure is included at least for making
First equal mating plate of the test equalizing light rays that light source issues, the first equal mating plate are mounted in container；Light source is mounted on end face
On；Wherein, test light is irradiated to wafer to be measured after optical processing structure.
The utility model embodiment additionally provides a kind of test device of test wafer, comprising: circuit board above-mentioned shines
Device and light sensation induction signal for controlling light source transmitting test light, receiving wafer output, and sentence according to light sensation induction signal
Disconnected wafer whether He Ge controller；The wafer is mounted on the circuit board, and the light emitting device is arranged in the circuit
On plate and correspond to the wafer；The controller is electrically connected at the light source in the wafer and the light emitting device；
Wherein, the test light is irradiated on the wafer after the optical processing structure.
In terms of existing technologies, test light is handled by optical processing structure for the present embodiment, can so that
Light emitting device generates uniform light, and luminous device structure is simple, at low cost, figure is smaller is easily mounted on wafer test machine；Together
When convenient for efficient carry out multi-bit parallel test.
In addition, optical processing structure further includes an at least polaroid；Polaroid is mounted in container, and in face of the first equal light
Piece.The present embodiment, come the light intensity of attenuation test light, avoids light intensity from crossing ambassador's wafer saturation to be measured by setting polaroid.
In addition, the number of polaroid is two, and optical processing structure further includes for adjusting the folder between two polaroids
Angle, to form the adjusting knob at light polarization angle；Adjusting knob is mounted at least one polaroid in two polaroids.This reality
It applies in example, adjusting knob is set on polaroid, to adjust the angle between two polaroids, so as to adjust test light intensity
Attenuation amplitude, with adjust test light luminous intensity, provide it is a kind of adjustment test light intensity mode.
In addition, optical processing structure further includes the second equal mating plate；Second equal mating plate is mounted in container, the second equal mating plate position
In the side of polaroid, and the first equal mating plate is located at the other side of polaroid.In the present embodiment, increase by the second equal mating plate, with right
Homogenization Treatments are carried out by the test light of polaroid, so that the test light being irradiated on wafer to be measured is more evenly.
In addition, light emitting device further includes multiple for detecting the light of the luminous intensity of the test light by optical processing structure
Detecting element；Multiple light detecting elements are mounted on the inner wall of container and are uniformly distributed.In the present embodiment, setting light is detected
Element, the luminous intensity and consistency of detection test light, to be adjusted to test light.
In addition, optical processing structure further includes the equal mating plate of third；The equal mating plate of third is mounted in container, and is located at first
Between mating plate and multiple light detecting elements.The equal mating plate of third is arranged in the present embodiment in light emitting device, further to test light
Line carries out Homogenization Treatments, so that test light meets the requirement of wafer to be measured.
In addition, container inner surface is provided with the light-absorption layer for avoiding light from reflecting on container inner wall.The present embodiment is in appearance
Box inner surface setting light-absorption layer is set, the reflection of container inner wall is reduced, so that more evenly by the light of equal mating plate out.
In addition, light source includes a plurality of light-emitting elements, a plurality of light-emitting elements are uniformly mounted on end face.The present embodiment provides
The concrete composition of light source, while a plurality of light-emitting elements are uniformly mounted on end face, and the test light of transmitting can be made more equal
It is even, so that more evenly by the light of equal mating plate out.
In addition, light source further includes the driving source for exporting a variety of driving currents to a plurality of light-emitting elements, driving source is separately connected
In a plurality of light-emitting elements.In the present embodiment, the driving current that can be issued by adjusting driving source is realized to test light intensity
Adjusting, provide another adjustment test light intensity mode.
In addition, test device further includes fixing seat in the test device of wafer；Container is fixed on electricity by fixing seat
On the plate of road, and wafer is located in container.Present embodiments provide the mounting means of wafer.
In addition, in the test device of wafer, test device further include configuration information for recording light emitting device and/or
The memory of the test result of wafer；Memory is electrically connected at controller.Memory is arranged in the present embodiment in test device,
To record configuration information required for the light for obtaining the different uniformitys.
Detailed description of the invention
One or more embodiments are illustrated by the picture in corresponding attached drawing, these exemplary theorys
The bright restriction not constituted to embodiment, the element in attached drawing with same reference numbers label are expressed as similar element, remove
Non- to have special statement, composition does not limit the figure in attached drawing.
Fig. 1 is the structural schematic diagram according to the light emitting device of the application first embodiment；
Fig. 2 is the structural schematic diagram according to the light emitting device of the utility model second embodiment；
Fig. 3 is the structural schematic diagram according to the light emitting device of the utility model 3rd embodiment；
Fig. 4 is the structural schematic diagram according to the light emitting device of the utility model fourth embodiment；
Fig. 5 is the structural schematic diagram according to the test device of the wafer of the 5th embodiment of the utility model.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, is further elaborated the utility model section Example.It should be appreciated that specific embodiment described herein is only
Only to explain the utility model, it is not used to limit the utility model.
The utility model first embodiment is related to a kind of light emitting device, the test device applied to wafer.Referring to FIG. 1,
Light emitting device 10 includes container 1, light source and optical processing structure with an end face.
Optical processing structure includes at least the first equal mating plate 31, and the first equal mating plate 31 is mounted on inside container 1, for survey
It tries light and carries out Homogenization Treatments.Wherein, the thickness of the first equal mating plate 31 can according to the requirement in test to equal light effect and
Setting.
In the present embodiment, the light-absorption layer for avoiding light from reflecting on container inner wall can be set in 1 inner surface of container, with
The reflection of bucket inner wall is reduced, so that more evenly by the light of equal mating plate out；Container 1 shines for fixing, supporting, sealing
The other structures of device 10, size can quantity according to other devices of the light emitting device 10 of installation and crystalline substances to be measured
Justify the photosensitive area of needs to set, the present embodiment is not intended to be limited in any this；Preferably, container 1 can be cylindrical body, so
It is without being limited thereto.In the present embodiment, the light-emitting window of light emitting device 10 can be equal to or slightly less than the opening of container 1；Wherein, it sends out
The requirement that the size of the light-emitting window of electro-optical device 10 can be tested according to multi-bit parallel is arranged, i.e., the digit tested every time is more (i.e.
It is more on the wafer tested every time), the light-emitting window of light emitting device 10 requires bigger.
In the present embodiment, the first equal mating plate 31 is needed at a distance from wafer as far as possible closely a bit, to ensure to test the equal of light
Even property, because uniformity is relatively high, and test light linear distance first is equal when test light just comes out from the first equal mating plate 31
Mating plate 31 is remoter, and uniformity is poorer；Therefore, the equal mating plate that test light finally passes through will control at a distance from wafer certain
In the range of, to guarantee that test light has preferable uniformity；Equal mating plate is generally 0.5cm to 2cm at a distance from wafer, however
The present embodiment is not intended to be limited in any this.
Light source is mounted on the end face 11 of container, for emitting test light towards optical processing structure.In the present embodiment,
Light source includes a plurality of light-emitting elements 21, is uniformly mounted on the end face 11 of container；Preferably, a plurality of light-emitting elements 21 are about end
The center point symmetry in face 11, so that the test light of transmitting is more evenly；Light-emitting component 21 is, for example, light emitting diode.Wherein, it sends out
Type, the quantity of optical element 21 can be selected according to the photobehavior of wafer to be measured, and the present embodiment is not intended to be limited in any this.
In the present embodiment, light source further includes driving source 22, and driving source 22 is electrically connected in a plurality of light-emitting elements 21, and
A variety of driving currents can be exported to a plurality of light-emitting elements 21；Driving source 22 issue driving current be it is adjustable, with realize pair
The adjusting of the test light intensity of transmitting；Wherein, driving power 22 may be mounted on the end face 11 of container 1, or driving
Source 22 also can be set in the circuit board for installing wafer, as long as being connect with fabrication, the present embodiment to this not
Do any restrictions.
In light emitting device 10 provided in this embodiment, driving source 22 issues driving current to light-emitting component 21, light-emitting component
21 receive generation sending test light after driving current, and test light is by the first equal progress of mating plate 31 Homogenization Treatments, then
Uniform test light is issued by light-emitting window.It should be noted that light emitting device 10 needs to protect in production and use process
Leakproofness is demonstrate,proved, the interference of extraneous light is avoided.
In terms of existing technologies, test light is handled by optical processing structure for the present embodiment, can so that
Light emitting device generates uniform light, and luminous device structure is simple, at low cost, figure is smaller is easily mounted on wafer test machine；Together
When convenient for efficient carry out multi-bit parallel test.
The utility model second embodiment is related to a kind of light emitting device, and the present embodiment is changing on the basis of first embodiment
Into mainly theing improvement is that: referring to FIG. 2, optical processing structure further includes an at least polaroid 32 in the present embodiment.
In the present embodiment, polaroid 32 is mounted in container 1, and faces the first equal mating plate 31, can be set in the
Below one equal mating plate 31, i.e. test light first passes through the first equal mating plate 31, using polaroid 32 (Fig. 2 is as example), so
Without being limited thereto, polaroid 32 also can be set in the upper surface of first equal mating plate 31, i.e. test light first passes through polaroid 32, then passes through
Cross the first equal mating plate 31.
In light emitting device 10 provided in this embodiment, driving source 22 issues driving current to light-emitting component 21, light-emitting component
21 receive generation sending test light after driving current, and test light is by the first equal progress of mating plate 31 Homogenization Treatments, then
Decayed by 32 pairs of test light of polaroid, uniform test light is issued by light-emitting window.
The present embodiment is for first embodiment, can be with by setting polaroid come the light intensity of attenuation test light
Light intensity is avoided to cross ambassador's wafer saturation to be measured.
The utility model 3rd embodiment is related to a kind of light emitting device, and the present embodiment is changing on the basis of second embodiment
Into mainly theing improvement is that: referring to FIG. 3, optical processing structure includes 33, two polaroids of adjusting knob in the present embodiment
32。
In the present embodiment, adjusting knob 33 is mounted at least one polaroid 32 in two polaroids 32, for adjusting
The angle between two polaroids 32 is saved, to form light polarization angular range；Belong in light polarization angular range in test light
Polarization light can pass through two polaroids 32；Preferably, the optical processing structure of the present embodiment may include two adjusting rotations
Button 33, respectively installs an adjusting knob 33 on two polaroids 32, and right the present embodiment is not intended to be limited in any this.
The principle for adjusting the angle between two polaroids 32 to adjust test light intensity is exemplified below: for example,
It is vertical direction that first polaroid 32, which is arranged, then the test light of first polaroid 32 permission vertical direction passes through；
It is then vertical direction 45 by the test light of second polaroid 32 such as 45 degree of directions that second polaroid 32 is arranged
The test light mapped on degree direction；Angle as second polaroid 32 is arranged is horizontal direction, then at this time without test light
Line passes through.
Preferably, second equal mating plate 34 is mounted on referring to FIG. 3, optical processing structure can also include the second equal mating plate 34
In container 1；At this point, the second equal mating plate 34 is located at the side of polaroid 32, the first equal mating plate 31 is located at the another of polaroid 32
Side, to carry out Homogenization Treatments to by the test light of polaroid 32, so that the test light being irradiated on wafer to be measured is more
Uniformly；The first equal mating plate 31 is set to the upper surface of polaroid 32 in the present embodiment, the second equal mating plate 34 is set to polaroid 32
Below (as example in figure), it is so without being limited thereto, the second equal mating plate 31 can also be set to the upper surface of polaroid 32, first
Equal mating plate 34 is set to below polaroid 32.
In light emitting device 10 provided in this embodiment, driving source 22 issues driving current to light-emitting component 21, light-emitting component
21 receive generation sending test light after driving current, and test light is by the first equal progress of mating plate 31 Homogenization Treatments, then
Decayed by two polaroids, 32 pairs of test light, adjusting knob 33 is provided on polaroid 32 to adjust two polaroids
Angle between 32 tests light by the second equal mating plate 34 later and carries out Homogenization Treatments, issued by light-emitting window uniform
Test light.
Adjusting knob is arranged for second embodiment in the present embodiment on polaroid, to adjust two polaroids
Between angle, so as to adjust test light intensity attenuation amplitude, with adjust test light luminous intensity, provide a kind of tune
The mode of whole test light intensity.
The utility model fourth embodiment is related to a kind of light emitting device, and the present embodiment is changing on the basis of 3rd embodiment
Into mainly theing improvement is that: referring to FIG. 4, light emitting device 10 further includes multiple light detecting elements 5 in the present embodiment.
In the present embodiment, multiple light detecting elements 5 are mounted on the inner wall of container 1 and are uniformly distributed；Multiple light inspections
It surveys element 5 and light source is located at the two sides of optical processing structure；Multiple light detecting elements 5 are used to detect the survey by optical processing structure
Try the luminous intensity of light；It is so without being limited thereto, it also can use other instruments in the light-emitting window of light emitting device 10 to test light
Luminous intensity and consistency are detected, and installation light detecting element 5 is not needed.
Preferably, optical processing structure can also include the equal mating plate 35 of third；The equal mating plate 35 of third is mounted in container 1,
And between polaroid 32 and multiple light detecting elements 5, Homogenization Treatments further are carried out to test light, so that test
Light meets the requirement of wafer to be measured.
In light emitting device 10 provided in this embodiment, driving source 22 issues driving current to light-emitting component 21, light-emitting component
21 receive generation sending test light after driving current, and test light is by the first equal progress of mating plate 31 Homogenization Treatments, then
Decayed by two polaroids, 32 pairs of test light, adjusting knob 33 is provided on polaroid 32 to adjust two polaroids
Angle between 32 tests light by the second equal mating plate 34 later and carries out Homogenization Treatments, utilizes multiple light detecting elements 5
It is equal using third then to test light by the luminous intensity and consistency of the test light after the second equal mating plate 34 for detection
Mating plate 35 carries out Homogenization Treatments, issues uniform test light by light-emitting window.
The present embodiment for 3rd embodiment, using light detecting element detect test light luminous intensity and
Consistency is adjusted with the driving current that the quantity of angle, light-emitting component to polaroid and driving source issue.It needs
Bright, the present embodiment can also be used as improvement on the basis of first embodiment, second embodiment, can achieve identical skill
Art effect.
5th embodiment of the utility model is related to a kind of test device of wafer, tests applied to wafer.Please
With reference to Fig. 5, the test device of wafer 104 includes circuit board 101, controller 102, memory 103 and first embodiment to
Light emitting device 10 in any one of four embodiments (in figure by taking the light emitting device in fourth embodiment as an example).
In the present embodiment, wafer 104 is mounted on the circuit board 101, and the light emitting device 10 is arranged in the circuit
On plate 101 and correspond to the wafer 104.
Specifically, circuit board 101 may include first surface and second surface, and opening is provided on circuit board 101
The opening on the first surface of circuit board 101 and corresponding to circuit board 101 is arranged in light emitting device 10, and wafer 104 is mounted on
Opening on the second surface of circuit board 101 and corresponding to circuit board 101；Light emitting device 10 can be fixed on by screw hole 104
On circuit board 101, screw hole 104 is set on the pedestal 4 of light emitting device 10, and light emitting device 10 is locked in circuit board by screw
On 101.Right present embodiment does not do any restrictions to this, and it is (as in the first embodiment not include fixing seat 4 in light emitting device 10
Light emitting device) in the case where, such as when can be pressed on light emitting device 10 on circuit board 101 by manipulator and stop one section
Between, to carry out the test of wafer 104.In the present embodiment, the openings of sizes of circuit board 101 can be with the light-emitting window of light emitting device 10
Size is identical, and right the present embodiment is not intended to be limited in any this.
Controller 102 is electrically connected at the light source in wafer 104 and light emitting device 10, for controlling light source transmitting test light
Line, i.e. controller 102 are connected to the driving power 22 in the light source of light emitting device 10；Wherein, test light passes through light processing knot
It is irradiated on wafer 104 after structure by the opening on circuit board 101；Controller 102 is also used to receive the light sensation of the output of wafer 104
Induction signal, and judge whether wafer 104 is qualified according to light sensation induction signal.
In the present embodiment, the first surface (i.e. upper surface in Fig. 5) of circuit board 101 is arranged in light emitting device 10, and sends out
The light-emitting window of electro-optical device 10 corresponds to the opening of circuit board 101；The second surface that wafer 104 is mounted on circuit board 101 (is schemed
Lower surface in 5) and correspond to circuit board 101 opening；The test light that light emitting device 10 issues is projected by light-emitting window, so
It is radiated on wafer 104 by the opening of circuit board 101 afterwards.
Wherein, wafer 104 is mounted on pallet, which is to be movably arranged relative to circuit board 101.Wafer 104
Area is actually much larger than the area of the opening on circuit board 101 (i.e. much larger than the shadow surface of the test light of light emitting device 10
Product), therefore the region of the irradiated area for corresponding to test light on wafer 104 can only once be tested (in this region
Including multiple, when test, the multiple of the partial region are electrically connected with multiple pins on 101 second surface of circuit board respectively,
Exporting light sensation induction signal to controller)；After the completion of primary test, pallet movement can control, so as to wafer
Carry out automatic test in 104 other regions；In other words, a wafer 104 is segmented into multiple regions, with several times
It is tested；Each region include it is multiple, i.e., every time test be multi-bit parallel test.
In the present embodiment, test device can also include fixing seat 4, and wafer is mounted on circuit board 101, and fixing seat 4 is pacified
On container 1, and for container 1 to be fixed on circuit board 101.
In the present embodiment, the test device of wafer 104 further includes memory 103；Memory 103 is electrically connected at control
Device, and the configuration information for recording light emitting device 10；Memory can recorde matches required for the light for obtaining the different uniformitys
Confidence breath, configuration information include the setting information of the driving source 22 of light-emitting component 21, the quantity of light-emitting component 21 and position letter
The mark of breath, the quantity of equal mating plate and location information, the quantity of polaroid 32 and location information and light emitting device 10 letter
Breath, it is so without being limited thereto.
The present embodiment in terms of existing technologies, provides a kind of test of test wafer using above-mentioned light emitting device
Device.
It will be understood by those skilled in the art that the various embodiments described above are to realize the specific implementation of the utility model
Example, and in practical applications, can to it, various changes can be made in the form and details, without departing from the spirit of the utility model
And range.
Claims (12)
1. a kind of light emitting device, comprising: sent out with the container of an end face, optical processing structure and towards the optical processing structure
Penetrate the light source of the test light for test；
The optical processing structure includes at least the first equal mating plate of the test equalizing light rays for issuing the light source, described
First equal mating plate is mounted in the container；
The light source installation is on the end surface；
Wherein, the test light is irradiated to wafer to be measured after the optical processing structure.
2. light emitting device as described in claim 1, wherein the optical processing structure further includes an at least polaroid；
The polaroid is mounted in the container, and faces the described first equal mating plate.
3. light emitting device as claimed in claim 2, wherein the number of the polaroid is two, and the optical processing structure
It further include for adjusting the angle between two polaroids, to form the adjusting knob at light polarization angle；
The adjusting knob is mounted at least one polaroid in two polaroids.
4. light emitting device as claimed in claim 2, wherein the optical processing structure further includes the second equal mating plate；
The second equal mating plate is mounted in the container, and the second equal mating plate is located at the side of the polaroid, and institute
State the other side that the first equal mating plate is located at the polaroid.
5. light emitting device according to any one of claims 1 to 4, wherein the light emitting device further includes for detecting warp
Cross multiple light detecting elements of the luminous intensity of the test light of the optical processing structure；
The multiple light detecting element is mounted on the inner wall of the container and is uniformly distributed.
6. light emitting device as claimed in claim 5, wherein the optical processing structure further includes the equal mating plate of third；
The equal mating plate of third is mounted in the container, and is located at the described first equal mating plate and the multiple light detection member
Between part.
7. light emitting device as described in claim 1, wherein the container inner surface, which is provided with, avoids light in container inner wall
The light-absorption layer of upper reflection.
8. light emitting device as described in claim 1, wherein the light source includes a plurality of light-emitting elements, the multiple luminous member
Part is uniformly mounted on the end face.
9. light emitting device as claimed in claim 8, wherein the light source further includes a variety of to the output of the multiple light-emitting component
The driving source of driving current, the driving source are connected to the multiple light-emitting component.
10. a kind of test device of test wafer, comprising: light emitting device described in circuit board, any one of claims 1 to 9
And the light sensation induction signal for emitting the test light for controlling the light source, receiving the wafer output, and according to described
Light sensation induction signal judge the wafer whether He Ge controller；
The wafer is mounted on the circuit board, and the light emitting device is arranged on the circuit board and corresponds to the crystalline substance
Circle；
The controller is electrically connected at the light source in the wafer and the light emitting device；
Wherein, the test light is irradiated on the wafer after the optical processing structure.
11. test device as claimed in claim 10, wherein on circuit boards, the test device is also for the wafer installation
Including fixing seat；
The container is fixed on the circuit board by the fixing seat.
12. test device as described in claim 10 or 11, wherein the test device further includes for recording described shine
The memory of the test result of the configuration information and/or wafer of device；
The memory is electrically connected at the controller.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/078890 WO2018176349A1 (en) | 2017-03-30 | 2017-03-30 | Light emitting device and wafer testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209148831U true CN209148831U (en) | 2019-07-23 |
Family
ID=63673899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201790000047.5U Active CN209148831U (en) | 2017-03-30 | 2017-03-30 | The test device of light emitting device, test wafer |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN209148831U (en) |
| WO (1) | WO2018176349A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117492161A (en) * | 2023-12-29 | 2024-02-02 | 深圳市迈腾电子有限公司 | Light-equalizing sheet positioning and correcting method, electronic equipment and computer readable medium |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103267938B (en) * | 2013-05-17 | 2016-03-30 | 嘉兴景焱智能装备技术有限公司 | CIS wafer becomes survey machine |
| CN103439539A (en) * | 2013-09-03 | 2013-12-11 | 苏州创瑞机电科技有限公司 | Mega-pixel CMOS optical chip module automatic testing socket |
-
2017
- 2017-03-30 CN CN201790000047.5U patent/CN209148831U/en active Active
- 2017-03-30 WO PCT/CN2017/078890 patent/WO2018176349A1/en active Application Filing
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117492161A (en) * | 2023-12-29 | 2024-02-02 | 深圳市迈腾电子有限公司 | Light-equalizing sheet positioning and correcting method, electronic equipment and computer readable medium |
| CN117492161B (en) * | 2023-12-29 | 2024-04-12 | 深圳市迈腾电子有限公司 | Light-equalizing sheet positioning and correcting method, electronic equipment and computer readable medium |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018176349A1 (en) | 2018-10-04 |
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