CN209082905U - It is a kind of for upper and lower floor without the ground structure of heating - Google Patents
It is a kind of for upper and lower floor without the ground structure of heating Download PDFInfo
- Publication number
- CN209082905U CN209082905U CN201821545728.2U CN201821545728U CN209082905U CN 209082905 U CN209082905 U CN 209082905U CN 201821545728 U CN201821545728 U CN 201821545728U CN 209082905 U CN209082905 U CN 209082905U
- Authority
- CN
- China
- Prior art keywords
- floor
- layer
- heating
- heat
- insulating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Floor Finish (AREA)
Abstract
The utility model provide it is a kind of for upper and lower floor without the ground structure of heating, include heat insulation layer, floor, EPE bed course, insulating layer, floor heating pipe, double-deck heat-conducting layer, timber floor surface layer；The floor is the floor underlying structure of building, which is provided with heat insulation layer；The floor upper layer is provided with EPE bed course, is equipped with insulating layer on the EPE bed course；It is preset with groove on the insulating layer, is equipped with floor heating pipe in the groove；The double-deck heat-conducting layer is equipped on the insulating layer, fitting is equipped with timber floor surface layer on the bilayer heat-conducting layer；The structure is provided with heat insulation layer in floor lower layer, is heated up uniformly using the floor heating floor heating of the utility model, and heat dissipation capacity is big, more commonly warm less, the energy saving of heat loss, and advantage of lower cost.
Description
Technical field
The utility model relates to interior decoration field more particularly to a kind of ground knots for upper and lower floor without heating
Structure.
Background technique
Floor heating, which refers to, is heated to certain temperature water, is transported to underfloor water pipe pipe radiating network, is generated heat by floor
Realize a kind of heating mode of heating purpose.But at space of the upper and lower floor without heating, need to install heating in this space
Facility, the heat that general heat-supplying mode geothermal tube generates largely are lost toward lower section, or even after will appear and upstairs opening floor heating, downstairs
The case where heating, energy consumption are very big.
Utility model content
The purpose of this utility model is that it is in view of the drawbacks of the prior art and insufficient, it provides a kind of for the equal nothing of upper and lower floor
The ground structure of heating, the structure are provided with heat insulation layer in floor lower layer, are heated up uniformly using the floor heating floor heating of the utility model,
Heat dissipation capacity is big, more commonly warm less, the energy saving of heat loss, and advantage of lower cost.
In order to achieve the above purposes, the technical solution adopted by the utility model is: it is a kind of for upper and lower floor without heating
Ground structure includes heat insulation layer, floor, EPE bed course, insulating layer, floor heating pipe, double-deck heat-conducting layer, timber floor surface layer；The building
Plate is the floor underlying structure of building, which is provided with heat insulation layer；The floor upper layer is provided with EPE bed course, should
Insulating layer is equipped on EPE bed course；It is preset with groove on the insulating layer, is equipped with floor heating pipe in the groove；The insulating layer
On be equipped with the double-deck heat-conducting layer, on the bilayer heat-conducting layer fitting be equipped with timber floor surface layer.
Preferably, the heat insulation layer is extruded polystyrene board.
Preferably, the insulating layer is pre-groove insulation board.
Preferably, the bilayer heat-conducting layer is two layers of thermally conductive aluminium foil.
The beneficial effects of the utility model are: the structure is provided with heat insulation layer in floor lower layer, using the utility model
Uniformly, heat dissipation capacity is big for floor heating floor heating heating, more commonly warm less, the energy saving of heat loss, and advantage of lower cost.
Detailed description of the invention
Attached drawing described herein is to be used to provide a further understanding of the present invention, and constitutes one of the application
Point, but do not constitute the restriction to the utility model.
A kind of equal ground structure schematic diagram without heating for upper and lower floor of Fig. 1.
Wherein: 1 is heat insulation layer, and 2 be floor, and 3 be EPE bed course, and 4 be insulating layer, and 5 be floor heating pipe, and 6 be the double-deck heat-conducting layer, 7
For timber floor surface layer.
Specific embodiment
In conjunction with attached drawing, the utility model is described in further detail.
As shown, it is a kind of for upper and lower floor without the ground structure of heating, include heat insulation layer 1, floor 2, EPE pad
Layer 3, insulating layer 4, floor heating pipe 5, double-deck heat-conducting layer 6, timber floor surface layer 7；The floor 2 is the floor underlying structure of building,
2 lower layer of floor is provided with heat insulation layer 1；2 upper layer of floor is provided with EPE bed course 3, is equipped with insulating layer on the EPE bed course 3
4；It is preset with groove on the insulating layer 4, floor heating pipe 5 is equipped in the groove；The double-deck heat-conducting layer is equipped on the insulating layer 4
6, fitting is equipped with timber floor surface layer 7 on the bilayer heat-conducting layer 6.
When it is implemented, the heat insulation layer 1 is extruded polystyrene board.
When it is implemented, the insulating layer 4 is pre-groove insulation board.
When it is implemented, the bilayer heat-conducting layer 6 is two layers of thermally conductive aluminium foil.
Claims (4)
1. it is a kind of for upper and lower floor without the ground structure of heating, it is characterised in that: include heat insulation layer, floor, EPE pad
Layer, insulating layer, floor heating pipe, double-deck heat-conducting layer, timber floor surface layer；The floor is the floor underlying structure of building, the floor
Lower layer is provided with heat insulation layer；The floor upper layer is provided with EPE bed course, is equipped with insulating layer on the EPE bed course；The insulating layer
On be preset with groove, be equipped with floor heating pipe in the groove；The double-deck heat-conducting layer is equipped on the insulating layer, on the bilayer heat-conducting layer
Fitting is equipped with timber floor surface layer.
2. it is according to claim 1 it is a kind of for upper and lower floor without the ground structure of heating, it is characterised in that: it is described absolutely
Thermosphere is extruded polystyrene board.
3. it is according to claim 1 it is a kind of for upper and lower floor without the ground structure of heating, it is characterised in that: the guarantor
Warm layer is pre-groove insulation board.
4. it is according to claim 1 it is a kind of for upper and lower floor without the ground structure of heating, it is characterised in that: it is described double
Layer heat-conducting layer is two layers of thermally conductive aluminium foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821545728.2U CN209082905U (en) | 2018-09-20 | 2018-09-20 | It is a kind of for upper and lower floor without the ground structure of heating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821545728.2U CN209082905U (en) | 2018-09-20 | 2018-09-20 | It is a kind of for upper and lower floor without the ground structure of heating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209082905U true CN209082905U (en) | 2019-07-09 |
Family
ID=67117205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821545728.2U Expired - Fee Related CN209082905U (en) | 2018-09-20 | 2018-09-20 | It is a kind of for upper and lower floor without the ground structure of heating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209082905U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111854413A (en) * | 2020-07-20 | 2020-10-30 | 中贸华易实业有限公司 | Pressure-resistant heat dissipation device and laying method thereof |
-
2018
- 2018-09-20 CN CN201821545728.2U patent/CN209082905U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111854413A (en) * | 2020-07-20 | 2020-10-30 | 中贸华易实业有限公司 | Pressure-resistant heat dissipation device and laying method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |