CN209071290U - A kind of upper plated film support plate - Google Patents
A kind of upper plated film support plate Download PDFInfo
- Publication number
- CN209071290U CN209071290U CN201821983942.6U CN201821983942U CN209071290U CN 209071290 U CN209071290 U CN 209071290U CN 201821983942 U CN201821983942 U CN 201821983942U CN 209071290 U CN209071290 U CN 209071290U
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- frame
- support plate
- plated film
- silicon wafer
- baffle
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Abstract
The utility model relates to solar battery sheet technical fields, in particular to a kind of upper plated film support plate.The upper plated film support plate provided in the embodiments of the present invention comprising the baffle for loading the frame of silicon wafer and for blocking silicon wafer single side face.Frame has accommodation space, and adapting table is provided in accommodation space, and adapting table forms the holding groove for carrying silicon wafer.Baffle is connected to frame and forms the cavity for having communication port far from holding groove side, baffle and frame.Base of frame is provided with baffle, also the lower section for accommodating the holding tank of silicon wafer can be made to form the small cavity of a part, the lower end surface of silicon wafer is isolated with external world's formation, and then reduce the influence of external environment, meanwhile communication port is set, silicon wafer upper and lower air pressure difference can be reduced, the dorsal edge position and center for making support plate plate the film layer of same thickness, and then avoid color difference.
Description
Technical field
The utility model relates to solar battery sheet technical fields, in particular to a kind of upper plated film support plate.
Background technique
For support plate as in solar battery sheet filming process, loading cell piece enters a loading apparatus of filming equipment,
Its material is made of carbon carbon composite and graphite material;As shown in Figure 1, Fig. 1 shows one of specification in the prior art
Support plate place silicon chip of solar cell according to the difference of the specification of support plate in when work each sash, plated into filming equipment
Film.Fig. 2 is the partial sectional view of Fig. 1, as shown in Fig. 2, support plate loads silicon wafer intracavitary, the work that by conveying equipment is delivered to apparatus and process
The closing of skill chamber, transmission process need to enter multiple and different process cavities, there is different process conditions respectively, if temperature is different, very
Reciprocal of duty cycle is different, plated film reaction gas difference etc.;After the completion of coating process, process cavity is exported, silicon wafer is taken out, loads new silicon again
Piece is recycled.Existing support plate in use, when silicon wafer is coating single side, such as upper plated film, that is, after entering process cavity,
The coating process environment that plated film gas generates is located at the top of support plate, and upper and lower cavities air pressure difference can make the dorsal edge of support plate
Position and center also plate the film layer of different-thickness, and the film layer of this different-thickness has obvious in later process
Color difference embody.
Utility model content
To solve the above problem in the prior art, the purpose of this utility model is to provide a kind of upper plated film support plates.
The embodiments of the present invention are achieved in that
A kind of upper plated film support plate comprising the baffle for loading the frame of silicon wafer and for blocking silicon wafer single side face.
The frame has accommodation space, and adapting table is provided in the accommodation space, and the adapting table is formed for carrying silicon wafer
Holding groove.The baffle is connected to the frame far from the holding groove side, and the baffle has with frame formation
There is the cavity of communication port.
The upper plated film support plate provided in the embodiments of the present invention comprising for loading the frame of silicon wafer and being used for
Block the baffle of silicon wafer single side face.The frame has accommodation space, and adapting table is provided in the accommodation space, described to hold
The consecutive holding groove formed for carrying silicon wafer.The baffle is connected to the frame far from the holding groove side, the gear
Plate and the frame form the cavity for having communication port.Base of frame is provided with baffle, can also make to accommodate silicon wafer
The lower section of holding tank forms the small cavity of a part, and the lower end surface of silicon wafer is isolated with external world's formation, and then reduces extraneous ring
The influence in border, meanwhile, communication port is set, silicon wafer upper and lower air pressure difference can be reduced, make dorsal edge position and the centre bit of support plate
The film layer for plating same thickness is set, and then avoids color difference.
In one embodiment of the utility model:
The baffle includes bottom plate and the frame for being located on bottom plate;The frame is removably attachable to the bottom plate.
In one embodiment of the utility model:
The height of the frame is set as 3mm to 10mm.
In one embodiment of the utility model:
The height of the frame is set as 6mm.
In one embodiment of the utility model:
The thickness of the bottom plate is set as 1mm to 3mm.
In one embodiment of the utility model:
The baffle is removably attachable to the frame by fixing screws, the fixing screws through the frame,
The frame and the bottom plate.
In one embodiment of the utility model:
The frame includes the first side plate and the second side plate, and first side plate is connected to institute along the first preset direction
Frame is stated, second side plate is connected to the frame, first preset direction and described second along the second preset direction
Preset direction is vertical.
In one embodiment of the utility model:
Second side plate includes at least two spaced sections of plates, and adjacent described section of plate forms the communication port.
In one embodiment of the utility model:
The baffle includes bottom panel and the side panel for being located on the bottom panel, the side panel and the bottom panel
It is integrally formed;The side panel and the frame are detachably connected.
In one embodiment of the utility model:
The communication port is set to the side panel, and the communication port is provided in round.
The beneficial effect of the utility model embodiment is:
The upper plated film support plate provided in the embodiments of the present invention comprising for loading the frame of silicon wafer and being used for
Block the baffle of silicon wafer single side face.The frame has accommodation space, and adapting table is provided in the accommodation space, described to hold
The consecutive holding groove formed for carrying silicon wafer.The baffle is connected to the frame far from the holding groove side, the gear
Plate and the frame form the cavity for having communication port.Base of frame is provided with baffle, can also make to accommodate silicon wafer
The lower section of holding tank forms the small cavity of a part, and the lower end surface of silicon wafer is isolated with external world's formation, and then reduces extraneous ring
The influence in border, meanwhile, communication port is set, silicon wafer upper and lower air pressure difference can be reduced, make dorsal edge position and the centre bit of support plate
The film layer for plating same thickness is set, and then avoids color difference.
Detailed description of the invention
It is to be used attached to being needed in embodiment below for the clearer technical solution for illustrating the utility model embodiment
Figure is briefly described.It should be appreciated that the following drawings illustrates only the certain embodiments of the utility model, it is not construed as pair
The limitation of the scope of the utility model.To those skilled in the art, without creative efforts, Neng Gougen
Other accompanying drawings are obtained according to these attached drawings.
Fig. 1 is support plate schematic diagram in the prior art;
Fig. 2 is the partial sectional view of Fig. 1;
Fig. 3 is the overall structure diagram for the upper plated film support plate that the utility model embodiment 1 provides;
Fig. 4 is the structural schematic diagram of the single frame for the upper plated film support plate that the utility model embodiment 1 provides;
Fig. 5 is the partial sectional view of Fig. 3.
Icon: the upper plated film support plate of 10-;100- frame;110- accommodation space;120- adapting table;130- holding groove;200- gear
Plate;210- cavity;220- communication port;230- bottom plate;240- frame;The first side plate of 242-;The second side plate of 244-;250- fixes spiral shell
Nail.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Usually here in attached drawing description and
The component of the utility model embodiment shown can be arranged and be designed with a variety of different configurations.
Therefore, requirement is not intended to limit to the detailed description of the embodiments of the present invention provided in the accompanying drawings below
The scope of the utility model of protection, but it is merely representative of the selected embodiment of the utility model.Based in the utility model
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the range of the utility model protection.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.
In the description of the utility model embodiment, it should be noted that if occur term " center ", "upper", "lower",
The orientation or positional relationship of the instructions such as "vertical", "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings,
Either the utility model product using when the orientation or positional relationship usually put, be merely for convenience of description the utility model
It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.If in addition, occurring term in the description of the utility model
" first ", " second " etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.
If being not offered as requiring component in addition, occurring the terms such as term "horizontal", "vertical" in the description of the utility model
Abswolute level or pendency, but can be slightly tilted.If "horizontal" only refers to that its direction is more horizontal with respect to for "vertical",
It is not to indicate that the structure is had to fully horizontally, but can be slightly tilted.
In the description of the utility model embodiment, it is also necessary to which explanation is unless specifically defined or limited otherwise, if
Term " setting ", " connection " occur shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body;It can be mechanical connection, be also possible to be electrically connected;It can be directly connected, it can also be indirect by intermediary
It is connected, can be the connection inside two elements.For the ordinary skill in the art, on being understood with concrete condition
State the concrete meaning of term in the present invention.
Embodiment 1:
Referring to figure 3. to Fig. 5, the present embodiment provides a kind of upper plated film support plates 10 comprising for loading the frame of silicon wafer
100 and the baffle 200 for blocking silicon wafer single side face.The frame 100 has accommodation space 110, the accommodation space
Adapting table 120 is provided in 110, the adapting table 120 forms the holding groove 130 for carrying silicon wafer.The baffle 200 connects
In the frame 100 far from 130 side of holding groove, the baffle 200 has communication port with the frame 100 formation
220 cavity 210.
In the present embodiment, the baffle 200 includes bottom plate 230 and the frame 240 for being located on bottom plate 230;The side
Frame 240 is removably attachable to the bottom plate 230.It sets baffle 200 to include bottom plate 230 and frame 240, convenient for making
Used time is assembled, it can be made to match the support plate of different sizes or different size, be easy to use by users;Meanwhile it needing
In use, being dismantled convenient for user, conclude and place, and then convenient for storage and transport.
It should be noted that not being defined here to the concrete form of baffle 200, it is possible to understand that, it is specific at other
In embodiment, other structures form can also be set by baffle 200 according to the demand of user.
In the present embodiment, the height of the frame 240 is set as 3mm to 10mm.
It should be noted that not being defined here to the thickness of frame 240, it is possible to understand that, in other specific implementations
In example, other sizes can also be set by the height of frame 240 according to the demand of user, at design initial stage, by frame 240
Height be set as 0mm, namely be not provided with frame 240, bottom plate 230 is directly contacted with support plate;By verifying, baffle 200 is from silicon
Piece distance is too close, and the aperture on bottom plate 230 is needed to have some improvements, but aperture will lead to balance inner and outer air pressure
Phenomena such as air-flow is uneven occurs.When the verified thickness by frame 240 is set as 3mm to 10mm, effect is more satisfactory.
Specifically, in the present embodiment, the height of the frame 240 is set as 6mm.It should be noted that not right here
The height of frame 240 is defined, it is possible to understand that, it, can also according to the demand of user, by side in other specific embodiments
The thickness of frame 240 is set as other sizes, such as 5mm, 7mm or 8mm etc..
In the present embodiment, the thickness of the bottom plate 230 is set as 1mm to 3mm.1mm is set by the thickness of bottom plate 230
It can avoid the not high problem of the excessive caused too small caused intensity of thick and heavy not easy to be processed and thickness of thickness to 3mm.
Specifically, in the present embodiment, the thickness of the bottom plate 230 is set as 2mm.It should be noted that not right here
The thickness of bottom plate 230 is defined, it is possible to understand that, it, can also according to the demand of user, the bottom of by other specific embodiments
The thickness of plate 230 is set as other sizes, such as 1mm or 3mm etc..
In the present embodiment, the baffle 200 is removably attachable to the frame 100 by fixing screws 250, described
Fixing screws 250 run through the frame 100, the frame 240 and the bottom plate 230.Baffle is connected by fixing screws 250
200 and frame 100, convenient for the dismounting of user, also realized while realizing that baffle 200 is connected to frame 100 baffle 200 from
The assembling of body, namely the assembling of frame 240 Yu bottom plate 230 is realized simultaneously.
It should be noted that not being defined here to frame 100 and the connection relationship of baffle 200, it is possible to understand that,
It, can also according to the demand of user, by frame 100 and the company of realization by way of clamping of baffle 200 in other specific embodiments
It connects.
In the present embodiment, the frame 240 includes the first side plate 242 and the second side plate 244, first side plate
242 are connected to the frame 100 along the first preset direction, and second side plate 244 is connected to institute along the second preset direction
Frame 100 is stated, first preset direction is vertical with second preset direction.Frame 240 is set to include being mutually perpendicular to
The first side plate 242 and the second side plate 244, convenient for along the edge of available frame 100 carry out installation settings.
It should be noted that not being defined here to the specific structure type of frame 240, it is possible to understand that,
In other specific embodiments, integral type can also be set by frame 240 according to the demand of user.
Specifically, in the present embodiment, second side plate 244 includes at least two spaced sections of plates, adjacent institute
It states a section plate and forms the communication port 220.It include at least two spaced sections of plates, adjacent described section of plate by the second side plate 244
The communication port 220 is formed, convenient for during the installation process, adjusting the distance of adjacent described section of plate in turn according to the demand of user,
And then change the size of the communication port 220.
The upper plated film support plate 10 provided in the embodiments of the present invention comprising for load the frame 100 of silicon wafer with
And the baffle 200 for blocking silicon wafer single side face.The frame 100 has an accommodation space 110, in the accommodation space 110
It is provided with adapting table 120, the adapting table 120 forms the holding groove 130 for carrying silicon wafer.The baffle 200 is connected to institute
Frame 100 is stated far from 130 side of holding groove, the baffle 200 has communication port 220 with the frame 100 formation
Cavity 210.100 bottom of frame is provided with baffle 200, the lower section for accommodating the holding tank of silicon wafer can also be made to form an office
The small cavity 210 in portion is isolated the lower end surface of silicon wafer with external world's formation, and then reduces the influence of external environment, meanwhile, setting stream
Port 220 can reduce silicon wafer upper and lower air pressure difference, and the dorsal edge position of support plate and center is made to plate the film of same thickness
Layer, and then avoid color difference.
Embodiment 2:
The present embodiment provides a kind of upper plated film support plate (not shown), substantially with the upper plated film support plate of first embodiment
Identical, the difference of the two is that the baffle of the upper plated film support plate of the present embodiment includes bottom panel and is located on the bottom panel
Side panel (not shown), the side panel and the bottom panel are integrally formed;The side panel and the frame are detachable
Ground connection.
It should be noted that the side panel of baffle and bottom panel setting are integrally formed, user can be reduced and existed
In use, the workload assembled, and then save human cost.
In the present embodiment, the communication port is set to the side panel, and the communication port is provided in round.It needs to illustrate
, when the side panel of baffle and bottom panel setting are integrally formed, the communication port is set to the side
Panel, it is ensured that the uniformity of air inlet.
Also it should be noted that not being defined here to the concrete shape of the communication port, it is possible to understand that, at other
In specific embodiment, communication port can also be shaped to rectangular or other shapes according to the demand of user.
The upper plated film support plate provided in the embodiments of the present invention comprising for loading the frame of silicon wafer and being used for
Block the baffle of silicon wafer single side face.The frame has accommodation space, and adapting table is provided in the accommodation space, described to hold
The consecutive holding groove formed for carrying silicon wafer.The baffle is connected to the frame far from the holding groove side, the gear
Plate and the frame form the cavity for having communication port.Base of frame is provided with baffle, can also make to accommodate silicon wafer
The lower section of holding tank forms the small cavity of a part, and the lower end surface of silicon wafer is isolated with external world's formation, and then reduces extraneous ring
The influence in border, meanwhile, communication port is set, silicon wafer upper and lower air pressure difference can be reduced, make dorsal edge position and the centre bit of support plate
The film layer for plating same thickness is set, and then avoids color difference.
Obviously, the above embodiments of the present invention is used for the purpose of clearly illustrating examples for clearly illustrating the present invention, and
It is not limitations of the embodiments of the present invention.For those of ordinary skill in the art, in above description
On the basis of can also make other variations or changes in different ways.There is no need and unable to give all embodiments
Exhaustion.Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention etc., should be included in
Within the protection scope of the utility model claims.
Claims (10)
1. a kind of upper plated film support plate, which is characterized in that the upper plated film support plate includes:
For loading the frame of silicon wafer, the frame has accommodation space, and adapting table is provided in the accommodation space, described
Adapting table forms the holding groove for carrying silicon wafer;
For blocking the baffle of silicon wafer single side face, the baffle is connected to the frame far from the holding groove side, the gear
Plate and the frame form the cavity for having communication port.
2. upper plated film support plate according to claim 1, which is characterized in that the baffle includes bottom plate and is located on bottom plate
Frame;The frame is removably attachable to the bottom plate.
3. upper plated film support plate according to claim 2, which is characterized in that the height of the frame is set as 3mm to 10mm.
4. upper plated film support plate according to claim 3, which is characterized in that the height of the frame is set as 6mm.
5. upper plated film support plate according to claim 2, which is characterized in that the thickness of the bottom plate is set as 1mm to 3mm.
6. upper plated film support plate according to claim 2, which is characterized in that the frame is removably connected by fixing screws
It is connected to the frame, the fixing screws run through the frame, the frame and the bottom plate.
7. upper plated film support plate according to claim 2, which is characterized in that the baffle includes the first side plate and the second side
Plate, first side plate are connected to the frame along the first preset direction, and second side plate connects along the second preset direction
It is connected to the frame, first preset direction is vertical with second preset direction.
8. upper plated film support plate according to claim 7, which is characterized in that second side plate includes that at least two intervals are set
The section plate set, adjacent described section of plate form the communication port.
9. upper plated film support plate according to claim 1, which is characterized in that the baffle includes bottom panel and is located on institute
The side panel of bottom panel is stated, the side panel and the bottom panel are integrally formed;The side panel and the frame are removably
Connection.
10. upper plated film support plate according to claim 9, which is characterized in that the communication port is set to the side panel, institute
Communication port is stated to be provided in round.
Priority Applications (1)
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CN201821983942.6U CN209071290U (en) | 2018-11-28 | 2018-11-28 | A kind of upper plated film support plate |
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CN201821983942.6U CN209071290U (en) | 2018-11-28 | 2018-11-28 | A kind of upper plated film support plate |
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CN209071290U true CN209071290U (en) | 2019-07-05 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111477576A (en) * | 2020-06-02 | 2020-07-31 | 深圳市石金科技股份有限公司 | Improved bearing disc and bearing device |
CN111690906A (en) * | 2020-06-30 | 2020-09-22 | 成都晔凡科技有限公司 | Bearing device |
WO2021004518A1 (en) * | 2019-07-11 | 2021-01-14 | 苏州迈正科技有限公司 | Composite tray |
CN115161620A (en) * | 2022-07-12 | 2022-10-11 | 上海德瀛睿创半导体科技有限公司 | Support plate and coating equipment |
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2018
- 2018-11-28 CN CN201821983942.6U patent/CN209071290U/en active Active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2021004518A1 (en) * | 2019-07-11 | 2021-01-14 | 苏州迈正科技有限公司 | Composite tray |
CN111477576A (en) * | 2020-06-02 | 2020-07-31 | 深圳市石金科技股份有限公司 | Improved bearing disc and bearing device |
CN111690906A (en) * | 2020-06-30 | 2020-09-22 | 成都晔凡科技有限公司 | Bearing device |
CN111690906B (en) * | 2020-06-30 | 2023-07-21 | 通威太阳能(金堂)有限公司 | Bearing device |
CN115161620A (en) * | 2022-07-12 | 2022-10-11 | 上海德瀛睿创半导体科技有限公司 | Support plate and coating equipment |
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