CN209070272U - A kind of backlight assembly and backlight module improving light reflectivity - Google Patents

A kind of backlight assembly and backlight module improving light reflectivity Download PDF

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Publication number
CN209070272U
CN209070272U CN201821907653.8U CN201821907653U CN209070272U CN 209070272 U CN209070272 U CN 209070272U CN 201821907653 U CN201821907653 U CN 201821907653U CN 209070272 U CN209070272 U CN 209070272U
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China
Prior art keywords
white ink
fpc
film
backlight assembly
ink layer
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Active
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CN201821907653.8U
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Chinese (zh)
Inventor
张小齐
彭益
李琪
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Shenzhen Longli Technology Co Ltd
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Shenzhen Longli Technology Co Ltd
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Priority to CN201821907653.8U priority Critical patent/CN209070272U/en
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Abstract

The utility model discloses a kind of backlight assembly for improving light reflectivity, it include: FPC, several pads on the FPC, the LED being welded on the pad and the cover film on the FPC, the cover film includes: white ink layer, the solid set on the PI film of white ink layer upper surface and set on white ink layer lower surface, the one side of the solid and FPC setting LED are pasted, photosensitive white ink is brushed in the white ink layer, the photosensitive white ink passes through UV photocuring.The utility model replaces ink and white glue on traditional FPC using cover film; wherein PI film has the function of protecting white ink layer; to prevent ink from falling off; PI film is the film of high-light transparent simultaneously; its smooth surface can be improved the reflectivity to light, increase the utilization rate of light; so that brightness is more uniform, to improve the yield of product.

Description

A kind of backlight assembly and backlight module improving light reflectivity
Technical field
The utility model relates to field of liquid crystal display more particularly to a kind of backlight assemblies and backlight mould for improving light reflectivity Group.
Background technique
In backlight industry, direct-light-type backlight and two kinds of side-edge type backlight are divided into according to FPC and LED installation site Type.FPC and LED is mounted on light guide plate side in side-edge type backlight, and light is directly injected from light guide plate side, from light guide plate Upper surface is projected, and with a certain distance from the LED being fixed on FPC has from the edge FPC, the light that LED is projected can lose major part, need One layer is added on FPC to improve brightness with the megohmite insulant of reflected light to increase the utilization rate of light.
White ink layer is usually printed on FPC in the prior art, because of FPC surface irregularity and the white oil of printing Layer of ink also out-of-flatness, and white ink is that at the surface FPC, hot setting, solvent volatilizees through hot setting, ink is easy to heave Fall off surface more out-of-flatness, and reflectivity only has 50%-60%, causes light that cannot inject well backlight module and causes bright spot The problem of.Also some glues one layer of white glue on the surface FPC, but reflecting effect is bad, and light utilization efficiency is not high.
Therefore, the prior art is defective, needs to improve.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of backlight assembly for improving light reflectivity.
The technical solution of the utility model is as follows: a kind of backlight assembly improving light reflectivity, comprising: FPC, be set to it is described Several pads on FPC, the LED being welded on the pad and the cover film on the FPC, the cover film packet It includes: white ink layer, the PI film set on white ink layer upper surface and connecing set on white ink layer lower surface Agent, the one side of the solid and FPC setting LED paste, photosensitive white ink, the sense are brushed in the white ink layer Light white ink passes through UV photocuring.
Further, the cover film is equipped with opening corresponding with the shape of LED and size, and LED is opened across this Mouthful.
Further, the cover film is covered in the region of pad edge to the edge FPC close to backlight module incidence surface.
Further, the edge of the cover film and the edge of FPC are concordant.
Further, the PI film is high-light transparent film, with a thickness of 10um-12.2um.
Further, the white ink layer with a thickness of 15um-17um.
The utility model also provides a kind of backlight module, comprising: light guide plate, reflector plate, optical film material and frame also wrap The backlight assembly of raising light reflectivity described above is included, the reflector plate is set to bottom surface of light guide plate, and the optical film material is set to The light-emitting surface of light guide plate, it is described improve light reflectivity backlight assembly be set to light guide plate incident side, the frame by light guide plate, Reflector plate, optical film material and the backlight assembly encirclement for improving light reflectivity.
Using the above scheme, the utility model replaces ink and white glue on traditional FPC using cover film, wherein PI film Have the function of protecting white ink layer, to prevent ink from falling off, while PI film is the film of high-light transparent, surfacing light It is sliding, it can be improved the reflectivity to light, increase the utilization rate of light, so that brightness is more uniform, to improve the yield of product.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the first coverage mode of the utility model cover film.
Fig. 2 is the structural schematic diagram of second of coverage mode of the utility model cover film.
Fig. 3 is the structural schematic diagram of the utility model cover film.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
It please refers to Fig.1 to Fig.3, the utility model provides a kind of backlight assembly for improving light reflectivity, comprising: FPC1, sets In several pads, the LED2 that is welded on the pad and the cover film 3 on the FPC1 on the FPC1.Institute Stating cover film 3 includes: white ink layer 31, set on the PI film 32 of 31 upper surface of white ink layer and set on described white The solid 33 of 31 lower surface of color ink layer.The one side of the solid 33 and FPC1 setting LED2 is pasted, and is by temperature 150 DEG C -180 DEG C of hot pressing is pressed together on the surface FPC1.
Photosensitive white ink is brushed in the white ink layer 31, the photosensitive white ink passes through UV photocuring, UV light According to making white ink layer flat and smooth, reflecting effect is improved, and photosensitive white ink 31 is the wink-dry in room temperature, it will not It falls off as causing ink to generate to be bubbled using hot setting in the prior art, influences light reflectivity.
The PI film 32 is the film of high-light transparent, and smooth surface is conducive to improve light reflectivity, in this implementation In example, with a thickness of 10um-12.2um, white ink layer 31 with a thickness of 15um-17um.
For the cover film 3 there are two types of coverage mode, first way is that cover film 3 is equipped with and the shape of LED2 and big Small corresponding opening, LED2 pass through the opening, i.e. cover film 3 is covered in remaining region in addition to LED2, as shown in Figure 1.The Two kinds of modes are the regions that cover film 3 is covered in pad edge to the edge FPC1 close to backlight module incidence surface, i.e., only exist The side of LED2 is equipped with cover film 3, and the other side is not provided with cover film 3, as shown in Figure 2.The second way is compared to the first The structure of mode cover film 3 is simpler, is more easier for cover film 3 to be pasted on FPC1, but the light reflection of first way Rate is higher.
The edge of cover film 3 can be concordant with the edge of FPC1, can also be concordant with the edge of LED2.
Individually when storage cover film 3, one layer of release paper 34 is set in 33 bottom surface of solid, with convenient transportation cover film 3.
The utility model also provides a kind of backlight module, comprising: light guide plate, reflector plate, optical film material and frame also wrap The backlight assembly of raising light reflectivity described above is included, the reflector plate is set to bottom surface of light guide plate, and the optical film material is set to The light-emitting surface of light guide plate, it is described improve light reflectivity backlight assembly be set to light guide plate incident side, the frame by light guide plate, Reflector plate, optical film material and the backlight assembly encirclement for improving light reflectivity.
In conclusion the utility model replaces ink and white glue on traditional FPC using cover film, wherein PI film has Protect white ink layer effect, to prevent ink from falling off, at the same PI film be high-light transparent film, smooth surface, It can be improved the reflectivity to light, increase the utilization rate of light, so that brightness is more uniform, to improve the yield of product.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle Within the scope of shield.

Claims (7)

1. it is a kind of improve light reflectivity backlight assembly characterized by comprising FPC, several pads on the FPC, The LED and the cover film on the FPC being welded on the pad, the cover film include: white ink layer, set In the PI film of white ink layer upper surface and solid set on white ink layer lower surface, the solid It is pasted with the one side of FPC setting LED, photosensitive white ink is brushed in the white ink layer, the photosensitive white ink passes through UV photocuring.
2. it is according to claim 1 improve light reflectivity backlight assembly, which is characterized in that the cover film be equipped with The corresponding opening of shape and size of LED, LED pass through the opening.
3. the backlight assembly according to claim 1 for improving light reflectivity, which is characterized in that the cover film is covered in weldering Plate edge to close to backlight module incidence surface the edge FPC region.
4. it is according to claim 1 improve light reflectivity backlight assembly, which is characterized in that the edge of the cover film with The edge of FPC is concordant.
5. the backlight assembly according to claim 1 for improving light reflectivity, which is characterized in that the PI film is high-light transparent Film, with a thickness of 10um-12.2um.
6. the backlight assembly according to claim 1 for improving light reflectivity, which is characterized in that the thickness of the white ink layer Degree is 15um-17um.
7. a kind of backlight module, comprising: light guide plate, reflector plate, optical film material and frame, which is characterized in that further include such as power Benefit requires the described in any item backlight assemblies for improving light reflectivity of 1-6, and the reflector plate is set to bottom surface of light guide plate, the optics Membrane material is set to the light-emitting surface of light guide plate, and the backlight assembly for improving light reflectivity is set to the incident side of light guide plate, the frame By light guide plate, reflector plate, optical film material and the backlight assembly encirclement for improving light reflectivity.
CN201821907653.8U 2018-11-19 2018-11-19 A kind of backlight assembly and backlight module improving light reflectivity Active CN209070272U (en)

Priority Applications (1)

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CN201821907653.8U CN209070272U (en) 2018-11-19 2018-11-19 A kind of backlight assembly and backlight module improving light reflectivity

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Application Number Priority Date Filing Date Title
CN201821907653.8U CN209070272U (en) 2018-11-19 2018-11-19 A kind of backlight assembly and backlight module improving light reflectivity

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CN209070272U true CN209070272U (en) 2019-07-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113450642A (en) * 2021-07-26 2021-09-28 江西华创触控科技有限公司 Backlight module, manufacturing method thereof, display device and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113450642A (en) * 2021-07-26 2021-09-28 江西华创触控科技有限公司 Backlight module, manufacturing method thereof, display device and electronic equipment

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