CN209000541U - A kind of mobile hard disk of high efficiency and heat radiation - Google Patents
A kind of mobile hard disk of high efficiency and heat radiation Download PDFInfo
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- CN209000541U CN209000541U CN201821653942.XU CN201821653942U CN209000541U CN 209000541 U CN209000541 U CN 209000541U CN 201821653942 U CN201821653942 U CN 201821653942U CN 209000541 U CN209000541 U CN 209000541U
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- heat
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- conductive metal
- metal pipe
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Abstract
The utility model provides a kind of mobile hard disk of high efficiency and heat radiation, it is related to memory and mobile memory design field, which solve mobile hard disk use process medium temperatures to spend the technical issues of height be easy to cause damage, including mobile hard disk ontology, thermal element is equipped on the inside of the mobile hard disk ontology, the thermal element is equipped with radiating piece, the heat-conducting piece for heat conduction is additionally provided between the radiating piece and the thermal element, the radiating piece includes the endothermic section positioned at the thermal element surface and the radiating part far from the thermal element；In use process, the heat concentration on thermal element is dispersed on radiating piece by heat-conducting piece, and heat is oriented to by the endothermic section on radiating piece and the thermal cycle between radiating part, so that heat can be distributed from thermal element, facilitate the heat dissipation of mobile hard disk entirety.
Description
Technical field
The utility model relates to memory and mobile memory design field more particularly to a kind of shiftings of high efficiency and heat radiation
Dynamic hard disk.
Background technique
Existing mobile hard disk, which is substantially, does mobile storage backup, and in carrying out storage and backup procedure, greatly
The data of amount disc high speed rotation of hard disk when backup generates a large amount of heat, and heat can not be taken away in time can be significantly
Influence hard disk speed, the reading and writing of data can all become very slow, while also affect making for hard disk in mobile hard disk
Use the service life.
As Publication No. CN204577101U patent in disclose a kind of heat dissipation mobile hard disk comprising cooling fin, wind
Fan, hard-disk cartridge shell, door-plate, pressing plate, spring and bolt, the surrounding setting of cooling fin one end of guide post and are dissipated there are four guide post
Backing welds together, and the other end is provided with screw thread, and one end of hard-disk cartridge shell is provided with installing port, is provided with one at installing port
A door-plate is equipped with spring on the inside of door-plate, and one end of spring and door-plate are fixed together, and the other end and pressing plate of spring are fixed
Together, together with hard-disk cartridge housing hinge, the other end of door-plate is provided with pin hole for one end of door-plate.
A kind of heat dissipation mobile hard disk disclosed by above-mentioned technical proposal mainly passes through the cooling fin on mobile hard disk
And fan radiates to mobile hard disk.Be limited to hard drive internal limited space, the prior art using external radiating mode into
Row heat dissipation, but obstructed based on heat transfer path under aforesaid way by hard disc structure, cause its heat dissipation effect unsatisfactory.
Utility model content
The purpose of this utility model is to provide a kind of mobile hard disks of high efficiency and heat radiation, have to mobile hard disk better
Good heat dissipation effect.
The above-mentioned purpose of utility model of the utility model has the technical scheme that
A kind of mobile hard disk of high efficiency and heat radiation, including mobile hard disk ontology, the mobile hard disk ontology include the shell in outside
Body, the mobile hard disk ontology inside are equipped with thermal element, and the thermal element is equipped with radiating piece, and the radiating piece and the heat are first
It is additionally provided with the heat-conducting piece for heat conduction between part, the radiating piece includes positioned at the endothermic section on the thermal element surface and remote
Radiating part from the thermal element.
By using above-mentioned technical proposal, in use process, the heat concentration on thermal element is dispersed by heat-conducting piece
On radiating piece, and heat is oriented to by the endothermic section on radiating piece and the thermal cycle between radiating part, so that hot
Amount can be distributed from thermal element, facilitate the heat dissipation of mobile hard disk ontology entirety.
Preferably, the heat-conducting piece is the heat-conducting layer being arranged on the thermal element, and the heat-conducting layer is by silicone grease or liquid gold
It coats, the radiating piece is the thermal conductive metal pipe being arranged on thermal element, and endothermic section is respectively described thermally conductive with radiating part
Metal tube is located at the part on thermal element surface and the part of floor projection deviation thermal element, and the endothermic section and the radiating part
Between be connected to setting.
By using above-mentioned technical proposal, thermal element surface is coated in as heat-conducting piece by heat-conducting layer, ensure that heat dissipation
Effect it is more obvious, and by the restriction of endothermic section and radiating part position, so that ensure that heat in carrying out radiation processes
It can be dispersed into radiating part by thermal element, realize the heat dissipation to mobile hard disk ontology.
Preferably, the closed setting of the thermal conductive metal pipe, the thermal conductive metal pipe are provided with coolant liquid, the heat-conducting metal
Track is extended along in pipe equipped with liquid-sucking core.
It is hot on mobile hard disk ontology in use process by coolant liquid as thermally conductive source by using above-mentioned technical proposal
When amount rises, evaporation that the coolant liquid positioned at endothermic section evaporates it to radiating part by the rising of heat, and passes through coolant liquid
The heat on thermal element is taken to radiating part, so that radiation processes can be effectively performed；And coolant liquid by evaporation from
It after endothermic section is moved to radiating part, is condensing to form liquid by radiating part, and is passing through the pressure between endothermic section and radiating part
Difference recycles so that the coolant liquid for forming drop is flowed from radiating part to endothermic section so that coolant liquid be made to be formed in thermal conductive metal pipe,
It ensure that the heat dissipation effect of mobile hard disk ontology.
Preferably, the liquid-sucking core be two, and the liquid-sucking core be located on the inside of the thermal conductive metal pipe up and down
Two sides side wall, two liquid-sucking core middle sections are arranged in a crossed manner.
By using above-mentioned technical proposal, by being located at the liquid-sucking core of upper and lower two sides, so that will cool down through capillary action
Liquid is absorbed into endothermic section from radiating part, and passes through the liquid-sucking core of two settings that intersect, and increases the coolant liquid to form drop
Flowing velocity, the circulation rate of coolant liquid is increased, so that cooling effect is effectively promoted.
Preferably, pcb board is equipped in the mobile hard disk ontology, the thermal element includes the master on the pcb board
Control chip and flash memory particle, the thermal conductive metal pipe be wholely set, and the thermal conductive metal pipe in the horizontal plane be projected as " U "
Type, the endothermic section on the flash memory particle are located at the end at the thermal conductive metal pipe both ends, are located on the main control chip
Endothermic section be located at the thermal conductive metal pipe center position.
By using above-mentioned technical proposal, by the thermal conductive metal pipe being wholely set, so that the overall volume of radiating piece obtains
To reduce, in installation process, the situation that can be effectively prevented from inner body excessively causes installation inconvenient occurs.
Preferably, heat-radiating substrate is additionally provided between the thermal conductive metal pipe and the outside shell, the heat-radiating substrate is flat
Face and the pcb board plane are arranged in parallel, and the heat-radiating substrate and the thermal conductive metal pipe are bonded to each other setting.
By using above-mentioned technical proposal, by the setting of heat-radiating substrate, in radiation processes, the heat on radiating piece passes through
Heat-radiating substrate is distributed to hull outside, to further ensure the effect of heat dissipation.
Preferably, the thermal conductive metal pipe is the thermal conductive metal pipe of pltine.
By using above-mentioned technical proposal, by the thermal conductive metal pipe of pltine, in radiation processes, the thermal coefficient of copper
383.8W/m.K, in metal, silver-colored thermal coefficient highest but cost is higher, and copper is as the heat-conducting metal for ranking second, i.e.,
Good heat dissipation effect is remained, and its cost is told somebody what one's real intentions are, can satisfy large batch of production.
Preferably, the heat-radiating substrate is coated with one layer of graphene heat dissipation film away from one side surface of thermal conductive metal pipe.
By using above-mentioned technical proposal, graphene is the highest substance of known thermal coefficient.Graphene theory is thermally conductive
Rate reaches 5300W/m.K, is common Heat Conduction Material Cu(401W/m.K) more than 13 times, and be much higher than graphite；It is dissipated by graphene
Quick conductive characteristic possessed by hotting mask and rapid cooling characteristic can be by the heat further progresss of mobile hard disk ontology
It distributes, ensure that heat can be distributed timely on mobile hard disk ontology.
In conclusion the advantageous effects of the utility model are as follows:
1. being coated in thermal element surface as heat-conducting piece by heat-conducting layer, it ensure that the effect of heat dissipation is more obvious, and logical
The restriction of endothermic section and radiating part position is crossed, so that ensure that heat can be distributed by thermal element in carrying out radiation processes
To radiating part, the heat dissipation to mobile hard disk ontology is realized；
2. in installation process, by heat-conducting layer as heat-conducting layer, thermal conductive metal pipe as first layer heat dissipating layer, then by according to
The heat-radiating substrate and graphene heat dissipation film of secondary installation respectively as second and third layer heat dissipating layer, fully by mobile hard disk sheet
Heat on body heat element is distributed, and ensure that the effect of heat dissipation, and avoid mobile hard disk ontology causes because temperature is excessively high
The case where damage, occurs.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model embodiment 1.
Fig. 2 is the perspective view of the explosion of the utility model embodiment 1.
Fig. 3 is the schematic cross-section of thermal conductive metal pipe in the utility model embodiment 1.
In figure, 1, mobile hard disk ontology；11, pcb board；12, main control chip；13, flash memory particle；14, shell；2, thermally conductive
Layer；3, thermal conductive metal pipe；31, liquid-sucking core；32, endothermic section；33, radiating part；4, heat-radiating substrate；5, graphene heat dissipation film.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
A kind of mobile hard disk of high efficiency and heat radiation, as shown in Figure 1, including mobile hard disk ontology 1, mobile hard disk ontology 1 includes
Shell 14 positioned at outside；Here, it as shown in Fig. 2, being successively arranged thermal element and radiating piece on the inside of mobile hard disk ontology 1, dissipates
It is additionally provided between the inside sidewalls radiating piece and thermal element of 1 thickness direction side of warmware and mobile hard disk ontology and is conducted for heat
Heat-conducting piece, radiating piece include positioned at thermal element surface endothermic section 32 and far from thermal element radiating part 33.In this way, radiating
Heat concentration on thermal element is dispersed on radiating piece by Cheng Zhong by heat-conducting piece, and by endothermic section 32 on radiating piece with
Thermal cycle between radiating part 33 is oriented to heat, so that heat can be distributed from thermal element, facilitates
The whole heat dissipation of mobile hard disk ontology 1.
In the present embodiment, in order to realize the thermally conductive of mobile hard disk ontology 1, as shown in Figure 1, heat-conducting piece is coated in thermal element
On heat-conducting layer 2, in the present embodiment, heat-conducting layer 2 is coated in the silicone grease or liquid gold on thermal element, and radiating piece is setting in hot member
Thermal conductive metal pipe 3 on part, and here, endothermic section 32 and radiating part 33 are respectively that thermal conductive metal pipe 3 is located at thermal element surface
Part and floor projection deviate the part of thermal element, and in the present embodiment, setting is connected between endothermic section 32 and radiating part 33.This
Sample in radiation processes, is coated in thermal element surface as heat-conducting piece by heat-conducting layer 2, ensure that the effect of heat dissipation is more obvious,
And passing through the restriction of 33 position of endothermic section 32 and radiating part, in radiation processes, heat can be dispersed into radiating part by thermal element
33, to realize the heat dissipation to mobile hard disk ontology 1.
In the present embodiment, in order to guarantee cold cycling in thermal conductive metal pipe 3, set as shown in figure 3, thermal conductive metal pipe 3 is closed
It sets, is provided with coolant liquid in thermal conductive metal pipe 3, track is extended along in thermal conductive metal pipe 3 equipped with liquid-sucking core 31；Here, such as Fig. 3
Shown, liquid-sucking core 31 is two, and liquid-sucking core 31 is located at the two sides side wall up and down of 3 inside of thermal conductive metal pipe, two imbibitions
31 middle section of core is arranged in a crossed manner.In this way, when heat dissipation, by coolant liquid as thermally conductive source, on mobile hard disk ontology 1 on heat
When rising, evaporation that the coolant liquid positioned at endothermic section 32 evaporates it to radiating part 33 by the rising of heat, and passes through coolant liquid
The heat on thermal element is taken to radiating part 33, so that radiation processes can be effectively performed；When coolant liquid passes through evaporation
After mobile from endothermic section 32 to radiating part 33, liquid is being formed by the condensation of radiating part 33, and pass through endothermic section 32 and radiating part
Pressure difference between 33, so that the coolant liquid for forming drop is flowed from radiating part 33 to endothermic section 32, so that coolant liquid be made to lead
Thermometal pipe 3 forms circulation, ensure that the heat dissipation effect of mobile hard disk ontology 1.
In the present embodiment, thermal element is contained in mobile hard disk ontology 1, here, as shown in Fig. 2, setting in mobile hard disk ontology 1
There is pcb board 11, thermal element includes the main control chip 12 and flash memory particle 13 on pcb board 11；In the present embodiment, such as Fig. 2 institute
Show, the thermal conductive metal pipe 3 on main control chip 12 and flash memory particle 13 is wholely set, and thermal conductive metal pipe 3 is in the horizontal plane
The endothermic section 32 for being projected as U-typed, and being located on flash memory particle 13 be located at the end at 3 both ends of thermal conductive metal pipe, positioned at master control
Endothermic section 32 on chip 12 is located at 3 center position of thermal conductive metal pipe.In this way, being led in radiation processes by what is be wholely set
Thermometal pipe 3, so that the overall volume of radiating piece is reduced, meanwhile, in installation process, inner body can be effectively prevented from
The situation for excessively causing installation inconvenient occurs.
In order to guarantee the heat dissipation effect of mobile hard disk ontology 1, thermal conductive metal pipe 3 used in the present embodiment is pltine
Thermal conductive metal pipe 3；And thermal conductive metal pipe 3 contains following components: calculating in mass ratio: 100 parts of copper, 26.5 parts of zinc, 26.5 parts
Nickel, 2 parts of beryllium oxide and 2 parts of zinc oxide.In this way, the thermal coefficient 383.8W/m.K of copper, copper is as ranking in known metal
Two heat-conducting metal remains good heat dissipation effect, and its cost is told somebody what one's real intentions are, and can satisfy large batch of production；And
Beryllium oxide has very high fusing point, and commonly used in alloy, catalyst and refractory material etc., beryllium oxide is very hard, there is ceramics
Characteristic.It by the addition of beryllium oxide and zinc oxide, ensure that in use process, the heat-conducting effect of metal tube.
In the present embodiment, in order to further ensure heat dissipation effect, as shown in Fig. 2, in thermal conductive metal pipe 3 and outside shell 14
Between be additionally provided with heat-radiating substrate 4, here, 4 plane of heat-radiating substrate and 11 plane of pcb board are arranged in parallel, and heat-radiating substrate 4 with
Thermal conductive metal pipe 3 is bonded to each other setting, in the present embodiment, as shown in Fig. 2, heat-radiating substrate 4 deviates from 3 one side surface of thermal conductive metal pipe
Coated with one layer of graphene heat dissipation film 5.In this way, the heat on radiating piece passes through heat-radiating substrate 4 to shell 14 in radiation processes
Outside distributes, to further ensure the effect of heat dissipation；And graphene is the highest substance of known thermal coefficient.Graphene
Theoretical conductivity reaches 5300W/m.K, is common Heat Conduction Material Cu(401W/m.K) more than 13 times, and be much higher than graphite；Pass through
Quick conductive characteristic possessed by graphene heat dissipation film 5 and rapid cooling characteristic can be by the heats of mobile hard disk ontology 1
Further progress distributes, and ensure that heat can be distributed timely on mobile hard disk ontology 1.
The installation method of mobile hard disk ontology 1 in the present embodiment: itself the following steps are included:
S1: pcb board 11 is installed therein on a side body 14, flash memory particle 13 and main control chip on pcb board 11
12 surface layer carries out the coating of heat-conducting layer 2；
S2: to 3 vacuumize process of thermal conductive metal pipe, blow vent is reserved on thermal conductive metal pipe 3, by vacuum pump to thermally conductive
3 inner air of metal tube is extracted；And liquid is injected before the sealing of thermal conductive metal pipe 3；In this way, passing through vacuumize process
Metal tube, so that the pressure in metal tube is distinguished with the external world, it, can between endothermic section 32 and radiating part 33 in use process
Pressure difference is formed, the progress for facilitating heat dissipation is normally carried out.
S3: and thermal conductive metal pipe 3 is mounted on pcb board 11, by 3 both ends end of thermal conductive metal pipe and 11 length of pcb board
The flash memory particle 13 at direction both ends is bonded to each other placement；
S4: heat-radiating substrate 4 and graphene heat dissipation film 5, Gai He are successively installed away from 11 side of pcb board in thermal conductive metal pipe 3
Other side shell 14 completes installation.
In this way, being used as heat-conducting layer by heat-conducting layer 2 in installation process, thermal conductive metal pipe 3 is used as first layer heat dissipating layer, then
Heat-radiating substrate 4 and graphene heat dissipation film 5 by successively installing will fully be moved respectively as the heat dissipating layer of second and third layer
Heat on dynamic 1 thermal element of hard disk ontology is distributed, and ensure that the effect of heat dissipation, avoids mobile hard disk ontology 1 because of temperature
Spending height leads to the case where damaging.
The embodiment of present embodiment is the preferred embodiment of the utility model, and not limitation is originally practical new according to this
The protection scope of type, therefore: the equivalence changes that all structures, shape, principle according to the utility model are done should all be covered by practical
Within novel protection scope.
Claims (8)
1. a kind of mobile hard disk of high efficiency and heat radiation, outside shell (14) including mobile hard disk ontology (1) and it is located at shell (14)
Interior thermal element, it is characterised in that: the thermal element is equipped with radiating piece, is additionally provided between the radiating piece and the thermal element
For the heat-conducting piece of heat conduction, the radiating piece includes positioned at the endothermic section (32) on the thermal element surface and far from the heat
The radiating part (33) of element.
2. a kind of mobile hard disk of high efficiency and heat radiation according to claim 1, it is characterised in that: the heat-conducting piece is that setting exists
Heat-conducting layer (2) on the thermal element, the heat-conducting layer (2) are coated by silicone grease or liquid gold, and the radiating piece is that setting exists
Thermal conductive metal pipe (3) on thermal element, endothermic section (32) and radiating part (33) are respectively that the thermal conductive metal pipe (3) are located at heat member
The part on part surface and floor projection deviate the part of thermal element, and connect between the endothermic section (32) and the radiating part (33)
Logical setting.
3. a kind of mobile hard disk of high efficiency and heat radiation according to claim 2, it is characterised in that: the thermal conductive metal pipe (3)
Closed setting, the thermal conductive metal pipe (3) are provided with coolant liquid, and track is extended along in the thermal conductive metal pipe (3) and is equipped with and is inhaled
Wick-containing (31).
4. a kind of mobile hard disk of high efficiency and heat radiation according to claim 3, it is characterised in that: the liquid-sucking core (31) is two
It is a, and the liquid-sucking core (31) is located at the two sides side wall up and down on the inside of the thermal conductive metal pipe (3), two liquid-sucking cores
(31) middle section is arranged in a crossed manner.
5. a kind of mobile hard disk of high efficiency and heat radiation according to claim 2, it is characterised in that: the mobile hard disk ontology
(1) pcb board (11) are equipped in, the thermal element includes the main control chip (12) and flash memory particle on the pcb board (11)
(13), the thermal conductive metal pipe (3) is wholely set, and the thermal conductive metal pipe (3) in the horizontal plane be projected as U-typed, position
It is located at the end at the thermal conductive metal pipe (3) both ends in the endothermic section (32) on the flash memory particle (13), is located at the master control
Endothermic section (32) on chip (12) is located at the thermal conductive metal pipe (3) center position.
6. a kind of mobile hard disk of high efficiency and heat radiation according to claim 5, it is characterised in that: the thermal conductive metal pipe (3)
It is additionally provided between outside shell (14) heat-radiating substrate (4), heat-radiating substrate (4) plane and the pcb board (11) plane phase
It is mutually arranged in parallel, and the heat-radiating substrate (4) and the thermal conductive metal pipe (3) are bonded to each other setting.
7. a kind of mobile hard disk of high efficiency and heat radiation according to claim 6, it is characterised in that: the thermal conductive metal pipe (3)
For the thermal conductive metal pipe (3) of pltine.
8. a kind of mobile hard disk of high efficiency and heat radiation according to claim 7, it is characterised in that: heat-radiating substrate (4) back
One layer of graphene heat dissipation film (5) is coated with from (3) one side surface of thermal conductive metal pipe.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821653942.XU CN209000541U (en) | 2018-10-12 | 2018-10-12 | A kind of mobile hard disk of high efficiency and heat radiation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821653942.XU CN209000541U (en) | 2018-10-12 | 2018-10-12 | A kind of mobile hard disk of high efficiency and heat radiation |
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| CN209000541U true CN209000541U (en) | 2019-06-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065084A (en) * | 2018-10-12 | 2018-12-21 | 苏州普福斯信息科技有限公司 | A kind of mobile hard disk of high efficiency and heat radiation |
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2018
- 2018-10-12 CN CN201821653942.XU patent/CN209000541U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065084A (en) * | 2018-10-12 | 2018-12-21 | 苏州普福斯信息科技有限公司 | A kind of mobile hard disk of high efficiency and heat radiation |
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