CN208944630U - Sfp封装电口模块测试装置 - Google Patents
Sfp封装电口模块测试装置 Download PDFInfo
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- CN208944630U CN208944630U CN201821462528.0U CN201821462528U CN208944630U CN 208944630 U CN208944630 U CN 208944630U CN 201821462528 U CN201821462528 U CN 201821462528U CN 208944630 U CN208944630 U CN 208944630U
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- 238000012360 testing method Methods 0.000 title claims abstract description 124
- 230000007246 mechanism Effects 0.000 claims abstract description 83
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- 239000013078 crystal Substances 0.000 claims description 37
- 238000006073 displacement reaction Methods 0.000 claims description 33
- 238000003825 pressing Methods 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 9
- 238000005516 engineering process Methods 0.000 abstract description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- 230000001174 ascending effect Effects 0.000 description 10
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- 230000008569 process Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 5
- 238000013522 software testing Methods 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 230000008520 organization Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
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CN201821462528.0U CN208944630U (zh) | 2018-09-07 | 2018-09-07 | Sfp封装电口模块测试装置 |
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CN201821462528.0U CN208944630U (zh) | 2018-09-07 | 2018-09-07 | Sfp封装电口模块测试装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109047044A (zh) * | 2018-09-07 | 2018-12-21 | 深圳市恒宝通光电子股份有限公司 | Sfp封装电口模块测试装置 |
CN113369158A (zh) * | 2021-06-07 | 2021-09-10 | 杭州超然金刚石有限公司 | 一种基于金刚石半导体生产的选型机 |
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2018
- 2018-09-07 CN CN201821462528.0U patent/CN208944630U/zh not_active Withdrawn - After Issue
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109047044A (zh) * | 2018-09-07 | 2018-12-21 | 深圳市恒宝通光电子股份有限公司 | Sfp封装电口模块测试装置 |
CN109047044B (zh) * | 2018-09-07 | 2023-09-01 | 深圳市恒宝通光电子股份有限公司 | Sfp封装电口模块测试装置 |
CN113369158A (zh) * | 2021-06-07 | 2021-09-10 | 杭州超然金刚石有限公司 | 一种基于金刚石半导体生产的选型机 |
CN113369158B (zh) * | 2021-06-07 | 2022-07-12 | 杭州超然金刚石有限公司 | 一种基于金刚石半导体生产的选型机 |
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Address after: 518000 809, 810, 811, block B, building 6, Shenzhen International Innovation Valley, Dali community, Xili street, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HI-OPTEL TECHNOLOGY Co.,Ltd. Address before: Hengbaotong building, No.2 building, Longjing Gaofa Science Park, Nanshan District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN HI-OPTEL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20210430 Address after: 523660 Room 101, building 16, Lihe Bauhinia intelligent manufacturing center, 105 Qingbin East Road, Qingxi Town, Dongguan City, Guangdong Province Patentee after: Dongguan Hengbao Tongguang Electronics Co.,Ltd. Address before: 518000 809, 810, 811, block B, building 6, Shenzhen International Innovation Valley, Dali community, Xili street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HI-OPTEL TECHNOLOGY Co.,Ltd. |
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Granted publication date: 20190607 Effective date of abandoning: 20230901 |
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AV01 | Patent right actively abandoned |
Granted publication date: 20190607 Effective date of abandoning: 20230901 |