CN208902327U - Precision differential pressure sensing device - Google Patents
Precision differential pressure sensing device Download PDFInfo
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- CN208902327U CN208902327U CN201820927431.6U CN201820927431U CN208902327U CN 208902327 U CN208902327 U CN 208902327U CN 201820927431 U CN201820927431 U CN 201820927431U CN 208902327 U CN208902327 U CN 208902327U
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- differential pressure
- pressure
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- sensitive face
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- 239000012530 fluid Substances 0.000 claims abstract description 62
- 230000008878 coupling Effects 0.000 claims abstract description 30
- 238000010168 coupling process Methods 0.000 claims abstract description 30
- 238000005859 coupling reaction Methods 0.000 claims abstract description 30
- 238000005259 measurement Methods 0.000 claims abstract description 11
- 238000002955 isolation Methods 0.000 claims description 31
- 238000003466 welding Methods 0.000 claims description 30
- 230000004308 accommodation Effects 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 abstract description 9
- 238000007789 sealing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005504 petroleum refining Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Abstract
This application involves differential pressure pick-up fields, are related specifically to a kind of precision differential pressure sensing device, comprising: pressure sensor, both ends are equipped with fluid coupling, and the fluid coupling is for connecting measurement equipment to be checked；Chip assembly is mounted on above the differential pressure pick-up；Circuit board module is mounted on above the chip assembly.The application connects measurement equipment to be checked by fluid coupling, avoids the excessive differential pressure flange of installation volume when using the differential pressure sensing device, substantially reduces occupied space when differential pressure sensing device uses, expands the application range of differential pressure sensing device.
Description
Technical field
This application involves differential pressure pick-up fields, are related specifically to a kind of precision differential pressure sensing device.
Background technique
Differential pressure pick-up is a kind of sensor for measuring difference between two pressure, is commonly used to measure a certain equipment
Or the pressure difference of component rear and front end.Currently, being widely used to automobile by the Inspection and monitoring system of core of differential pressure pick-up
With all trades and professions such as locomotive equipment, thermal power generation, health care, chemical industry, petroleum refining, industrial electronic, Internet of Things.
Such as the Chinese utility model patent that notification number is CN107228731A, disclose " a kind of differential pressure sensor arrangement and
Its packaging method ", has pressure-sensitive face and a pressure-sensitive diaphragm, pressure-sensitive diaphragm by generating displacement after extraneous pressure, pressure-sensitive diaphragm with
The distance between pressure-sensitive face changes, and is suppressing from pressure guide hole chip in differential pressure pick-up respectively by pilot medium just
Anti- two sides, the resistance value so as to cause the bridge resistance, of chip interior change, and are able to the pressure difference of detection both ends diaphragm.But
When in use, it needs that differential pressure flange is installed on the differential pressure sensor arrangement, for connecting differential pressure pick-up and to be detected setting
Standby or component causes entire differential pressure sensing device volume excessive, prevents differential pressure sensing device from applying in space than narrow
On device or equipment, the use scope of the differential pressure pick-up is limited.In addition, the mounting structure one of this clamping plate collocation sensor
As sealed using sealing ring, it is at high cost, if assemble bad or overlong time will appear leakage phenomenon, there are also a few thing fields
The problems such as also generating corrosion if the medium and sealing ring material of conjunction measurement are incompatible.
Utility model content
The purpose of the application is to provide a kind of precision differential pressure sensing device, solves differential pressure sensing device body in the prior art
Product it is excessive, be unfavorable for using the problem of, have the advantages that small in size, easy to install and use.
To achieve the above object, the embodiment of the present application uses following technical scheme: precision differential pressure sensing device, comprising:
Differential pressure pick-up, both ends are equipped with fluid coupling, and the fluid coupling is for connecting measurement equipment to be checked；Chip assembly, peace
Above the differential pressure pick-up；Circuit board module is mounted on above the chip assembly.
The embodiment of the present application connects measurement equipment to be checked by adopting the above technical scheme, by fluid coupling, and avoiding should in use
Installation volume excessive differential pressure flange when differential pressure sensing device substantially reduces occupied space when differential pressure sensing device uses,
Apply the differential pressure sensing device on more devices or equipment, such as automobile engine nacelle etc. expands differential pressure sensing
The application range of device.In addition, using do not needed before the sensing device installation differential pressure flange, save installation differential pressure flange when
Between, compared with existing differential pressure sensing device, have the advantages that easy to install and use.Finally, the embodiment of the present application just has welding
Sealing, does not need using sealing ring, there is no risk of leakage possessed by traditional difference sensor.
Further, in the embodiment of the present application, fluid coupling includes: fluid inlet, the fluid inlet inner wall setting
There is screw thread, for connecting the pipeline of trandfer fluid in measurement equipment to be checked；And fluid channel, the fluid channel are connected to the differential pressure
Sensor and the fluid inlet.The embodiment of the present application on fluid coupling by being arranged fluid inlet and fluid channel, connection
Fluid coupling and differential pressure pick-up guide fluid to be detected to the pressure element of differential pressure pick-up, realize and pass to differential pressure
The detection of the pressure of sensor both ends fluid.
Further, in the embodiment of the present application, differential pressure pick-up includes: the first pressure-sensitive face and the second pressure-sensitive face, difference
The both ends of the differential pressure pick-up are set, and surface has ripple；First pressure guide hole, be connected to the first pressure-sensitive face with it is described
Chip assembly forms positive pressure chamber；With the second pressure guide hole, it is connected to the second pressure-sensitive face and the chip assembly, forms negative pressure
Chamber；First isolation diaphragm and the second isolation diaphragm are separately positioned on the first pressure-sensitive face and the second pressure-sensitive face.Its
In, pilot medium is filled in positive pressure chamber and negative pressure cavity, when in use, the first isolation diaphragm and the second isolation film are respectively by difference
The pressure of pressure sensor both ends fluid, accommodation space, the second isolation film between the first isolation diaphragm of extruding and the first pressure-sensitive face
Accommodation space between piece and the second pressure-sensitive face, and the pressure difference at both ends is transferred to by chip assembly by pilot medium.
Further, in the embodiment of the present application, differential pressure pick-up further include: annular interconnecting piece, the annular interconnecting piece
The excircle in the first pressure-sensitive face and the second pressure-sensitive face is set.The practical annular interconnecting piece is that setting is sensed in differential pressure
Fluid coupling interconnecting piece on device is mounted on fluid coupling preferably on differential pressure pick-up, simultaneously for welding fluid coupling
The pressure-sensitive performance of the pressure-sensitive face of will not influence and isolation diaphragm.
Further, in the embodiment of the present application, fluid coupling further include: connection ring, the fluid coupling pass through described
Connection ring is connect with the differential pressure pick-up.Connection ring and the annular interconnecting piece weld, realize the fluid coupling with it is described
The connection of differential pressure pick-up.Fluid coupling is connect by above-mentioned connection ring with differential pressure pick-up, and differential pressure biography is in particular welded on
It on the shape interconnecting piece of sensor, is mounted on fluid coupling preferably on differential pressure pick-up, while will not influence pressure-sensitive face and isolation
The pressure-sensitive performance of diaphragm.
Further, in the embodiment of the present application, chip assembly further include: sleeve, include: in shown sleeve welding bench and
Silicon cup, is formed with a chip accommodation space between the silicon cup and the welding bench, include: binding in the chip accommodation space
Plate is equipped with sensor chip on the binding board.In the embodiment of the present application, the structure of chip assembly is conventional arrangement,
Principle and effect are also substantially the same with the prior art, and still, the chip assembly in the embodiment of the present application has additional a welding bench, are led to
It crosses welding bench and differential pressure pick-up welds, have the function of flame proof, improve the explosion insulation performance of the differential pressure sensing device, detect pressure difference
Stability it is more preferable.
Further, in the embodiment of the present application, it is provided with welding groove on differential pressure pick-up, is used for erecting and welding platform；
And limiting slot, it is arranged in welding groove excircle, for installing the sleeve.The embodiment of the present application is being set by differential pressure pick-up
Welding groove and limiting slot are set, realizes the connection with chip assembly, does not need the appearance that chip assembly is set inside differential pressure pick-up
It receives space, can largely reduce the volume of this differential pressure sensing device, meet its exquisitenessization demand.
Further, in the embodiment of the present application, it is provided with link slot on sleeve, is used for connection line board group part.
Further, in the embodiment of the present application, circuit board module includes: mounting plate, is arranged in the link slot；
Wiring board is mounted on the mounting plate；Threaded sleeve is set in the wiring board periphery, and is fixed on the connection
Slot outer wall, surface have screw thread；Threaded cap, through threaded cap on the threaded sleeve.Circuit board module passes through threaded sleeve
And mounting plate is mounted on chip assembly, chip assembly is by circuit board module to obtaining power supply and the defeated current signal of unofficial biography to phase
In the instrument and meter answered.
The embodiment of the present application connects measurement equipment to be checked by adopting the above technical scheme, by fluid coupling, and avoiding should in use
Installation volume excessive differential pressure flange when differential pressure sensing device substantially reduces occupied space when differential pressure sensing device uses,
Apply the differential pressure sensing device on more devices or equipment, such as automobile engine nacelle etc. expands differential pressure sensing
The application range of device.In addition, using do not needed before the sensing device installation differential pressure flange, save installation differential pressure flange when
Between, compared with existing differential pressure sensing device, have the advantages that easy to install and use.Finally, the embodiment of the present application passes through to existing
There is the internal structure of differential pressure sensing device to be improved, so that each section component of differential pressure sensing device is arranged more reasonable, save
Space reduces the volume of differential pressure pick-up.Secondly, the embodiment of the present application just has welded seal, do not need not deposit using sealing ring
The risk of leakage possessed by traditional difference sensor.
Detailed description of the invention
The application is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the structural schematic diagram of precision differential pressure sensing device described in the embodiment of the present application.
Fig. 2 is the structural schematic diagram of the differential pressure pick-up in above-mentioned precision differential pressure sensing device.
Fig. 3 is the structural schematic diagram of the chip assembly in above-mentioned precision differential pressure sensing device.
Fig. 4 is the structural schematic diagram of the patch panel assemblies in above-mentioned precision differential pressure sensing device.
In attached drawing
10, differential pressure pick-up 101, sensor body 102, the first pressure-sensitive face
103, the second pressure-sensitive face 104, the first isolation diaphragm 105, the second isolation diaphragm
106, the first pressure guide hole 107, the second pressure guide hole 108, fluid coupling
1081, connection ring 1082, fluid inlet 1083, fluid channel
109, annular interconnecting piece 110, welding groove 111, limiting slot
20, chip assembly 201, sleeve 202, welding bench
203, binding board 204, silicon cup 205, sensor chip
206, first pressure hole 207, second pressure hole 208, oil-filled pipeline
209, electrical interface 2011, link slot
30, circuit board module 301, wiring board 302, mounting plate
303, threaded sleeve 304, threaded cap 305, thread seal circle
306, cable connector
Specific embodiment
In order to which the objects, technical solutions and advantages of the application are more clearly understood, with reference to embodiments, to the application
It is further elaborated.It should be appreciated that specific embodiment described herein is only used to explain the application, it is not used to
Limit the application.
In the description of the present application, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical", " water
It is flat ", "inner", the instructions such as "outside" orientation or positional relationship be to be based on the orientation or positional relationship shown in the drawings, merely to just
In description the application and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with
Specific orientation construction and operation, therefore should not be understood as the limitation to the application.
As shown in Figure 1, present embodiment discloses a kind of precision differential pressure sensing device, including differential pressure pick-up 10, chip
Component 20 and circuit board module 30, in which: differential pressure pick-up 10 has pressure element, for measuring the pressure of both ends fluid, and
Pressure is transmitted to chip assembly 20, chip assembly 20 obtains power supply by circuit board module 30 again and transmits current signal extremely outward
In corresponding instrument and meter, it is able to measure the pressure difference of both ends fluid.
Specifically, as shown in Fig. 2, in the present embodiment, differential pressure pick-up 10 includes sensor body 101.The sensor
Ontology 101 is implemented as the cylindrical exterior structure of traditional differential pressure pick-up.But according to alternative substitution embodiment party
Formula, sensor body 101 or other shapes, such as the forms such as spherical, rectangular.In above-mentioned all embodiments, pass
Sensor ontology 101 is both needed to have the first pressure-sensitive face 102 and the second pressure-sensitive face 103, the first pressure-sensitive face 102 and the second pressure-sensitive face 103
It is specifically implemented as convoluted diaphragm, i.e. surface has annular concentric ripple, and material is stainless steel material.In the present embodiment,
The two sides of cylinder shape sensor ontology 101 are arranged in first pressure-sensitive face 102 and the second pressure-sensitive face 103, are used for measurement sensor sheet
The pressure difference at the both ends of body 101.The first isolation diaphragm 104 is respectively arranged on the outside of first pressure-sensitive face 102 and the second pressure-sensitive face 103
With the second isolation diaphragm 105, set-up mode is specially to weld.Between the first pressure-sensitive face 102 and the first isolation diaphragm 104,
It is formed with accommodation space between two pressure-sensitive faces 103 and the second isolation diaphragm 105, pilot medium, institute are filled in the accommodation space
It states pilot medium and is specifically as follows silicone oil, but not limited to this.In sensor body 101, it is additionally provided with 106 He of the first pressure guide hole
Second pressure guide hole 107, in which: the first pressure guide hole 106 connect 102 connections with the first pressure-sensitive face, with the first pressure-sensitive face 102 and first
Accommodation space between isolation diaphragm 104 forms positive pressure chamber；Second pressure guide hole 107 and the connection of the second pressure-sensitive face 103, with the second sense
The accommodation space formed between pressure surface 103 and the second isolation diaphragm 105 forms negative pressure cavity.First pressure guide hole 106 and the second pilot
Hole 107 is connected to chip assembly 20, transmits pressure to chip assembly 20.
In addition, in the present embodiment, being also respectively provided with fluid coupling 108 in 101 two sides of sensor body, which connects
First 108 are located on the first isolation diaphragm 104 or the second isolation diaphragm 105 without being connected thereto, and specific set-up mode is welding.
For convenience of fluid coupling 108 is welded on 101 two sides of sensor body, in the first pressure-sensitive face 102 of 101 two sides of sensor body
The excircle in the second pressure-sensitive face 103 is provided with annular interconnecting piece 109, and is provided with connection ring 1081 on fluid coupling 108, even
It connects ring 1081 to be welded on annular interconnecting piece 109, realizes that fluid coupling 108 is fixed on sensor body 101 without influencing first
The pressure-sensitive function of isolation diaphragm 104 or the second isolation diaphragm 105 can also protect the first isolation diaphragm 104 or the second isolation film
Piece 105 is avoided generating abrasion in storage and transportational process or be scratched.In 108 outside of fluid coupling, it is provided with fluid inlet
1082, which is provided with screw thread, for connecting the pipeline of trandfer fluid, thread connecting mode dismounting side
Just.Fluid channel 1083 is provided between fluid inlet 1082 and the first isolation diaphragm 104 or the second isolation diaphragm 105, even
Logical fluid inlet 1082 and isolation diaphragm (104,105).When in use, fluid to be detected is flowed into from fluid inlet 1082, is led to
It crosses fluid channel 1083 and applies pressure to the first isolation diaphragm 104 or the second isolation diaphragm 105 respectively.
Secondly, in the embodiment shown in fig. 1, unlike existing differential pressure pick-up, not having inside sensor body 101
There are the accommodation space of setting chip assembly 20, the i.e. inside that is not arranged in differential pressure pick-up 10 of chip assembly 20, but installs
In the top of differential pressure pick-up 10, it is therefore an objective to reduce the volume of differential pressure pick-up 10 as much as possible.Specifically, in Fig. 2, sensing
Welding groove 110 is provided with above device ontology 101.110 excircle of welding groove is provided with limiting slot 111, limiting slot 111 and welding
Slot 110 is arranged concentrically.And the structure of chip assembly 20 is as shown in figure 3, include sleeve 201, welding bench 202, binding board 203, silicon
Cup 204 and sensor chip 205, sensor chip 205 can be embodied as the gloomy MD series monocrystal silicon chip of Dare.
The set-up mode of chip assembly 20 is as shown in Figs. 1-3 as a result: sleeve 201 is mounted in limiting slot 111, limiting slot
111 be specially annular, is cooperated with sleeve 201.Inside sleeve 201, welding bench 202 is mounted on welding groove 110, welding groove
110 are specifically implemented as circular groove, can have welding bench 202 to be adapted to completely, and differential pressure sensing dress is preferably assembled in realization
It sets.Silicon cup 204 is installed on welding bench 202, a chip accommodation space, the core are provided between silicon cup 204 and welding bench 203
It is provided with binding board 203 in piece accommodation space, sensor chip 205 is installed on binding board 203.Above-mentioned installation or set-up mode
It is welding, meets flame proof requirement.In addition, it is provided with first pressure hole 206 and second pressure hole 207 in chip assembly, the
One pressure port 206 is connected to the first pressure guide hole 106 and extends to the lower end surface of sensor chip 205, second pressure hole 207 and
Two pressure guide holes 107 are connected to and extend to the upper surface of sensor chip 205, to reach the first pressure guide hole 106 and the second pressure guide hole
107 sensor chip 205 into chip assembly 20 transmits the purpose of pressure.On chip assembly 20, it is additionally provided with oil filler pipe
Road 208 and electrical interface 209, oil-filled pipeline 208 are connected to the first pressure guide hole 106 and the second pressure guide hole 107, for positive pressure chamber and
Negative pressure cavity is filled with silicone oil, 209 connection line board group part of electrical interface.
Finally, setting is wired in the wiring board receiving portion as shown in figure 4, circuit board module 30 includes wiring board receiving portion
Road plate 301.Wiring board receiving portion is made of mounting plate 302, threaded sleeve 303 and threaded cap 304.Under 303 outer wall of threaded sleeve
Side is provided with screw thread, thread seal circle 305 is provided in screw thread, the inner wall corresponding position of threaded cap 304 is also provided with and thread bush
The screw thread that pipe 303 matches, threaded cap 304 on threaded sleeve 303, realize the sealing of wiring board receiving portion by thread set.
304 top of threaded cap is provided with connecting hole, waterproof cable connector 306 is installed in connecting hole, is used for 301 He of connection line plate
External instrument and meter and power supply device.
The set-up mode of circuit board module 30 is provided with link slot in 201 upper end of sleeve as shown in Fig. 1,3,4 as a result,
2011, mounting plate 302 is installed in link slot 2011, the outer wall of link slot 2011 is equipped with threaded sleeve 303, specific installation side
Formula is welding.Electrical interface 207 passes through 302 connection line plate 301 of mounting plate, conveys electric current to wiring board 301.
When in use, it first passes through oil-filled pipeline 206 and is filled with pilot medium to positive pressure chamber and negative pressure cavity, and open power supply dress
It sets, provides burning voltage to sensor chip 205 by wiring board 301.Again by the pipeline and sensing of device to be detected
The fluid couplings 108 of 101 two sides of device ontology connects, and fluid is flowed into from fluid inlet 1082, by fluid channel 1083 respectively to
First isolation diaphragm 104 or the second isolation diaphragm 105 apply pressure, squeeze the pilot medium in positive pressure chamber and negative pressure cavity, and lead to
Pilot medium is crossed respectively to the lower end surface of sensor chip 205 and upper surface transmitting pressure.Sensor chip 205 is in upper and lower ends
Pressure under the action of generate micro-strain, cause the bridge resistance, resistance value inside sensor chip 205 to change, make to sense
Output electric current changes device chip 205 outward, and is transferred to corresponding instrument and meter by wiring board 301, realizes that measurement is poor
The pressure difference at 10 both ends of pressure sensor.
Although the illustrative specific embodiment of the application is described above, in order to the technology of the art
Personnel are it will be appreciated that the application, but the application is not limited only to the range of specific embodiment, to the common skill of the art
For art personnel, as long as long as various change the attached claims limit and determine the application spirit and scope in, one
It cuts and is created using the application of the application design in the column of protection.
Claims (7)
1. precision differential pressure sensing device characterized by comprising
Differential pressure pick-up, both ends are equipped with fluid coupling, and the fluid coupling is for connecting measurement equipment to be checked；
Chip assembly is mounted on above the differential pressure pick-up；
Circuit board module is mounted on above the chip assembly；
Wherein, the fluid coupling includes:
Fluid inlet, the fluid inlet inner wall is provided with screw thread, for connecting the pipeline of trandfer fluid in measurement equipment to be checked；With
Fluid channel, the fluid channel are connected to the differential pressure pick-up and the fluid inlet；
Connection ring, the fluid coupling are connect by the connection ring with the differential pressure pick-up.
2. precision differential pressure sensing device according to claim 1, wherein the differential pressure pick-up includes:
First pressure-sensitive face and the second pressure-sensitive face, are separately positioned on the both ends of the differential pressure pick-up, and surface has ripple；
First pressure guide hole is connected to the first pressure-sensitive face and the chip assembly, forms positive pressure chamber；With
Second pressure guide hole is connected to the second pressure-sensitive face and the chip assembly, forms negative pressure cavity；
First isolation diaphragm and the second isolation diaphragm are separately positioned on the first pressure-sensitive face and the second pressure-sensitive face.
3. precision differential pressure sensing device according to claim 2, wherein the differential pressure pick-up further include:
The excircle in the first pressure-sensitive face and the second pressure-sensitive face, institute is arranged in annular interconnecting piece, the annular interconnecting piece
It states connection ring and the annular interconnecting piece welds, realize the connection of the fluid coupling Yu the differential pressure pick-up.
4. precision differential pressure sensing device according to claim 1, wherein the chip assembly further include:
Sleeve includes: in shown sleeve
Welding bench and silicon cup, are formed with a chip accommodation space between the silicon cup and the welding bench, the chip accommodates empty
It is interior to include:
Binding board is equipped with sensor chip on the binding board.
5. precision differential pressure sensing device according to claim 4, wherein be provided on the differential pressure pick-up
Welding groove is used to install the welding bench；
Limiting slot is arranged in welding groove excircle, for installing the sleeve.
6. precision differential pressure sensing device according to claim 4, wherein be provided with link slot on the sleeve.
7. precision differential pressure sensing device according to claim 6, wherein the circuit board module includes:
The inside of the link slot is arranged in mounting plate；
Wiring board is mounted on the mounting plate；
Threaded sleeve is set in the wiring board periphery, and is fixed on the link slot outer wall, and surface has screw thread；
Threaded cap, through threaded cap on the threaded sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820927431.6U CN208902327U (en) | 2018-06-15 | 2018-06-15 | Precision differential pressure sensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820927431.6U CN208902327U (en) | 2018-06-15 | 2018-06-15 | Precision differential pressure sensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208902327U true CN208902327U (en) | 2019-05-24 |
Family
ID=66566747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820927431.6U Expired - Fee Related CN208902327U (en) | 2018-06-15 | 2018-06-15 | Precision differential pressure sensing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208902327U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108645560A (en) * | 2018-06-15 | 2018-10-12 | 江苏德尔森传感器科技有限公司 | Precision differential pressure sensing device |
| CN114746734A (en) * | 2019-12-03 | 2022-07-12 | 恩德莱斯和豪瑟尔欧洲两合公司 | Method for producing a differential pressure sensor |
| CN116878720A (en) * | 2023-04-20 | 2023-10-13 | 汉斯韦尔(山东)物联技术有限公司 | High stable silicon differential pressure sensor |
-
2018
- 2018-06-15 CN CN201820927431.6U patent/CN208902327U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108645560A (en) * | 2018-06-15 | 2018-10-12 | 江苏德尔森传感器科技有限公司 | Precision differential pressure sensing device |
| CN114746734A (en) * | 2019-12-03 | 2022-07-12 | 恩德莱斯和豪瑟尔欧洲两合公司 | Method for producing a differential pressure sensor |
| CN116878720A (en) * | 2023-04-20 | 2023-10-13 | 汉斯韦尔(山东)物联技术有限公司 | High stable silicon differential pressure sensor |
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Legal Events
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|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210506 Address after: 210000 Zhongguancun Software Park, 7 Yingcui Road, Jiangjun Avenue, Jiangning Development Zone, Nanjing City, Jiangsu Province Patentee after: JIANGSU DER SENSOR HOLDINGS Ltd. Address before: 215600 Room 202, building a, emerging industry development center, Zhangjiagang Free Trade Zone, Suzhou City, Jiangsu Province (dersen) Patentee before: JIANGSU DERSON SENSOR TECHNOLOGY Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190524 |