CN208848874U - Wafer processing device - Google Patents
Wafer processing device Download PDFInfo
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- CN208848874U CN208848874U CN201821708777.3U CN201821708777U CN208848874U CN 208848874 U CN208848874 U CN 208848874U CN 201821708777 U CN201821708777 U CN 201821708777U CN 208848874 U CN208848874 U CN 208848874U
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- Prior art keywords
- wafer
- processing device
- arm
- reaction chamber
- wafer processing
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- 238000012545 processing Methods 0.000 title claims abstract description 35
- 238000012546 transfer Methods 0.000 claims abstract description 44
- 230000033001 locomotion Effects 0.000 claims description 9
- 230000003028 elevating effect Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to technical field of manufacturing semiconductors more particularly to a kind of wafer processing devices.The wafer processing device includes: reaction chamber；First transfer chamber has the first mechanical arm, handles for wafer to be transmitted in the reaction chamber from the external world；Second transfer chamber is located at the opposite sides of the reaction chamber with first transfer chamber, has the second mechanical arm, for will be through the reaction chamber treated the wafer transfer to the external world.The utility model reduces the contaminated probability of wafer, improves the yield of semiconductor product.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors more particularly to a kind of wafer processing devices.
Background technique
With the continuous development of semiconductor processing technology, IC circuit level is higher and higher, the crucial ruler of semiconductor product
It is very little to be gradually reduced, the control of pollutant is required also higher and higher.IC is formed on wafer, this is subjected to many technique
Step, each processing step require to carry out in specific wafer processing chamber, in many cases, these wafer-process chambers
Room requires to be maintained in the environment of vacuum or intimate vacuum, could carry out normal process to wafer.Therefore, in crystalline substance
In round treatment process, during wafer is transferred to another processing chamber housing from a processing chamber housing, atmosphere is needed to transmit
Mould group (Atmosphere Transfer Module, ATM), gas lock (Airlock), vacuum transmission module (Vacuum
Transfer Module, VTM), the same specification transport chamber of front end open-type or front end open-type universal cavity (Front
Opening Unified Pod, FOUP) etc. synergistic effect realize.
Wafer has to before the processing chamber housing for entering per pass technique through over cleaning, with remove crystal column surface particle,
The pollutants such as organic matter, metal, natural oxide, therefore, how to reduce the pollution of crystal column surface is that semiconductor technology developed
An important ring in journey.Metallic pollution is a well-known problem in semi-conductor industry, and is including polysilicon gate
It is especially universal in the formation process of CMOS transistor.When being performed etching to the polysilicon layer with crystallographic surface defects, etching
Defect area cannot be passed through completely, so that leading to the generation of the polysilicon isolated island of polysilicon lines short circuit.
In actual operation process, wafer is transmitted to the wafer inside reaction chamber and after having handled certainly from the external world
Reaction chamber is transmitted to the external world and requires by multiple transmitting steps, and untreated wafer with processed wafer same
It is transported in one space, so that the probability that crystal column surface is contaminated with metals greatly increases, affects the yield of semiconductor product.
Therefore, the contaminated probability of wafer how is reduced, the yield of semiconductor product is improved, is skill urgently to be resolved at present
Art problem.
Utility model content
The utility model provides a kind of wafer processing device, for solving existing wafer processing device in transmission wafer mistake
The problem of wafer contamination is easily led in journey.
To solve the above-mentioned problems, the utility model provides a kind of wafer processing device, comprising:
Reaction chamber；
First transfer chamber has the first mechanical arm, carries out for wafer to be transmitted in the reaction chamber from the external world
Processing；
Second transfer chamber is located at the opposite sides of the reaction chamber with first transfer chamber, has the second machine
Tool arm, for will be through the reaction chamber treated the wafer transfer to the external world.
Preferably, further includes:
First demarcation plate, between the reaction chamber and first transfer chamber, for the reaction chamber to be isolated
With first transfer chamber；
Second demarcation plate, between the reaction chamber and second transfer chamber, for the reaction chamber to be isolated
With second transfer chamber.
Preferably, first mechanical arm is identical as the second mechanical arm structure；The first mechanical arm packet
Include support column and supporting table；The support column extends along the vertical direction；The supporting table is located at the top of the support column, is used for
Carry the wafer.
Preferably, first mechanical arm further includes controller and the first driver；First driver connects institute
Controller is stated, supporting table described in the first order-driven for issuing according to the controller surrounds first axle rotation, described
First axle extends along the vertical direction and is overlapped with the axis of the support column.
Preferably, first mechanical arm further includes the second driver；Second driver connects the controller,
Elevating movement is carried out along the vertical direction for support column described in the second order-driven according to the controller.
Preferably, first mechanical arm further includes the track extended along first level direction, the first level side
To vertical with the vertical direction；The bottom of the support column is connect with the track, and the support column can be along the rail
Road sliding.
Preferably, first mechanical arm further includes the arm ontology being located on the support table, the arm ontology
For clamping the wafer.
Preferably, the arm ontology includes supporting part and the first clamp arm and second for being respectively positioned on the supporting part surface
Clamp arm；First clamp arm and second clamp arm for clamping the wafer for being placed in the supporting part surface jointly.
Preferably, first clamp arm is fixed on the supporting part surface；Second clamp arm is connect with the supporting part,
And can on the supporting part surface along the second horizontal motion, second horizontal direction simultaneously with the first level side
To vertical with the vertical direction.
Preferably, the supporting part extends along second horizontal direction, and its end is connect with the supporting table；It is described
Arm ontology further includes third driver；The third driver connects the controller, for driving the supporting part to surround
Second axis rotation, the second axis pass through the center of the supporting part and extend along second horizontal direction.
Wafer processing device provided by the utility model, the opposite sides of reaction chamber be respectively set the first transfer chamber and
Second transfer chamber, and it is respectively arranged with a mechanical arm in first transfer chamber and second transfer chamber, it is to be processed
The wafer that wafer is sent to the reaction chamber and has handled through first transfer chamber is exported through second transfer chamber, is kept away
Exempt from wafer to be processed and processed wafer is located in the same space, reduces the contaminated probability of wafer, partly led to improve
The yield of body product.
Detailed description of the invention
Attached drawing 1 is the positive structure diagram of wafer processing device in specific embodiment of the present invention；
Attached drawing 2 is the overlooking structure diagram of wafer processing device in specific embodiment of the present invention；
Attached drawing 3 is the overlooking structure diagram of arm ontology in specific embodiment of the present invention；
Attached drawing 4 is the positive structure diagram of arm ontology in specific embodiment of the present invention.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of wafer processing device provided by the utility model.
Present embodiment provides a kind of wafer processing device, and attached drawing 1 is in specific embodiment of the present invention
The positive structure diagram of wafer processing device, attached drawing 2 are that wafer processing device is bowed in specific embodiment of the present invention
Depending on structural schematic diagram.
As shown in Figure 1 and Figure 2, the wafer processing device that present embodiment provides includes: reaction chamber 10；First passes
Defeated room 11 has the first mechanical arm, handles for wafer to be transmitted in the reaction chamber 10 from the external world；Second passes
Defeated room 12 is located at the opposite sides of the reaction chamber 10 with first transfer chamber 11, has the second mechanical arm, uses
In will be through the reaction chamber 10 treated the wafer transfer to the external world.
Wherein, the reaction chamber 10 can be the reaction chamber for carrying out backside of wafer etching technics, at this point, the reaction
There is the sucker 101 for carrying the wafer and the pipeline for transmitting photoresist to the crystal column surface in chamber 10
102.Specifically, first transfer chamber 11 can be located at the reaction chamber 10 front end, first mechanical arm from
Load port 15 obtains wafer to be processed, and by inside wafer transfer to be processed to the reaction chamber 10, carries out the back side
The process such as etching.Correspondingly, second transfer chamber 12 can be located at the rear end of the reaction chamber 10, second machine
Tool arm obtains the wafer handled through the reaction chamber 10 inside the reaction chamber 10, and should treated wafer biography
Transport to unloader port 16.Present embodiment is by being respectively completed being put into for wafer in the opposite end of the reaction chamber 10
With the process of taking-up, avoids wafer to be processed and processed wafer from being located in the same space, reduce the contaminated probability of wafer, from
And improve the yield of semiconductor product.
In order to be further reduced the contaminated probability of wafer, it is preferred that the wafer-process dress that present embodiment provides
It sets further include: the first demarcation plate 13, it is described anti-for being isolated between the reaction chamber 10 and first transfer chamber 11
Answer chamber 10 and first transfer chamber 11；Second demarcation plate 14 is located at the reaction chamber 10 and second transfer chamber 12
Between, for the reaction chamber 10 and second transfer chamber 12 to be isolated.Wherein, first demarcation plate 13 can be according to need
Closure or openness are wanted, to control whether the reaction chamber 10 is connected to first transfer chamber 11；Second demarcation plate
14 also can according to need closure or openness, thus control whether the reaction chamber 10 is connected to second transfer chamber 12,
To further improve the using flexible of the wafer processing device.
In this specific implementation embodiment, the structure of first mechanical arm and second mechanical arm can phase
Together, it can also be different, those skilled in the art can select according to actual needs.In order to be further simplified at the wafer
Manage the structure of device, it is preferred that first mechanical arm is identical as the second mechanical arm structure；First manipulator
Arm includes support column 111 and supporting table 112；The support column 111 extends along the vertical direction；The supporting table 112 is located at described
The top of support column 111, for carrying the wafer.It is furthermore preferred that first mechanical arm further includes controller and first
Driver；First driver connects the controller, described in the first order-driven for being issued according to the controller
Supporting table 112 surrounds first axle rotation, and the first axle extends along the vertical direction and the axis with the support column 111
It is overlapped.
Preferably, first mechanical arm further includes the second driver；Second driver connects the controller,
Elevating movement is carried out along the vertical direction for support column 111 described in the second order-driven according to the controller.
Preferably, first mechanical arm further includes the track 114 extended along first level direction, the first level
Direction is vertical with the vertical direction；The bottom of the support column 111 is connect with the track 114, and 111 energy of the support column
It is enough to be slided along the track 114.
Specifically, as shown in Figure 1 and Figure 2, along Z-direction extension, (the i.e. described vertical direction is Z axis to the support column 111
Direction), the first level direction is Y direction.The supporting table 112 can be rotated along the first axle, so as to
Drive the wafer rotation being located in the supporting table 112；The support column 111 can carry out elevating movement along Z-direction, thus
Drive the wafer elevating being located in the supporting table 112；Meanwhile the support column 111 can be on the track 114 along Y-axis
Direction movement, so that the wafer being located in the supporting table 112 be driven to move along the y axis.By the track 114, described
The cooperation of support column 111 and the supporting table 112, can be adjusted flexibly the position of the wafer, to further improve institute
State the degree of automation of the first mechanical arm.
Attached drawing 3 is the overlooking structure diagram of arm ontology in specific embodiment of the present invention, and attached drawing 4 is that this is practical
The positive structure diagram of arm ontology in novel specific embodiment.As shown in Figure 3, Figure 4, it is preferred that described first is mechanical
Arm further includes the arm ontology 113 in the supporting table 112, and the arm ontology 113 is for clamping the wafer 30.
It is furthermore preferred that the arm ontology 113 includes supporting part 31 and 32 He of the first clamp arm for being respectively positioned on 31 surface of supporting part
Second clamp arm 33；First clamp arm 32 is with second clamp arm 33 for clamping the institute for being placed in 31 surface of supporting part jointly
State wafer 30.
Present embodiment clamps the crystalline substance with second clamp arm 33 using the first clamp arm 32 being oppositely arranged jointly
Circle, compared to tradition machinery arm in such a way that vacuum suction acts on fixed wafer, present embodiment passes through mechanical folder
It holds to fix wafer, on the one hand reduces the dependence to vacuum suction, reduce the cost of mechanical arm；On the other hand it also mentions
The high safety of mechanical arm transmission wafer, avoids wafer from sliding in transmission process.Wherein, first clamp arm 32 and institute
The concrete shape of the second clamp arm 33 is stated, those skilled in the art can be set according to actual needs.In order in stable holding wafer
While, prevent plowing from wafer, it is preferred that the contact surface of first clamp arm 32 and second clamp arm 33 and the wafer 30
It is arc.
Preferably, first clamp arm 32 is fixed on 31 surface of supporting part；Second clamp arm 33 and the carrying
Portion 31 connects, and can on 31 surface of supporting part along the second horizontal motion, second horizontal direction simultaneously with institute
It states first level direction and the vertical direction is vertical.
Specifically, second horizontal direction can be X-direction, along the x axis by second clamp arm 33
Movement, the adjustable arm ontology 113 is applied to the chucking power on the wafer 30, so as to realize to various sizes
The firm clamping of wafer avoids the offset of the wafer 30.
Preferably, the supporting part 31 extends along second horizontal direction, and its end and the supporting table 112 connect
It connects；The arm ontology 113 further includes third driver；The third driver connects the controller, described for driving
Supporting part 31 surrounds second axis rotation, and the second axis passes through the center of the supporting part 31 and along the second level side
To extension.
Specifically, the supporting part 31 can be around the second axis rotation extended along the x axis, to realize
Overturning to the wafer 30 for being located at 31 surface of supporting part, consequently facilitating the wafer 30 after overturning is transmitted to institute
Reaction chamber 10 is stated, (such as back-etching technique) is handled to the back side of the wafer 30.Wherein, the back of the wafer 30
Face refers to, is formed with the wafer 30 or surface that the front of pre-formed device architecture is opposite.
The wafer processing device that present embodiment provides, is respectively set the first transmission in the opposite sides of reaction chamber
Room and the second transfer chamber, and it is respectively arranged with a mechanical arm in first transfer chamber and second transfer chamber, wait locate
The wafer that the wafer of reason is sent to the reaction chamber and has handled through first transfer chamber is defeated through second transfer chamber
Out, it avoids wafer to be processed and processed wafer from being located in the same space, reduces the contaminated probability of wafer, to improve
The yield of semiconductor product.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of wafer processing device characterized by comprising
Reaction chamber；
First transfer chamber has the first mechanical arm, handles for wafer to be transmitted in the reaction chamber from the external world；
Second transfer chamber is located at the opposite sides of the reaction chamber with first transfer chamber, has the second manipulator
Arm, for will be through the reaction chamber treated the wafer transfer to the external world.
2. wafer processing device according to claim 1, which is characterized in that further include:
First demarcation plate, between the reaction chamber and first transfer chamber, for the reaction chamber and institute to be isolated
State the first transfer chamber；
Second demarcation plate, between the reaction chamber and second transfer chamber, for the reaction chamber and institute to be isolated
State the second transfer chamber.
3. wafer processing device according to claim 1, which is characterized in that first mechanical arm and second machine
Tool arm structure is identical；First mechanical arm includes support column and supporting table；The support column extends along the vertical direction；Institute
The top that supporting table is located at the support column is stated, for carrying the wafer.
4. wafer processing device according to claim 3, which is characterized in that first mechanical arm further includes controller
With the first driver；First driver connects the controller, and the first instruction for being issued according to the controller is driven
The supporting table is moved around first axle rotation, the first axle extends along the vertical direction and the axis with the support column
It is overlapped.
5. wafer processing device according to claim 4, which is characterized in that first mechanical arm further includes the second drive
Dynamic device；Second driver connects the controller, for support column described in the second order-driven according to the controller
Elevating movement is carried out along the vertical direction.
6. wafer processing device according to claim 5, which is characterized in that first mechanical arm further includes along first
The track that horizontal direction extends, the first level direction are vertical with the vertical direction；The bottom of the support column with it is described
Track connection, and the support column can be slided along the track.
7. wafer processing device according to claim 6, which is characterized in that first mechanical arm further includes being located at institute
The arm ontology in supporting table is stated, the arm ontology is for clamping the wafer.
8. wafer processing device according to claim 7, which is characterized in that the arm ontology include supporting part and
The first clamp arm and the second clamp arm positioned at the supporting part surface；First clamp arm and second clamp arm for clamping jointly
It is placed in the wafer on the supporting part surface.
9. wafer processing device according to claim 8, which is characterized in that first clamp arm is fixed on the supporting part
Surface；Second clamp arm is connect with the supporting part, and can be on the supporting part surface along the second horizontal motion, institute
It is vertical with the first level direction and the vertical direction simultaneously to state the second horizontal direction.
10. wafer processing device according to claim 9, which is characterized in that the supporting part is along the second level side
To extension, and its end is connect with the supporting table；The arm ontology further includes third driver；The third driver connects
The controller is connect, for driving the supporting part around second axis rotation, the second axis passes through the supporting part
Center and along second horizontal direction extend.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821708777.3U CN208848874U (en) | 2018-10-19 | 2018-10-19 | Wafer processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821708777.3U CN208848874U (en) | 2018-10-19 | 2018-10-19 | Wafer processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208848874U true CN208848874U (en) | 2019-05-10 |
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ID=66376359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821708777.3U Expired - Fee Related CN208848874U (en) | 2018-10-19 | 2018-10-19 | Wafer processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208848874U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140483A (en) * | 2021-03-03 | 2021-07-20 | 上海璞芯科技有限公司 | Wafer conveying method and wafer conveying platform |
-
2018
- 2018-10-19 CN CN201821708777.3U patent/CN208848874U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140483A (en) * | 2021-03-03 | 2021-07-20 | 上海璞芯科技有限公司 | Wafer conveying method and wafer conveying platform |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190510 |