CN208835440U - A kind of radiator for solid-state physics laser - Google Patents
A kind of radiator for solid-state physics laser Download PDFInfo
- Publication number
- CN208835440U CN208835440U CN201821785465.2U CN201821785465U CN208835440U CN 208835440 U CN208835440 U CN 208835440U CN 201821785465 U CN201821785465 U CN 201821785465U CN 208835440 U CN208835440 U CN 208835440U
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- China
- Prior art keywords
- heat sink
- thermal performance
- copper
- micro channels
- pipe
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Abstract
The utility model discloses a kind of radiators for solid-state physics laser, it is heat sink including laser crystal and copper, laser crystal is gripped by upper and lower two blocks of copper is heat sink, laser crystal and copper it is heat sink between be equipped with diamond paillon, Thermal Performance of Micro Channels device is additionally provided on copper is heat sink, Thermal Performance of Micro Channels device includes Thermal Performance of Micro Channels pipe, header, inlet tube and outlet, and the heat sink side of upper and lower two blocks of copper is respectively arranged with slot;Thermal Performance of Micro Channels pipe pass through slot, and respectively by upper and lower two blocks of copper it is heat sink centered on coil setting;The upper and lower ends of Thermal Performance of Micro Channels pipe are connected with the outlet set on the heat sink upper end of copper, and the inlet tube set on the heat sink lower end of copper respectively;Radiating fin is additionally provided on Thermal Performance of Micro Channels pipe.The utility model is respectively arranged with the Thermal Performance of Micro Channels pipe of wound form on upper and lower two bronze medal is heat sink, increases the heat sink hot-cast socket effect of copper, while being provided with radiating fin on Thermal Performance of Micro Channels pipe, increases heat conducting and radiating area, good heat dissipation effect.
Description
Technical field
The utility model relates to solid-state physics field of lasers, especially a kind of heat dissipation for solid-state physics laser is filled
It sets.
Background technique
In use, input gross energy only has small part to be converted to laser output, most energy to solid state laser
The heat consumption that amount is converted into device dissipates.Especially laser crystal fever influence maximum that laser export.Due to laser
Input power is bigger, and fuel factor is also more serious, therefore, how to eliminate the heat converted by power dissipation in time, becomes development
The key technology of high-power solid-state physics laser.
Number of patent application: CN201220267251.2 discloses a kind of radiating subassembly for end-face pump solid laser,
Including for lateral containment type installation laser bar heat dissipation base, the longitudinal cross-section area of heat dissipation base by laser bar installation place extremely
Few vertically both direction is gradually increased;Since the shape of heat sink (heat dissipation base) is gradually expanded outward in the patent, increase heat
The volume for conducting basis increases heat dissipation capacity, the laser for end pumping using the fast feature of heat sink material heat conduction velocity
In, increase the volume of matrix heat dissipation heat transfer, enhances thermal conduction effect.
Above-mentioned patent application is only to increase the volume of heat dissipation conduction, carries out heat transfer using traditional heat-dissipating fin, only
It is used suitable for low-power solid-state physics laser, in the environment of the evolution of moment high heat, thermal conduction effect is poor.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of dissipating for solid-state physics laser
Thermal solves the problems, such as that traditional thermal conduction effect is poor, and the application can accelerate laser by the way of the radiating fin of microchannel
The heat loss of device, and with tradition it is air-cooled combine, heat transfer effect is strong, easy to use.
The purpose of this utility model is achieved through the following technical solutions:
A kind of radiator for solid-state physics laser, including laser crystal and copper it is heat sink, laser crystal is by upper and lower
Two blocks of copper are heat sink to be gripped, laser crystal and copper it is heat sink between be equipped with diamond paillon, be additionally provided with microchannel on copper is heat sink
Heat-exchanger rig, Thermal Performance of Micro Channels device include Thermal Performance of Micro Channels pipe, header, inlet tube and outlet, and upper and lower two blocks of copper is heat sink
Side is respectively arranged with the slot coincideing with Thermal Performance of Micro Channels tube shape;Thermal Performance of Micro Channels pipe passes through slot, and respectively with upper and lower
Setting is coiled centered on two blocks of copper are heat sink;The upper and lower ends of Thermal Performance of Micro Channels pipe respectively be set to the heat sink upper end of copper outlet,
And the inlet tube set on the heat sink lower end of copper is connected;Multiple microchannel flow paths, every microchannel are provided in Thermal Performance of Micro Channels pipe
It is additionally provided with branch flow pipe on heat exchanger tube, header is provided on branch flow pipe, the microchannel in header and branch flow pipe is flowed
Road is connected;Radiating fin is additionally provided on Thermal Performance of Micro Channels pipe.
Preferably, it is additionally provided on Thermal Performance of Micro Channels pipe along the heat sink axial dowel of copper, dowel and every microchannel
Heat exchanger tube contact weld is connected, which plays the role of fixed Thermal Performance of Micro Channels pipe position, while being also equipped with plastotype effect,
So that Thermal Performance of Micro Channels pipe is unlikely to deform in use.
Preferably, one end of inlet tube and outlet, which blocks, end cap, is avoided that the liquid seepage of inlet tube and outlet
Phenomenon.
Preferably, it is additionally provided with flow deflector in inlet tube and outlet, the liquid guide flow of inlet tube can be entered microchannel
Heat exchanger tube, and flowed out after heat exchange from outlet.
Preferably, it is additionally provided with radiator fan outside radiating fin, by increasing air flowing, increases the heat on radiating fin
Measure radiating rate.
Preferably, the contact position of Thermal Performance of Micro Channels pipe and slot is coated with heat-conducting silicone grease.
The beneficial effects of the utility model are:
(1) it is respectively arranged with the Thermal Performance of Micro Channels pipe of wound form on upper and lower two bronze medal is heat sink, increases the heat sink heat of copper and turns
Effect is changed, while being provided with radiating fin on Thermal Performance of Micro Channels pipe, increases heat conducting and radiating area, good heat dissipation effect;
(2) it is additionally provided with radiator fan, microchannel heat dissipation is air-cooled with tradition, fin heat dissipation etc. combines, so that laser
Device working portion heat loss is high-efficient, good cooling results, is suitable for high power solid-state physics laser and uses.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the utility model;
Fig. 2 is diagrammatic cross-section of the utility model with radiating fin;
Fig. 3 is the structural schematic diagram of the utility model Thermal Performance of Micro Channels device;
In figure, 101- laser crystal, 102- diamond paillon, 103- copper is heat sink, 104- slot, 105- Thermal Performance of Micro Channels
Pipe, 106- radiator fan, 107- radiating fin, 108- outlet, 109- header, 110- branch flow pipe, 111- dowel,
112- inlet tube.
Specific embodiment
Illustrate the embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this theory
Content disclosed by bright book understands other advantages and effect of the utility model easily.The utility model can also be by addition
Different specific embodiments are embodied or practiced, and the various details in this specification can also be based on different viewpoints and answer
With carrying out various modifications or alterations under the spirit without departing from the utility model.It should be noted that the case where not conflicting
Under, the feature in following embodiment and embodiment can be combined with each other.
It should be noted that diagram provided in following embodiment only illustrates the basic of the utility model in a schematic way
Conception, only shown in schema then with related component in the utility model rather than component count when according to actual implementation, shape
And size is drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its assembly layout
Kenel may also be increasingly complex.
Embodiment:
A kind of radiator for solid-state physics laser please refers to shown in attached drawing 1- attached drawing 3, including laser crystal
101 and copper heat sink 103, laser crystal 101 gripped by upper and lower two blocks of copper heat sink 103, laser crystal 101 and copper heat sink 103
Between be equipped with diamond paillon 102, copper is heat sink to be additionally provided with Thermal Performance of Micro Channels device on 103, and Thermal Performance of Micro Channels device includes micro-
Channel for heat exchange pipe 105, header 109, inlet tube 112 and outlet 108, upper and lower heat sink 103 side of two blocks of copper are respectively arranged with
The slot 104 coincideing with 105 shape of Thermal Performance of Micro Channels pipe;Thermal Performance of Micro Channels pipe 105 passes through slot 104, and respectively with upper and lower two
Block copper is heat sink to coil setting centered on 103;The upper and lower ends of Thermal Performance of Micro Channels pipe 105 are respectively and set on heat sink 103 upper end of copper
Outlet 108, and the inlet tube 112 set on heat sink 103 lower end of copper are connected;It is provided in Thermal Performance of Micro Channels pipe 105 multiple micro-
Channel flow path is additionally provided with branch flow pipe 110 on every Thermal Performance of Micro Channels pipe 105, is provided with header on branch flow pipe 110
109, header 109 is connected with the microchannel flow path in branch flow pipe 110;Heat dissipation is additionally provided on Thermal Performance of Micro Channels pipe 105
One end of fin 107, inlet tube 112 and outlet 108, which blocks, end cap, is avoided that the liquid of inlet tube 112 and outlet 108
It is additionally provided with flow deflector in percolation phenomenon, inlet tube 112 and outlet 108, the liquid guide flow of inlet tube 112 can be entered micro- logical
Road heat exchanger tube 105, and flowed out after heat exchange from outlet 108, it is additionally provided with radiator fan 106 outside radiating fin 107, is passed through
Increase air flowing, increases the heat spreader speed on radiating fin 107, the contact position of Thermal Performance of Micro Channels pipe 105 and slot 104
It sets and is coated with heat-conducting silicone grease.
As preferred one embodiment, it is additionally provided on Thermal Performance of Micro Channels pipe 105 along the axial dowel of copper heat sink 103
111, dowel 111 is connected with every 105 contact weld of Thermal Performance of Micro Channels pipe, which plays fixed Thermal Performance of Micro Channels
The effect of 105 position of pipe, while it being also equipped with plastotype effect, so that Thermal Performance of Micro Channels pipe 105 is unlikely to deform in use.
Need to be illustrated for embodiment, laser crystal 101 be set to two duplicate copper heat sink 103 it
Between, it ensure that the heat dissipation uniformity of upper and lower two copper heat sink 103.Again due to solid-state physics laser incident light propagation direction with
Temperature gradient side is upwardly close to consistent, therefore, in the arrangement of radiator, needs the axial direction arrangement along copper heat sink 103, also
It is consistent with the axial direction of laser crystal 101.And in solid-state physics laser working process, energy deposition leads to temperature mistake
Thermal stress caused by high and temperature distributing disproportionation still has, therefore, in laser crystal 101 and upper and lower two copper heat sink 103
Between be additionally provided with diamond paillon 102, which can effectively improve 101 waste heat of laser crystal and causes radial temperature
Gradient and thermal lensing effect are spent, to improve high-output power and good beam quality.
It needing to be further illustrated according to embodiment, Thermal Performance of Micro Channels pipe 105 is nested between copper heat sink 103, so that
Upper and lower two copper heat sink 103 is respectively taken away heat by Thermal Performance of Micro Channels pipe 105, is provided with again on Thermal Performance of Micro Channels pipe 105
Radiating fin 107 takes away the heat on radiating fin 107 by the air energy of flow.In solid-state physics laser working process,
The heat diffusion of laser crystal 101 is cold inside the Thermal Performance of Micro Channels pipe 105 inside copper heat sink 103 into copper heat sink 103
But boiling or liquid gas morphologic change occur for liquid to absorb heat, boiling liquid or steam by pipeline and flow out from outlet 108, and
The radiating fin 107 being arranged on Thermal Performance of Micro Channels pipe 105 takes away partial heat by heat transfer, in the outer of radiating fin 107
Side is equipped with radiator fan 106, then can reinforce cross-ventilation, increases the radiating efficiency of radiating fin 107.It is dissipated by microchannel
Three kinds of modes such as heat, radiating fin heat dissipation and wind-cooling heat dissipating combine, and can quickly take away the heat of copper heat sink 103, avoid heat
Amount is accumulated in heating position, is effectively reduced the thermal stress of solid-state physics laser, improves the performance of solid-state physics laser and steady
It is qualitative.
Specific embodiment of the present utility model above described embodiment only expresses, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model.
Claims (6)
1. a kind of radiator for solid-state physics laser, including laser crystal and copper it is heat sink, laser crystal is by upper and lower two
Block copper is heat sink to be gripped, laser crystal and copper it is heat sink between be equipped with diamond paillon, which is characterized in that also set up on copper is heat sink
There is a Thermal Performance of Micro Channels device, Thermal Performance of Micro Channels device includes Thermal Performance of Micro Channels pipe, header, inlet tube and outlet, and upper and lower two
Block copper is heat sink, and side is respectively arranged with the slot coincideing with Thermal Performance of Micro Channels tube shape;Thermal Performance of Micro Channels pipe passes through slot, and divides
Not by upper and lower two blocks of copper it is heat sink centered on coil setting;The upper and lower ends of Thermal Performance of Micro Channels pipe are respectively and set on the heat sink upper end of copper
Outlet, and the inlet tube set on the heat sink lower end of copper are connected;It is provided with multiple microchannel flow paths in Thermal Performance of Micro Channels pipe, every
Be additionally provided with branch flow pipe on Thermal Performance of Micro Channels pipe, be provided with header on branch flow pipe, header with it is micro- in branch flow pipe
Channel flow path is connected;Radiating fin is additionally provided on Thermal Performance of Micro Channels pipe.
2. a kind of radiator for solid-state physics laser according to claim 1, which is characterized in that Thermal Performance of Micro Channels
It is additionally provided on pipe along the heat sink axial dowel of copper, dowel is connected with every Thermal Performance of Micro Channels pipe contact weld.
3. a kind of radiator for solid-state physics laser according to claim 1, which is characterized in that inlet tube and go out
One end of mouth pipe, which blocks, end cap.
4. a kind of radiator for solid-state physics laser according to claim 1, which is characterized in that inlet tube and go out
Flow deflector is additionally provided in mouth pipe.
5. a kind of radiator for solid-state physics laser according to claim 1, which is characterized in that outside radiating fin
It is additionally provided with radiator fan.
6. a kind of radiator for solid-state physics laser according to claim 1, which is characterized in that Thermal Performance of Micro Channels
The contact position of pipe and slot is coated with heat-conducting silicone grease.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821785465.2U CN208835440U (en) | 2018-10-31 | 2018-10-31 | A kind of radiator for solid-state physics laser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821785465.2U CN208835440U (en) | 2018-10-31 | 2018-10-31 | A kind of radiator for solid-state physics laser |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208835440U true CN208835440U (en) | 2019-05-07 |
Family
ID=66319872
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821785465.2U Expired - Fee Related CN208835440U (en) | 2018-10-31 | 2018-10-31 | A kind of radiator for solid-state physics laser |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208835440U (en) |
-
2018
- 2018-10-31 CN CN201821785465.2U patent/CN208835440U/en not_active Expired - Fee Related
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190507 Termination date: 20191031 |
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CF01 | Termination of patent right due to non-payment of annual fee |