CN208833961U - Optical module - Google Patents
Optical module Download PDFInfo
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- CN208833961U CN208833961U CN201821236895.9U CN201821236895U CN208833961U CN 208833961 U CN208833961 U CN 208833961U CN 201821236895 U CN201821236895 U CN 201821236895U CN 208833961 U CN208833961 U CN 208833961U
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- Prior art keywords
- optical module
- laser
- optical
- multiplexer
- amplifier
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Abstract
The utility model relates to a kind of optical module, including PCBA board and optical fiber connector, PCBA board is equipped with light emission component, and optical fiber connector is connect with light emission component;Light emission component includes laser, driving chip and multiplexer, the input terminal of laser is connected with the output end of driving chip, the transmitting terminal of laser is connected with the input terminal of multiplexer, and the quantity of laser transmitting terminal is at least two-way, and all uses the transistor outline package of small size;The transmitting terminal and multiplexer of laser are connected in a manner of lock pin, and the optical signal from least two-way laser is multiplexed with optical signal all the way by multiplexer, and laser transmitting terminal can be effectively reduced the manufacturing cost of optical module using the transistor outline package of small size.
Description
Technical field
The utility model relates to a kind of optical modules, more particularly to a kind of optical mode being made of PCBA board and optical fiber connector
Block.
Background technique
With the continuous improvement that the continuous development and netizen of optical communications industry require network service quality, fiber optic communication system
System has become closer to people's lives.Higher broadband and port density, lower energy consumption become optical fiber telecommunications system
Continuous pursuit where, wherein optical module is the key components in entire optical fiber telecommunications system.
However, optical module at this stage has that manufacturing cost is high, wherein the optical assembly cost in optical module accounts for system
This 60% or more is caused, packaging cost accounts for 40% of manufacturing cost or more, reduces optical module manufacture from optical chip angle merely
The space very little of cost, most possible reduce optical mode block cost is encapsulation technology, but existing optical module generally use it is airtight
Property encapsulation, this packaging cost is higher.
Utility model content
The technical problem to be solved by the present invention is to provide a kind of low cost optical modules of non-airtight encapsulation.
A kind of optical module, including PCBA board and optical fiber connector, the PCBA board are equipped with light emission component, the optical fiber
Connector is connect with light emission component;The light emission component includes laser, driving chip and multiplexer, the laser
Input terminal is connected with the output end of driving chip, and the transmitting terminal of the laser is connected with the input terminal of multiplexer;The laser
The transmitting terminal quantity of device is at least two-way, and all uses the transistor outline package of small size;The transmitting terminal of the laser with
Multiplexer is connected in a manner of lock pin, and the optical signal from least two-way laser is multiplexed with light letter all the way by the multiplexer
Number.
Above-mentioned optical module, since the transmitting terminal of laser uses the transistor outline package of small size, to solve light
The module problem at high cost using air-tight packaging.
The optical module further includes light-receiving component, the optical fiber connector and light-receiving in one of the embodiments,
Component connection, the light-receiving component includes photodetection chip, amplifier and demultiplexer, the input terminal of the amplifier with
The output end of photodetection chip is connected, and the output end of the amplifier is connected with the input terminal of demultiplexer;The light-receiving
Photodetection chip and amplifier in component are fixed in PCBA board by chip on board encapsulation technology.Photodetection chip and
Amplifier is fixed in PCBA board by chip on board encapsulation technology, to further reduce packaging cost, reduces optical mode
The manufacturing price of block.
The quantity of the laser transmitting terminal is four tunnels in one of the embodiments,.
The multiplexer is no heat type array waveguide raster multiplexer in one of the embodiments,.
The demultiplexer is no heat type array waveguide grating demultiplexer, the no heat in one of the embodiments,
Type array waveguide grating demultiplexer and photodetection chip, which are formed, receives optical coupling.
Wherein, no heat type array waveguide raster multiplexer and not only have without heat type array waveguide grating demultiplexer higher
Stability and good polarization mode dispersion characteristic, and can use self-compensation situation technology to ambient temperature carry out it is self-adaptive controlled
System.
The optical module is 40G QSFP LR4 optical module, 40G QSFP LR4 optical module in one of the embodiments,
Generally it is connected with single-mode optical fiber connector, up to 10km, hot connecting and disconnecting interface has the single mode optical fiber maximum transmission distance of support
Lower energy consumption.
The amplifier in the 40G QSFP LR4 optical module is trans-impedance amplifier, signal in one of the embodiments,
After optical fiber connector transmits, optical power and dispersion can be decayed to a certain extent, and amplifier converts optical signal
It is electric signal come when amplifying processing, trans-impedance amplifier can effectively inhibit the amplification of noise signal, so that signal-to-noise ratio be mentioned
Height is in a desired transmission performance number.
The photodetection chip in the 40G QSFP LR4 optical module is lithium drift detection in one of the embodiments,
Device, the core of lithium drifted detector are that storeroom inserts one layer of medium intrinsic half between p-type semiconductor material and N-type semiconductor
Conductor during converting optical signal into electric signal, is permitted since the addition of dielectric layer increases so as to cause the width of depletion region
Perhaps more photo-generate electron-holes are generated in high field region, while reducing the junction capacity of photodetector, are effectively shortened
Response time.
The optical fiber connector in the 40G QSFP LR4 optical module is plug-in square light in one of the embodiments,
Fiber connector, plug-in square optical fiber connector are made of easy to operate modular jack latch mechanism, used by
The size of contact pin and sleeve is the half of size used in ordinary optic fibre connector, effectively improves optical fiber in fibre distribution frame and connects
Connect the density of device.
Detailed description of the invention
Fig. 1 is the schematic diagram of optical module internal component.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The preferred embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms in fact
It is existing, however it is not limited to embodiment described herein.On the contrary, purpose of providing these embodiments is makes public affairs to the utility model
It is more thorough and comprehensive to open content.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
In the description of the present invention, it should be understood that term " on ", "lower", "vertical", "horizontal", "inner",
The orientation or positional relationship of the instructions such as "outside" is method based on the figure or positional relationship, is merely for convenience of describing this reality
It is described with novel with simplified, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific
Orientation construction and operation, therefore should not be understood as limiting the present invention.
Optical module shown in FIG. 1 includes PCBA board 100 and optical fiber connector 200, and PCBA board 100 is equipped with light emission component
(Transmitting Optical Sub-Assembly, TOSA), optical fiber connector 200 is connect with light emission component;Light emitting
Component includes laser 400, driving chip 300 and multiplexer (MUX) 600, the input terminal and driving chip 300 of laser 400
Output end be connected, the transmitting terminal of laser 400 is connected with the input terminal of multiplexer 600, the number of 400 transmitting terminal 500 of laser
Amount be at least two-way, and all using transistor outline (Transistor Outline, the TO) encapsulation of small size (MINI);Laser
The transmitting terminal 500 of device 400 is connect in a manner of lock pin with multiplexer 600, and multiplexer 600 is by the light from least two-way laser
Signal multiplexing is optical signal all the way.
Wherein, the driving chip 300 in light emission component will drive laser after the Electric signal processing for inputting a constant bit rate
400 launch the modulated optical signal of at least respective rate on 2 tunnels, then are multiplexed with the optical signal of at least two-way through multiplexer 600
Optical signal is sent to optical fiber connector 200 all the way.
Above-mentioned optical module, since the transmitting terminal 500 of laser 400 uses the transistor outline package of small size, to solve
Optical module of the having determined problem at high cost using air-tight packaging.
Further, optical module further includes light-receiving component (Receiving Optical Sub-Assembly, ROSA),
Optical fiber connector 200 is connect with light-receiving component, light-receiving component include photodetection (Photoelectric Detection,
PD) chip 800, amplifier 900 and demultiplexer (DEMUX) 700, input terminal and the photodetection chip 800 of amplifier 900
Output end is connected, and the output end of amplifier 900 is connected with the input terminal of demultiplexer 700;Photodetection in light-receiving component
Chip 800 and amplifier 900 encapsulate (Chip On Board, COB) technology by chip on board and are fixed in PCBA board 100.
Wherein, the optical signal all the way that the demultiplexer 700 in light-receiving component emits optical fiber connector 200 be decomposed into
Few two-way has the optical signal of a constant bit rate, and at least two-way there is the optical signal of a constant bit rate to convert by photodetection chip 800
Electric signal, then the electric signal through 900 output phase code rate of amplifier.
Above-mentioned optical module, since photodetection chip 800 and amplifier 900 are fixed on by chip on board encapsulation technology
In PCBA board 100, to further reduce packaging cost, the manufacturing price of optical module is reduced.
Specifically, the quantity of 400 transmitting terminal 500 of laser is four tunnels.
Further, multiplexer 600 is no heat type array waveguide grating (Athermal Arrayed Waveguide
Grating, AAWG) multiplexer, demultiplexer 700 is no heat type array waveguide grating demultiplexer, no heat type Waveguide array light
Grid demultiplexer and photodetection chip 800, which are formed, receives optical coupling.Wherein, no heat type array waveguide grating not only has higher
Stability and good polarization mode dispersion characteristic, and can use self-compensation situation technology to ambient temperature carry out it is self-adaptive controlled
System.
Further, optical module is 40G QSFP LR4 optical module, and 40G QSFP LR4 optical module is generally and single mode optical fiber
Connector 200 is connected, and for the single mode optical fiber maximum transmission distance of support up to 10km, hot connecting and disconnecting interface has lower energy consumption.
Specifically, the amplifier 900 in 40G QSFP LR4 optical module is trans-impedance amplifier (Trans-Impedance
Amplifier, TIA), after the transmission of optical fiber connector 200, optical power and dispersion can be declined signal to a certain extent
Subtract, amplifier 900 converts optical signal into electric signal come when amplifying processing, trans-impedance amplifier can effectively inhibit noise
The amplification of signal, to improving signal-to-noise ratio in a desired transmission performance number.
Specifically, the photodetection chip 800 in 40G QSFP LR4 optical module is lithium drift (PIN) detector, lithium drift
The core of shift detector is that storeroom inserts one layer of medium intrinsic semiconductor between p-type semiconductor material and N-type semiconductor,
During converting optical signal into electric signal, allow more since the addition of dielectric layer increases so as to cause the width of depletion region
Photo-generate electron-hole generated in high field region, while the junction capacity of photodetector is reduced, when being effectively shortened response
Between.
Specifically, the optical fiber connector 200 in 40G QSFP LR4 optical module is plug-in square (LC) optical fiber connector,
Plug-in square optical fiber connector is made of easy to operate modular jack latch mechanism, used contact pin and sleeve
Size be size used in ordinary optic fibre connector half, effectively improve the close of optical fiber connector in fibre distribution frame
Degree.
In use, optical module is inserted on the socket for needing equipment to be used, what equipment was transmitted out has a constant bit rate
For electric signal after the driving chip 300 in light emission component is handled, driving laser 400 launches the respective rate at least 2 tunnels
Modulated optical signal, then the optical signal of at least two-way is multiplexed with optical signal all the way through multiplexer 600 and is sent to optical fiber connector
200;The optical signal all the way that demultiplexer 700 in light-receiving component emits optical fiber connector 200 is decomposed at least two-way tool
There is the optical signal of a constant bit rate, at least two-way there is the optical signal of a constant bit rate to convert electric signal by photodetection chip 800, then
Electric signal through 900 output phase code rate of amplifier, so as to equipment use.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (9)
1. a kind of optical module, including PCBA board and optical fiber connector, the PCBA board is equipped with light emission component, and the optical fiber connects
Device is connect to connect with light emission component;The light emission component includes laser, driving chip and multiplexer, the laser it is defeated
Enter end to be connected with the output end of driving chip, the transmitting terminal of the laser is connected with the input terminal of multiplexer;It is characterized in that,
The quantity of the laser transmitting terminal is at least two-way, and all uses the transistor outline package of small size;The laser
Transmitting terminal and multiplexer are connected in a manner of lock pin, and the optical signal from least two-way laser is multiplexed with one by the multiplexer
Road optical signal.
2. optical module according to claim 1, which is characterized in that further include light-receiving component, the optical fiber connector with
The connection of light-receiving component, the light-receiving component includes photodetection chip, amplifier and demultiplexer, the amplifier it is defeated
Enter end to be connected with the output end of photodetection chip, the output end of the amplifier is connected with the input terminal of demultiplexer;It is described
Photodetection chip and amplifier in light-receiving component are fixed in PCBA board by chip on board encapsulation technology.
3. optical module according to claim 1, which is characterized in that the quantity of the laser transmitting terminal is four tunnels.
4. optical module according to claim 1, which is characterized in that the multiplexer is multiplexed for no heat type array waveguide grating
Device.
5. optical module according to claim 2, which is characterized in that the demultiplexer is no heat type array waveguide grating solution
Multiplexer, the no heat type array waveguide grating demultiplexer and photodetection chip, which are formed, receives optical coupling.
6. optical module described in any one according to claim 1~5, which is characterized in that the optical module is 40G QSFP
LR4 optical module.
7. optical module according to claim 2, which is characterized in that the amplifier is trans-impedance amplifier.
8. optical module according to claim 2, which is characterized in that the photodetection chip is lithium drifted detector.
9. optical module according to claim 6, which is characterized in that the optical fiber connector is the connection of plug-in square optical fiber
Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201821236895.9U CN208833961U (en) | 2018-08-01 | 2018-08-01 | Optical module |
Applications Claiming Priority (1)
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CN201821236895.9U CN208833961U (en) | 2018-08-01 | 2018-08-01 | Optical module |
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CN208833961U true CN208833961U (en) | 2019-05-07 |
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CN201821236895.9U Expired - Fee Related CN208833961U (en) | 2018-08-01 | 2018-08-01 | Optical module |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110618505A (en) * | 2019-09-24 | 2019-12-27 | 武汉光迅科技股份有限公司 | Optical receiving end assembly and optical module |
CN111294113A (en) * | 2020-02-10 | 2020-06-16 | 长飞光纤光缆股份有限公司 | Emitted light power monitoring device and preparation method thereof |
CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
WO2021218464A1 (en) * | 2020-04-29 | 2021-11-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN114257306A (en) * | 2021-12-20 | 2022-03-29 | 北京京东方技术开发有限公司 | Communication device, method and system |
-
2018
- 2018-08-01 CN CN201821236895.9U patent/CN208833961U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110618505A (en) * | 2019-09-24 | 2019-12-27 | 武汉光迅科技股份有限公司 | Optical receiving end assembly and optical module |
CN111294113A (en) * | 2020-02-10 | 2020-06-16 | 长飞光纤光缆股份有限公司 | Emitted light power monitoring device and preparation method thereof |
WO2021218464A1 (en) * | 2020-04-29 | 2021-11-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
CN114257306A (en) * | 2021-12-20 | 2022-03-29 | 北京京东方技术开发有限公司 | Communication device, method and system |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190507 Termination date: 20200801 |