CN208801544U - A kind of semiconductor plastic package die preventing cooling fin deviation - Google Patents

Abstract

The utility model relates to mold design technical fields, and disclose a kind of semiconductor plastic package die that can prevent cooling fin deviation, including upper die holder and lower die holder, reinforcing rib is fixedly connected on the outside of the upper die holder and lower die holder, lightening hole is offered between two adjacent said ribs, the front and back of the upper die holder and lower die holder two sides is fixedly connected to lifting lug, and the internal activity of eight lifting lugs is connected with derricking gear, is fixedly connected with punch-pin in the middle part of the bottom of the upper die holder.This can prevent the semiconductor plastic package die of cooling fin deviation, pass through guide plate, guide hole and guide post, guiding role is played in molding, by nitrogen gas spring, buffer function can be played in molding, the reinforcing rib can enhance the overall stability of mold, by lifting lug and boom hoisting, lifting of the mold in molding, debugging or transportational process can be facilitated, limited by cooling fin, the position that cooling fin can be limited in punching course, avoids cooling fin deviation.

Description

A kind of semiconductor plastic package die preventing cooling fin deviation

Technical field

The utility model relates to mold design technical field, specially a kind of semiconductor plastic package that can prevent cooling fin deviation Mold.

Background technique

Semiconductor plastic package die is fixed charging cavate thermosetting plastics compression mod, is exclusively used in integrated circuit, semiconductor, core The Plastic Package of piece is used cooperatively, the building block of plastic package die are as follows: upper mold portion with semiconductor devices molding plastic packaging machine Point, part of the lower die, ejection system, support system, guided positioning system and reset system etc..

As semiconductor plastic package die is because its excellent characteristic is while manufacturing extensive use, people deposit it The problem of also pay more attention to, cooling fin is easy deviation to current most semiconductor plastic package die in process of production, thus We have proposed one kind can prevent the semiconductor plastic package die of cooling fin deviation from solving the above problems.

Utility model content

(1) the technical issues of solving

In view of the deficiencies of the prior art, the utility model provides a kind of Semi-conductor plastic capsulation mould that can prevent cooling fin deviation Tool, has the advantages that preventing cooling fin deviation, and solving most semiconductor plastic package die, cooling fin holds in process of production The problem of easy deviation.

(2) technical solution

Cooling fin deviation purpose is prevented for realization is above-mentioned, the utility model provides the following technical solutions: one kind can prevent from dissipating The outside of the semiconductor plastic package die of backing deviation, including upper die holder and lower die holder, the upper die holder and lower die holder is fixed to be connected It is connected to reinforcing rib, offers lightening hole between two adjacent said ribs, the front and back of the upper die holder and lower die holder two sides is solid Surely it is connected with lifting lug, the internal activity of eight lifting lugs is connected with derricking gear, fixed company in the middle part of the bottom of the upper die holder It is connected to punch-pin, the front and back of the upper die holder bottom and two sides for being located at punch-pin are fixedly connected to guide plate mounting base, four institutes The two sides for stating guide plate mounting base are fixedly connected to guide plate, and the inside of four guide plate mounting bases offers guide hole, described The bottom of upper die holder and it is located at guide plate mounting base and far from the side of punch-pin is fixedly connected with nitrogen gas spring contact block, the upper die holder The back side be fixedly connected with mold designation card, the middle top of the lower die holder is fixedly connected with cavity plate, the interior bottom of the cavity plate It is fixedly connected with cooling fin limit in the middle part of wall, is inlaid with ejection device assembly, the lower die holder top in the middle part of the inner bottom wall of the cavity plate The front and back in portion and be located at cavity plate two sides be fixedly connected to guide post mounting base, the top of four guide post mounting bases is equal It is fixedly connected with guide post, four guide post mounting bases are fixedly connected to nitrogen gas spring mounting base far from the side of cavity plate, and four It is fixedly connected to nitrogen gas spring at the top of a nitrogen gas spring mounting base, is fixedly connected at the top of four guide posts The dead block of pier；

The ejection device assembly includes sleeve, and the inside of the sleeve is fixedly connected with reset spring, the reset spring Top and be located at sleeve internal activity be connected with angled slide block；The derricking gear includes limit card board, the limit card board Left side be connected with hanger rod.

Preferably, eight lifting lugs are made of left and right two halves, and the gap between the two halves of left and right is not less than ten lis Rice.

Preferably, the surface of eight hanger rods offers a guide groove, and guide groove length is less than the length and depth of hanger rod Degree is not less than one centimetre, and the limit card board is intermediate projective structure, and protrusion operative tip is bonded with guide groove.

Preferably, cavity plate is run through in the bottom of the ejection device assembly, and the top of sleeve and the inner bottom wall of cavity plate are in same water In plane, the height of four nitrogen gas springs is above the height of guide post.

Preferably, the outer diameter of the punch-pin is less than the internal diameter of cavity plate, and error range is within two.

Preferably, eight hanger rods run through lifting lug and diameter length is all identical.

Preferably, the length of the upper die holder and lower die holder, width and material are all the same.

(3) beneficial effect

Compared with prior art, the utility model provides a kind of semiconductor plastic package die that can prevent cooling fin deviation, Have it is following the utility model has the advantages that

1, this can prevent the semiconductor plastic package die of cooling fin deviation, by guide plate, guide hole and guide post, play in molding Guiding role can reduce the hard contact to nitrogen gas spring by nitrogen gas spring contact block in molding, by nitrogen gas spring, Buffer function can be played in molding, avoid mold damage due to excessive velocities, the reinforcing rib can enhance the whole steady of mold It is qualitative, mold weight can be made to mitigate by lightening hole, save cost, by lifting lug and boom hoisting, can facilitate mold molding, Debugging or the lifting of transportational process middle rolling car, are limited by cooling fin, the position of cooling fin can be limited in punching course, is avoided Cooling fin deviation.

2, this can prevent the semiconductor plastic package die of cooling fin deviation, pass through the protrusion part on limit card board top and hanger rod The guide groove fitting that surface opens up, guaranteeing that hanger rod can twitch not can be rotated, and guarantee that it, without departing from lifting lug, passes through reset spring And angled slide block, finished product can be jacked up automatically after the completion of punching press from cavity plate inner wall, conveniently be taken.

Detailed description of the invention

FIG. 1 is a schematic structural view of the utility model；

Fig. 2 is the utility model backing-out punch component structure diagram；

Fig. 3 is the utility model hanger rod and limit card board attachment structure schematic diagram；

Fig. 4 is that the utility model cavity plate and cooling fin limit attachment structure schematic diagram.

In figure: 1 upper die holder, 2 punch-pin, 3 reinforcing ribs, 4 lightening holes, 5 guide plate mounting bases, 6 guide plates, 7 guide holes, 8 nitrogen gas springs Contact block, 9 lifting lugs, 10 derricking gears, 11 mold designation cards, 12 lower die holders, 13 cavity plates, the limit of 14 cooling fins, 15 backing-out punch groups Part, 16 guide post mounting bases, 17 guide posts, 18 nitrogen gas spring mounting bases, 19 nitrogen gas springs, 20 sleeves, 21 reset springs, 22 ejections Block, 23 hanger rods, 24 limit card boards, the dead block of 25 piers.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Please refer to Fig. 1-4, a kind of semiconductor plastic package die preventing cooling fin deviation, including upper die holder 1 and lower die holder 12, the length of upper die holder 1 and lower die holder 12, width and material are all the same, and the outside of upper die holder 1 and lower die holder 12 is fixedly connected with There is reinforcing rib 3, reinforcing rib 3 can enhance the overall stability of mold, and lightening hole 4 is offered between two adjacent said ribs 3, mitigate Hole 4 can be such that mold weight mitigates, and save cost, and the front and back of 12 two sides of upper die holder 1 and lower die holder is fixedly connected to lifting lug 9, Eight lifting lugs 9 are made of left and right two halves, and the gap between the two halves of left and right is not less than ten centimetres, the inside of eight lifting lugs 9 It is connected with derricking gear 10, by lifting lug 9 and boom hoisting 10, can facilitate mold in molding, debugging or transportational process The lifting of driving, the bottom middle part of upper die holder 1 are fixedly connected with punch-pin 2, and the outer diameter of punch-pin 2 is less than the internal diameter of cavity plate 13, and Error range within two, the front and back of 1 bottom of upper die holder and be located at punch-pin 2 two sides be fixedly connected to guide plate installation Seat 5, guide plate mounting base 5 can provide support and mounting surface, and the two sides of four guide plate mounting bases 5 are fixedly connected to guide plate 6, guide plate 6 provide guiding role in clamping process, and the inside of four guide plate mounting bases 5 offers guide hole 7, and guide hole 7 is in clamping process Middle offer guiding role, the bottom of upper die holder 1 and is located at guide plate mounting base 5 and far from the side of punch-pin 2 is fixedly connected with nitrogen bullet Spring contact block 8, the back side of upper die holder 1 are fixedly connected with mold designation card 11, and mold designation card 11 can be used to the volume of marking mould Number, the other informations such as type and brand, the middle top of lower die holder 12 is fixedly connected with cavity plate 13, the inner bottom wall middle part of cavity plate 13 It is fixedly connected with cooling fin limit 14, cooling fin limit 14 can limit the position of cooling fin in clamping process, prevent its movement, Ejection device assembly 15 is inlaid in the middle part of the inner bottom wall of cavity plate 13, the bottom of ejection device assembly 15 runs through cavity plate 13, ejects device assembly 15 can eject stamping parts after mould punching, the front and back at the top of the lower die holder 12 and two sides for being located at cavity plate 13 are solid Surely it is connected with guide post mounting base 16, the top of four guide post mounting bases 16 is fixedly connected to guide post 17, and guide post 17 can mold Guiding role is provided in the process, and four guide post mounting bases 16 are fixedly connected to nitrogen gas spring mounting base far from the side of cavity plate 13 18, the top of four nitrogen gas spring mounting bases 18 is fixedly connected to nitrogen gas spring 19, concrete model X-1000-100, material For spring steel, type is free type gas spring, and medium is nitrogen, stroke 80mm, and the height of four nitrogen gas springs 19 is above The height of guide post 17, nitrogen gas spring 19 can play buffer function in molding, avoid mold damage due to excessive velocities, four are led The top of column 17 is fixedly connected to the dead block 25 of pier, and the dead block 25 of pier can avoid guide post 17 and 7 inner wall of guide hole straight when molding on earth Contact；

Ejecting device assembly 15 includes sleeve 20, and the top of sleeve 20 and the inner bottom wall of cavity plate 13 are in same level, set The inside of cylinder 20 is fixedly connected with reset spring 21, the top of the reset spring 21 and internal activity for being located at sleeve 20 is connected with top Finished product can be jacked up after the completion of punching press from 13 inner wall of cavity plate automatically, conveniently be taken by block 22 out, reset spring 21 and angled slide block 22 It takes；Derricking gear 10 includes limit card board 24, and limit card board 24 is intermediate projective structure, and protrusion operative tip is bonded with guide groove, The left side of limit card board 24 is connected with hanger rod 23, and eight hanger rods 23 run through lifting lug 9 and diameter length is all identical, and eight are hung The surface of stick 23 offers a guide groove, and guide groove length is less than the length of hanger rod 23 and depth is not less than one centimetre.

In conclusion this can prevent the semiconductor plastic package die of cooling fin deviation, by guide plate 6, guide hole 7 and guide post 17, Guiding role is played in molding, by nitrogen gas spring contact block 8, can be reduced in molding and the hardness of nitrogen gas spring 19 is connect Touching can play buffer function in molding, avoid mold damage due to excessive velocities, the reinforcing rib 3 by nitrogen gas spring 19 The overall stability that mold can be enhanced can be such that mold weight mitigates by lightening hole 4, save cost, by lifting lug 9 and play lifting 10 are set, can facilitate mold can be in punching press by cooling fin limit 14 in molding, debugging or the lifting of transportational process middle rolling car The position that cooling fin is limited in journey, avoids cooling fin deviation.

This can prevent the semiconductor plastic package die of cooling fin deviation, protrusion part and hanger rod by 24 top of limit card board The guide groove fitting that 23 surfaces open up, guaranteeing that hanger rod 23 can twitch not can be rotated, and guarantee it without departing from lifting lug 9, by multiple Finished product can be jacked up after the completion of punching press from 13 inner wall of cavity plate automatically, conveniently be taken by position spring 21 and angled slide block 22.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that There is also other identical elements in process, method, article or equipment including the element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims (7)

1. one kind can prevent the semiconductor plastic package die of cooling fin deviation, including upper die holder (1) and lower die holder (12), feature exists In: it is fixedly connected to reinforcing rib (3) on the outside of the upper die holder (1) and lower die holder (12), between two adjacent said ribs (3) It offering lightening hole (4), the front and back of the upper die holder (1) and lower die holder (12) two sides is fixedly connected to lifting lug (9), and eight The internal activity of a lifting lug (9) is connected with derricking gear (10), is fixedly connected in the middle part of the bottom of the upper die holder (1) convex Mould (2), the front and back of upper die holder (1) bottom and the two sides for being located at punch-pin (2) are fixedly connected to guide plate mounting base (5), The two sides of four guide plate mounting bases (5) are fixedly connected to guide plate (6), and the inside of four guide plate mounting bases (5) is equal It offers guide hole (7), the bottom of the upper die holder (1) and is located at guide plate mounting base (5) and is fixedly connected far from the side of punch-pin (2) Have nitrogen gas spring contact block (8), the back side of the upper die holder (1) is fixedly connected with mold designation card (11), the lower die holder (12) middle top is fixedly connected with cavity plate (13), and cooling fin limit is fixedly connected in the middle part of the inner bottom wall of the cavity plate (13) (14), ejection device assembly (15), the front and back at the top of the lower die holder (12) are inlaid in the middle part of the inner bottom wall of the cavity plate (13) And the two sides for being located at cavity plate (13) are fixedly connected to guide post mounting base (16), the top of four guide post mounting bases (16) is equal It is fixedly connected with guide post (17), four guide post mounting bases (16) are fixedly connected to nitrogen bullet far from the side of cavity plate (13) Spring mounting base (18) is fixedly connected to nitrogen gas spring (19) at the top of four nitrogen gas spring mounting bases (18), four institutes It states and is fixedly connected to the dead block of pier (25) at the top of guide post (17)；

The ejection device assembly (15) includes sleeve (20), and the inside of the sleeve (20) is fixedly connected with reset spring (21), The top of the reset spring (21) and be located at sleeve (20) internal activity be connected with angled slide block (22)；The derricking gear (10) include limit card board (24), be connected with hanger rod (23) on the left of the limit card board (24).

2. the semiconductor plastic package die that one kind according to claim 1 can prevent cooling fin deviation, it is characterised in that: eight The lifting lug (9) is made of left and right two halves, and the gap between the two halves of left and right is not less than ten centimetres.

3. the semiconductor plastic package die that one kind according to claim 1 can prevent cooling fin deviation, it is characterised in that: eight The surface of the hanger rod (23) offers a guide groove, and guide groove length is less than the length of hanger rod (23) and depth is not less than one li Rice, the limit card board (24) are intermediate projective structure, and protrusion operative tip is bonded with guide groove.

4. the semiconductor plastic package die that one kind according to claim 1 can prevent cooling fin deviation, it is characterised in that: described Cavity plate (13) are run through in the bottom for ejecting device assembly (15), and the top of sleeve (20) and the inner bottom wall of cavity plate (13) are in same level Interior, the height of four nitrogen gas springs (19) is above the height of guide post (17).

5. the semiconductor plastic package die that one kind according to claim 1 can prevent cooling fin deviation, it is characterised in that: described The outer diameter of punch-pin (2) is less than the internal diameter of cavity plate (13), and error range is within two.

6. the semiconductor plastic package die that one kind according to claim 1 can prevent cooling fin deviation, it is characterised in that: eight The hanger rod (23) runs through lifting lug (9) and diameter length is all identical.

7. the semiconductor plastic package die that one kind according to claim 1 can prevent cooling fin deviation, it is characterised in that: described The length of upper die holder (1) and lower die holder (12), width and material are all the same.