CN208796976U - Transportation system and base plate processing system - Google Patents

Abstract

The utility model provides a kind of transportation system and base plate processing system that can make delivery precision raising.The transportation system of one embodiment is a kind of transportation system of handled object, it has the fork for keeping and conveying handled object and the mounting table for conveying destination or delivery source as handled object, the fork has with the rear-face contact of the handled object the multiple maintaining parts for keeping the handled object, the mounting table has the multiple supporting parts for the handover that the handled object is carried out between the fork, for the relative position of the multiple maintaining part and the multiple supporting part, at the position for joining the handled object between the fork and the mounting table, two line segment angulations by a maintaining part and the two supporting part connection adjacent with one maintaining part in the multiple maintaining part are by two line segment institutes of one maintaining part and the two maintaining part connection adjacent with one maintaining part At angle more than.

Description

Transportation system and base plate processing system

Technical field

The utility model relates to a kind of transportation system and base plate processing systems.

Background technique

There is known have to carry out the base plate processing system of the conveying mechanism of the conveying of wafer in multiple intermodules.At substrate In reason system, conveying mechanism inputs wafer into each module, by wafer to from the mounting table liter outstanding being configured in each module Drop pin handover.Conveying mechanism includes arm, rotatable and flexible；Fork, is set to the top of arm, for keeping wafer, passes through Revolution of arm and flexible, carries out the conveying of wafer in multiple intermodules.

If existing due to impact when stopping conveying wafer at a high speed using such conveying mechanism and generating wafer The case where dislocation.Therefore, in the past, misplace in order to prevent, be provided with using the upper surface in fork with the rear-face contact of wafer and protected Hold the conveying mechanism of the pad of wafer (for example, referring to patent document 1).

Existing technical literature

Patent document

Patent document 1: Japanese Unexamined Patent Publication 2014-99542 bulletin

Utility model content

Utility model will solve the problems, such as

However, there is the case where pad is bonded to the back side of wafer in above-mentioned conveying mechanism.If pad is bonded to wafer The back side, then there are following situations: when by wafer to the mounting table lifter pin handover outstanding from each module, wafer is being gone up and down Pin upper vibration and generate dislocation, delivery precision reduction.

Therefore, in view of the above problems, and it is an object of the present invention to provide a kind of transportation system that delivery precision can be made to improve.

The solution to the problem

In order to achieve the above objectives, the transportation system of the first method of the utility model is a kind of delivery system of handled object System has holding and conveys the fork of handled object and the mounting table for conveying destination or delivery source as handled object, Wherein, the fork has with the rear-face contact of the handled object the multiple maintaining parts for keeping the handled object, the load Multiple supporting parts that platform has the handover that the handled object is carried out between the fork are set, for the multiple maintaining part and institute The relative position for stating multiple supporting parts, in the position for joining the handled object between the fork and the mounting table Place, by two of a maintaining part and the two supporting part connection adjacent with one maintaining part in the multiple maintaining part Line segment angulation is two by one maintaining part and the two maintaining part connection adjacent with one maintaining part It is more than line segment angulation.

The second method of the utility model provides the transportation system according to first method, which is characterized in that will be located Reason body position for being joined between the fork and the mounting table is following position: linking the multiple maintaining part and shape At polygon center of gravity it is consistent with the center of gravity of polygon for linking the multiple supporting part and being formed.

The Third Way of the utility model provides the transportation system according to first or second mode, which is characterized in that The multiple maintaining part is 3, and the multiple supporting part is 3.

The fourth way of the utility model provides the transportation system according to the first either type into Third Way, It is characterized in that, the coefficient of friction between the multiple maintaining part and the back side of the handled object is 0.2 or more.

5th mode of the utility model provides the transportation system according to the first either type into Third Way, It is characterized in that, the Shore hardness of the multiple maintaining part is 100 or less.

6th mode of the utility model provides the transportation system according to the first either type into Third Way, It is characterized in that, the multiple maintaining part is formed by fluorubber.

7th mode of the utility model provides the transportation system according to either type in the first to the 6th mode, It is characterized in that, the multiple maintaining part has the retaining surface for keeping the handled object, and the retaining surface is relative to described The upper surface of fork is obliquely arranged.

The eighth mode of the utility model provides the transportation system according to either type in the first to the 6th mode, It is characterized in that, the multiple maintaining part is respectively relative to the circumferential to make a reservation for of the imaginary circle at the center by the multiple maintaining part Angle tilt be arranged.

9th mode of the utility model provides a kind of base plate processing system, has: conveying chamber, has for keeping And convey the fork of handled object；Load room, there is mounting table for loading the handled object, the fork have with it is described The rear-face contact of handled object keeps multiple maintaining parts of the handled object, the mounting table have between the fork into Multiple supporting parts of the handover of the row handled object, for the opposite position of the multiple maintaining part and the multiple supporting part It sets, at the position for joining the handled object between the fork and the mounting table, by the multiple maintaining part In a maintaining part and the connection of adjacent with one maintaining part two supporting parts two line segment angulations be by It is more than one maintaining part and two line segment angulations of two maintaining part adjacent with one maintaining part connection.

Tenth mode of the utility model provides the base plate processing system according to the 9th mode, which is characterized in that institute It states conveying chamber and is retained atmospheric pressure atmosphere.

The effect of utility model

According to disclosed transportation system, delivery precision can be made to improve.

Detailed description of the invention

Fig. 1 is the skeleton diagram for the base plate processing system that the transportation system of the embodiments of the present invention is applicable in.

Fig. 2 is the figure for indicating the 1st structural example of transportation system of the embodiments of the present invention.

Fig. 3 is the figure (1) being illustrated for the shape of the pad to setting to the upper surface of fork.

Fig. 4 is the figure (2) being illustrated for the shape of the pad to setting to the upper surface of fork.

Fig. 5 is the figure (3) being illustrated for the shape of the pad to setting to the upper surface of fork.

Fig. 6 is the figure (4) being illustrated for the shape of the pad to setting to the upper surface of fork.

Fig. 7 is the figure for indicating the 2nd structural example of transportation system of the embodiments of the present invention.

Fig. 8 is the figure for indicating the 3rd structural example of transportation system of the embodiments of the present invention.

Description of symbols

1, base plate processing system；10, transfer module；11, conveying mechanism；13, it pitches；20, technical module；21, objective table； 22, lifter pin；30, loading module；32, locator；33, objective table；34, protrusion；35, conveying mechanism；37, it pitches；38, it pads； 40, interlocking module is loaded；41, objective table；42, lifter pin；W, wafer.

Specific embodiment

Hereinafter, being illustrated referring to attached drawing to the mode for implementing the utility model.In addition, in the specification and drawings In, for substantially the same structure, by marking identical appended drawing reference, so that the repetitive description thereof will be omitted.

(base plate processing system)

One example of the base plate processing system that the transportation system as the embodiments of the present invention is applicable in, to can The base plate processing system for singlely implementing the various processing such as corona treatment to the wafer as handled object is illustrated.Figure 1 is the skeleton diagram of base plate processing system that is applicable in of transportation system of the embodiments of the present invention.In Fig. 1, for side Just illustrate, the diagram of top plate of each module of base plate processing system etc. is omitted.

As shown in Figure 1, base plate processing system 1 has transfer module 10,6 technical modules 20, loading modules 30 and two A load interlocking module 40.

Transfer module 10 has substantially pentagon shaped when looking down.Transfer module 10 is made of vacuum chamber, is matched in inside It is equipped with conveying mechanism 11.Conveying mechanism 11 includes guide rail (not shown)；Two arms 12；And fork 13, it is configured at each arm 12 Top, for supporting wafer W.Each arm 12 is that selection compliance puts together machines arm type (Japanese: ス カ ラ ア ー system タ イ プ), be configured to revolution, it is capable of expansion and contraction.Conveying mechanism 11 is moved along guide rail, technical module 20, load interlocking module 40 it Between convey wafer W.

Technical module 20 radial configuration and is connect around transfer module 10 with transfer module 10.Technical module 20 It is made of vacuum chamber, has and be configured to internal columned objective table 21.Objective table 21, which has from upper surface, to be protruded freely Multiple thin 3 rodlike lifter pins 22.Each lifter pin 22 is configured at when looking down on same circumference, by from the upper of objective table 21 Surface is prominent, supports and lift the wafer W for being placed into objective table 21, also, by being retracted into objective table 21, make to be supported Wafer W to objective table 21 load.Technical module 20 depressurizes inside and is led after wafer W is placed on objective table 21 Enter processing gas, further to inside apply RF power and generate plasma, using plasma to wafer W implement etc. from Daughter processing.Transfer module 10 and technical module 20 are separated by the gate valve 23 for being opened and closed freely.

Loading module 30 is relatively configured with transfer module 10.Loading module 30 is rectangular-shape, is to be retained atmosphere It calms the anger the Atmospheric Transportation room of atmosphere.Interlocking module is loaded there are two connecting in the one side alongst of loading module 30 40.3 load ports 31 are connected in the another side alongst of loading module 30.As the multiple wafer W's of receiving The FOUP (front open type wafer feeder, Front-Opening Unified Pod) of container is placed in load ports 31.Loading mould The one side along short side direction of block 30 is connected with locator 32.In addition, being configured with conveying mechanism 35 in loading module 30.

Locator 32, which has, is configured to internal columned objective table 33.It is provided in objective table 33 prominent from upper surface The multiple thin 3 rodlike protrusions 34 come.Each protrusion 34 is configured at when looking down on same circumference, by objective table 33 (or arm 36 declines) is risen, supports and lifts wafer W.Locator 32 is to adjust wafer W relative to load interlocking module 40 Used in transfer position.Specifically, locator 32 is to the center of wafer W and the notch of wafer W relative to wafer W's The direction at center is detected, and is adjusted to the transfer position of wafer W, so that in load interlocking module 40 in wafer W Heart position and the direction of notch become predetermined position and predetermined direction.

Conveying mechanism 35 includes guide rail (not shown)；Arm 36；And fork 37, it is configured at the top of arm 36, for supporting Wafer W.Arm 36 is that selection compliance puts together machines arm type, is configured to move freely along guide rail, also, be configured to back Turn, is capable of expansion and contraction.In loading module 30, conveying mechanism 35 is in FOUP (not shown), the locator for being placed on each load ports 31 Wafer W is conveyed between 32 and load interlocking module 40.

Load interlocking module 40 is configured between transfer module 10 and loading module 30.Load interlocking module 40 by can will in Portion switches to vacuum, the internal pressure variable cells of atmospheric pressure are constituted, and has and is configured to internal columned objective table 41.Load interlocking Module 40 when wafer W is inputted from loading module 30 to transfer module 10, so that inside is maintained atmospheric pressure and from loading After module 30 has received wafer W, inside is depressurized and inputs wafer W to transfer module 10.In addition, by wafer W from When transfer module 10 is exported to loading module 30, inside is maintained into vacuum and from transfer module 10 have received wafer W it Afterwards, inside is made to boost to atmospheric pressure and input wafer W to loading module 30.Objective table 41 has from prominent freely more in upper surface A thin 3 rodlike lifter pins 42.Each lifter pin 42 is configured at when looking down on same circumference, passes through the upper table from objective table 41 Face is prominent, supports and lift wafer W, also, by being retracted into objective table 41, carries supported wafer W to objective table 41 It sets.

Base plate processing system 1 has the control device 50 being made of such as computer.Control device 50 is to processing substrate system The movement of each component of system 1 is controlled.

(transportation system)

(the 1st structural example)

1st structural example of the transportation system of the embodiments of the present invention is illustrated.Fig. 2 is to indicate that this is practical new The figure of 1st structural example of the transportation system of the embodiment of type, fork 37 and loading when indicating to overlook at the position of handover wafer W The positional relationship of platform 41.

As shown in Fig. 2, the transportation system of the 1st structural example includes the fork 37 for the conveying mechanism 35 being configured in loading module 30 With the lifter pin 42 for the objective table 41 being configured in load interlocking module 40.

Fork 37 is made of the planar plate members of forked.Fork 37 upper surface, be provided on the same circumference 3 pad 38a, 38b、38c。

Each pad 38a, 38b, 38c keeps wafer W with the rear-face contact of wafer W when fork 37 supports wafer W.It is preferred that each The coefficient of friction padded between 38a, 38b, 38c and the back side of wafer W is 0.2 or more.Thereby, it is possible to prevent to convey wafer at a high speed When W as stopping when impact etc. caused by wafer W dislocation.Additionally, it is preferred that respectively padding the Shore hardness of 38a, 38b, 38c is 100 or less.Thereby, it is possible to prevent with convey at a high speed when wafer W as stopping when impact etc. caused by wafer W dislocation. As the material of such pad 38a, 38b, 38c, can enumerate such as Viton (registered trademark), Kalrez (registered trademark) Fluorubber.

Each lifter pin 42a, 42b, 42c at the position for joining wafer W between fork 37 and objective table 41 to be located at fork The mode of the inner or outer side of 37 forked section configures.Each lifter pin 42a, 42b, 42c do not interfere with fork 37 as a result, energy It is enough to protrude upwards.Therefore, it is located in the upper end of each lifter pin 42a, 42b, 42c upper than each pad 38a, 38b, 38c of fork 37 When holding position against the top, the rear-face contact of each lifter pin 42a, 42b, 42c and wafer W and lift wafer W.On the other hand, exist When the upper end of each lifter pin 42a, 42b, 42c are located at the upper end position on the lower than each pad 38a, 38b, 38c, respectively pad 38a, The rear-face contact of 38b, 38c and wafer W and support wafer W.I.e., in the transportation system of the embodiments of the present invention, respectively Lifter pin 42a, 42b, 42c are moved along up and down direction, the relative position relative to fork 37 are changed, to carry out the friendship of wafer W It connects.

Then, pad 38 and the relative position of lifter pin 42 are illustrated.

Pad the relative position of 38a, 38b, 38c and lifter pin 42a, 42b, 42c by wafer W fork 37 and objective table 41 it Between meet relationship below at the position that joins.If being conceived to pad 38a, 38a and two lifter pins adjacent with pad 38a will be padded Two line segment angulation θ 1 of 42b, 42c connection are will pad 38a and link with adjacent two pads 38b, the 38c of 38a are padded Two 2 or more line segment angulation θ.In the case where being conceived to pad 38b, 38c, also meet same relationship.If i.e., having in mind In pad 38b, then will pad 38b and with pad 38b it is adjacent two lifter pins 42c, 42a connection two line segment angulations be by Pad 38b and two line segment angulations of two pad 38c, 38a connection adjacent with pad 38b or more.Will pad 38c and with pad Two line segment angulations of 38c adjacent two lifter pins 42a, 42b connection are will to pad 38c and adjacent with pad 38c two It is more than two line segment angulations of a pad 38a, 38b connection.As a result, when joining wafer W from fork 37 to objective table 41, Even in the case that pad 38 is affixed to the back side of wafer W, the handover of stable wafer W can also be carried out, delivery precision is improved.

For example, in the case where 1 pad 38 has been removed from the back side of wafer W first, can using 3 lifter pins 42 come With the reaction force that 3 points keep two removings of pad 38 of residue at the back side that will be affixed to wafer W and generate when release.Therefore, The vibration for inhibiting the wafer W on lifter pin 42 can carry out the handover of stable wafer W, improve delivery precision.In addition, can subtract The contact damage gently generated due to the rear-face contact of lifter pin 42 and wafer W.In addition, for example, first by two pads 38 from In the case that the back side of wafer W has been removed, by being set as 1 >=θ of θ 2, so as to make residue 1 of the back side for being affixed to wafer W Pad 38 is stripped and the reaction force dispersion that generates when being released.Therefore, the vibration for inhibiting the wafer W on lifter pin 42, can The handover of stable wafer W is carried out, delivery precision is improved.In addition, can reduce the rear-face contact due to lifter pin 42 and wafer W And the contact damage generated.

It is preferred that being following position by the position joined between fork 37 and objective table 41 wafer W: 38a, 38b, 38c will be padded Connection and formed barycenter oftriangle G38 with by lifter pin 42a, 42b, 42c link and formed barycenter oftriangle G42 mono- It causes.It is particular enable to inhibit the vibration of wafer W when wafer W to be handed off to lifter pin 42a, 42b, 42c as a result,.

Then, it is illustrated based on example of Fig. 3~Fig. 6 to the shape of pad 38.But the shape of pad 38 is not limited to Fig. 3~shape shown in fig. 6.Fig. 3~Fig. 6 is for being illustrated to the shape being arranged to the pad 38 of the upper surface of fork 37 Figure.Fig. 3~Fig. 6 is figure when pitching 37 and objective table 41 from side when pad 38 remains wafer W.

The upper end of pad 38P shown in Fig. 3 has flat retaining surface, when fork 37 supports wafer W, pads the holding of 38P The rear-face contact of face and wafer W keeps wafer W.In this configuration, it pads 38P and the contact area at the back side of wafer W is larger, because This, can prevent to convey the dislocation when wafer W at a high speed.

Pad 38Q shown in Fig. 4 is that the retaining surface of pad 38P shown in Fig. 3 is obliquely arranged relative to the upper surface of fork 37.? In the structure, can make to pad the contact between 38Q and the back side of wafer W becomes point contact.Therefore, weaken pad 38Q and be bonded to crystalline substance The power at the back side of circle W inhibits the vibration of the wafer W on lifter pin 42 when joining wafer W from fork 37 to objective table 41, can The handover of stable wafer W is carried out, delivery precision is improved.In addition, for upper surface of the retaining surface relative to fork 37 for padding 38Q Inclined direction, both can multiple pad 38Q all tilted to identical direction, can also respectively pad 38Q and be tilted to different direction.Separately Outside, for pad 38Q retaining surface relative to fork 37 upper surface inclination angle, both can multiple pad 38Q be entirely identical angle Degree, can also respectively pad 38Q and be different angle.

Pad 38R shown in fig. 5 be it is shown in Fig. 3 pad 38P retaining surface relative to fork 37 upper surface be obliquely arranged, and Multiple pad 38R are respectively relative to be arranged by the circumferential of imaginary circle at the center of multiple pad 38R with scheduled angle tilt. I.e., multiple pad 38R are obliquely arranged as the blade of electric fan.In this configuration, even if for concave after process Or convex produces the wafer W of warpage, and whole contacts between multiple pad 38R and the back side of wafer W can also be made to become point Contact.Therefore, the state of the warpage regardless of wafer W, all weaken pad 38R be bonded to wafer W the back side power, from fork 37 When joining wafer W to objective table 41, inhibits the vibration of the wafer W on lifter pin 42, the handover of stable wafer W can be carried out. As a result, improving delivery precision.

Pad 38S shown in fig. 6 has hemispherical protrusion 38S1 in upper surface, when fork 37 supports wafer W, pads 38S The upper end of protrusion 38S1 and the rear-face contact of wafer W keep wafer W.In this configuration, can make to pad 38S's and wafer W Contact between the back side becomes point contact.Therefore, weaken the power that pad 38S is bonded to the back side of wafer W, from fork 37 to objective table When 41 handover wafer W, inhibits the vibration of the wafer W on lifter pin 42, the handover of stable wafer W can be carried out, improve conveying Precision.In addition, the shape of protrusion 38S1 be not limited to it is hemispherical, as long as making contact between the back side of wafer W can be made For point contact, just it is also possible to other shapes.As other shapes, can enumerate for example triangular shaped.

(the 2nd structural example)

2nd structural example of the transportation system of the embodiments of the present invention is illustrated.Fig. 7 is to indicate that this is practical new The figure of 2nd structural example of the transportation system of the embodiment of type, fork 37 and loading when indicating to overlook at the position of handover wafer W The positional relationship of platform 33.

As shown in fig. 7, the transportation system of the 2nd structural example includes the fork 37 for the conveying mechanism 35 being configured in loading module 30 And it is configured to the protrusion 34 of the objective table 33 in locator 32.

Fork 37 is made of the planar plate members of forked.Fork 37 upper surface, be provided on the same circumference 3 pad 38a, 38b、38c。

Each pad 38a, 38b, 38c keeps wafer W with the rear-face contact of wafer W when fork 37 supports wafer W.It is preferred that each The coefficient of friction padded between 38a, 38b, 38c and the back side of wafer W is 0.2 or more.Thereby, it is possible to prevent to convey wafer at a high speed Dislocation when W.Additionally, it is preferred that the Shore hardness for respectively padding 38a, 38b, 38c is 100 or less.It is defeated with high speed thereby, it is possible to prevent Send the dislocation when wafer W.Specifically, can properly use such as Viton (registrar as each pad 38a, 38b, 38c Mark), the fluorubber such as Kalrez (registered trademark).

Objective table 33 and each protrusion 34a, 34b, 34c are in the position for joining wafer W between fork 37 and objective table 33 The mode that the place of setting is located at the inside of the forked section of fork 37 configures.As a result, objective table 33 and each protrusion 34a, 34b, 34c not with 37 interference of fork, it will be able to be moved upward.Therefore, it is located at each pad than fork 37 in the upper end of each protrusion 34a, 34b, 34c When the position against the top of the upper end of 38a, 38b, 38c, the rear-face contact of each protrusion 34a, 34b, 34c and wafer W and lift crystalline substance Circle W.On the other hand, it is located at the position of upper end on the lower than each pad 38a, 38b, 38c in the upper end of each protrusion 34a, 34b, 34c When setting, respectively pads the rear-face contact of 38a, 38b, 38c and wafer W and support wafer W.I.e., in the embodiments of the present invention In transportation system, objective table 33 and each protrusion 34a, 34b, 34c are moved along up and down direction, are changed relative to the opposite of fork 37 Position, to carry out the handover of wafer W.

Then, pad 38 and the relative position of protrusion 34 are illustrated.

Pad the relative position of 38a, 38b, 38c and protrusion 34a, 34b, 34c by wafer W fork 37 and objective table 33 it Between meet relationship below at the position that joins.If being conceived to pad 38a, 38a and two protrusions adjacent with pad 38a will be padded Two line segment angulation θ 11 of 34b, 34c connection are will pad 38a and link with adjacent two pads 38b, the 38c of 38a are padded Two 12 or more line segment angulation θ.In the case where having pad 38b, 38c in mind, also meet same relationship.If i.e., In pad 38b, then will pad two line segment angulations that 38b and two protrusion 34c, the 34a adjacent with pad 38b link is eye It will be more than two line segment angulations for padding 38b and two pad 38c, 38a connection adjacent with pad 38b.If being conceived to pad 38c, then will pad 38c and with pad 38c it is adjacent two protrusions 34a, 34b connection line segment angulation be will pad 38c and It is more than the line segment angulation of two pad 38a, 38b connection adjacent with pad 38c.It is being handed over as a result, from fork 37 to objective table 33 When meeting wafer W, even can also carry out the handover of stable wafer W in the case that pad 38 is affixed to the back side of wafer W, mention High delivery precision.

For example, in the case where 1 pad 38 has been removed from the back side of wafer W first, can using 3 protrusions 34 with 3 points of reaction forces for keeping two removings of pad 38 of residue at the back side that will be affixed to wafer W and being generated when release.Therefore, press down The vibration of wafer W on protrusion 34 processed can carry out the handover of stable wafer W, improve delivery precision.In addition, for example, in head In the case where first two pads 38 have been removed from the back side of wafer W, by being set as 11 >=θ of θ 12, so as to make to be affixed to wafer 1 pad 38 of residue at the back side of W is stripped and the reaction force dispersion that generates when being released.Therefore, inhibit on protrusion 34 Wafer W vibration, can carry out the handover of stable wafer W, improve delivery precision.

Preferably, by wafer W, the position that joins is following position between fork 37 and objective table 33: will pad 38a, 38b, 38c link and the weight of the barycenter oftriangle G38 of formation and the triangle for forming protrusion 34a, 34b, 34c connection Heart G34 is consistent.It is particular enable to inhibit the vibration of wafer W when wafer W to be handed off to protrusion 34a, 34b, 34c as a result,.

In addition, also in the same manner as the 1st structural example, being able to use Fig. 3~various shape shown in fig. 6 in the 2nd structural example The pad 38 of shape.

(the 3rd structural example)

3rd structural example of the transportation system of the embodiments of the present invention is illustrated.Fig. 8 is to indicate that this is practical new The figure of 3rd structural example of the transportation system of the embodiment of type, fork 37 and loading when indicating to overlook at the position of handover wafer W The positional relationship of platform 41.

As shown in figure 8, the transportation system of the 3rd structural example includes the fork 37 for the conveying mechanism 35 being configured in loading module 30 And it is configured to the lifter pin 42 of the objective table 41 in load interlocking module 40.

The transportation system of 3rd structural example is provided with this point and the 1st of 4 pads 38a, 38b, 38c, 38d in the upper surface of fork 37 The transportation system of structural example is different.In addition, can be set as same as the transportation system of the 1st structural example for other structures Structure, therefore, a part omitted the description.

The relative position for padding 38a, 38b, 38c, 38d and lifter pin 42a, 42b, 42c wafer W is being pitched into 37 and objective table Meet relationship below at the position joined between 41.If being conceived to pad 38a, 38a will be padded and two adjacent with pad 38a rise Two line segment angulation θ 21 of drop pin 42b, 42c connection are will to pad 38a and two pad 38b, 38ds company adjacent with pad 38a Two 22 or more line segment angulation θ of knot.In the case where having pad 38b, 38c, 38d in mind, also meet same relationship. If i.e., being conceived to pad 38b, angle formed by the line segment of 38b and two lifter pins 42c, 42a connection adjacent with pad 38b will be padded Degree is will to pad 38b and the line segment angulation of two pad 38c, 38a connection adjacent with pad 38b or more.If being conceived to pad 38c, then will pad 38c and with pad 38c it is adjacent two lifter pins 42a, 42b connection line segment angulation be will pad 38c and It is more than the line segment angulation of two pad 38b, 38d connection adjacent with pad 38c.If be conceived to pad 38d, will pad 38d and The line segment angulation of two lifter pin 42a, 42bs connection adjacent with pad 38d is will to pad 38d and adjacent with pad 38d two It is more than the line segment angulation of a pad 38c, 38a connection.As a result, when joining wafer W from fork 37 to objective table 41, even if In the case where being the back side that pad 38 is affixed to wafer W, the handover of stable wafer W can also be carried out, improves delivery precision.

For example, in the case where 1 pad 38 has been removed from the back side of wafer W first, can using 3 lifter pins 42 with 3 points of reaction forces for keeping 3 removings of pad 38 of residue at the back side that will be bonded to wafer W and being generated when release.Therefore, inhibit The vibration of wafer W on lifter pin 42 can carry out the handover of stable wafer W, improve delivery precision.In addition, for example, first In the case that 3 pads 38 have been removed from the back side of wafer W, by being set as 21 >=θ of θ 22, so as to make to be affixed to wafer W's 1 pad 38 of residue at the back side is stripped and the reaction force dispersion that generates when being released.Therefore, inhibit the crystalline substance on lifter pin 42 The vibration of circle W, can carry out the handover of stable wafer W, improve delivery precision.

Preferably, by wafer W, the position that joins is following position between fork 37 and objective table 41: will pad 38a, 38b, 38c, 38d link and the center of gravity G38 of the quadrangle of formation and the triangle for forming lifter pin 42a, 42b, 42c connection Center of gravity G42 it is consistent.It is particular enable to inhibit the vibration of wafer W when wafer W to be handed off to lifter pin 42a, 42b, 42c as a result,.

In addition, also in the same manner as the 1st structural example, being able to use Fig. 3~various shape shown in fig. 6 in the 3rd structural example The pad 38 of shape.

In the above-described embodiment, objective table 21,33,41 is as the conveying destination of wafer W or the load of delivery source Set an example of platform.Lifter pin 22,42 and protrusion 34 are an examples of supporting part.Pad 38 is to maintain an example in portion Son.Transfer module 10 and loading module 30 are an examples of conveying chamber.Technical module 20, locator 32 and the mutual mode locking of load Block 40 is an example for loading room.

More than, the mode for implementing the utility model is illustrated, but above content does not limit utility model Content, various deformations and improvements can be carried out in the scope of the utility model.

In the above-described embodiment, enumerating pad 38 is to be illustrated in case where 3 or 4, but do not limit In this, such as it is also possible to 5 or more.In addition, enumerating lifter pin 22,42 and protrusion 34 is carried out in case where 3 Illustrate, but not limited to this, such as is also possible to 4 or more.In which case it is preferable that by wafer W in fork 37 and load The position joined between object platform 21,41,33 is following position: the center of gravity for the polygon that the connection of multiple pads 38 is formed and general Multiple lift pins 22,42 or protrusion 34 link and the center of gravity of the polygon of formation is consistent.It is particular enable to inhibit wafer as a result, The vibration of wafer W when W is handed off to lifter pin 22,42 or protrusion 34.

In addition, in the above-described embodiment, enumerating transportation system includes fork 37, each lifter pin 42 of objective table 41 or load It is illustrated for the structure of each protrusion 34 of object platform 33, but not limited to this.For example, transportation system is also possible to wrap It includes the fork 13 for the conveying mechanism 11 being configured in transfer module 10 and is configured to and load the objective table 41 in interlocking module 40 The structure of each lifter pin 42.In addition, for example, transportation system is also possible to include the conveying mechanism 11 being configured in transfer module 10 Fork 13 and the objective table 21 being configured in technical module 20 each lifter pin 22 structure.

Claims (10)

1. a kind of transportation system is the transportation system of handled object, have the fork for keeping and conveying handled object with And as the conveying destination of handled object or the mounting table of delivery source, which is characterized in that

The fork has with the rear-face contact of the handled object the multiple maintaining parts for keeping the handled object,

The mounting table has the multiple supporting parts for the handover that the handled object is carried out between the fork,

For the relative position of the multiple maintaining part and the multiple supporting part, by the handled object in the fork and institute It states at the position joined between mounting table,

By two of a maintaining part and the two supporting part connection adjacent with one maintaining part in the multiple maintaining part A line segment angulation is two by one maintaining part and the two maintaining part connection adjacent with one maintaining part It is more than a line segment angulation.

2. transportation system according to claim 1, which is characterized in that

The position that handled object is joined between the fork and the mounting table is following position: connection is the multiple Maintaining part and the center of gravity of polygon that is formed is consistent with the center of gravity of polygon for linking the multiple supporting part and being formed.

3. transportation system according to claim 1 or 2, which is characterized in that

The multiple maintaining part is 3, and the multiple supporting part is 3.

4. transportation system according to claim 1 or 2, which is characterized in that

Coefficient of friction between the multiple maintaining part and the back side of the handled object is 0.2 or more.

5. transportation system according to claim 1 or 2, which is characterized in that

The Shore hardness of the multiple maintaining part is 100 or less.

6. transportation system according to claim 1 or 2, which is characterized in that

The multiple maintaining part is formed by fluorubber.

7. transportation system according to claim 1 or 2, which is characterized in that

The multiple maintaining part has the retaining surface for keeping the handled object,

The retaining surface is obliquely arranged relative to the upper surface of the fork.

8. transportation system according to claim 1 or 2, which is characterized in that

The multiple maintaining part is respectively relative to the circumferential with scheduled angle of the imaginary circle at the center by the multiple maintaining part Degree is obliquely arranged.

9. a kind of base plate processing system, which is characterized in that it has:

Conveying chamber has the fork for keeping and conveying handled object；

Room is loaded, there is the mounting table for loading the handled object,

The fork has with the rear-face contact of the handled object the multiple maintaining parts for keeping the handled object,

The mounting table has the multiple supporting parts for the handover that the handled object is carried out between the fork,

For the relative position of the multiple maintaining part and the multiple supporting part, by the handled object in the fork and institute It states at the position joined between mounting table,

By two of a maintaining part and the two supporting part connection adjacent with one maintaining part in the multiple maintaining part A line segment angulation is two by one maintaining part and the two maintaining part connection adjacent with one maintaining part It is more than a line segment angulation.

10. base plate processing system according to claim 9, which is characterized in that

The conveying chamber is retained atmospheric pressure atmosphere.