CN208788181U - A kind of automation quartz wafer grinding device - Google Patents
A kind of automation quartz wafer grinding device Download PDFInfo
- Publication number
- CN208788181U CN208788181U CN201821608901.9U CN201821608901U CN208788181U CN 208788181 U CN208788181 U CN 208788181U CN 201821608901 U CN201821608901 U CN 201821608901U CN 208788181 U CN208788181 U CN 208788181U
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- cylinder
- gas bar
- connect
- polishing
- quartz wafer
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Abstract
The utility model relates to a kind of automation quartz wafer grinding devices, including conveyer belt, pusher, shedding mechanism, workpiece polishing mechanism, chip template, on the conveyor belt, the pusher is in the side of conveyer belt, and the shedding mechanism is in the other side of conveyer belt for the chip template, the workpiece polishing mechanism is equipped with sensor in the top of shedding mechanism, the side of the workpiece polishing mechanism.The utility model passes through the setting of automation quartz wafer grinding device, and the automation polishing after realizing the corrosion of quartz wafer improves grinding efficiency, while also improving the quality of quartz wafer.
Description
Technical field
The utility model relates to a kind of automation quartz wafer grinding devices.
Background technique
Quartz wafer after corrosion, polish by surface layer, and manual grinding not only low efficiency, while production cost
It is higher.
Summary of the invention
A kind of in order to overcome the deficiencies of the prior art, the utility model provides automation quartz wafer grinding device.
To solve the above problems, the technical scheme adopted by the utility model is
A kind of automation quartz wafer grinding device, including conveyer belt, pusher, shedding mechanism, workpiece polishing mechanism, chip
Template, on the conveyor belt, the pusher is in the side of conveyer belt, and the shedding mechanism is defeated for the chip template
The other side of band is sent, the workpiece polishing mechanism is equipped with sensor in the top of shedding mechanism, the side of the workpiece polishing mechanism,
The pusher includes mounting rack one, cylinder one, gas bar one, cylinder two, gas bar two, and push plate one is described
Cylinder one and cylinder two are mounted on mounting rack one, and described one one end of gas bar is connect with cylinder one, and the gas bar one is another
End is connect with push plate one, and described two one end of gas bar is connect with cylinder two, and two other end of gas bar is connect with push plate one,
The shedding mechanism includes mounting rack two, cylinder three, gas bar three, cylinder four, gas bar four, and push plate two is described
Cylinder three and cylinder four are mounted on mounting rack two, and described three one end of gas bar is connect with cylinder three, and the gas bar three is another
End is connect with push plate two, and described four one end of gas bar is connect with cylinder four, and four other end of gas bar is connect with push plate two,
The workpiece polishing mechanism includes workbench, locating rack, guide rail, cylinder five, gas bar five, movable block, cylinder six, gas bar
Six, cylinder seven, gas bar seven, polishing rack, motor of polishing, roller of polishing, transmission shaft, the locating rack is mounted on the upper of workbench
Side, the guide rail is mounted on the inside of locating rack, and the cylinder five is mounted on locating rack, described five one end of gas bar with
Cylinder five connects, and five other end of gas bar is connect with movable block, and the movable block is mounted on guide rail, the cylinder
Six and cylinder seven be mounted on movable block, described six one end of gas bar is connect with cylinder six, six other end of gas bar and is beaten
Frame connection is ground, the gas bar July 1st end is connect with cylinder seven, and seven other end of gas bar is connect with polishing rack, the biography
Moving axis is mounted on polishing rack, and the polishing roller is mounted on transmission shaft, the polishing motor and transmission axis connection.
As a preference, the conveyer belt is connected to motor.
As a preference, the chip template goes into battle and shows multiple groups quartz wafer.
As a preference, the workbench is equipped with limitting casing.
As a preference, the limitting casing is equipped with damping spring.
By adopting the above-described technical solution, compared with prior art, the utility model is beaten by automating quartz wafer
The setting of mill apparatus, the automation polishing after realizing the corrosion of quartz wafer, improves grinding efficiency, while also improving quartz
The quality of chip.
The utility model is described in further detail with reference to the accompanying drawings and detailed description simultaneously.
Detailed description of the invention
Fig. 1 is a kind of front view for automating quartz wafer grinding device of the utility model.
Fig. 2 is a kind of right view for automating quartz wafer grinding device of the utility model.
Fig. 3 is a kind of top view for automating quartz wafer grinding device of the utility model.
Fig. 4 is a kind of axonometric drawing for automating quartz wafer grinding device of the utility model.
In figure: 1, conveyer belt, 2, pusher, 21, mounting rack one, 22, cylinder one, 23, gas bar one, 24, cylinder two,
25, gas bar two, 26, push plate one, 3, shedding mechanism, 31, mounting rack two, 32, cylinder three, 33, gas bar three, 34, cylinder four, 35,
Gas bar four, 36, push plate two, 4, workpiece polishing mechanism, 4a, workbench, 4b, locating rack, 4c, guide rail, 4d, cylinder five, 4e, gas bar five,
4p, 4f, movable block, 4g, cylinder six, 4h, gas bar six, 4j, cylinder seven, 4k, gas bar seven, 4m, polishing rack, 4n, polishing motor are beaten
Grinding roller, 4q, transmission shaft, 4r, limitting casing, 4s, damping spring, 5, chip template, 6, sensor, 7, motor, 8, quartz wafer.
Specific embodiment
Embodiment:
As shown in Figs 1-4, a kind of automation quartz wafer grinding device, including conveyer belt 1, pusher 2, shedding mechanism
3, workpiece polishing mechanism 4, chip template 5, the chip template 5 is on conveyer belt 1, and the pusher 2 is the one of conveyer belt 1
Side, the shedding mechanism 3 is in the other side of conveyer belt 1, and in the top of shedding mechanism 3, described beats the workpiece polishing mechanism 5
The side of grinding machine structure 4 is equipped with sensor 6,
The pusher 2 includes mounting rack 1, and cylinder 1, gas bar 1, cylinder 2 24, gas bar 2 25 pushes away
Plate 1, the cylinder 1 and cylinder 2 24 are mounted on mounting rack 1, described one 23 one end of gas bar and cylinder one
22 connections, one 23 other end of gas bar are connect with push plate 1, and described 2 25 one end of gas bar is connect with cylinder 2 24, institute
2 25 other end of gas bar stated is connect with push plate 1,
The shedding mechanism 3 includes mounting rack 2 31, and cylinder 3 32, gas bar 3 33, cylinder 4 34, gas bar 4 35 pushes away
Plate 2 36, the cylinder 3 32 and cylinder 4 34 are mounted on mounting rack 2 31, described 3 33 one end of gas bar and cylinder three
32 connections, 3 33 other end of gas bar are connect with push plate 2 36, and described 4 35 one end of gas bar is connect with cylinder 4 34, institute
4 35 other end of gas bar stated is connect with push plate 2 36,
The workpiece polishing mechanism 4 includes workbench 4a, locating rack 4b, guide rail 4c, five 4d of cylinder, five 4e of gas bar, movable block
4f, six 4g of cylinder, six 4h of gas bar, seven 4j of cylinder, gas bar seven 4k, polishing rack 4m, polish motor 4n, and polish roller 4p, transmission shaft 4q,
The locating rack 4b is mounted on the top of workbench 4a, and the guide rail 4c is mounted on the inside of locating rack 4b, the gas
Five 4d of cylinder is mounted on locating rack 4b, and described five one end 4e of gas bar is connect with five 4d of cylinder, the five 4e other end of gas bar
It is connect with movable block 4f, the movable block 4f is mounted on guide rail 4c, and six 4g of cylinder and seven 4j of cylinder are mounted on work
On motion block 4f, described six one end 4h of gas bar is connect with six 4g of cylinder, and the six 4h other end of gas bar is connect with polishing rack 4m,
Described seven one end 4k of gas bar is connect with seven 4j of cylinder, and the seven 4k other end of gas bar is connect with polishing rack 4m, the biography
Moving axis 4q is mounted on polishing rack 4m, and the polishing roller 4p is mounted on transmission shaft 4q, the polishing motor 4n and transmission
Axis 4q connection.
Further, the conveyer belt 1 is connect with motor 7, and by the setting of motor 7, the conveying for conveyer belt 1 is provided
Power.
Further, the chip template 5, which is gone into battle, shows multiple groups quartz wafer 8, passes through setting for multiple groups quartz wafer 8
It sets, improves grinding efficiency.
Further, the workbench 4a, which is equipped with limitting casing 4r, realizes wafer dies by the setting of limitting casing 4r
The limit of plate 5.
Further, the limitting casing 4r is equipped with damping spring 4s and can be fought each other by the setting of damping spring 4s
The downlink of mill frame 4m is buffered, and is reduced the rigid contact of quartz wafer 8 and the roller 4p that polishes, is reduced scrappage.
In the utility model, when sensor 6 detects that the conveyer belt 1 of the side of pusher 2 is equipped with chip template 5
When, controller is sent the signal to, cylinder 1 is controlled by controller and pushes gas bar 1, cylinder 2 24 pushes gas bar two
25, so that push plate 1 driven to move forward, it is pushed into chip template 5 in limitting casing 4r, gas is then pushed by five 4d of cylinder
Five 4e of bar is mobile, to drive movable block 4f mobile, then pushes six 4h of gas bar, seven 4j of cylinder to push gas bar by six 4g of cylinder
Seven 4k, thus make gentle seven 4k of bar of six 4h of gas bar that polishing rack 4m be pushed to move down, it, can after polishing rack 4m touches damping spring 4s
It realizes the buffering of polishing roller 4p, polishing roller 4p is then driven by polishing motor 4n, the corrosion layer on 8 surface of quartz wafer is carried out
Polishing, six 4g of exhaust hood and seven 4j of cylinder that polishes drive polishing rack 4m uplink, then push gas bar 3 33 to move by cylinder 3 32
Dynamic, it is mobile that cylinder 4 34 pushes gas bar 4 35, to drive push plate 2 36 mobile, is pushed away chip template 5 by push plate 2 36
It send to conveyer belt 1, the quartz wafer 8 after making polishing enters next process.
By adopting the above-described technical solution, compared with prior art, the utility model is beaten by automating quartz wafer
The setting of mill apparatus, the automation polishing after realizing the corrosion of quartz wafer, improves grinding efficiency, while also improving quartz
The quality of chip.
The utility model is not limited to above-mentioned preferred forms, and anyone should learn that under the enlightenment of the utility model
The structure change made, it is all that there is same or similar technical solution with the utility model, belong to the utility model
Protection scope.
Claims (5)
1. a kind of automation quartz wafer grinding device, including conveyer belt, pusher, shedding mechanism, workpiece polishing mechanism, wafer dies
Plate, it is characterised in that: on the conveyor belt, in the side of conveyer belt, described unloads the pusher chip template
Mechanism is expected in the other side of conveyer belt, and the workpiece polishing mechanism is set in the top of shedding mechanism, the side of the workpiece polishing mechanism
There is sensor,
The pusher includes mounting rack one, cylinder one, gas bar one, cylinder two, gas bar two, push plate one, the cylinder
One and cylinder two be mounted on mounting rack one, described one one end of gas bar is connect with cylinder one, one other end of gas bar with
Push plate one connects, and described two one end of gas bar is connect with cylinder two, and two other end of gas bar is connect with push plate one,
The shedding mechanism includes mounting rack two, cylinder three, gas bar three, cylinder four, gas bar four, push plate two, the cylinder
Three and cylinder four be mounted on mounting rack two, described three one end of gas bar is connect with cylinder three, three other end of gas bar with
Push plate two connects, and described four one end of gas bar is connect with cylinder four, and four other end of gas bar is connect with push plate two,
The workpiece polishing mechanism includes workbench, locating rack, guide rail, cylinder five, gas bar five, movable block, cylinder six, gas bar six,
Cylinder seven, gas bar seven, polishing rack, motor of polishing, roller of polishing, transmission shaft, the locating rack are mounted on the top of workbench, institute
The guide rail stated is mounted on the inside of locating rack, and the cylinder five is mounted on locating rack, described five one end of gas bar and cylinder
Five connections, five other end of gas bar are connect with movable block, and the movable block is mounted on guide rail, six He of cylinder
Cylinder seven is mounted on movable block, and described six one end of gas bar is connect with cylinder six, six other end of gas bar and polishing rack
Connection, the gas bar July 1st end are connect with cylinder seven, and seven other end of gas bar is connect with polishing rack, the transmission shaft
It is mounted on polishing rack, the polishing roller is mounted on transmission shaft, the polishing motor and transmission axis connection.
2. automation quartz wafer grinding device as described in claim 1, it is characterised in that: the conveyer belt and motor connects
It connects.
3. automation quartz wafer grinding device as described in claim 1, it is characterised in that: the chip template is gone into battle column
There is multiple groups quartz wafer.
4. automation quartz wafer grinding device as described in claim 1, it is characterised in that: the workbench is equipped with limit
Position frame.
5. automation quartz wafer grinding device as claimed in claim 4, it is characterised in that: the limitting casing, which is equipped with, to be subtracted
Shake spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821608901.9U CN208788181U (en) | 2018-09-30 | 2018-09-30 | A kind of automation quartz wafer grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821608901.9U CN208788181U (en) | 2018-09-30 | 2018-09-30 | A kind of automation quartz wafer grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208788181U true CN208788181U (en) | 2019-04-26 |
Family
ID=66211355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821608901.9U Active CN208788181U (en) | 2018-09-30 | 2018-09-30 | A kind of automation quartz wafer grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208788181U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110640566A (en) * | 2019-09-20 | 2020-01-03 | 长春理工大学 | External spline clamping groove position burr remove device |
| CN112589669A (en) * | 2020-12-09 | 2021-04-02 | 苏州斯尔特微电子有限公司 | Feeding mechanism for wafer grinding |
-
2018
- 2018-09-30 CN CN201821608901.9U patent/CN208788181U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110640566A (en) * | 2019-09-20 | 2020-01-03 | 长春理工大学 | External spline clamping groove position burr remove device |
| CN110640566B (en) * | 2019-09-20 | 2021-09-21 | 长春理工大学 | External spline clamping groove position burr remove device |
| CN112589669A (en) * | 2020-12-09 | 2021-04-02 | 苏州斯尔特微电子有限公司 | Feeding mechanism for wafer grinding |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201222 Address after: 413000 Wufu East Road, Changchun Industrial Park, Ziyang District, Yiyang City, Hunan Province Patentee after: Hunan kexintai Electronics Co.,Ltd. Address before: 413000 Changchun Economic Development Zone, Ziyang District, Yiyang City, Hunan Province Patentee before: YIYANG HUAGUANG TECHNOLOGY ELECTRONIC Co.,Ltd. |
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| TR01 | Transfer of patent right |