CN208764685U

CN208764685U - Glass steeps LED light entirely

Info

Publication number: CN208764685U
Application number: CN201821271646.3U
Authority: CN
Inventors: 王其远; 曹亮亮; 蒋洪奎; 陈慧武; 刘伟; 何飞桦
Original assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Current assignee: Zhangzhou Lidaxin Optoelectronic Technology Co ltd
Priority date: 2018-08-08
Filing date: 2018-08-08
Publication date: 2019-04-19
Anticipated expiration: 2028-08-08

Abstract

The utility model discloses glass to steep LED light and its assembly method, including blister, lamp cap, light source module and stem entirely；The stem is hollow column, and bottom end sets horn-like opening, and upper end is equipped with aeration aperture, and the aeration aperture is connected to air exhaust rod, and the air exhaust rod is set in stem and extends downward into opening；The light source module includes LED light source, driving IC and conducting wire, and the LED light source and driving IC package are connected in the substrate, and by conducting wire；The conducting wire includes Dumet wire and nickel wire.The present invention has cast out traditional driving plate, reduces heat source, and by the way of aeration aperture and air exhaust rod cooperation heat dissipation, whole lamp heat dissipation is good, improves the whole lamp load power upper limit and light leads to the upper limit, structural member is few, production and assembly efficiency are high, at low cost, have good core competitiveness.

Description

Glass steeps LED light entirely

Technical field

The utility model relates to glass to steep LED light entirely.

Background technique

Existing glass steeps lamp entirely, mostly uses the drive module being separately provided greatly, and the drive module is mainly installed on lamp Head in, whole lamp work when drive module generate amount of heat, and place driving lamp cap due to inner space it is narrow, generation Heat is difficult to spill into air, therefore heat dissipation effect is unsatisfactory.Original of the existing radiating subassembly due to drive module setting Cause is usually socketed on outside lamp cap or is set to lamp cap and blister junction, and component increases, and increases lamp body weight, reduces assembly effect Rate.

Utility model content

The purpose of the utility model is to overcome in place of the deficiencies in the prior art, provides glass and steep LED light entirely, solve The problem of drive module setting and whole lamp radiate in above-mentioned background technique.

The technical scheme adopted by the utility model to solve the technical problem is as follows: glass steeps LED light, including blister and lamp entirely Head, shown blister and lamp cap are enclosed a cavity, and light source module and stem are equipped in the cavity；

The stem is hollow column, and the bottom end of the stem sets opening, and the opening is in horn-like, the maximum of opening Outer diameter corresponds to the diameter of blister bottom, and blister bottom is fixed in the opening welding, and stem is erected in blister；The stem Top is equipped with aeration aperture, and the aeration aperture is connected to air exhaust rod, and the air exhaust rod is set in stem and extends downward into opening； In open under machining state, the chamber formed with the blister and stem is communicated for the lower end of the air exhaust rod；When in blister After being filled with inert gas or mixed gas containing inert gas, the lower end of the air exhaust rod is sealed through fusing, the bubble shell-and-core Column forms airtight chamber；

The light source module includes LED light source, driving IC and conducting wire, and the driving IC is set to the top of stem, described LED light source is packaged in driving IC, and is connected by conducting wire；Driving IC is fixed in the upper end of the conducting wire, and lower end is protruded into stem, And extend to lamp cap.

In one preferred embodiment of the utility model, the conducting wire includes the Dumet wire of the stem fusion and is connected to The nickel wire at Dumet wire both ends.

In one preferred embodiment of the utility model, the driving IC includes transparent substrate, and the LED light source is packaged in it Middle one side, the transparent substrate two sides are coated with fluorescent material.

In one preferred embodiment of the utility model, the driving IC includes aluminum substrate, and the LED light source is packaged in aluminium base The two sides on plate two sides, the aluminum substrate is coated with fluorescent material.

In one preferred embodiment of the utility model, by pasting object assembly connection between the bottom and lamp cap of the blister.

In one preferred embodiment of the utility model, shown lamp cap bottom sets a lamel.

In one preferred embodiment of the utility model, the stem material is glass.

In one preferred embodiment of the utility model, the model of the LED light includes A60, P45, B35, G lamp.

The technical program compared with the background art, it has the following advantages:

1. not setting up drive module individually, conventional ADS driving mode is removed, by driving IC in light source integral packaging, reduces driving The heat generated when operation；

2. radiating mode is combined with light source module, radiated by stem, stem sets aeration aperture and air exhaust rod, may be implemented Heat is exchanged with air, excellent in heat dissipation effect；

3. the material of blister and stem is glass, the conducting wire of light source module is by the Dumet wire fused with stem and connection Nickel wire in Dumet wire both ends forms, and the thermal expansion coefficient of Dumet wire is almost consistent with glass, ensure that encapsulation yields and length Phase reliable vacuum degree；

4. the design of whole lamp effectively mitigates whole lamp grammes per square metre, component is reduced, packaging efficiency is improved, reduces cost.

Detailed description of the invention

Fig. 1 is 1 cross-sectional view of embodiment.

Fig. 2 is 1 explosive view of embodiment.

Fig. 3 is 1 light source module structure schematic diagram of embodiment.

Fig. 4 is that 5 glass fiber of embodiment bubble is processed as bubble shell structure variation schematic diagram.

Fig. 5 is 2 cross-sectional view of embodiment.

Fig. 6 is 3 cross-sectional view of embodiment.

Fig. 7 is 4 cross-sectional view of embodiment.

Specific embodiment

Embodiment 1

Fig. 1-3 is please referred to, the glass of the present embodiment steeps LED light entirely, using model A60, including blister 1 and E27 lamp cap 4, Shown blister 1 and lamp cap 4 are enclosed a cavity, and light source module 2 and stem 3 are equipped in the cavity, has been filled with inertia in cavity The mixed gas of gas or inert gas, for reinforcing heat dissipation；

The stem 3 is hollow column, is glass material, the bottom end of the stem 3 sets horn-like opening, described to open The maximum outside diameter of mouth corresponds to the diameter setting of 1 bottom of blister, and 1 bottom of blister is fixed in the opening welding, and stem 3 is erected on bubble In shell 1；The stem 3 is equipped with aeration aperture 31, and the aeration aperture 31 is connected to air exhaust rod 33, and the air exhaust rod 33 is set to core In column 3 and extend downward into opening；The lower end of the air exhaust rod 33 is under machining state in open, outside air and the bubble Shell 1 and core cylindrical 3 at chamber communicate；It is described after being filled with indifferent gas in blister 1 or mixed gas body containing inert gas The lower end of air exhaust rod 33 is sealed through fusing, and the blister 1 and stem 3 form airtight chamber；

The light source module 2 includes that LED light source 23, driving IC and conducting wire, the driving IC are set to the top of stem 3, The driving IC is the integrated chip of belt substrate, and the LED light source 23 is packaged in driving IC, and is connected by conducting wire；It is described to lead Driving IC is fixed in the upper end of line, and lower end is protruded into stem 3, and extends to lamp cap 4.

In the present embodiment, the conducting wire includes the Dumet wire 25 and be connected to 25 both ends of Dumet wire that the stem 3 fuses Nickel wire 27, the top of stem 3 is pinched in the present embodiment, in order to the fusion of Dumet wire 25, and since the heat of Dumet wire 25 is swollen Swollen coefficient is almost consistent with glass, ensure that encapsulation yields and vacuum degree reliably and with long-term.

In the present embodiment, the substrate 21 of the driving IC includes a cross-brace plate and is upwardly extended by cross-brace plate Several vertical plates, the vertical plate interval setting, it is unaffected to guarantee that the scattered light and heat of each LED light source 23 lead to, while each vertical The plate distribution low using intermediate high both sides, is farthest utilized the space in blister 1.

In products application, when the substrate 21 is transparent substrate 21, the LED light source 23 is with driving IC package in it Middle one side, 21 two sides of substrate are coated with fluorescent material.When the substrate 21 is using aluminum substrate 21, the LED light source 23 It is packaged in 21 two sides of substrate, driving IC package is coated with fluorescent material in wherein one side, the two sides of the substrate 21.LED light source 23 can change with the packaged type of IC is driven according to different substrate 21.

To guarantee being bonded for blister 1 and lamp cap 4, connected between 1 bottom of blister and lamp cap 4 by pasting object assembly It connects, common object of pasting has silicone adhesive, AB glue and welding powder glue etc..Shown 4 bottom of lamp cap sets a lamel 5, also referred to as drawing pin, For being electrically connected.

Embodiment 2

Embodiment 2 the difference from embodiment 1 is that: the present embodiment steeps lamp using P45 model glass entirely, please refers to Fig. 5, The substrate 21 of middle light source module 2 is fan-shaped, and the specific circle that a part is cut for one, the part cut is the bottom of substrate 21, To guarantee the firm of light source module 2；Meanwhile the linear compartment of terrain of LED light source 23 is packaged in substrate 21, applied atop has fluorescence Matter.

Embodiment 3

Embodiment 3 the difference from embodiment 1 is that: the present embodiment steeps lamp using B35 model glass entirely, please refers to Fig. 6, should The characteristics of model lamp is that blister 1 is candle shape, and 1 internal volume of blister is smaller, therefore the light source module 2 of the lamp is designed as and blister 1 The compatible candle shape of shape, 21 Bottoming a part of substrate become parallel lines, guarantee the firm of assembly.Candle candlelight shape Substrate 21, in the settable more LED light sources 23 in the part that it is upwardly extended, to make up the deficiency on width.

Embodiment 4

Embodiment 4 the difference from embodiment 1 is that: the present embodiment is G lamp, please refers to Fig. 7,1 inner space of blister compared with Greatly, 3 length of stem is long compared with embodiment 1, and the power or light that corresponding light source module 2 is carried are logical also to be increased.

Embodiment 5

The assembly method of LED light described in Examples 1 to 4, includes the following steps:

(0) production of light source module 2: by LED light source 23 and driving IC package in the wherein one or both sides of substrate 21, 21 two sides of substrate coats fluorescent material, and by nickel wire 27 and LED light source 23 and driving IC welding, the tail end of nickel wire 27 connects Du Magnesium wire 25, the Dumet wire 25 are used to fuse with stem 3, then weld nickel wire 27, the nickel wire in the other end of Dumet wire 25 27 extend downward into the opening of stem 3

(1) 3 top of stem is heated to molten condition, merges two Dumet wires 25 for being terminated with nickel wire 27 with stem 3, 3 top intermediate fabrication aeration aperture 31 of stem, the aeration aperture 31 are connected with a hollow body, are air exhaust rod 33, the air exhaust rod 33 and extend downward into 3 bottom of stem；

(2) nickel wire 27 of 25 upper end of Dumet wire is connect with light source module 2；

(3) stem 3 and light source module 2 are fixed on envelope row's machine jig, then glass fiber bubble 6 are inserted in from top to bottom, Please refer to Fig. 4, the bottom bore of the glass fiber bubble 6 is greater than the size of light source module 2, and glass fiber 6 is steeped bottom-heated to molten Melt state, 6 bottoms of glass fiber bubble are then encircled by contraction by envelope row's machine jig and form blister 1, finally by 1 bottom end of blister and core The bottom of column 3 is packaged under heating melting state；

(4) air exhaust rod 33 being connect after encapsulating by the aeration aperture 31 with stem 3 extracts the air in blister 1 out, It is re-filled with inert gas or the mixed gas containing inert gas, is then blown the melting of 33 redundance of air exhaust rod, air exhaust rod The port of 33 lower ends inwardly collapses closing under atmospheric pressure effect, so that blister 1 and stem 3 constitute a closed chamber；

(5) nickel wire 27 of 25 lower end of Dumet wire is electrically connected with lamp cap 4, is fixed between 1 bottom of blister and head lamp with pasting object, Complete assembly.

The glass of the utility model steeps LED light entirely, and assembly method is simple, and component is few, and assembly efficiency is high, manufacturing cost it is low and Reliably and with long-term, yields is high for vacuum degree.

Skilled person will appreciate that when technical parameter of the invention changes in the following range, it is contemplated that obtain Same as the previously described embodiments or similar technical effect: 21 size of substrate of the driving IC is open less than or equal to blister 1, drives Dynamic IC shape can be led to according to 1 shape of blister, light and power demand is arranged.

The above, only the utility model preferred embodiment, therefore, it cannot be limited according to, and the utility model is implemented It is practical new to should still belong to this for range, i.e., equivalent changes and modifications made according to the scope of the patent of the utility model and the content of the manual In the range of type covers.

Claims

1. glass steeps LED light entirely, it is characterised in that: including blister and lamp cap, shown blister and lamp cap are enclosed a cavity, should Light source module and stem are equipped in cavity；

The stem is hollow column, and the bottom end of the stem sets opening, and the opening is in horn-like, the maximum outside diameter of opening Blister bottom is fixed in the diameter of corresponding blister bottom, the opening welding, and stem is erected in blister；The top of the stem Equipped with aeration aperture, the aeration aperture is connected to air exhaust rod, and the air exhaust rod is set in stem and extends downward into opening；It is described In open under machining state, the chamber formed with the blister and stem is communicated for the lower end of air exhaust rod；When being filled in blister After inert gas or mixed gas containing inert gas, the lower end of the air exhaust rod is sealed through fusing, the blister and core cylindrical At airtight chamber；

The light source module includes that LED light source, driving IC and conducting wire, the driving IC are set to the top of stem, the LED light Source is packaged in driving IC, and is connected by conducting wire；Driving IC is fixed in the upper end of the conducting wire, and lower end is protruded into stem, and is prolonged Extend to lamp cap.

2. glass according to claim 1 steeps LED light entirely, it is characterised in that: the conducting wire includes what the stem fused Dumet wire and the nickel wire for being connected to Dumet wire both ends.

3. glass according to claim 1 steeps LED light entirely, it is characterised in that: the driving IC includes transparent substrate, described LED light source is packaged in wherein one side, and the transparent substrate two sides is coated with fluorescent material.

4. glass according to claim 1 steeps LED light entirely, it is characterised in that: the driving IC includes aluminum substrate, described LED light source is packaged in aluminum substrate two sides, and the two sides of the aluminum substrate is coated with fluorescent material.

5. glass according to claim 1 steeps LED light entirely, it is characterised in that: pass through between the bottom and lamp cap of the blister Paste object assembly connection.

6. glass according to claim 1 steeps LED light entirely, it is characterised in that: shown lamp cap bottom sets a lamel.

7. glass according to claim 1 steeps LED light entirely, it is characterised in that: the stem material is glass.

8. glass according to claim 1 steeps LED light entirely, it is characterised in that: the model of the LED light include A60, P45, B35, G lamp.